CN112833799B - Soldering flux glue climbing height detection device and detection method - Google Patents
Soldering flux glue climbing height detection device and detection method Download PDFInfo
- Publication number
- CN112833799B CN112833799B CN202110020738.4A CN202110020738A CN112833799B CN 112833799 B CN112833799 B CN 112833799B CN 202110020738 A CN202110020738 A CN 202110020738A CN 112833799 B CN112833799 B CN 112833799B
- Authority
- CN
- China
- Prior art keywords
- soldering flux
- glue dipping
- platform
- groove
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention provides a soldering flux glue climbing height detection device and a soldering flux glue climbing height detection method, and belongs to the technical field of chip packaging. Scaling powder is climbed and is glued high detection device includes: remove the board, measure the tool, measure the board and be stained with gluey platform, it is provided with and is stained with gluey groove to be stained with gluey platform one side, it is used for the holding to wait to be stained with the scaling powder of getting to be stained with gluey groove, it includes the cylinder and the flexible telescopic link that sets up in the cylinder to measure the tool, be provided with the measurement scale on the telescopic link, be provided with the tool installation head on the removal board, the tool installation head is used for the installation to measure the tool, it is used for removing the measurement tool to be stained with gluey platform to remove the board, it is provided with the detection camera to measure the board, the detection camera is used for receiving the telescopic link that measures the tool and is stained with the image information after getting the scaling powder. The invention aims to provide a soldering flux thickness detection device and a soldering flux thickness detection method, which can automatically detect the glue climbing height of soldering flux in corresponding glue dipping grooves and are suitable for glue dipping grooves with different specifications.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a soldering flux climbing height detection device and a soldering flux climbing height detection method.
Background
With the rapid development of the semiconductor industry, electronic products are miniaturized and thinned to meet the requirements of users and product performance, and memories are higher and higher, so that more and more chip packaging products adopting a flip chip technology are available.
The flip chip technology mainly uses bumps of a chip to pick up soldering flux so as to complete the welding of the chip and a substrate in a reflow soldering mode. Can glue the convenient welding of chip through the scaling powder, simultaneously, can improve the activity of soldering tin, make the welding point firmer, avoid the emergence of rosin joint, cold welding. Therefore, after the chip bump is stained with the soldering flux, the glue-climbing height of the soldering flux is particularly important for the soldering quality, and therefore the glue-climbing height of the soldering flux needs to be measured before soldering so as to ensure that the chip bump is stained with the soldering flux in the corresponding glue-staining groove.
In the conventional flux measuring instrument, different deep grooves are directly milled in a measuring area by using a milling machining mode, the leftmost position is a zero point position, the heights of the deep grooves are sequentially increased from left to right (for example, 20um to 100um), and each deep groove is marked by using a scale mark. When measuring the scaling powder, hold the handle, the scaling powder in the gluey inslot is stained with in the measuring area contact, utilizes capillary action, looks over the climbing on the degree of depth groove and glues, finds the scale mark that corresponds and accomplishes the measurement, and the measured value is the scale mark value. The existing measuring jig has the specification of a depth groove corresponding to the depth of a glue dipping groove, so that when the specifications of the glue dipping grooves are different, the measuring jig with the corresponding specification needs to be replaced correspondingly, the wide applicability is lower, manual operation is needed, and the measuring precision and the efficiency are lower.
Disclosure of Invention
The invention aims to provide a soldering flux thickness detection device and a soldering flux thickness detection method, which can automatically detect the glue climbing height of soldering flux in corresponding glue dipping grooves and are suitable for glue dipping grooves of different specifications.
The embodiment of the invention is realized by the following steps:
in one aspect, an embodiment of the present invention provides a soldering flux climbing height detection apparatus, including: remove the board, measure the tool, measure the board and be stained with gluey platform, it is provided with and is stained with gluey groove to be stained with gluey platform one side, it is used for the holding to wait to be stained with the scaling powder of getting to be stained with gluey groove, it includes the cylinder and the flexible telescopic link that sets up in the cylinder to measure the tool, be provided with the measurement scale on the telescopic link, be provided with the tool installation head on the removal board, the tool installation head is used for the installation to measure the tool, it is used for removing the measurement tool to be stained with gluey platform to remove the board, it is provided with the detection camera to measure the board, the detection camera is used for receiving the telescopic link that measures the tool and is stained with the image information after getting the scaling powder.
Optionally, the soldering flux climbing height detection device further comprises a jig storage rack for storing the measuring jig, the mobile machine platform is further provided with an identification camera, the jig storage rack is provided with first identification feature points corresponding to the storage positions of the measuring jig, and the measuring jig is correspondingly provided with second identification feature points.
Optionally, one side of the glue dipping platform, on which the glue dipping groove is formed, is further provided with a third identification feature point.
Optionally, one side of the glue dipping platform departing from the glue dipping groove is provided with a first driving device, and the first driving device is used for driving the lifting height of the glue dipping platform.
