CN220208927U

CN220208927U - Semiconductor handling device

Info

Publication number: CN220208927U
Application number: CN202321794221.1U
Authority: CN
Inventors: 丁波; 李铁; 陈瀚; 侯金松; 杭海燕; 谷卫东
Original assignee: Shanghai Micro Semi World Co ltd
Current assignee: Shanghai Micro Semi World Co ltd
Priority date: 2023-07-10
Filing date: 2023-07-10
Publication date: 2023-12-19
Anticipated expiration: 2033-07-10

Abstract

The utility model discloses a semiconductor carrying device, and relates to the technical field of semiconductor wafer carrying; including the mounting panel, the mounting panel top is equipped with two synchronizing wheels, and two synchronizing wheel outside transmission are connected with the hold-in range, the hold-in range outside is fixed with a plurality of evenly distributed's the platform of placing, and a plurality of is placed and is all equipped with the wafer box on the bench, the mounting panel top is close to right side department and is equipped with the arm. Through installing the arm on the mounting panel to install mobile robot in the bottom of the box of mounting panel below, thereby make the arm can follow the box and remove, thereby be convenient for carry out long distance wafer transport between different equipment.

Description

Semiconductor handling device

Technical Field

The utility model relates to the technical field of semiconductor wafer conveying, in particular to a semiconductor conveying device.

Background

The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, wherein the most common semiconductor material is silicon, and the semiconductor silicon is mainly used for manufacturing silicon wafers in chip production.

The wafer handling arm of publication number CN218513436U, which comprises a Z-axis drive assembly, a rotational drive assembly, an X-axis drive assembly, a first arm, a second arm, and a wafer pallet; the rotary driving assembly is fixedly connected with the Z-axis driving assembly, the first arm is fixed at the top of the rotary driving assembly, the second arm is slidably arranged at the top of the first arm, and the wafer supporting plate is slidably arranged at the top of the second arm; the output shaft of the third rotary driving piece of the X-axis driving assembly is provided with a first synchronous wheel, a first arm is provided with a second synchronous wheel, a first synchronous belt is wound on the first synchronous wheel and the second synchronous wheel, a first connecting block is fixedly arranged on the first synchronous belt, the first connecting block is fixedly connected with the second arm, two ends of the second arm are respectively provided with a third synchronous wheel and a fourth synchronous wheel, a second synchronous belt is wound on the third synchronous wheel and the fourth synchronous wheel, a second connecting block and a third connecting block are arranged on the second synchronous belt, the second connecting block is connected with the first arm, and the third connecting block is connected with the wafer supporting plate.

The above-mentioned transport arm can remove in the direction of X axle and Z axle through X axle drive assembly and Z axle drive assembly when using, but because the distance restriction of X axle drive assembly and Z axle drive assembly itself for above-mentioned transport arm only can carry out the transport of wafer between the equipment that the distance is nearer, and do not set up the mechanism of accomodating the wafer in the above-mentioned device, make the wafer need once only accomplish the transport directly after taking off, and, above-mentioned transport arm sets up only a wafer layer board, consequently, need repeatedly go on many times when carrying in a large number of wafers, and transport efficiency is lower at every turn.

Disclosure of Invention

The utility model provides a semiconductor conveying device. Through installing the arm on the mounting panel to install mobile robot in the bottom half of mounting panel below, make the arm can follow mounting panel and box and remove, thereby can carry long distance wafer transport, through setting up synchronizing wheel and hold-in range, and fixed a plurality of places the platform of placing of wafer box in the hold-in range outside, thereby can deposit the wafer in batches when carrying, set up two arms simultaneously, and install a plurality of wafer layer boards on one of them arm, thereby can carry a plurality of wafers simultaneously, handling efficiency has been improved.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the semiconductor carrying device comprises a mounting plate, wherein two synchronous wheels are arranged at the top of the mounting plate, synchronous belts are connected to the outer sides of the two synchronous wheels in a transmission manner, a plurality of evenly distributed placing tables are fixed on the outer sides of the synchronous belts, wafer boxes are arranged on the plurality of placing tables, and a mechanical arm is arranged at the position, close to the right side, of the top of the mounting plate;

the top of the mounting plate is fixedly provided with a cover body, the right side of the cover body is provided with an opening, the synchronous wheel, the synchronous belt and the placing table are all positioned in the cover body, the bottom of the mounting plate is fixedly provided with a box body with the top arranged in the opening, and the top of the placing table is fixedly provided with a gravity sensor;

