CN219135739U - Automatic change chip package and press from both sides and get device - Google Patents
Automatic change chip package and press from both sides and get device Download PDFInfo
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- CN219135739U CN219135739U CN202223066017.6U CN202223066017U CN219135739U CN 219135739 U CN219135739 U CN 219135739U CN 202223066017 U CN202223066017 U CN 202223066017U CN 219135739 U CN219135739 U CN 219135739U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model discloses an automatic chip packaging part clamping device, which belongs to the technical field of chip packaging and comprises a body, wherein the body comprises a base, a material chamber and a controller are arranged on the base, a packaging part is placed in the material chamber, a pushing mechanism for pushing the packaging part is connected onto the material chamber in a sliding manner, a conveying mechanism is arranged on the base and is used for conveying the packaging part, a rotating mechanism is arranged in the base and is fixedly connected with a rotating rod, the rotating rod is connected with the base in a sliding manner, an adsorption mechanism for adsorbing the packaging part is arranged in the rotating rod, the pushing mechanism pushes the packaging part out of the material chamber, the conveying mechanism conveys the packaging part into a positioning groove, the rotating mechanism rotates the adsorption mechanism on the rotating rod to the position right above the positioning groove, the adsorption mechanism adsorbs the packaging part, and then rotates the packaging part into a subsequent proper position through the rotating rod.
Description
Technical Field
The utility model belongs to the technical field of chip packaging, and particularly relates to an automatic chip packaging part clamping device.
Background
Along with the popularization of intellectualization and the continuous growth of the semiconductor market, embedded packaging chips are widely and intelligently worn, mobile phones, vehicle-mounted electronic equipment and the like, and the chip packaging, namely, a shell for mounting a semiconductor integrated circuit chip has the functions of placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, the chip packaging is a bridge for communicating the world inside the chip with an external circuit, the contact point of the chip is connected to a pin of the packaging shell through a wire, and the pin is connected with other devices through the wire on a printed board; the package plays an important role in CPU and other LSI integrated circuits, and has the advantages of increased pin number, reduced pin spacing, reduced weight, improved reliability and more convenient use.
In practical use, the conventional packaging device has at least the following problems: 1. after the first layer of chip packaging piece is taken down, the position can not be quickly complemented, so that the continuous operation is difficult to perform, secondly, when the chip packaging piece is clamped, multi-angle adjustment is often needed, and the mechanical structure is adopted for adjustment, so that the adjustment is realized at higher cost, and the clamping precision needed by the chip packaging piece is difficult to achieve; in summary, the above problems seriously hamper the large-scale popularization of the chip packaging apparatus.
Disclosure of Invention
The utility model aims to: an automated chip package clamping device is provided, which solves the above problems existing in the prior art.
The technical scheme is as follows: the utility model provides an automatic change chip package presss from both sides and gets device, includes the body, the body includes the base, be equipped with material room and controller on the base, the encapsulation piece has been placed in the material room, sliding connection has the promotion on the material room the pushing mechanism of encapsulation piece, be equipped with transport mechanism on the base, transport mechanism is used for the transportation encapsulation piece, be equipped with slewing mechanism in the base, slewing mechanism fixedly connected with dwang, the dwang with base sliding connection, be equipped with in the dwang and adsorb the adsorption mechanism of encapsulation piece.
In a further embodiment, a pushing hole is formed in the bottom of the material chamber, the size of the pushing hole is the same as that of the packaging piece, the pushing mechanism comprises a pushing shell arranged on the base, a first air cylinder arranged in the pushing shell, a first telescopic rod connected with the first air cylinder, a pushing plate is fixedly connected to the free end of the first telescopic rod, the pushing plate is slidably connected in the pushing hole, and the pushing plate is used for pushing the packaging piece, and the first air cylinder is electrically connected with the controller.