Optionally, one side of the glue dipping platform, which is provided with the glue dipping groove, is also provided with a cleaning groove, one side of the first driving device, which deviates from the glue dipping platform, is provided with a cleaning agent accommodating groove, and the cleaning groove is connected with the cleaning agent accommodating groove through an injection tube.
Optionally, be stained with one side that gluey platform set up and be stained with gluey groove and still be provided with the scaling powder that is used for depositing the scaling powder and deposit the district, the scaling powder is deposited the district and is provided with the scraper, is stained with gluey platform and deviates from one side of being stained with gluey groove and is provided with the second drive arrangement who is connected with the scraper drive, and second drive arrangement is used for driving the scraper and removes to being stained with gluey groove.
In another aspect of the embodiments of the present invention, a soldering flux creeping glue height detecting method is provided, where the soldering flux creeping glue height detecting method is based on any one of the above-mentioned soldering flux creeping glue height detecting devices, and the method includes:
a fixed measuring jig is installed and fixed through a jig installing head arranged on a movable machine table;
adjusting the telescopic length of a telescopic rod on the measuring jig according to the groove depth of a glue dipping groove arranged on the glue dipping platform;
moving the measuring jig to the adhesive dipping platform through a moving machine table so that a telescopic rod of the measuring jig can dip the soldering flux in the adhesive dipping groove of the adhesive dipping platform;
moving the measuring jig to the measuring machine through the moving machine;
and receiving image information of the telescopic rod of the measuring jig after being stained with the soldering flux and identifying the corresponding scale value through a detection camera arranged on the measuring machine.
Optionally, when the soldering flux climbing height detection device includes the first driving device, after receiving image information of the telescopic rod of the measuring jig after being stained with the soldering flux and identifying the corresponding scale through the detection camera arranged on the measuring machine, the method further includes:
judging whether the scale value meets a preset range or not;
if not, the height of the gluing platform is adjusted through the driving of the first driving device, and the measuring jig is moved to the gluing platform through the moving machine again, so that the telescopic rod of the measuring jig is used for picking the soldering flux in the gluing groove of the gluing platform.
Optionally, when the soldering flux creeping glue height detecting device further comprises a cleaning groove, the measuring jig is moved to the glue dipping platform again through the moving machine table, so that before the telescopic rod of the measuring jig is dipped into the soldering flux in the glue dipping groove of the glue dipping platform, the method further comprises:
the measuring jig is moved to the glue dipping platform through the moving machine table, so that the telescopic rod of the measuring jig extends into the cleaning groove to clean the telescopic rod.
Optionally, when the soldering flux climbing glue height detection device comprises a soldering flux storage area, a scraper and a second driving device, the measuring jig is moved to the glue dipping platform through the moving machine table, so that before the telescopic rod of the measuring jig is dipped into the soldering flux in the glue dipping groove of the glue dipping platform, the method further comprises the following steps:
and the second driving device drives the scraper to move towards the glue dipping groove so as to scrape the soldering flux in the glue dipping groove.
The embodiment of the invention has the beneficial effects that:
the invention provides a soldering flux glue-climbing height detection device which comprises a mobile machine table, a measurement jig, a measurement machine table and a glue-dipping platform. Wherein, be stained with gluey groove on one side of being stained with gluey platform, be stained with gluey inslot and can hold the scaling powder of waiting to be stained with and pick up. The measuring jig comprises an air cylinder and a telescopic rod which is arranged in the air cylinder in a telescopic mode, measuring scales are arranged on the telescopic rod, and scaling powder in the glue dipping groove can be dipped through the telescopic rod. The movable machine platform is provided with a jig mounting head, and the measuring jig can be mounted and fixed on the movable machine platform through the jig mounting head. Be provided with the detection camera on the measuring board, utilize the detection camera can receive the telescopic link of measuring tool and be stained with the image information after getting the scaling powder. In practical application, can install the measurement tool fixedly through the tool installation head on the removal board, then utilize the removal board to remove the measurement tool to being stained with gluey platform to, the telescopic link of measuring the tool can stretch out and draw back under the pneumatic control of cylinder, so that its scale scope that stretches out the part of cylinder can satisfy the specification requirement that is stained with gluey groove and corresponds (adjust flexible length promptly and make the telescopic link can with be stained with the scaling powder contact of gluing the inslot and have and climb gluey space). The measuring jig is pressed down through the moving machine table so that the telescopic rod of the measuring jig can be stained with the soldering flux in the glue dipping groove, then the measuring jig is moved to the measuring machine table, the image information of the telescopic rod stained with the soldering flux is received through the detection camera arranged on the measuring machine table, and therefore the scale value corresponding to the soldering flux climbing height can be identified according to the image information so as to complete measurement. Can realize through the device that the scaling powder climbs the automated inspection of gluing the height to can adjust through the flexible of the telescopic link of measuring the tool, with the groove of being stained with of being applicable to different specifications is measured, improves this measuring tool's extensive suitability.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a device for detecting a thickness of a flux according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a jig storage rack of the soldering flux thickness detection apparatus according to the embodiment of the present invention;
fig. 3 is a schematic structural diagram of a glue dipping platform of the soldering flux thickness detection device according to the embodiment of the invention;
fig. 4 is a schematic flow chart of a method for detecting a thickness of a flux according to an embodiment of the present invention.