the inner wall of the top of the cover body is fixedly provided with a U-shaped plate, the synchronous wheel is movably connected between the U-shaped plate and the mounting plate, the U-shaped plate is fixedly provided with a first motor, the output shaft of the first motor and the left synchronous wheel are fixedly provided with gears, and the two gears are meshed;

the top of the mounting plate is provided with a base, the mechanical arms are fixed on the base, two mechanical arms are arranged, one mechanical arm is provided with a wafer supporting plate, the other mechanical arm is provided with a plurality of wafer supporting plates, the bottom of the mounting plate is fixedly provided with an L-shaped plate, a first cylinder is fixed on the L-shaped plate, the mounting plate is provided with an opening, and the extending end of the first cylinder penetrates through the opening and is fixedly connected with the mechanical arm;

the box body is internally provided with two movable plates which are arranged left and right, the top and the bottom of the two movable plates are movably connected with supporting plates, the upper supporting plate is movably connected with a mounting plate, the lower supporting plate is movably connected with the inner wall of the box body, the two movable plates are provided with threaded holes, a screw rod with two ends penetrating through the threaded holes is arranged between the two movable plates, linear guide rails are fixed on the inner wall of the box body and the L-shaped plate, a second motor is fixed on a slide block of the right linear guide rail, and the left end and the right end of the screw rod are respectively connected with the left linear guide rail and the second motor;

two mobile robots which are arranged left and right are fixed at the bottom of the box body.

Preferably, the top of the mounting plate is fixed with a T-shaped plate, the top of the T-shaped plate is provided with a sliding groove, and the synchronous belt passes through the sliding groove.

Preferably, the bottom of the mounting plate is fixed with an annular guide rail which is sealed in an annular manner, and the placing table is fixedly connected with a sliding block of the annular guide rail.

Preferably, the baffle that the platform top was fixed with the U-shaped setting of placing, and place platform side and baffle opposite side and seted up the fluting, be equipped with the limiting plate in the fluting, the fluting lateral wall is seted up flutedly, and the recess internal fixation has the second cylinder, second cylinder stretches out end and limiting plate fixed connection, rectangular channel has been seted up in the cover body left side, and has the dodge gate through hinge swing joint.

Preferably, the box body and the mobile robot are fixed through bolts.

Compared with the prior art, the utility model has the beneficial effects that:

1. the mechanical arm is arranged on the mounting plate, and the mobile robot is arranged at the bottom of the box body below the mounting plate, so that the mechanical arm can move along with the box body, and long-distance wafer carrying among different devices is facilitated;

2. through setting up synchronizing wheel and hold-in range on the mounting panel to a plurality of placing tables of placing the wafer box in the hold-in range outside is fixed, thereby can deposit the transport wafer in batches, sets up two arms simultaneously, and installs a wafer layer board and a plurality of wafer layer boards on two arms respectively, thereby can select to carry one or more wafers, has improved conveying efficiency.

Drawings

FIG. 1 is an external construction diagram of the present utility model;

FIG. 2 is a schematic diagram of the internal structure of the present utility model;

fig. 3 is a schematic top view of the present utility model.

Reference numerals in the drawings: 1. a mounting plate; 2. a case; 3. a cover body; 4. a wafer cassette; 5. a synchronizing wheel; 6. a gear; 7. a first motor; 8. a synchronous belt; 9. a T-shaped plate; 10. a U-shaped plate; 11. a placement table; 12. an annular guide rail; 13. a mechanical arm; 14. a wafer pallet; 15. a first cylinder; 16. a linear guide rail; 17. an L-shaped plate; 18. a second motor; 19. a movable plate; 20. a support plate; 21. a mobile robot; 22. a second cylinder; 23. and (3) a screw.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution: the semiconductor carrying device comprises a mounting plate 1, wherein two synchronous wheels 5 are arranged at the top of the mounting plate 1, a synchronous belt 8 is connected to the outer sides of the two synchronous wheels 5 in a transmission manner, a plurality of evenly-distributed placing tables 11 are fixed on the outer sides of the synchronous belt 8, wafer boxes 4 are arranged on the plurality of placing tables 11, and a mechanical arm 13 is arranged at the position, close to the right side, of the top of the mounting plate 1;