In a further embodiment, a moving-out hole is formed in one side of the material chamber opposite to the pushing hole, the size of the moving-out hole is the same as that of the packaging piece, the moving-out hole is used for moving out the packaging piece, a positioning groove opposite to the moving-out hole is formed in the base, the positioning groove is used for limiting the position of the packaging piece, and a conveying cavity is formed in the bottom surface of the positioning groove.
In a further embodiment, a conveying mechanism is arranged in the conveying cavity, the conveying mechanism comprises a first motor, a driving wheel fixedly connected with the output end of the first motor, a first conveying belt slidingly connected with the driving wheel, a driven wheel slidingly connected with the other end of the first conveying belt, a conveying wheel coaxially rotating with the driven wheel, a second conveying belt is sleeved on the conveying wheel, the second conveying belt is used for conveying the packaging piece, and the first motor is electrically connected with the controller.
In a further embodiment, a rotating cavity is formed in the base, a rotating mechanism is arranged in the rotating cavity, the rotating mechanism comprises a second motor, a driving shaft connected with the second motor, a first gear sleeved on the driving shaft, a second gear meshed with the first gear, a driven shaft inserted on the second gear, and the driven shaft is fixedly connected to the rotating rod.
In a further embodiment, the second motor is electrically connected with the controller, the driving shaft and the driven shaft are respectively connected with the base in a rotating manner through bearings, a hose is arranged in the rotating rod, one end of the hose is connected with the air pump, the other end of the hose is divided into a first hose and a second hose, the first hose and the second hose are respectively symmetrically arranged on the rotating rod, a control valve is arranged on the first hose and the second hose, and the free ends of the first hose and the second hose are respectively connected with the adsorption mechanism.
In a further embodiment, the sliding grooves are respectively formed in two sides of the rotating rod, the adsorption mechanism comprises an adsorption shell fixedly connected with the rotating rod, a second air cylinder arranged in the adsorption shell, a second telescopic rod connected with the second air cylinder, a sliding block fixedly connected with the free end of the second telescopic rod, the sliding block is slidably connected in the sliding grooves, the sliding block is communicated with the first hose or the second hose, a sucker is communicated with the sliding block, the sucker is used for adsorbing the packaging piece, and the second air cylinder is electrically connected with the controller.
The beneficial effects are that:
1. the first air cylinder is started through the controller, the first air cylinder drives the first telescopic rod to move towards the pushing hole, the first telescopic rod drives the push plate to move along the pushing hole and pushes the packaging piece out of the moving-out hole, and subsequent operation is facilitated; after pushing out the bottom packaging piece, the packaging piece of the secondary bottom layer can be downwards complemented to the bottom layer under the action of gravity, and an additional mechanism is not needed to realize the complemented position, so that the operation is simple and efficient.
2. When the package is clamped, firstly, a pushing mechanism is started, the package is pushed out of the material chamber by the pushing mechanism, the package is transported into the positioning groove by the rear conveying mechanism, then the adsorbing mechanism on the rotating rod is rotated to be right above the positioning groove by the rotating mechanism, then the package is adsorbed by the adsorbing mechanism, and then the package is rotated to a subsequent proper position by the rotating rod; in the whole process, the transfer structure affecting the precision is less, and the required clamping precision of the packaging piece can be achieved while the cost is reduced.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is an enlarged view of FIG. 1 at A;
FIG. 3 is an enlarged view at B in FIG. 1;
fig. 4 is an enlarged view at C in fig. 1.
The reference numerals in the drawings are: 1. a base; 11. a material chamber; 12. a push hole; 13. removing the hole; 14. a transfer chamber; 15. a rotating chamber; 16. a positioning groove; 2. a package; 3. a pushing mechanism; 31. pushing the housing; 32. a first cylinder; 33. a first telescopic rod; 34. a push plate; 4. a conveying mechanism; 41. a first motor; 42. a driving wheel; 43. a first conveyor belt; 44. driven wheel; 45. a transfer wheel; 46. a second conveyor belt; 5. a rotating mechanism; 51. a second motor; 52. a driving shaft; 53. a first gear; 54. a second gear; 55. a driven shaft; 6. a rotating lever; 61. a sliding groove; 7. a hose; 71. a first hose; 72. a second hose; 73. a control valve; 8. an adsorption mechanism; 81. an adsorption housing; 82. a second cylinder; 83. a second telescopic rod; 84. a slide block; 85. a suction cup; 9. and a controller.