Icon: 110-a mobile machine; 111-a jig mounting head; 112-a recognition camera; 120-measuring the fixture; 121-a cylinder; 122-a telescoping rod; 123-second identifying feature points; 130-a measuring machine; 131-a detection camera; 140-glue dipping platform; 141-glue dipping tank; 142-a third identified feature point; 143-a first driving device; 144-cleaning tank; 145-detergent container; 146-a scraper; 147-a second drive; 150-jig storage rack; 151-first identified feature point.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The embodiment of the invention provides a soldering flux climbing height detection device, as shown in fig. 1, comprising: the mobile machine table 110, the measuring jig 120, the measuring machine table 130 and the glue dipping platform 140, a glue dipping groove 141 is formed in one side of the glue dipping platform 140, the glue dipping groove 141 is used for containing soldering flux to be dipped, the measuring jig 120 comprises an air cylinder 121 and a telescopic rod 122 which is telescopically arranged in the air cylinder 121, measuring scales are arranged on the telescopic rod 122, a jig mounting head 111 is arranged on the mobile machine table 110, the jig mounting head 111 is used for mounting the measuring jig 120, the mobile machine table 110 is used for moving the measuring jig 120 to the glue dipping platform 140, the measuring machine table 130 is provided with a detection camera 131, and the detection camera 131 is used for receiving image information of the measuring jig 120 after the telescopic rod 122 is dipped in the soldering flux.
The glue dipping groove 141 disposed on the glue dipping platform 140 is generally a glue dipping groove 141 used for dipping the chip bumps into the soldering flux during chip mounting. According to the different specifications (groove depth) of the dipping groove 141, the telescopic length of the telescopic rod 122 of the measuring jig 120 can be adjusted to perform corresponding adaptation, so that the telescopic rod 122 can have a certain glue-climbing space when being dipped with the soldering flux in the dipping groove 141.
Generally, in practical applications, the moving machine 110 of the soldering flux creeping height detecting apparatus may directly adopt a chip mounter, and accordingly, the jig mounting head 111 is a mounting head of the chip mounter. Of course, in the embodiment of the present invention, a person skilled in the art may also use other common mobile machines 110, such as a three-axis mobile machine 110, or design a corresponding mobile machine 110 according to actual requirements, which is not limited herein, as long as the mobile machine 110 can drive the measurement fixture 120 to move to the glue dipping platform 140 and pick up the flux and drive the measurement fixture 120 to move to the measurement machine 130.
The soldering flux glue-climbing height detection device provided by the embodiment of the invention comprises a mobile machine table 110, a measurement jig 120, a measurement machine table 130 and a glue-dipping platform 140. Wherein, a glue dipping groove 141 is disposed on one side of the glue dipping platform 140, and the glue dipping groove 141 can accommodate the soldering flux to be dipped. Measure tool 120 and include cylinder 121 and flexible telescopic link 122 that sets up in cylinder 121, be provided with the measurement scale on the telescopic link 122, can be stained with the scaling powder of being stained with in the gluey groove 141 of getting through telescopic link 122. The movable stage 110 is provided with a jig mounting head 111, and the measuring jig 120 can be mounted and fixed on the movable stage 110 by the jig mounting head 111. The measuring machine 130 is provided with a detecting camera 131, and the detecting camera 131 can receive image information of the telescopic rod 122 of the measuring tool 120 after being dipped with the soldering flux. In practical applications, the measuring jig 120 can be fixed by the jig mounting head 111 on the movable machine 110, and then the movable machine 110 is used to move the measuring jig 120 to the glue dipping platform 140, and the telescopic rod 122 of the measuring jig 120 can be extended and retracted under the pneumatic control of the air cylinder 121, so that the scale range of the portion of the measuring jig 120 extending out of the air cylinder 121 can meet the specification requirement corresponding to the glue dipping groove 141 (i.e., the telescopic length is adjusted to enable the telescopic rod 122 to contact with the soldering flux in the glue dipping groove 141 and have a glue dipping space). The measuring jig 120 is pressed down by the moving machine 110 so that the telescopic rod 122 can be stained with the soldering flux in the glue staining groove 141, then the measuring jig 120 is moved to the measuring machine 130, the image information of the telescopic rod 122 stained with the soldering flux is received by the detection camera 131 arranged on the measuring machine 130, and therefore the scale value corresponding to the soldering flux climbing height can be identified according to the image information so as to complete measurement. Can realize the scaling powder through the device and climb the automated inspection of gluing the height to can adjust through the flexible of the telescopic link 122 of measuring tool 120, in order to be applicable to being stained with of different specifications and glue groove 141 and measure, improve this measuring tool 120's extensive suitability.