the top of the mounting plate 1 is fixedly provided with a cover body 3, the right side of the cover body 3 is provided with an opening, the synchronous wheel 5, the synchronous belt 8 and the placing table 11 are all positioned in the cover body 3, the bottom of the mounting plate 1 is fixedly provided with a box body 2 with the top being provided with the opening, the top of the placing table 11 is fixedly provided with a gravity sensor, the bottom of the mounting plate 1 is fixedly provided with an annular closed annular guide rail 12, the placing table 11 is fixedly connected with a sliding block of the annular guide rail 12, the placing table 11 is supported, and the placing table 11 can move smoothly conveniently;

the top of the placing table 11 is fixedly provided with a baffle plate which is arranged in a U shape, a slot is formed in one side of the side edge of the placing table 11 opposite to the baffle plate, a limiting plate is arranged in the slot, a groove is formed in the side wall of the slot, a second cylinder 22 is fixedly arranged in the groove, the extending end of the second cylinder 22 is fixedly connected with the limiting plate, a rectangular groove is formed in the left side of the cover body 3, a movable door is movably connected through a hinge, the limiting plate is driven to move through the second cylinder 22, the limiting plate is enabled to be in contact with the wafer box 4, the wafer box 4 is pushed to be tightly attached to the baffle plate, so that the wafer box 4 is clamped and fixed, the wafer box 4 is prevented from toppling when the placing table 11 moves, and the wafer box 4 is convenient to replace;

the inner wall of the top of the cover body 3 is fixedly provided with a U-shaped plate 10, the synchronous wheel 5 is movably connected between the U-shaped plate 10 and the mounting plate 1, a first motor 7 is fixed on the U-shaped plate 10, the output shaft of the first motor 7 and the left synchronous wheel 5 are both fixedly provided with gears 6, the two gears 6 are meshed, the top of the mounting plate 1 is fixedly provided with a T-shaped plate 9, the top of the T-shaped plate 9 is provided with a sliding groove, and the synchronous belt 8 penetrates through the sliding groove to support the synchronous belt 8, so that the synchronous belt 8 is prevented from falling down under the influence of gravity and being separated from the synchronous wheel 5;

the top of the mounting plate 1 is provided with a base, the mechanical arms 13 are fixed on the base, two mechanical arms 13 are arranged, one mechanical arm 13 is provided with a wafer supporting plate 14, the other mechanical arm 13 is provided with a plurality of wafer supporting plates 14, the bottom of the mounting plate 1 is fixedly provided with an L-shaped plate 17, the L-shaped plate 17 is fixedly provided with a first cylinder 15, the mounting plate 1 is provided with an opening, and the extending end of the first cylinder 15 passes through the opening and is fixedly connected with the mechanical arm 13;

two movable plates 19 which are arranged left and right are arranged in the box body 2, the top and the bottom of each movable plate 19 are movably connected with a supporting plate 20, the upper supporting plate 20 is movably connected with the mounting plate 1, the lower supporting plate 20 is movably connected with the inner wall of the box body 2, threaded holes are formed in each movable plate 19, a screw rod 23 with two ends penetrating through the threaded holes is arranged between each movable plate 19, linear guide rails 16 are fixed on the inner wall of the box body 2 and the L-shaped plate 17, a second motor 18 is fixed on a sliding block of the right linear guide rail 16, and the left end and the right end of each screw rod 23 are respectively connected with the left linear guide rail 16 and the second motor 18;

two mobile robots 21 which are arranged left and right are fixed at the bottom of the box body 2, so that the mobile robots 21 are conveniently separated from the box body 2, and the mobile robots 21 are conveniently maintained.