Detailed Description
In order to make the technical scheme of the present utility model better understood by those skilled in the art, the present utility model will be further described in detail with reference to the accompanying drawings.
As shown in fig. 1-4, an automatic chip package 2 clamping device comprises a body, wherein the body comprises a base 1, a material chamber 11 and a controller 9 are arranged on the base 1, a package 2 is placed in the material chamber 11, a pushing mechanism 3 for pushing the package 2 is slidably connected on the material chamber 11, a conveying mechanism 4 is arranged on the base 1, the conveying mechanism 4 is used for conveying the package 2, a rotating mechanism 5 is arranged in the base 1, the rotating mechanism 5 is fixedly connected with a rotating rod 6, the rotating rod 6 is slidably connected with the base 1, and an adsorption mechanism 8 for adsorbing the package 2 is arranged in the rotating rod 6.
Through the technical scheme, when the package 2 starts to be clamped, the pushing mechanism 3 is started firstly, the pushing mechanism 3 pushes the package 2 out of the material chamber 11, then the conveying mechanism 4 conveys the package 2 into the positioning groove 16, then the rotating mechanism 5 rotates the adsorbing mechanism 8 on the rotating rod 6 to be right above the positioning groove 16, then the adsorbing mechanism 8 adsorbs the package 2, and then the rotating rod 6 rotates the package 2 to a subsequent proper position; the whole process has less transfer structure affecting the precision, and can achieve the required clamping precision of the packaging piece 2 while reducing the cost.
As shown in fig. 1-4, a pushing hole 12 is formed in the bottom of the material chamber 11, the size of the pushing hole 12 is the same as that of the packaging member 2, the pushing mechanism 3 comprises a pushing shell 31 arranged on the base 1, a first air cylinder 32 arranged in the pushing shell 31, a first telescopic rod 33 connected with the first air cylinder 32, a push plate 34 fixedly connected with the free end of the first telescopic rod 33, the push plate 34 is slidably connected in the pushing hole 12, the push plate 34 is used for pushing the packaging member 2, the first air cylinder 32 is electrically connected with the controller 9, a moving-out hole 13 is formed in one side of the material chamber 11 opposite to the pushing hole 12, the size of the moving-out hole 13 is the same as that of the packaging member 2, and the moving-out hole 13 is used for moving out the packaging member 2.
According to the technical scheme, the first air cylinder 32 is started through the controller 9, the first air cylinder 32 drives the first telescopic rod 33 to move towards the pushing hole 12, the first telescopic rod 33 drives the push plate 34 to move along the pushing hole 12 and push the packaging piece 2 out of the moving-out hole 13, and subsequent operation is facilitated; after pushing out the bottom packaging piece 2, the packaging piece 2 at the secondary bottom can be downwards complemented to the bottom layer under the action of gravity, and an additional mechanism is not needed to realize the complemented position, so that the operation is simple and efficient.
As shown in fig. 1-4, a positioning groove 16 opposite to the moving-out hole 13 is formed on the base 1, the positioning groove 16 is used for limiting the position of the packaging piece 2, a conveying cavity 14 is formed on the bottom surface of the positioning groove 16, a conveying mechanism 4 is arranged in the conveying cavity 14, the conveying mechanism 4 comprises a first motor 41, a driving wheel 42 fixedly connected with the output end of the first motor 41, a first conveying belt 43 slidingly connected with the driving wheel 42, a driven wheel 44 slidingly connected with the other end of the first conveying belt 43, a conveying wheel 45 coaxially rotating with the driven wheel 44, a second conveying belt 46 is sleeved on the conveying wheel 45, the second conveying belt 46 is used for conveying the packaging piece 2, and the first motor 41 is electrically connected with the controller 9.