Optionally, as shown in fig. 2, the soldering flux climbing height detecting device further includes a jig storage rack 150 for storing the measuring jig 120, the mobile machine 110 is further provided with an identification camera 112 (as shown in fig. 1), the jig storage rack 150 is provided with a first identification feature point 151 corresponding to a storage position of the measuring jig 120, and the measuring jig 120 is correspondingly provided with a second identification feature point 123.
Wherein, the jig storage rack 150 may be provided with a through hole corresponding to the telescopic rod 122 of the measuring jig 120, and the measuring jig 120 may be inserted into the through hole through the telescopic rod 122 for storage.
The jig storage rack 150 is provided to facilitate storage of the measuring jig 120. By arranging the recognition camera 112 on the mobile machine 110, correspondingly arranging the first recognition feature point 151 on the jig storage rack 150, and correspondingly arranging the second recognition feature point 123 on the measurement jig 120, the mobile machine 110 can be more conveniently and accurately positioned to the jig storage rack 150 and the measurement jig 120 according to the recognition of the recognition camera 112 on the corresponding recognition feature points, so that the mobile machine 110 can automatically pick and place the measurement jig 120, the automation degree of the soldering flux climbing height detection device is improved, and the detection efficiency is improved.
It should be noted that, when the mobile machine 110 adopts the chip mounter, the recognition camera 112 is correspondingly a mounting head camera on the chip mounter.
Optionally, as shown in fig. 3, a third identification feature point 142 is further disposed on one side of the glue dipping platform 140, where the glue dipping slot 141 is disposed.
Through set up third discernment characteristic point 142 on being stained with gluey platform 140, can utilize discernment camera 112 to the discernment of third discernment characteristic point 142, judge and be stained with gluey platform 140 and be in the horizontality to adjust according to the judged result and be stained with gluey platform 140 so that it can keep the level, thereby improve the effect that measuring tool 120 is stained with and gets the scaling powder, improve measurement accuracy.
Optionally, as shown in fig. 1, a first driving device 143 is disposed on a side of the glue dipping platform 140 away from the glue dipping slot 141, and the first driving device 143 is configured to drive the lifting of the height of the glue dipping platform 140.
Through setting up first drive arrangement 143 in order to being stained with the height of gluing platform 140 and adjusting to can make and climb to glue when high measuring result does not conform to the required requirement of chip dress subsides dress and be stained with the scaling powder, can utilize first drive arrangement 143 to be stained with the regulation of gluing platform 140 in order to change the degree of depth when measuring tool 120 is stained with the scaling powder, thereby make the result of remeasurement can accord with the requirement, and then can directly utilize this to be stained with the groove 141 of being stained with of gluing on gluing platform 140 to carry out the scaling powder and be stained with good welding chip after making the measurement accomplish.
The first driving device 143 may be a linear motor, a linear cylinder 121, etc. with a driving direction along the height direction of the glue dipping platform 140, which is not limited herein.
Optionally, as shown in fig. 1, a cleaning groove 144 is further disposed on one side of the glue dipping platform 140, where the glue dipping groove 141 is disposed, a cleaning agent accommodating groove 145 is disposed on one side of the first driving device 143 away from the glue dipping platform 140, and the cleaning groove 144 is connected to the cleaning agent accommodating groove 145 through an injection tube.
Through setting up clean groove 144 and sanitizer storage tank 145, the sanitizer in sanitizer storage tank 145 can pour into clean groove 144 into through the injection syringe, thereby can utilize moving platform to remove measurement tool 120 to clean groove 144 and insert telescopic link 122 clean inslot 144, clean telescopic link 122 to utilizing the sanitizer to measure tool 120, dispel remaining scaling powder when preceding measurement, thereby avoid the scaling powder to remain and cause measuring error, improve measurement accuracy.
Optionally, as shown in fig. 1, a soldering flux storage area for storing soldering flux is further disposed on one side of the glue dipping platform 140, where the glue dipping groove 141 is disposed, a scraper 146 is disposed in the soldering flux storage area, a second driving device 147 in driving connection with the scraper 146 is disposed on one side of the glue dipping platform 140, which deviates from the glue dipping groove 141, and the second driving device 147 is used for driving the scraper 146 to move towards the glue dipping groove 141.
Deposit the district through setting up the scaling powder and can deposit the scaling powder to deposit the scraper 146 in district through the setting at the scaling powder, can deposit the scaling powder that the district was deposited with the scaling powder under the drive of second drive arrangement 147 and scrape cloth to be stained with in the gluey groove 141 towards being stained with gluey groove 141 removal, thereby realize carrying out automatic filler to the scaling powder of being stained with in the gluey groove 141, thereby further reduce artifical intervention, improve work efficiency.
The second driving device 147 may be a linear motor, a linear cylinder 121, or the like, with a driving direction facing the glue dipping tank 141, which is not limited herein.