Working principle: when in use, the device is moved to the side of a wafer to be carried by the mobile robot 21, when the position of the wafer is higher, the two movable plates 19 are driven to move by the second motor 18 to deflect the supporting plate 20, the mounting plate 1 is lifted to drive the mechanical arm 13 to lift, the wafer at the higher position is convenient to take, the mechanical arm 13 inserts the wafer into the wafer box 4 for storage after taking the wafer, the gravity of the wafer box 4 is increased along with the increase of the wafer, when one wafer box 4 slows down the wafer, the gravity sensor senses the corresponding gravity change and transmits a signal to the first motor 7, the first motor 7 drives the synchronous wheel 5 to rotate through the gear 6, the synchronous belt 8 drives the placing table 11 to move, the wafer box 4 is moved forwards, the next-controlled wafer box 4 is moved to the mechanical arm 13, so that more wafers can be stored continuously, when the device moves to the position of unloading the wafer, the wafer is unloaded again through the matching of the mechanical arm 13, the first motor 7, the synchronous wheel 5 and the synchronous belt 8, in the unloading process, the wafer supporting plate 14 or the mechanical arm 13 with a plurality of wafer supporting plates 14 is selected according to the number of wafers required by equipment to carry, after the wafer is unloaded, the wafer is carried, the wafer box 4 can be selectively replaced according to the size of the wafer before the wafer is carried, the movable door is opened, the second cylinder 22 is controlled to extend so as to lead the wafer box 4 to be replaced according to the principle of the limiting plate, thereby loosening the wafer box 4, enabling the second cylinder 22 to shrink and drive the limiting plate to move towards the wafer box 4, pushing the wafer box 4 to be closely attached to the baffle after the limiting plate contacts with the wafer box 4, further enabling the limiting plate to be matched with the baffle to clamp and fix the wafer box 4, therefore, the wafer box 4 is replaced, the operation is convenient, and the use is simple.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Semiconductor handling device, comprising a mounting plate (1), characterized in that: two synchronous wheels (5) are arranged at the top of the mounting plate (1), synchronous belts (8) are connected to the outer sides of the two synchronous wheels (5) in a transmission mode, a plurality of evenly-distributed placing tables (11) are fixed on the outer sides of the synchronous belts (8), wafer boxes (4) are arranged on the plurality of placing tables (11), and a mechanical arm (13) is arranged at the top of the mounting plate (1) close to the right side;

the device is characterized in that a cover body (3) is fixed at the top of the mounting plate (1), an opening is formed in the right side of the cover body (3), the synchronous wheel (5), the synchronous belt (8) and the placing table (11) are all located in the cover body (3), a box body (2) with the top being provided with the opening is fixed at the bottom of the mounting plate (1), and a gravity sensor is fixed at the top of the placing table (11);

the novel synchronous motor is characterized in that a U-shaped plate (10) is fixed on the inner wall of the top of the cover body (3), the synchronous wheel (5) is movably connected between the U-shaped plate (10) and the mounting plate (1), a first motor (7) is fixed on the U-shaped plate (10), gears (6) are fixed on the output shaft of the first motor (7) and the left synchronous wheel (5), and the two gears (6) are meshed;

the top of the mounting plate (1) is provided with a base, the mechanical arms (13) are fixed on the base, two mechanical arms (13) are arranged, one mechanical arm (13) is provided with a wafer supporting plate (14), the other mechanical arm (13) is provided with a plurality of wafer supporting plates (14), the bottom of the mounting plate (1) is fixed with an L-shaped plate (17), the L-shaped plate (17) is fixed with a first air cylinder (15), the mounting plate (1) is provided with an opening, and the extending end of the first air cylinder (15) penetrates through the opening and is fixedly connected with the mechanical arm (13);

two movable plates (19) which are arranged left and right are arranged in the box body (2), the top and the bottom of each movable plate (19) are movably connected with a supporting plate (20), the upper supporting plate (20) is movably connected with the mounting plate (1), the lower supporting plate (20) is movably connected with the inner wall of the box body (2), threaded holes are formed in the two movable plates (19), screw rods (23) with two ends penetrating through the threaded holes are arranged between the two movable plates (19), linear guide rails (16) are fixed on the inner wall of the box body (2) and the L-shaped plate (17), a second motor (18) is fixed on a sliding block of the right linear guide rail (16), and the left end and the right end of each screw rod (23) are connected with the left linear guide rail (16) and the second motor (18) respectively;

two mobile robots (21) which are arranged left and right are fixed at the bottom of the box body (2).

2. A semiconductor handling device according to claim 1, wherein: the T-shaped plate (9) is fixed at the top of the mounting plate (1), a sliding groove is formed in the top of the T-shaped plate (9), and the synchronous belt (8) penetrates through the sliding groove.

3. A semiconductor handling device according to claim 1, wherein: the bottom of the mounting plate (1) is fixedly provided with an annular guide rail (12) which is annular and closed, and the placing table (11) is fixedly connected with a sliding block of the annular guide rail (12).

4. A semiconductor handling device according to claim 1, wherein: the utility model discloses a movable door, including placing platform (11), including baffle, limiting plate, cover body (3), recess, second cylinder (22) are fixed with the baffle that the U-shaped set up in placing platform (11) top, and place platform (11) side and baffle opposite side set up the fluting, be equipped with the limiting plate in the recess, recess lateral wall sets up fluting, second cylinder (22) stretch out end and limiting plate fixed connection, rectangular channel has been seted up in cover body (3) left side, and has the dodge gate through hinge swing joint.

5. A semiconductor handling device according to claim 1, wherein: the box body (2) and the mobile robot (21) are fixed through bolts.