Through the technical scheme, the positioning groove 16 corresponds to the moving-out hole 13, the conveying mechanism 4 is arranged below the positioning groove 16, and after the packaging piece 2 is pushed onto the conveying mechanism 4 by the push plate 34, the conveying mechanism 4 conveys the packaging piece 2 into the positioning groove 16, so that the subsequent operation is convenient; the first motor 41 is started by the controller 9, the first motor 41 drives the driving wheel 42 to rotate, the driving wheel 42 drives the driven wheel 44 to rotate through the first conveying belt 43, the driven wheel 44 rotates to drive the coaxial conveying wheel 45 to rotate, the conveying wheel 45 drives the second conveying belt 46 to rotate, and the second conveying belt 46 moves the packaging part 2 into the positioning groove 16.
As shown in fig. 1-4, a rotating cavity 15 is formed on the base 1, a rotating mechanism 5 is arranged in the rotating cavity 15, the rotating mechanism 5 comprises a second motor 51, a driving shaft 52 connected with the second motor 51, a first gear 53 sleeved on the driving shaft 52, a second gear 54 meshed with the first gear 53, a driven shaft 55 inserted on the second gear 54, the driven shaft 55 is fixedly connected on the rotating rod 6, the second motor 51 is electrically connected with the controller 9, the driving shaft 52 and the driven shaft 55 are respectively connected with the base 1 in a rotating way through bearings, a hose 7 is arranged in the rotating rod 6, one end of the hose 7 is connected with an air pump, the other end of the hose is divided into a first hose 71 and a second hose 72, the first hose 71 and the second hose 72 are respectively symmetrically arranged on the rotating rod 6, control valves 73 are arranged on the first hose 71 and the second hose 72, and free ends of the first hose 71 and the second hose 72 are respectively connected with an adsorption mechanism 8.
Through the technical scheme, after the package 2 reaches the inside of the positioning groove 16, the controller 9 starts the second motor 51, the second motor 51 drives the driving shaft 52 to rotate, the driving shaft 52 drives the first gear 53 to rotate, the first gear 53 drives the second gear 54 to rotate, the second gear 54 drives the driven shaft 55 to rotate, the driven shaft 55 drives the rotating rod 6 to rotate, and the rotating rod 6 rotates the adsorption mechanism 8 to the position right above the positioning groove 16; the control valve 73 can control the opening of air pump, and when the control valve 73 was opened, the air pump can adsorb the encapsulation 2 to adsorption equipment 8 on, and the setting of first software and second hose 72 makes the adsorption effect of two adsorption equipment 8 not influenced, can separate each other and use, and when one adsorption equipment 8 adsorbed encapsulation 2, another adsorption equipment 8 transported encapsulation 2, improves work efficiency.
As shown in fig. 1-4, the two sides of the rotating rod 6 are respectively provided with a sliding groove 61, the adsorption mechanism 8 comprises an adsorption shell 81 fixedly connected with the rotating rod 6, a second air cylinder 82 arranged in the adsorption shell 81, a second telescopic rod 83 connected with the second air cylinder 82, a sliding block 84 fixedly connected with the free end of the second telescopic rod 83, the sliding block 84 is slidably connected in the sliding groove 61, the sliding block 84 is communicated with the first hose 71 or the second hose 72, the sliding block 84 is communicated with a sucking disc 85, the sucking disc 85 is used for adsorbing the packaging part 2, and the second air cylinder 82 is electrically connected with the controller 9.