In another aspect of the embodiments of the present invention, an execution main body of the soldering flux climbing height detection device based on any one of the above-mentioned methods may be a control device for controlling the soldering flux climbing height detection device, and the like.
As shown in fig. 4, the method includes:
s201: the measuring jig 120 is fixed and installed by a jig installation head 111 provided on the movable stage 110.
S202: the telescopic length of the telescopic rod 122 on the measuring tool 120 is adjusted according to the groove depth of the glue dipping groove 141 arranged on the glue dipping platform 140.
S203: the measuring tool 120 is moved to the glue dipping platform 140 by the moving machine 110, so that the telescopic rod 122 of the measuring tool 120 picks up the soldering flux in the glue dipping groove 141 of the glue dipping platform 140.
S204: the measuring tool 120 is moved to the measuring machine 130 by the moving machine 110.
S205: the image information of the telescopic rod 122 of the measuring tool 120 dipped with the soldering flux is received and the corresponding scale value is identified by the detecting camera 131 arranged on the measuring machine 130.
In the image information obtained after the telescopic rod 122 of the measuring jig 120 is dipped in the soldering flux, the recognition and detection camera 131 may recognize the scale value corresponding to the climbing height of the soldering flux according to the gray value of the soldering flux in the image, and then read the corresponding scale value.
In practical applications, the measuring tool 120 is moved to the adhesive dipping platform 140 by the moving machine 110, so that before the telescopic rod 122 of the measuring tool 120 picks up the soldering flux in the adhesive dipping groove 141 of the adhesive dipping platform 140, the measuring tool 120 can be moved to the measuring machine 130, and the telescopic rod 122 of the measuring tool 120 which is not picked up by the soldering flux is identified and calibrated by the detecting camera 131, so that the accuracy of subsequent measurement identification can be improved, and the measurement precision can be improved.
When the soldering flux climbing height detection device comprises the jig storage rack 150 and the recognition camera 112, the jig storage rack 150 is provided with the first recognition feature point 151 corresponding to the storage position of the measurement jig 120, and the measurement jig 120 is provided with the second recognition feature point 123, the step of installing and fixing the measurement jig 120 by the jig installation head 111 arranged on the mobile machine table 110 may comprise positioning the jig storage rack 150 and the measurement jig 120 according to the recognition of the first recognition feature point 151 and the second recognition feature point 123 by the recognition camera 112; the jig mounting head 111 of the movable machine 110 moves to the storage position of the measuring jig 120 according to the positions of the jig storage rack 150 and the measuring jig 120, and takes and mounts the measuring jig 120. Therefore, the measuring jig 120 can be automatically taken and placed by the movable machine table 110, the automation degree of the soldering flux climbing height detection device is improved, and the detection efficiency is improved.
When the glue dipping platform 140 is further provided with the third identification feature point 142 on the side where the glue dipping groove 141 is provided, before the measuring tool 120 is moved to the glue dipping platform 140 by the moving machine 110 so that the telescopic rod 122 of the measuring tool 120 is dipped in the soldering flux in the glue dipping groove 141 of the glue dipping platform 140, the method may further include identifying the third identification feature point 142 by the identification camera 112 to control the first driving device 143 to adjust the glue dipping platform 140 to be in a horizontal state. Thereby improving the effect of the measuring tool 120 dipping the soldering flux and improving the measuring precision.
The soldering flux climbing height detection method provided by the embodiment of the invention can firstly install and fix the measuring jig 120 through the jig installation head 111 arranged on the movable machine table 110; then, the telescopic length of the telescopic rod 122 on the measuring jig 120 is adjusted according to the groove depth of the glue dipping groove 141 arranged on the glue dipping platform 140; then, the measuring tool 120 is moved to the glue dipping platform 140 by the moving machine 110, so that the telescopic rod 122 of the measuring tool 120 picks up the soldering flux in the glue dipping groove 141 of the glue dipping platform 140; finally, the measuring tool 120 is moved to the measuring machine 130 by the moving machine 110; and receives the image information of the telescopic rod 122 of the measuring tool 120 dipped with the soldering flux and identifies the corresponding scale value through the detection camera 131 arranged on the measuring machine 130. Can realize that the scaling powder climbs the automated inspection of gluing the height to can adjust through the flexible of the telescopic link 122 of measuring tool 120, in order to be applicable to being stained with of different specifications and glue groove 141 and measure, improve this measuring tool 120's extensive suitability.
Optionally, when the soldering flux climbing height detecting device includes the first driving device 143, after receiving the image information of the telescopic rod 122 of the measuring tool 120 stained with the soldering flux and identifying the corresponding scale by the detecting camera 131 arranged on the measuring machine 130, the method further includes:
judging whether the scale value meets a preset range or not;
if not, the height of the glue dipping platform 140 is adjusted by the driving of the first driving device 143, and the measuring tool 120 is moved to the glue dipping platform 140 by the moving machine 110 again, so that the telescopic rod 122 of the measuring tool 120 picks up the soldering flux in the glue dipping groove 141 of the glue dipping platform 140, and the process is repeated until the measured scale value meets the preset range.
The preset range met by the scale value can be a glue climbing height range required by the chip salient point to pick up the soldering flux when the chip is mounted.
Through the steps, the glue dipping platform 140 can be adjusted according to the glue climbing height measurement result, so that the soldering flux can be directly picked up by using the glue dipping groove 141 on the glue dipping platform 140 after the measurement is completed, and the soldering flux meeting the requirement can be obtained and the soldering flux can climb the glue height to perform good chip welding.
Optionally, when the soldering flux creeping glue height detecting device further includes a cleaning groove 144, the measuring tool 120 is moved to the glue dipping platform 140 by the moving machine 110 again, so that before the telescopic rod 122 of the measuring tool 120 picks up the soldering flux in the glue dipping groove 141 of the glue dipping platform 140, the method further includes:
the measuring tool 120 is moved to the glue dipping platform 140 by the moving machine 110, so that the telescopic rod 122 of the measuring tool 120 extends into the cleaning groove 144 to clean the telescopic rod 122.
By cleaning the telescopic rod 122 of the measuring jig 120, the residual soldering flux in the previous measurement can be removed, so that the measurement error caused by the residual soldering flux is avoided, and the measurement precision is improved.
Optionally, when the soldering flux creeping height detecting device includes a soldering flux storage area, a scraper 146 and a second driving device 147, the measuring tool 120 is moved to the glue dipping platform 140 by the moving machine 110, so that before the telescopic rod 122 of the measuring tool 120 dips the soldering flux in the glue dipping groove 141 of the glue dipping platform 140, the method further includes:
the second driving device 147 drives the scraper 146 to move toward the glue dipping groove 141 to scrape the soldering flux in the glue dipping groove 141.
By spreading the flux in the glue dipping groove 141 by the scraper 146, the efficiency of filling the flux into the glue dipping groove 141 can be improved.
It can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific implementation manner and effects of the soldering flux climbing height detection method described above may refer to the corresponding description and explanation in the foregoing embodiment of the soldering flux climbing height detection device, and no further description is provided in the present invention.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a scaling powder is climbed and is glued high detection device which characterized in that includes: remove the board, measure the tool, measure the board and be stained with gluey platform, it is provided with and is stained with gluey groove to be stained with gluey platform one side, it is used for the holding to wait to be stained with the scaling powder of getting to be stained with gluey groove, it includes the cylinder and flexible set up in to measure the tool telescopic link in the cylinder, be provided with the measurement scale on the telescopic link, be provided with the tool installation head on the removal board, the tool installation head is used for installing measure the tool, it is used for removing to remove the board measure the tool extremely be stained with gluey platform, it is provided with the detection camera to measure the board, the detection camera is used for receiving the telescopic link of measuring the tool is stained with gets image information behind the scaling powder.
2. The device for detecting the climbing height of soldering flux as claimed in claim 1, further comprising a jig storage rack for storing the measuring jigs, wherein the mobile machine platform is further provided with an identification camera, the jig storage rack is provided with first identification feature points corresponding to the storage positions of the measuring jigs, and the measuring jigs are correspondingly provided with second identification feature points.
3. The soldering flux glue-climbing height detection device as claimed in claim 2, wherein a third identification feature point is further disposed on one side of the glue dipping platform where the glue dipping groove is disposed.
4. The soldering flux glue-climbing height detection device as defined in claim 1, wherein a first driving device is disposed on a side of the glue dipping platform away from the glue dipping groove, and the first driving device is used for driving the height of the glue dipping platform to rise and fall.
5. The soldering flux glue-climbing height detection device as claimed in claim 4, wherein a cleaning groove is further disposed on one side of the glue dipping platform, a cleaning agent containing groove is disposed on one side of the first driving device away from the glue dipping platform, and the cleaning groove is connected with the cleaning agent containing groove through an injection tube.
6. The soldering flux glue-climbing height detection device according to claim 1, wherein a soldering flux storage area for storing soldering flux is further arranged on one side of the glue dipping platform, which is provided with the glue dipping groove, a scraper is arranged on the soldering flux storage area, a second driving device in driving connection with the scraper is arranged on one side of the glue dipping platform, which is far away from the glue dipping groove, and the second driving device is used for driving the scraper to move towards the glue dipping groove.
7. A soldering flux creeping glue height detection method, which is based on the soldering flux creeping glue height detection device as claimed in any one of claims 1 to 6, and comprises the following steps:
a fixed measuring jig is installed and fixed through a jig installing head arranged on a movable machine table;
adjusting the telescopic length of a telescopic rod on the measuring jig according to the groove depth of a glue dipping groove arranged on the glue dipping platform;
moving the measuring jig to the glue dipping platform through the moving machine table so that the telescopic rod of the measuring jig picks up the soldering flux in the glue dipping groove of the glue dipping platform;
moving the measuring jig to the measuring machine table through the moving machine table;
and receiving the image information of the telescopic rod of the measuring jig after being stained with the soldering flux and identifying the corresponding scale value through a detection camera arranged on the measuring machine.