Through the above technical scheme, when the rotating rod 6 rotates the adsorption mechanism 8 to the position right above the positioning groove 16, the second air cylinder 82 is started through the controller 9, the second air cylinder 82 drives the second telescopic rod 83 to move towards the direction of the packaging piece 2, the second telescopic rod 83 drives the sliding block 84 and the sucker 85 to move towards the direction of the packaging piece 2 along the sliding groove 61, when the sucker 85 contacts with the packaging piece 2, the packaging piece 2 is adsorbed on the sucker 85 through air in the air pump, and then the second air cylinder 82 resets, and the rotating rod 6 is rotated through the rotating mechanism 5 to transfer the packaging piece 2 to a subsequent proper position.
Working principle: the first air cylinder 32 is started through the controller 9, the first air cylinder 32 drives the first telescopic rod 33 to move towards the pushing hole 12, the first telescopic rod 33 drives the pushing plate 34 to move along the pushing hole 12 and push the packaging piece 2 out of the moving-out hole 13, after the packaging piece 2 is pushed onto the second conveying belt 46 by the pushing plate 34, the first motor 41 is started through the controller 9, the first motor 41 drives the driving wheel 42 to rotate, the driving wheel 42 drives the driven wheel 44 to rotate through the first conveying belt 43, the driven wheel 44 drives the coaxial conveying wheel 45 to rotate, the conveying wheel 45 drives the second conveying belt 46 to rotate, the second conveying belt 46 moves the packaging piece 2 to the inside of the positioning groove 16, then the second motor 51 is started through the controller 9, the second motor 51 drives the driving shaft 52 to rotate, the driving shaft 52 drives the first gear 53 to rotate, the first gear 53 drives the second gear 54 to rotate, the driven shaft 55 drives the rotating rod 6 to rotate the adsorbing mechanism 8 to the position right above the positioning groove 16, then the second air cylinder 82 is started through the controller 9, the second air cylinder 82 drives the second air cylinder 82 to rotate the second driving rod 83 to move towards the second packaging piece 2 to the position of the positioning groove 85, and then the second air cylinder 82 slides towards the packaging piece 2 to move towards the position 85 when the second telescopic rod 85 contacts the packaging piece 2, and then the second telescopic rod 85 moves towards the packaging piece 2 to move towards the position 85, and then the packaging piece 2 moves towards the position 85 through the telescopic rod 85 when the second telescopic rod is contacted with the packaging piece 2.
In addition, the specific features described in the above embodiments may be combined in any suitable manner without contradiction. The various possible combinations of the utility model are not described in detail in order to avoid unnecessary repetition.
Claims (7)
1. An automatic change chip package spare and press from both sides and get device, includes body, its characterized in that: the body includes base (1), be equipped with material room (11) and controller (9) on base (1), placed encapsulation piece (2) in material room (11), sliding connection has the promotion on material room (11) pushing mechanism (3) of encapsulation piece (2), be equipped with transport mechanism (4) on base (1), transport mechanism (4) are used for the transportation encapsulation piece (2), be equipped with slewing mechanism (5) in base (1), slewing mechanism (5) fixedly connected with dwang (6), dwang (6) with base (1) sliding connection, be equipped with in dwang (6) and adsorb adsorption mechanism (8) of encapsulation piece (2).
2. An automated chip package clamping apparatus according to claim 1, wherein: the pushing mechanism is characterized in that a pushing hole (12) is formed in the bottom of the material chamber (11), the size of the pushing hole (12) is the same as that of the packaging piece (2), the pushing mechanism (3) comprises a pushing shell (31) arranged on the base (1), a first air cylinder (32) arranged in the pushing shell (31) is connected with a first telescopic rod (33) fixedly connected with a pushing plate (34) at the free end of the first telescopic rod (33), the pushing plate (34) is slidably connected in the pushing hole (12), the pushing plate (34) is used for pushing the packaging piece (2), and the first air cylinder (32) is electrically connected with the controller (9).
3. An automated chip package clamping apparatus according to claim 2, wherein: the material chamber (11) is relative to one side of pushing hole (12) has seted up and has shifted out hole (13), shift out the size of hole (13) with encapsulation piece (2) the same, shift out hole (13) are used for the shift out of encapsulation piece (2), set up on base (1) with shift out constant head tank (16) that hole (13) are relative, constant head tank (16) are used for prescribing a limit to the position of encapsulation piece (2), conveyer chamber (14) have been seted up to constant head tank (16) bottom surface.
4. An automated chip package gripping apparatus according to claim 3, wherein: be equipped with transport mechanism (4) in conveying chamber (14), transport mechanism (4) include first motor (41), with action wheel (42) of first motor (41) output fixed connection, with action wheel (42) sliding connection's first conveyer belt (43), with first conveyer belt (43) other end sliding connection's driven pulley (44), with driven pulley (44) coaxial pivoted transfer wheel (45), the cover is equipped with second conveyer belt (46) on transfer wheel (45), second conveyer belt (46) are used for the transportation package (2), first motor (41) with controller (9) electric connection.
5. An automated chip package clamping apparatus according to claim 4, wherein: the base (1) is provided with a rotating cavity (15), a rotating mechanism (5) is arranged in the rotating cavity (15), the rotating mechanism (5) comprises a second motor (51), a driving shaft (52) connected with the second motor (51) is sleeved with a first gear (53) on the driving shaft (52), a second gear (54) meshed with the first gear (53) is inserted into a driven shaft (55) on the second gear (54), and the driven shaft (55) is fixedly connected with a rotating rod (6).
6. An automated chip package gripping apparatus according to claim 5, wherein: the utility model discloses a motor, including base (1), rotary rod (6), second motor (51), controller (9) electric connection, driving shaft (52) with driven shaft (55) pass through the bearing respectively with base (1) rotate and be connected, be equipped with hose (7) in rotary rod (6), hose (7) one end is connected with the air pump, and the other end divide into first hose (71) and second hose (72), first hose (71) and second hose (72) symmetry respectively set up on rotary rod (6), be equipped with control valve (73) on first hose (71) and second hose (72), first hose (71) and second hose (72) free end are connected with adsorption equipment (8) respectively.
7. The automated chip package clamping device of claim 6, wherein: sliding tray (61) have been seted up respectively to dwang (6) both sides, adsorption equipment (8) include with dwang (6) fixed connection's absorption shell (81), set up second cylinder (82) in absorption shell (81), with second telescopic link (83) that second cylinder (82) are connected, second telescopic link (83) free end fixedly connected with slider (84), slider (84) sliding connection is in sliding tray (61), slider (84) with first hose (71) or second hose (72) intercommunication, slider (84) intercommunication has sucking disc (85), sucking disc (85) are used for adsorbing package (2), second cylinder (82) with controller (9) electric connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223066017.6U CN219135739U (en) | 2022-11-18 | 2022-11-18 | Automatic change chip package and press from both sides and get device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223066017.6U CN219135739U (en) | 2022-11-18 | 2022-11-18 | Automatic change chip package and press from both sides and get device |
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| Publication Number | Publication Date |
|---|---|
| CN219135739U true CN219135739U (en) | 2023-06-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223066017.6U Active CN219135739U (en) | 2022-11-18 | 2022-11-18 | Automatic change chip package and press from both sides and get device |
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| CN (1) | CN219135739U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117259880A (en) * | 2023-10-12 | 2023-12-22 | 江苏雷博微电子设备有限公司 | Chip reflow soldering equipment |
-
2022
- 2022-11-18 CN CN202223066017.6U patent/CN219135739U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117259880A (en) * | 2023-10-12 | 2023-12-22 | 江苏雷博微电子设备有限公司 | Chip reflow soldering equipment |
| CN117259880B (en) * | 2023-10-12 | 2024-03-22 | 江苏雷博微电子设备有限公司 | Chip reflow soldering equipment |
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