8. The method for detecting the climbing height of the soldering flux of claim 7, wherein when the soldering flux climbing height detecting device comprises the first driving device, the method further comprises the steps of, after receiving the image information of the telescopic rod of the measuring jig after dipping the soldering flux and identifying the corresponding scales by the detecting camera arranged on the measuring machine, the method further comprising:
judging whether the scale value meets a preset range or not;
if not, the height of the glue dipping platform is adjusted through the driving of the first driving device, and the measuring jig is moved to the glue dipping platform through the moving machine again, so that the telescopic rod of the measuring jig is used for dipping the soldering flux in the glue dipping groove of the glue dipping platform.
9. The method for detecting the climbing height of the soldering flux of claim 8, wherein when the soldering flux climbing height detecting device further comprises a cleaning groove, the measuring tool is moved to the glue dipping platform again by the mobile machine, so that before the telescopic rod of the measuring tool picks up the soldering flux in the glue dipping groove of the glue dipping platform, the method further comprises:
and moving the measuring jig to the glue dipping platform through the mobile machine table, so that the telescopic rod of the measuring jig extends into the cleaning groove to clean the telescopic rod.
10. The method according to claim 7, wherein when the device for detecting the climbing height of the soldering flux comprises a soldering flux storage area, a scraper and a second driving device, the measuring tool is moved to the glue dipping platform by the moving machine, so that before the telescopic rod of the measuring tool picks up the soldering flux in the glue dipping groove of the glue dipping platform, the method further comprises:
the second driving device drives the scraper to move towards the glue dipping groove so as to scrape the soldering flux into the glue dipping groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110020738.4A CN112833799B (en) | 2021-01-07 | 2021-01-07 | Soldering flux glue climbing height detection device and detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110020738.4A CN112833799B (en) | 2021-01-07 | 2021-01-07 | Soldering flux glue climbing height detection device and detection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112833799A CN112833799A (en) | 2021-05-25 |
| CN112833799B true CN112833799B (en) | 2022-07-08 |
Family
ID=75928353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110020738.4A Active CN112833799B (en) | 2021-01-07 | 2021-01-07 | Soldering flux glue climbing height detection device and detection method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112833799B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114549454A (en) * | 2022-02-18 | 2022-05-27 | 岳阳珞佳智能科技有限公司 | Online monitoring method and system for chip glue-climbing height of production line |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW409946U (en) * | 1999-02-08 | 2000-10-21 | Jau Jian Ji | Tool smeared with flux for assembling covered chips |
| CN204361064U (en) * | 2014-12-17 | 2015-05-27 | 江苏长电科技股份有限公司 | A kind of hot pressing upside-down mounting board chip transport sector |
| CN104826773A (en) * | 2015-05-11 | 2015-08-12 | 东莞市沃德精密机械有限公司 | Efficient dispenser for hot melt adhesive |
| CN204892252U (en) * | 2015-06-05 | 2015-12-23 | 苏州晓创光电科技有限公司 | High accuracy adhesive deposite device |
| CN105583490A (en) * | 2016-02-26 | 2016-05-18 | 深圳亚力盛连接器有限公司 | Automatic tin pick-up machine |
| CN107702653A (en) * | 2017-11-13 | 2018-02-16 | 易思维（天津）科技有限公司 | A kind of robot coating three-dimensional information vision inspection apparatus and method |
| CN107790838A (en) * | 2016-08-31 | 2018-03-13 | 广州市诺的电子有限公司 | A kind of automatic infiltration soldering picks |
| CN109990720A (en) * | 2019-04-24 | 2019-07-09 | 江苏杰士德精密工业有限公司 | The measuring device of plate glue height in mobile phone |
| CN110376208A (en) * | 2019-07-18 | 2019-10-25 | 深圳市鹰眼在线电子科技有限公司 | The detection method and spot gluing equipment of point glue equipment and its dispensing size |
| CN110686581A (en) * | 2019-09-24 | 2020-01-14 | 甬矽电子(宁波)股份有限公司 | Novel scaling powder climbs and glues altitude measurement instrument |
| CN110805800A (en) * | 2019-11-27 | 2020-02-18 | 浙江理工大学 | Full-automatic lifting platform for dispensing and control method thereof |
| CN210533240U (en) * | 2019-09-24 | 2020-05-15 | 甬矽电子(宁波)股份有限公司 | Novel scaling powder climbs and glues altitude measurement instrument |
| CN210546478U (en) * | 2019-08-28 | 2020-05-19 | 苏州扬麒电子工业有限公司 | Triaxial testing arrangement that slice electron spare was used |
| CN111584395A (en) * | 2020-04-13 | 2020-08-25 | 苏州通富超威半导体有限公司 | Processing method and processing system beneficial to uniform glue climbing height of chip bottom sealing glue |
| CN112188753A (en) * | 2020-10-28 | 2021-01-05 | 先进光电器材（深圳）有限公司 | Multi-head eutectic machine |
-
2021
- 2021-01-07 CN CN202110020738.4A patent/CN112833799B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW409946U (en) * | 1999-02-08 | 2000-10-21 | Jau Jian Ji | Tool smeared with flux for assembling covered chips |
| CN204361064U (en) * | 2014-12-17 | 2015-05-27 | 江苏长电科技股份有限公司 | A kind of hot pressing upside-down mounting board chip transport sector |
| CN104826773A (en) * | 2015-05-11 | 2015-08-12 | 东莞市沃德精密机械有限公司 | Efficient dispenser for hot melt adhesive |
| CN204892252U (en) * | 2015-06-05 | 2015-12-23 | 苏州晓创光电科技有限公司 | High accuracy adhesive deposite device |
| CN105583490A (en) * | 2016-02-26 | 2016-05-18 | 深圳亚力盛连接器有限公司 | Automatic tin pick-up machine |
| CN107790838A (en) * | 2016-08-31 | 2018-03-13 | 广州市诺的电子有限公司 | A kind of automatic infiltration soldering picks |
| CN107702653A (en) * | 2017-11-13 | 2018-02-16 | 易思维（天津）科技有限公司 | A kind of robot coating three-dimensional information vision inspection apparatus and method |
| CN109990720A (en) * | 2019-04-24 | 2019-07-09 | 江苏杰士德精密工业有限公司 | The measuring device of plate glue height in mobile phone |
| CN110376208A (en) * | 2019-07-18 | 2019-10-25 | 深圳市鹰眼在线电子科技有限公司 | The detection method and spot gluing equipment of point glue equipment and its dispensing size |
| CN210546478U (en) * | 2019-08-28 | 2020-05-19 | 苏州扬麒电子工业有限公司 | Triaxial testing arrangement that slice electron spare was used |
| CN110686581A (en) * | 2019-09-24 | 2020-01-14 | 甬矽电子(宁波)股份有限公司 | Novel scaling powder climbs and glues altitude measurement instrument |
| CN210533240U (en) * | 2019-09-24 | 2020-05-15 | 甬矽电子(宁波)股份有限公司 | Novel scaling powder climbs and glues altitude measurement instrument |
| CN110805800A (en) * | 2019-11-27 | 2020-02-18 | 浙江理工大学 | Full-automatic lifting platform for dispensing and control method thereof |
| CN111584395A (en) * | 2020-04-13 | 2020-08-25 | 苏州通富超威半导体有限公司 | Processing method and processing system beneficial to uniform glue climbing height of chip bottom sealing glue |
| CN112188753A (en) * | 2020-10-28 | 2021-01-05 | 先进光电器材（深圳）有限公司 | Multi-head eutectic machine |
Non-Patent Citations (1)
| Title |
|---|
| 底部焊端类器件（BTC）的点胶填充及灌封工艺;杨根林;《第九届中国高端SMT学术会议论文集》;20151103;第124-142页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112833799A (en) | 2021-05-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107553083B (en) | A kind of preceding windscreen wiper transmission arm automatic setup system | |
| WO2019144431A1 (en) | Smoke alarm automatic assembly production line | |
| CN112833799B (en) | Soldering flux glue climbing height detection device and detection method | |
| CN207841351U (en) | A kind of mobile phone camera eyeglass abutted equipment | |
| CN113156596B (en) | Three-piece coupling device and coupling method | |
| CN113696638A (en) | Glass substrate circuit printing method and equipment | |
| CN111112149A (en) | Automatic chip testing machine | |
| CN111878494B (en) | Screen pasting method and screen pasting equipment for mobile terminal | |
| CN110062530A (en) | A kind of numerical control drilling machine of processing PCB plate and the cutter replacing method of numerical control drilling machine | |
| CN211352664U (en) | Vision-guided circuit board paster welding system | |
| US6471117B1 (en) | Transfer fluxing method and apparatus for component placement on substrate | |
| CN115372672A (en) | Workbench of probe device, control method and probe testing method | |
| US11317551B2 (en) | Component mounter | |
| JP3823719B2 (en) | Electronic component mounting apparatus and electronic component mounting method | |
| JP6849547B2 (en) | Eccentricity correction method for parts holder | |
| CN113290361A (en) | Automatic support assembling equipment and using method thereof | |
| CN218937328U (en) | Detection device for solder paste thickness | |
| CN215354395U (en) | Substitute artifical constructional device who paints matching fluid | |
| CN115338088B (en) | Adhesive dispensing device | |
| JPH09246790A (en) | Device for loading electronic part | |
| CN220006301U (en) | Lamp panel repair equipment | |
| CN116660569B (en) | Multifunctional quantitative liquid dripping workstation | |
| CN115465000B (en) | Assembling equipment and assembling method | |
| CN216880075U (en) | Die bonding equipment | |
| CN117794221A (en) | Full-automatic chip mounting system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |