CN112820673A - Transfer apparatus, transfer method, and display device - Google Patents

Transfer apparatus, transfer method, and display device Download PDF

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Publication number
CN112820673A
CN112820673A CN202110181082.4A CN202110181082A CN112820673A CN 112820673 A CN112820673 A CN 112820673A CN 202110181082 A CN202110181082 A CN 202110181082A CN 112820673 A CN112820673 A CN 112820673A
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Prior art keywords
substrate
transfer
driving
transferred
target substrate
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CN202110181082.4A
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Chinese (zh)
Inventor
李维善
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Shenzhen Haiwei Electronic Materials Co ltd
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Nanchang Guangheng Electronic Center LP
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Priority to CN202110181082.4A priority Critical patent/CN112820673A/en
Publication of CN112820673A publication Critical patent/CN112820673A/en
Priority to PCT/CN2022/075591 priority patent/WO2022171102A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The embodiment of the invention discloses transfer equipment, a transfer method and a display device. The transfer apparatus includes: the transfer substrate is arranged opposite to the target substrate, the surface of the transfer substrate close to the target substrate is used for placing components to be transferred, and the components to be transferred are arranged in an array; the driving array substrate is provided with driving execution parts, the driving execution parts are arranged in an array mode, and the driving execution parts are used for driving the corresponding to-be-transferred components to be separated from the transfer substrate and transferred to the target substrate. Compared with the prior art, the embodiment of the invention improves the precision and yield of mass transfer.

Description

Transfer apparatus, transfer method, and display device
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a transfer device, a transfer method and a display device.
Background
With the development of display technologies, a display device is gradually replaced by a Liquid Crystal Display (LCD) display mode by a Cathode Ray Tube (CRT) display mode, and recently, an Organic Light Emitting Diode (OLED) display mode, a Micro LED (Micro LED or MINI LED) display mode, and the like have been rapidly developed as a new generation display technology. Among them, Micro LEDs are called future display technologies due to their advantages of high response speed, high color gamut, high brightness, and long lifetime. The LCD can improve contrast and color gamut in cooperation with the MINI LED backlight technology, the quantum dot technology, or the high color rendering technology. This allows the LCD to reduce contrast and color gamut disadvantages compared to OLEDs while maintaining lifetime and brightness advantages.
However, Micro LEDs and MINI LEDs require the use of mass transfer technology during fabrication. At present, mechanical parts beating, stamp type, electrostatic or fluid assembly and the like are adopted in a mass transfer technology, but the existing transfer technology has the problems of low precision and low yield, and is difficult to support mass production and popularization of Micro LED and MINI LED technologies, so that the transfer technology becomes one of the bottlenecks of the Micro LED and MINI LED technologies.
Disclosure of Invention
The embodiment of the invention provides transfer equipment, a transfer method and a display device, which are used for improving the precision and the yield of mass transfer.
In a first aspect, an embodiment of the present invention provides a transfer apparatus, including:
the transfer substrate is arranged opposite to the target substrate, the surface of the transfer substrate close to the target substrate is used for placing components to be transferred, and the components to be transferred are arranged in an array;
the driving array substrate is provided with driving execution parts, the driving execution parts are arranged in an array mode, and the driving execution parts are used for driving the corresponding to-be-transferred components to be separated from the transfer substrate and transferred to the target substrate.
Optionally, the driving execution part comprises a driving circuit and an energy triggering component; the driving circuit comprises a switching device, wherein the switching device is used for responding to a control signal to conduct and transmitting a driving signal to the energy triggering part; the energy trigger component responds to the driving signal and generates energy trigger to drive the corresponding component to be transferred to be separated from the transfer substrate.
Optionally, the switching device comprises a triode or a field effect transistor;
alternatively, the energy triggering part includes at least one of an electromagnetic device, a heat source device, an optical device, a mechanical device, and a chemical and electrostatic device.
Optionally, the transfer device further comprises:
an auxiliary part arranged on the surface of the transfer substrate close to the target substrate; the auxiliary parts correspond to the components to be transferred one by one and are used for clamping the components to be transferred or arranged between the components to be transferred and the transfer substrate; the auxiliary part is used for releasing the component to be transferred under the action of the energy triggering component; or the transfer device is used for assisting the alignment of the component to be transferred and the target substrate.
Optionally, the driving array substrate further includes:
the gate gating module is connected with the switching device on the driving array substrate; the gate gating module is used for conducting the switching devices line by line or conducting at least part of the switching devices of the lines simultaneously;
the source gating module is connected with the switching device on the driving array substrate; the source gating module is used for simultaneously sending the driving signals to the energy triggering components of at least partial columns through the switching devices;
wherein the rows extend in a first direction and the columns extend in a second direction; alternatively, the rows extend in the second direction and the columns extend in the first direction; the first direction and the second direction intersect.
Optionally, the transfer device further comprises:
an optical measuring device for measuring positional information contained in the transfer substrate or the target substrate;
the data processing device is connected with the optical measuring device; the data processing device is used for determining the number and the positions of the components to be transferred on the transfer substrate according to the position information;
the array driving device is connected with the data processing device; the array driving device is used for driving the corresponding driving execution part on the driving array substrate to work according to the number and the position of the components to be transferred, which need to be transferred.
Optionally, the transfer device further comprises:
the moving device is used for controlling the driving array substrate, the transfer substrate and the target substrate to move; the driving array substrate and the target substrate are kept relatively static, and the transfer substrate and the target substrate are aligned in the displacement process;
alternatively, the transfer apparatus includes:
and the moving device is used for driving the transfer substrate to move so as to align the transfer substrate with the target substrate.
Optionally, the target substrate is another transfer substrate, a backlight driving backplane or a display driving backplane.
Optionally, the arrangement density of the driving execution part for driving the array substrate is the same as the arrangement density of the components to be transferred of the target substrate;
or the arrangement density of the driving execution part for driving the array substrate is 1/n of the arrangement density of the components to be transferred of the target substrate, and n is a positive integer.
In a second aspect, an embodiment of the present invention further provides a transfer method, which may use the transfer apparatus provided in any embodiment of the present invention, where the transfer method includes:
providing a target substrate;
providing a transfer substrate, and aligning the transfer substrate with the target substrate; the parts to be transferred are arranged on one side of the transfer substrate and are arranged in an array;
providing a driving array substrate, placing the driving array substrate on one side of the transfer substrate, which is far away from the target substrate, aligning with the target substrate and keeping the driving array substrate relatively static; the driving array substrate is provided with driving execution parts which are arranged in an array;
driving at least a part of the driving performing part to separate the corresponding component to be transferred from the transfer substrate to be transferred onto the target substrate; wherein the transferred component satisfies a transfer accuracy.
Optionally, the driving at least part of the driving performing part to separate the corresponding component to be transferred from the transfer substrate to be transferred onto the target substrate includes:
measuring the positions of the transfer substrate and the target substrate by adopting an optical measuring device to obtain transfer information;
the data processing device processes according to the transfer information, determines whether the position of the component to be transferred on the transfer substrate meets the transfer precision or not, and obtains quantity information and position information;
the array driving device drives the corresponding driving execution part on the driving array substrate to work according to the quantity information and the position information;
or, the driving at least a part of the driving performing part to separate the corresponding component to be transferred from the transfer substrate to be transferred onto the target substrate includes:
acquiring pre-stored quantity information and position information of the components needing to be transferred;
and the array driving device drives the corresponding driving execution part on the driving array substrate to work according to the quantity information and the position information.
Optionally, the transfer information includes at least one of:
a position of a component to be transferred on the transfer substrate, a shape of the component to be transferred on the transfer substrate, a crack of the component to be transferred on the transfer substrate, a direction of the component to be transferred on the transfer substrate, a position of an alignment mark on the transfer substrate, a shape of the alignment mark on the transfer substrate, a direction of the alignment mark on the transfer substrate; the alignment mark position on the target substrate, the alignment mark shape on the target substrate, the alignment mark direction on the target substrate, the pad position on the target substrate, the pad shape on the target substrate, and the pad direction on the target substrate.
Optionally, the step of transferring the component to be transferred is performed once, and the target substrate is a driving backplane;
or, the step of transferring the component to be transferred is repeatedly performed at least twice, the transfer accuracy in the step performed later being higher than the transfer accuracy in the step performed earlier; wherein the target substrate is another transfer substrate before being transferred to the driving backplane.
Optionally, the arrangement density of the driving execution part for driving the array substrate is the same as the arrangement density of the components to be transferred of the target substrate; if a part of the components to be transferred is transferred in the step of transferring the components to be transferred for the first time, after the part of the components to be transferred is transferred, the method further includes:
carrying out realignment on the transfer substrate and the target substrate, and executing the step of transferring the components to be transferred until all the remaining components to be transferred are transferred to the target substrate;
or the arrangement density of the driving execution part of the driving array substrate is 1/n of the arrangement density of the components to be transferred of the target substrate, and n is a positive integer; after part of the components to be transferred are transferred, the method further comprises the following steps: and performing the step of realigning the transfer substrate with the target substrate and the step of transferring the component to be transferred at least n-1 times.
In a third aspect, an embodiment of the present invention further provides a display device, including: the display device comprises a driving back plate and a display chip arranged on the driving back plate, wherein the display chip is transferred onto the driving back plate by adopting the transfer method according to any embodiment of the invention.
The embodiment of the invention is provided with the driving array substrate in the transfer equipment, and the driving execution part is arranged on the driving array substrate so as to drive the corresponding component to be transferred to be separated from the transfer substrate. By the arrangement, only the parts to be transferred which meet the transfer precision can be transferred in the process of one transfer, and other parts to be transferred which do not meet the transfer precision can be transferred by carrying out the alignment again. Compared with the existing mass transfer technology, the embodiment of the invention realizes the accurate control and transfer of the parts to be transferred, thereby improving the transfer precision and transfer yield.
Drawings
Fig. 1 is a schematic perspective view of a transfer apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view taken along line A-A of FIG. 1;
fig. 3 is a schematic structural diagram of a field effect transistor according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a connection between a transfer substrate and an auxiliary portion according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another connection between a transfer substrate and an auxiliary portion according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a driving array substrate according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of another transfer apparatus provided in an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of another transferring apparatus according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of another transferring apparatus provided in an embodiment of the present invention;
fig. 10 is a schematic structural diagram of another transferring apparatus provided in an embodiment of the present invention;
fig. 11 is a schematic flow chart of a transfer method according to an embodiment of the present invention;
FIG. 12 is a schematic diagram of a transfer method provided by an embodiment of the present invention in various steps;
FIG. 13 is a schematic illustration of another transfer method provided by an embodiment of the present invention in various steps;
FIG. 14 is a schematic diagram of another transfer method provided by an embodiment of the present invention in various steps;
fig. 15 is a schematic diagram of another transfer method provided in an embodiment of the present invention in each step.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
The embodiment of the invention provides transfer equipment. Fig. 1 is a schematic perspective view of a transfer apparatus according to an embodiment of the present invention, and fig. 2 is a schematic cross-sectional view taken along a-a in fig. 1. Referring to fig. 1 and 2, the transferring apparatus includes: a transfer substrate 100 and a driving array substrate 200. The transfer substrate 100 is disposed opposite to the target substrate 300, the transfer substrate 100 is close to the surface 101 of the target substrate 300 for placing the components (e.g., chips 110) to be transferred, and the components to be transferred are arranged in an array. That is, in the transfer process of the components to be transferred, the components to be transferred arranged in an array need to be first placed on the transfer substrate 100 near the surface 101 of the target substrate 300. The driving array substrate 200 is provided with driving execution parts 210, the driving execution parts 210 are arranged in an array, and the driving execution parts 210 are used for driving the corresponding components to be transferred to be separated from the transfer substrate 100 and transferred to the target substrate 300.
The parts to be transferred are parts that need to be transferred in large batches, for example parts with dimensions in the range of 1um-5 mm. Illustratively, the component to be transferred includes a chip, other circuit or semiconductor device, an auxiliary component for transfer, and the like. The following description will be given taking the component to be transferred as a chip, but the invention is not limited thereto. The chip 110 may be, for example, a light emitting device chip, and specifically, the chip 110 may be a Micro LED chip or a MINI LED chip, and a large number of light emitting device chips 110 are transferred, and finally, a display apparatus may be formed. The transfer substrate 100 may also be referred to as a transition carrier plate or a temporary carrier plate for pre-arranging the chips 110 according to the sizes of the chips to be transferred. In general, the position and orientation of the chips 110 placed on the transfer substrate 100 may be imprecise, or even disorganized. The target substrate 300 may also be referred to as a target carrier plate, i.e., the transfer target location of the chip 110 is a location on the target carrier plate. The driving array substrate 200 refers to a substrate provided with driving performing parts 210 (i.e., a driving array) arranged in an array. The driving array substrate 200 may be located at a side of the transfer substrate 100 away from the target substrate 300 (as shown in fig. 1 and 2); or may be located on the other side of the transfer substrate 100, and may be set as needed in practical applications. By adopting the transfer device provided by the embodiment of the invention, the position precision of the chip 110 transferred to the target bearing plate can be higher than that of the chip on the transfer substrate 100. Optionally, high-precision alignment marks (Mark) are disposed on the transfer substrate 100, the target substrate 300 and the driving array substrate 200 to achieve accurate alignment of the substrates, so as to be beneficial for improving the transfer precision of the chip 110, for example, the precision of the alignment marks may be in a range of 1 μm to 5 mm.
Illustratively, the method for transferring the chip by adopting the transfer device comprises the following steps: providing a target substrate 300; providing a transfer substrate 100, arranging chips 110 to be transferred in an array arrangement on one side 101 of the transfer substrate 100, and aligning the transfer substrate 100 with a target substrate 300; providing a driving array substrate 200, placing the driving array substrate 200 on one side of the transfer substrate 100 far away from the target substrate 300, aligning with the target substrate 300 and keeping relatively still; at least a part of the driving actuators 210 is driven to separate the corresponding chips 110 from the transfer substrate 100 and transfer them onto the target substrate 300 (knock-out). Wherein the transferred chip 110 satisfies the transfer accuracy. The chip 110 corresponding to the driving execution unit 210 refers to the chip 110 directly facing the driving execution unit 210 after the transfer substrate 100 is aligned, for example, the first driving execution unit 210 from the left corresponds to the first chip 110 from the left in fig. 1; if the first chip 110 from the left satisfies the transfer accuracy, the driving execution unit 210 can drive the chip 110 to be separated from the transfer substrate 100 and transferred onto the target substrate 300.
As can be seen, the embodiment of the present invention drives the corresponding chip 110 to be separated from the transfer substrate 100 by disposing the driving array substrate 200 in the transfer apparatus and disposing the driving performing part 210 on the driving array substrate 200. In this way, only the chips 110 that satisfy the transfer accuracy can be transferred in one transfer process, and the other chips 110 that do not satisfy the transfer accuracy can be transferred by performing the alignment again. Compared with the existing mass transfer technology, the embodiment of the invention realizes the accurate control and transfer of the chip 110 to be transferred, thereby improving the transfer precision and the transfer yield.
In the embodiment of the present invention, the driving performing part 210 may be disposed in various ways, and any embodiment that can separate the driving chip 110 from the transfer substrate 100 is within the protection scope of the present invention. Some of these are described below, but the present invention is not limited thereto.
With continued reference to fig. 1 and 2, in one embodiment of the present invention, optionally, the driving execution part 210 includes a driving circuit 211 and an energy triggering component 212; the driving circuit 211 includes a switching device for turning on in response to a control signal, transmitting a driving signal to the energy triggering part 212; the energy triggering part 212 generates an energy trigger to drive the corresponding chip 110 to be separated from the transfer substrate 100 in response to the driving signal.
The switching device comprises a semiconductor device such as a triode or a field effect transistor. Fig. 3 is a schematic structural diagram of a field effect transistor according to an embodiment of the present invention. Referring to fig. 3, in one embodiment of the present invention, the fet optionally includes a Gate, a Source and a Drain, illustratively, the Gate being connected to the control signal, the Source being connected to the drive signal, and the Drain being connected to the energy triggering component 212. When the Gate of the fet receives the control signal, the Source and the Drain are turned on, and the driving signal is transmitted to the energy triggering unit 212. The switching device may be a separately arranged triode or a field effect transistor, or may be a combination of semiconductor devices, such as a Complementary Metal Oxide Semiconductor (CMOS), and the like, and may be arranged as required in actual needs. The switching device may be formed in a Thin Film Transistor (TFT) to reduce the thickness of the driving array substrate 200 and the size of the transfer apparatus. Illustratively, the thin film transistor or the field effect transistor array may be directly fabricated on the substrate of the driving array substrate 200 using a semiconductor process.
The energy triggering part 212 includes at least one of an electromagnetic device, a heat source device, an optical device, a mechanical device, and a chemical and electrostatic device. Wherein, the electromagnetic device can be an electromagnetic coil, and can generate electromagnetic change under the drive of the drive signal; accordingly, the chip 110 itself may be provided with a magnetic force capable of being separated from the transfer substrate 100 upon electromagnetic change. The heat source device can be a resistance wire, for example, and can generate heat energy change under the driving of a driving signal; accordingly, the chip 110 and the transfer substrate 100 may be bonded together by a bonding adhesive having a low melting point, and after the temperature is increased, the bonding adhesive is melted, and the chip 110 can be separated from the transfer substrate 100. The optical device may be, for example, a laser source, and may generate laser light when driven by a driving signal; accordingly, the chip 110 and the transfer substrate 100 may be fixed to each other by an optically excited substance, and the optically excited substance may generate a substance state change to release the chip 110 after being irradiated by the laser. The mechanical device can be, for example, an ultrasonic wave generating device, memory metal or piezoelectric ceramic, and the like, and can be deformed under the driving of a driving signal; accordingly, the chip 110 is separated from the transfer substrate 100 by an external force. The chemical device may be, for example, an electrochemical device, and the electrochemical device is driven by a driving signal to generate a chemical change, such as a thermal energy change or a substance state change. The energy triggering component 212 may comprise one, two or more of the above-mentioned devices, and those skilled in the art will appreciate that if the energy triggering component 212 comprises two or more of the above-mentioned devices, two or more driving circuits may be required to be arranged accordingly.
Therefore, the driving execution part 210 according to the embodiment of the present invention includes the driving circuit 211 and the energy triggering components 212 corresponding to the driving circuit 211 one by one, and the driving circuit 211 drives the corresponding energy triggering components 212 to work, so as to drive the corresponding chip 110 to be separated from the transfer substrate 100, thereby further improving the positioning accuracy and the transfer accuracy of the chip 110.
For example, the energy triggering component 212 may be directly fabricated on the driving array substrate 200 by using a semiconductor process; it is also possible to separately fabricate the energy triggering part 212 and then connect the energy triggering part 212 and the driving array substrate 200 by means of bonding or conductive medium.
In the above embodiments, the chip 110 itself may be separated from the transfer substrate 100 by the energy triggering member 212, and an auxiliary unit may be provided to change energy by the energy triggering member 212, which will be described in detail below.
Fig. 4 is a schematic structural diagram of a connection between a transfer substrate and an auxiliary portion according to an embodiment of the present invention. Referring to fig. 4, in an embodiment of the present invention, optionally, an auxiliary portion 120 is disposed on the transfer substrate 100 near the surface 101 of the target substrate 300; the auxiliary portions 120 correspond to the chips 110 one by one, and are used for clamping the chips 110, and the auxiliary portions 120 release the chips 110 under the action of the energy triggering parts 212. For example, if the energy triggering component 212 is an electromagnetic device, the electromagnetic device may generate electromagnetic changes under the driving of the driving signal; accordingly, the auxiliary portion 120 has a magnetic force, is attached to the transfer substrate 100, and can hold the chip 110 and attach the chip 110 to the transfer substrate 100; upon the electromagnetic change, the auxiliary portion 120 is separated from the transfer substrate 100, thereby separating the chip 110 from the substrate. If the energy triggering component 212 is a heat source device, the driving of the driving signal can generate heat energy change; accordingly, the auxiliary portion 120 and the transfer substrate 100 are bonded together by the adhesive with a low melting point, and can clamp the chip 110 to attach the chip 110 to the transfer substrate 100; after the temperature is increased, the adhesive paste is melted, and the auxiliary portion 120 is separated from the transfer substrate 100, thereby separating the chip 110 from the transfer substrate 100. Alternatively, the energy triggering component 212 is a heat source device, and the driving of the driving signal can generate the thermal energy change; correspondingly, the auxiliary portion 120 is a hot melt material, and is fixed to the transfer substrate 100, and can clamp the chip 110 to attach the chip 110 to the transfer substrate 100; after the temperature is increased, the auxiliary part 120 is melted, thereby releasing the chip 110 such that the chip 110 is separated from the transfer substrate 100. If the energy triggering component 212 is an optical device, laser can be generated under the driving of the driving signal; accordingly, the auxiliary portion 120 and the transfer substrate 100 are fixed to the transfer substrate 100 by the photo-excited substance, and can hold the chip 110 to attach the chip 110 to the transfer substrate 100; after the laser irradiation, the substance state of the optically excited substance changes, and the auxiliary portion 120 is separated from the transfer substrate 100, thereby separating the chip 110 from the transfer substrate 100. Alternatively, the energy triggering component 212 is a light emitting device, and can generate laser light under the driving of the driving signal; accordingly, the auxiliary portion 120 is a photo-excited substance, is fixed to the transfer substrate 100, and can hold the chip 110 to attach the chip 110 to the transfer substrate 100; after being irradiated with the laser, the auxiliary portion 120 undergoes a change in state of matter, thereby releasing the chip 110 so that the chip 110 is separated from the transfer substrate 100.
Based on the above embodiments, optionally, the auxiliary portion 120 may also be used as an alignment mark to assist in completing the alignment between the chip 110 and the target substrate 300, so as to improve the alignment accuracy of the chip 110.
The auxiliary portion 120 for holding the chip 110 may be left or removed from the final product, and may be set as needed in practical applications.
Fig. 5 is a schematic structural diagram of another connection between a transfer substrate and an auxiliary portion according to an embodiment of the present invention. Referring to fig. 5, in an embodiment of the present invention, optionally, an auxiliary portion 120 is disposed on the transfer substrate 100 near the surface 101 of the target substrate 300; the auxiliary parts 120 are in one-to-one correspondence with the chips 110, and are disposed between the chips 110 and the transfer substrate 100; the auxiliary portion 120 is used to be separated from the transfer substrate 100 by the energy trigger part 212 to release the chip 110. Illustratively, the chip 110 and the auxiliary portion 120 are bonded together by solder paste, conductive adhesive, or the like.
For example, if the energy triggering component 212 is an electromagnetic device, the electromagnetic device may generate electromagnetic changes under the driving of the driving signal; accordingly, the auxiliary unit 120 has a magnetic force and is attached to the transfer substrate 100; upon the electromagnetic change, the auxiliary portion 120 is separated from the transfer substrate 100, thereby separating the chip 110 from the substrate. If the energy triggering component 212 is a heat source device, the driving of the driving signal can generate heat energy change; accordingly, the auxiliary part 120 and the transfer substrate 100 are bonded together by the adhesive having a lower melting point; after the temperature is increased, the adhesive paste is melted, and the auxiliary portion 120 is separated from the transfer substrate 100, thereby separating the chip 110 from the transfer substrate 100. If the energy triggering component 212 is an optical device, laser can be generated under the driving of the driving signal; accordingly, the auxiliary portion 120 and the transfer substrate 100 are fixed to each other by the optically excited substance; after the laser irradiation, the substance state of the optically excited substance changes, and the auxiliary portion 120 is separated from the transfer substrate 100, thereby separating the chip 110 from the transfer substrate 100.
Fig. 6 is a schematic structural diagram of a driving array substrate according to an embodiment of the present invention. Referring to fig. 6, in an embodiment of the present invention, optionally, the driving array substrate 200 is an active driving array, and the driving array substrate 200 further includes a gate gating module 220 and a source gating module 230. The gate gating module 220 is connected to the switching device (driving circuit 211) on the driving array substrate 200; the gate gating module 220 is used to turn on the switching devices on a row-by-row basis or to turn on at least some of the switching devices of a row simultaneously. The source gating module 230 is connected with the switching device on the driving array substrate 200; the source gating module 230 is configured to simultaneously send a driving signal to at least some of the energy triggering components 212 of the columns via the switching devices.
The driving method of the gate gating module 220 is to turn on the switching devices row by row, or to turn on at least some rows of switching devices simultaneously, and may be selected according to actual needs. The driving mode of the source gating module 230 is to send a driving signal to some of the energy triggering components 212 of the columns through the switching devices, or send a driving signal to all of the energy triggering components 212 of the columns, and may be selected according to actual needs.
For example, the driving executing portion 210 on the driving array substrate 200 may be scanned in a row/column scanning manner, at this time, the gate gating module 220 controls the switching devices to be turned on and off row by row, and at the same time, the driving signal corresponding to the column is output by the source gating module 230 and connected to the source writing of the corresponding switching device, so as to drive the energy triggering component 212 to execute the punching operation, and enable the corresponding chip 110 to perform the transferring operation. For example, the chips 110 in the first row, the second column, the third row, the third column, the fourth row, the fourth column, the fifth row, the fifth column and the sixth row are consistent with the transfer accuracy, and the source gating module 230 writes a driving signal to the switching device of the first column when the gate gating module 220 scans the switching device of the first row; when the gate gating module 220 scans the second row of switching devices, the source gating module 230 writes a driving signal to the switching devices of the second column; … … and so on until the gate gating module 220 scans to the sixth row of switching devices, the source gating module 230 writes the drive signal to the switching devices of the sixth column.
For example, the driving executing portion 210 on the driving array substrate 200 may be scanned in a surface scanning manner, at this time, the gate gating module 220 controls on and off of multiple rows of switching devices simultaneously, and at this time, the driving signal of the corresponding column is output by the source gating module 230 and connected to the source writing of the corresponding switching device, so as to drive the energy triggering component 212 to execute the punching operation, and enable the corresponding chip 110 to perform the transferring operation. For example, the chips 110 positioned at the first three columns of the first row, the first three columns of the second row, the first three columns of the third row, and the first three columns of the fourth row meet the transfer accuracy, the gate gating module 220 simultaneously scans the switching devices of the first four rows, and the source gating module 230 simultaneously writes the driving signals to the switching devices of the first three columns.
The embodiment of the invention adopts the active driving array, can realize the scanning mode of row/column scanning or surface scanning, ensures that scanning and printing can be quickly executed, improves the transfer efficiency and stability and simplifies the operation difficulty.
It is to be noted that, as exemplarily shown in fig. 6, the rows extend along a first direction X, the columns extend along a second direction Y, and the first direction X and the second direction Y intersect. This is not a limitation of the invention, and in other embodiments, the row and column directions may be reversed, for example, the rows extend in the second direction Y and the columns extend in the first direction X.
Fig. 7 is a schematic structural diagram of another transfer apparatus provided in an embodiment of the present invention. Referring to fig. 7, in an embodiment of the present invention, the transfer apparatus optionally further includes an optical measurement device 400, a data processing device 500, and an array driving device 600. The optical measurement device 400 is used to measure information contained in the transfer substrate 100 or the target substrate 300; the data processing device 500 is connected with the optical measuring device 400; the data processing device 500 is used for determining the number and the positions of the chips 110 to be transferred on the transfer substrate 100 according to the information measured by the optical measuring device 400; an array driving device 600 connected to the data processing device 500; the array driving apparatus 600 is used to drive the corresponding driving executing unit 210 according to the number and position of the chips 110 to be transferred.
The optical measurement device 400 may be, for example, an automatic optical inspection device (AOI) or an X-Ray (X Ray) measurement device. The measured information of the transfer substrate 100 may be, for example, a position of the chip 110 on the transfer substrate 100, a shape of the chip 110 on the transfer substrate 100, a crack of the chip 110 on the transfer substrate 100, an orientation of the chip 110 on the transfer substrate 100, a position of an alignment mark on the transfer substrate 100, a shape of an alignment mark on the transfer substrate 100, an orientation of an alignment mark on the transfer substrate 100, a position of the chip 110 on the transfer substrate 100, a shape of the chip on the transfer substrate 100, a crack of the chip on the transfer substrate 100, or an orientation of the chip 110 on the transfer substrate 100. The measured position information of the target substrate 300 may be, for example, a position of an alignment mark on the target substrate 300, a shape of an alignment mark on the target substrate 300, a direction of an alignment mark on the target substrate 300, a position of a pad on the target substrate 300, a shape of a pad on the target substrate 300, or a direction of a pad on the target substrate 300. Therefore, the alignment mark detected by the optical measurement apparatus 400 can be a alignment point or an alignment point array. The information detected by the optical measurement apparatus 400 can be used to perform alignment and also can be used to determine whether the chip 110 meets the alignment requirement.
The data processing device 500 may be, for example, a chip 110 having a data processing function, such as a microprocessor, a single chip microcomputer, or a Digital Signal Processor (DSP). Specifically, the data processing device 500 can process and calculate positional information such as the position of the chip 110 on the transfer substrate 100, the position of the alignment mark on the transfer substrate 100, the shape of the alignment mark on the transfer substrate 100, or the direction of the alignment mark on the transfer substrate 100, and can obtain the position of the transfer substrate 100 and the position of each chip 110 on the transfer substrate 100. And, the data processing apparatus 500 can process and calculate the position of the alignment mark on the target substrate 300, the shape of the alignment mark on the target substrate 300, the direction of the alignment mark on the target substrate 300, the position of the pad on the target substrate 300, the shape of the pad on the target substrate 300, or the direction of the pad on the target substrate 300, and the like, and can obtain the position of the target substrate 300 and the position where each chip 110 on the target substrate 300 needs to be accurately placed. The data processing device 500 can process and calculate the chip shape on the transfer substrate 100, the chip crack on the transfer substrate 100, and the like, thereby obtaining the number and the position of the defective chips 110. The data processing apparatus 500 determines, in conjunction with the above information, whether the transfer substrate 100 and the target substrate 300 are aligned, and whether each chip 110 satisfies the transfer accuracy, thereby determining the number and positions of the chips 110 that need to be transferred on the transfer substrate 100.
The array driving apparatus 600 may be, for example, a chip such as a timing controller, and the array driving apparatus 600 generates signals such as timing control signals according to the number and positions of the chips 110 to be transferred to determine the driving methods of the gate gating module 220 and the source gating module 230, so as to drive the corresponding driving execution units 210 to operate and perform the printing. In other embodiments, the array driving apparatus 600 may further be configured to control the size of the driving signal generated by the source gating module 230 according to the size of the chip 110 to be transferred, so as to improve the stability and reliability of the transfer of the chip 110. The array driving device 600 may be disposed on the driving array substrate 200, or may be disposed outside the driving array substrate 200 independently, and may be set as required in practical applications.
In the above embodiments, the data processing device 500 and the array driving device 600 may be the chip 110 separately provided, or may be integrated in the same chip 110, and may be set as needed in practical applications.
It should be noted that, in the above embodiments, the position of the target substrate 300 and the position of the transfer substrate 100 are detected by using an optical detection device, which is not limited to the present invention. In other embodiments, the optical detection device may not be provided, and the number and the positions of the chips 110 to be transferred may be pre-stored, and may be set as required in practical applications.
Fig. 8 is a schematic structural diagram of another transferring apparatus according to an embodiment of the present invention. Referring to fig. 8, in an embodiment of the present invention, the transfer apparatus optionally further includes a moving device 700, and the moving device 700 is configured to drive the transfer substrate 100 to move so as to align the transfer substrate 100 with the target substrate 300. Illustratively, the driving array substrate 200 and the target substrate 300 are kept still and aligned accurately, and only the position of the transfer substrate 100 needs to be adjusted by the motion device 700. In the embodiment of the invention, only the transfer substrate 100 is arranged for displacement alignment, which is beneficial to reducing the manufacturing cost of the transfer equipment.
Fig. 9 is a schematic structural diagram of another transferring apparatus according to an embodiment of the present invention. Referring to fig. 9, the transfer apparatus includes a moving device 700, and the moving device 700 is used to control the driving array substrate 200, the transfer substrate 100, and the target substrate 300 to be displaced. The movement device 700 may be a device capable of controlling the substrate to move, such as a robot. Illustratively, the motion device 700 can drive the array substrate 200 and the target substrate 300 to remain relatively stationary, and the transfer substrate 100 and the target substrate 300 are aligned during the displacement process. For example, dynamic piece beating is performed by calculating the motion advance, thereby being beneficial to further improving the transfer precision.
With continued reference to fig. 9, in the above embodiments, optionally, the target substrate 300 is another transfer substrate 100, a backlight driving backplane or a display driving backplane. If the target substrate 300 is another transfer substrate 100, the transfer of the chip 110 may be repeated for a plurality of times, and the accuracy of the chip 110 is higher every time the transfer is performed. Thus, each transfer operation can have more chips 110 to meet the transfer precision, thereby being beneficial to improving the transfer efficiency. The target substrate 300 may be, for example, a glass substrate or a quartz substrate, which is beneficial to improve the dimensional stability, thermal stability and chemical stability of the target substrate 300, thereby improving the transfer accuracy.
If the target substrate 300 is a backlight driving backplane, in this case, the chip 110 is a backlight chip, and after the chip 110 is completely transferred to the backlight driving backplane, the chip 110 and the bonding pads on the backlight driving backplane need to be soldered by using a hot pressing method, a UV curing method, a reflow soldering method, and the like, so as to form a backlight source in the display device. If the target substrate 300 is a display driving backplane, in this case, the chip 110 is a display chip, and after the chip 110 is completely transferred to the display driving backplane, the chip 110 and the bonding pads on the display driving backplane need to be bonded by using a hot pressing method, a UV curing method, a reflow soldering method, and the like, so as to form pixels in the display device. The driving back plates such as the backlight driving back plate or the display driving back plate are provided with driving circuits, and when the transfer substrate 100 and the driving back plate are aligned and transferred, the transfer substrate 100 and the driving back plate can also play a role in supporting and protecting the chip 110 and protecting the circuits on the driving back plate. The driving backplane can be made of flexible materials such as Polyimide (PI), Polycarbonate (PC) or polyethylene terephthalate (PET) as a substrate to realize flexible display. The circuit film layer in the driving backplane can adopt an Organic Thin Film Transistor (OTFT), an organic field effect transistor (OMOS) or the like. The driving back plate can be a glass substrate or a quartz substrate with a driving circuit engraved thereon, or a flexible printed circuit board (FPC), a Printed Circuit Board (PCB), or the like.
It should be noted that, in the above embodiments, it is exemplarily shown that the arrangement density of the driving execution parts 210 of the driving array substrate 200 is the same as the arrangement density of the chips 110 of the target substrate 300, that is, the driving execution parts 210 correspond to the chips 110 one to one, which is not a limitation to the present invention. In other embodiments, the arrangement density of the driving actuators 210 driving the array substrate 200 may be different from the arrangement density of the chips 110 of the target substrate 300. Fig. 10 is a schematic structural diagram of another transferring apparatus according to an embodiment of the present invention. Referring to fig. 10, optionally, the arrangement density of the driving actuators 210 of the driving array substrate 200 is 1/n of the arrangement density of the chips 110 of the target substrate 300, and n is a positive integer, so that the number of the driving actuators 210 is reduced, which is beneficial to reducing the manufacturing cost. Fig. 10 exemplarily shows a case where n is 2, so that 1/2 chips 110 may be transferred during one transfer, and the remaining 1/2 chips 110 may be transferred during the next transfer.
In summary, the driving array substrate 200 is disposed in the transfer apparatus, and the driving performing part 210 is disposed on the driving array substrate 200, so as to drive the corresponding chip 110 to be separated from the transfer substrate 100. In this way, only the chips 110 that satisfy the transfer accuracy can be transferred in one transfer process, and the other chips 110 that do not satisfy the transfer accuracy can be transferred by performing the alignment again. Compared with the existing mass transfer technology, the embodiment of the invention realizes the accurate control and transfer of the chip 110 to be transferred, thereby improving the transfer precision and the transfer yield. Furthermore, by adopting the active driving array, row/column scanning or area scanning can be realized, thereby improving the efficiency of mass transfer. Further, by providing the optical measurement device 400, the alignment accuracy can be improved, thereby further improving the transfer accuracy. Further, by arranging the moving device 700, the driving array substrate 200 and the target substrate 300 can be kept relatively still, and the transfer substrate 100 and the target substrate 300 can be aligned, so that the transfer substrate 100 and the target substrate 300 can be aligned in a displacement process, and the transfer precision is further improved.
The embodiment of the invention provides a transfer method, which can be used for transferring chips in large batch by adopting the transfer equipment provided by any embodiment of the invention. Fig. 11 is a schematic flowchart of a transfer method according to an embodiment of the present invention, and fig. 12 is a schematic diagram of steps of the transfer method according to the embodiment of the present invention. Referring to fig. 11 and 12, the transfer method includes the steps of:
s110, providing the target substrate 300.
The target substrate 300 may also be referred to as a target carrier plate, i.e., the transfer target position of the chip 110 is a position on the target substrate 300.
S120, providing a transfer substrate 100, and aligning the transfer substrate 100 with a target substrate 300; the chips 110 to be transferred are disposed on one side 101 of the transfer substrate 100, and the chips 110 are arranged in an array.
The transfer substrate 100 may also be referred to as a transition carrier or a temporary carrier, and is used for pre-arranging the chips 110 according to the size of the chips 110 to be transferred. In general, the position and orientation of the chips 110 placed on the transfer substrate 100 may be imprecise, or even disorganized.
S130, providing the driving array substrate 200, placing the driving array substrate 200 on one side of the transfer substrate 100 far away from the target substrate 300, aligning with the target substrate 300 and keeping relatively still.
The driving array substrate 200 is provided with driving execution parts 210, and the driving execution parts 210 are arranged in an array, for example, the driving execution parts 210 correspond to the chips 110 one to one. Alternatively, the driving execution part 210 includes a driving circuit 211 and an energy triggering part 212; the driving circuit 211 includes a switching device for turning on in response to a control signal, transmitting a driving signal to the energy triggering part 212; the energy triggering part 212 generates an energy trigger to drive the corresponding chip 110 to be separated from the transfer substrate 100 in response to the driving signal. The switching device includes a semiconductor device such as a triode or a field effect transistor, and the energy triggering part 212 includes at least one of an electromagnetic device, a heat source device, an optical device, a mechanical device, and a chemical device and an electrostatic device.
Alternatively, the array substrate 200 and the target substrate 300 are driven to synchronously displace and remain relatively stationary, so that the transfer substrate 100 and the target substrate 300 are aligned during the displacement. For example, dynamic piece beating is performed by calculating the motion advance, thereby being beneficial to further improving the transfer precision. Alternatively, both the driving array substrate 200 and the target substrate 300 are stationary, and both are kept absolutely stationary.
S140, the all-drive executing unit 210 is driven to separate the corresponding chip 110 from the transfer substrate 100 and transfer the chip onto the target substrate 300.
Here, since all the chips 110 satisfy the transfer accuracy, all the chips 110 are transferred onto the target substrate 300. Alternatively, a method of determining whether the chip position on the transfer substrate 100 satisfies the transfer requirement is: comparing (for example, subtracting) the chip position on the transfer substrate 100 with a preset position or the chip solder foot position on the target substrate 300, determining whether the two positions are completely overlapped or partially overlapped, and if so, meeting the transfer requirement; if the minimum overlapping area is partially overlapped, the minimum overlapping area is compared with a set threshold value, and whether the threshold value requirement is met or not is determined.
It should be noted that, in the above embodiment, the execution order of S120 and S130 may be interchanged.
In S110 to S140, all the driving executing units 210 are driven to transfer all the chips 110 on the transfer substrate 100 at one time, which is not a limitation of the present invention. In other embodiments, it is also possible to drive the executing part 210 by the driving part to transfer all the chips 110 on the transfer substrate 100 in at least two chip 110 transfer (knock-out) steps. Fig. 13 is a schematic diagram of another transfer method provided in the embodiment of the present invention in each step. Referring to fig. 13, the transfer method includes the steps of:
s210, providing the target substrate 300.
S220, providing the transfer substrate 100, and aligning the transfer substrate 100 with the target substrate 300; the chips 110 to be transferred are disposed on one side of the transfer substrate 100, and the chips 110 are arranged in an array.
Here, the transfer substrate 100 is exemplarily aligned with the target substrate 300 and then arranged in parallel, and in order to clearly show the number of chips 110 transferred, it is shown in fig. 13 that the transfer substrate 100 and the target substrate 300 have different viewing angles.
S230, providing the driving array substrate 200, and placing the driving array substrate 200 on a side of the transfer substrate 100 away from the target substrate 300.
S240, the driving part drives the performing part 210 to separate the corresponding chip 110 from the transfer substrate 100 and transfer the chip onto the target substrate 300.
Only a part of the chips 110 on the transfer substrate 100 satisfy the transfer accuracy, and the chips 110 satisfying the transfer accuracy are transferred by the corresponding driving executing units 210, thereby completing the first piece-making operation.
S250, the transfer substrate 100 and the target substrate 300 are aligned again, and the remaining driving performing part 210 is driven to separate the corresponding chip 110 from the transfer substrate 100 and transfer the chip onto the target substrate 300.
In which the transfer substrate 100 and the target substrate 300 are aligned again so that the remaining chips 110 can satisfy the alignment accuracy. For example, all the remaining chips 110 satisfy the transfer accuracy, and the corresponding driving execution units 210 transfer all the remaining chips 110 to complete the second piece-making operation.
Fig. 12 and 13 illustrate that all chips 110 can be transferred from the transfer substrate 100 to the target substrate 300 by one or two punching operations, but the present invention is not limited thereto, and the punching number in one punching process may be set as necessary in practical applications.
As can be seen from the above steps, the embodiment of the present invention separates the corresponding chip 110 from the transfer substrate 100 by performing the piece-striking operation using the driving performing part 210 on the driving array substrate 200. In this way, only the chips 110 that satisfy the transfer accuracy can be transferred in one transfer process, and the other chips 110 that do not satisfy the transfer accuracy can be transferred by performing the alignment again. Compared with the existing mass transfer technology, the embodiment of the invention realizes the accurate control and transfer of the chip 110 to be transferred, thereby improving the transfer precision and the transfer yield.
In the above embodiments, in S140, S240, and S250, there are various methods for determining the driving execution unit 210 that needs to be driven, and several of them will be described below.
In an embodiment of the present invention, the method adopted by the driving executing part 210 for determining that the driving is required comprises the following steps:
first, the positions of the transfer substrate 100 and the target substrate 300 are measured by an optical measuring device to obtain transfer information.
The optical measuring device may be, for example, an automatic optical inspection device (AOI) or an X-Ray (X Ray) measuring device. The transfer information includes at least one of: a position of the chip 110 on the transfer substrate 100, a shape of the chip on the transfer substrate 100, a chip crack on the transfer substrate 100, a direction of the chip 110 on the transfer substrate 100, a position of the alignment mark on the transfer substrate 100, a shape of the alignment mark on the transfer substrate 100, and a direction of the alignment mark on the transfer substrate 100; the alignment mark position on the target substrate 300, the alignment mark shape on the target substrate 300, the alignment mark direction on the target substrate 300, the pad position on the target substrate 300, the pad shape on the target substrate 300, and the pad direction on the target substrate 300.
Then, the data processing apparatus performs processing based on the transfer information, determines whether or not the chip position on the transfer substrate 100 satisfies the transfer accuracy, and obtains the number information and the position information.
The data processing device may be a chip 110 having a data processing function, such as a microprocessor, a single chip microcomputer, or a Digital Signal Processor (DSP). Specifically, the data processing device can process and calculate positional information such as the position of the chip 110 on the transfer substrate 100, the position of the alignment mark on the transfer substrate 100, the shape of the alignment mark on the transfer substrate 100, or the direction of the alignment mark on the transfer substrate 100, and can obtain the position of the transfer substrate 100 and the position of each chip 110 on the transfer substrate 100. And, the data processing apparatus can process and calculate the position of the alignment mark on the target substrate 300, the shape of the alignment mark on the target substrate 300, the direction of the alignment mark on the target substrate 300, the position of the pad on the target substrate 300, the shape of the pad on the target substrate 300, or the direction of the pad on the target substrate 300, and the like, and can obtain the position of the target substrate 300 and the position where each chip 110 on the target substrate 300 needs to be accurately placed. The data processing device can process and calculate the chip shape on the transfer substrate 100, the chip crack on the transfer substrate 100, and the like, thereby obtaining the number and the position of the defective chips 110. The data processing apparatus determines, in conjunction with the above information, whether the transfer substrate 100 and the target substrate 300 are aligned, and whether each chip 110 satisfies the transfer accuracy, thereby determining the number and positions of the chips 110 that need to be transferred on the transfer substrate 100.
Finally, the array driving device drives the corresponding driving execution unit 210 to operate according to the number information and the position information.
In this embodiment, the driving array substrate 200 is an active driving array, and includes a gate gating module and a source gating module. The array driving device may be, for example, a chip such as a timing controller, and the array driving device may generate signals such as timing control signals according to the number and positions of the chips 110 to be transferred, so as to determine the driving modes of the gate gating module and the source gating module, and may implement the scanning mode of row/column scanning or surface scanning, and drive the corresponding driving execution part 210 to operate, so that scanning and printing may be quickly performed, thereby improving transfer efficiency and stability, and simplifying operation difficulty.
In another embodiment of the present invention, the method for determining the driving execution part 210 needing to be driven comprises the following steps:
first, pre-stored information on the number of chips to be transferred and position information are acquired.
Then, the array driving device drives the corresponding driving execution unit 210 to operate based on the number information and the position information. The driving method of the array driving apparatus is similar to that of the previous embodiment, and is not repeated.
In the above embodiments, optionally, the step of transferring the chip 110 is performed once, that is, the target substrate 300 is a driving backplane. If the target substrate 300 is a backlight driving backplane, the chip 110 is a backlight chip, and after the chip 110 is completely transferred to the backlight driving backplane, the chip 110 and the bonding pads on the backlight driving backplane need to be soldered by means of hot pressing, UV curing, reflow soldering, and the like, so as to form a backlight source in the display device. If the target substrate 300 is a display driving backplane, in this case, the chip 110 is a display chip, and after the chip 110 is completely transferred to the display driving backplane, the chip 110 and the bonding pads on the display driving backplane need to be bonded by using a hot pressing method, a UV curing method, a reflow soldering method, and the like, so as to form pixels in the display device.
In each of the above embodiments, optionally, the step of transferring the chip 110 is repeatedly performed at least twice, and the transfer precision in the later performed step is higher than that in the earlier performed step; wherein the target substrate 300 is another transfer substrate 100 before being transferred to the driving backplane. Specifically, fig. 14 is a schematic diagram of steps of another transfer method provided in an embodiment of the present invention. Referring to fig. 14, the transfer method includes the steps of:
s300, the target substrate 300 is another transfer substrate, and the chips 110 satisfying the first transfer accuracy are transferred from the one transfer substrate 100 to the other transfer substrate (the target substrate 300).
S400, the target substrate 300 is a driving backplane, the target substrate 300 in S300 is taken as the transfer substrate 100, and the chips 110 satisfying the second transfer accuracy are transferred from the transfer substrate 100 to the driving backplane. Wherein the second transfer accuracy is higher than the first transfer accuracy.
According to the embodiment of the invention, all the chips 110 are transferred at least twice, and the transfer precision of the transfer step executed later is higher than that of the transfer step executed earlier, so that more chips 110 can be transferred in one-time piece printing process, the total times of piece printing can be reduced, and the precision of mass transfer can be improved.
It should be noted that, in the above embodiments, the transfer method in the case where the arrangement density of the driving execution parts 210 of the driving array substrate 200 is the same as the arrangement density of the chips 110 of the target substrate 300, that is, the driving execution parts 210 correspond to the chips 110 one to one is exemplarily shown, which is not a limitation of the present invention. In other embodiments, the arrangement density of the driving executing parts 210 of the driving array substrate 200 may be different from the arrangement density of the chips 110 of the target substrate 300, so that the number of the driving executing parts 210 is reduced, which is beneficial to reducing the manufacturing cost. In this case, fig. 15 is a schematic diagram of steps of another transfer method provided by an embodiment of the present invention. Referring to fig. 15, in one embodiment of the present invention, the arrangement density of the driving performing part 210 of the driving array substrate 200 is 1/n of the arrangement density of the chips 110 of the target substrate 300, and n is a positive integer. Taking n-2 as an example, the transfer method comprises the following steps:
s510, aligning the driving array substrate 200 and the target substrate 300 for the first time.
The driving executing part 210 on the driving array substrate 200 corresponds to a half chip position on the target substrate 300.
S520, the corresponding chip 110 satisfying the transfer accuracy is transferred from the transfer substrate 100 to the target substrate 300 by the driving execution unit 210.
S530, performing a second alignment between the driving array substrate 200 and the target substrate 300.
The driving executing part 210 on the driving array substrate 200 corresponds to the remaining half chip position on the target substrate 300.
S540, the remaining chips 110 satisfying the transfer accuracy are transferred from the transfer substrate 100 to the target substrate 300 by the driving execution unit 210.
Through S510 to S540, the transfer of all chips 110 is completed, and the transfer accuracy is the same as in the case where the drive execution unit 210 corresponds one-to-one to the chips 110.
In summary, the transfer method provided in the embodiment of the invention can perform a batch transfer of the chips 110 on the transfer substrate 100 once or multiple batch transfers by using different target substrates 300; each large-batch transfer can be completed by one-time piece printing, and also can be divided into multiple times of alignment piece printing, and the transfer precision and the transfer efficiency are both higher.
The embodiment of the invention also provides a display device, which can be an LCD display device provided with the Mini LED backlight source, an LCD display device provided with the Micro LED backlight source, a Mini LED display device or a Micro LED display device. The display device includes: the display device comprises a driving backboard and a display chip (such as a Mini LED chip or a Micro LED chip) arranged on the driving backboard, wherein the display chip is transferred onto the driving backboard by adopting the transfer method provided by any embodiment of the invention.
The driving backplane may be made of a flexible material such as Polyimide (PI), Polycarbonate (PC), or polyethylene terephthalate (PET), for example, to realize flexible display. The circuit film layer in the driving backplane can adopt an Organic Thin Film Transistor (OTFT), an organic field effect transistor (OMOS) or the like. The driving back plate can be a glass substrate or a quartz substrate with a driving circuit engraved thereon, or a flexible printed circuit board (FPC), a Printed Circuit Board (PCB), or the like.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (15)

1. A transfer apparatus, comprising:
the transfer substrate is arranged opposite to the target substrate, the surface of the transfer substrate close to the target substrate is used for placing components to be transferred, and the components to be transferred are arranged in an array;
the driving array substrate is provided with driving execution parts, the driving execution parts are arranged in an array mode, and the driving execution parts are used for driving the corresponding to-be-transferred components to be separated from the transfer substrate and transferred to the target substrate.
2. The transfer apparatus according to claim 1, wherein the drive execution section includes a drive circuit and an energy triggering member; the driving circuit comprises a switching device, wherein the switching device is used for responding to a control signal to conduct and transmitting a driving signal to the energy triggering part; the energy trigger component responds to the driving signal and generates energy trigger to drive the corresponding component to be transferred to be separated from the transfer substrate.
3. The transfer apparatus of claim 2, wherein the switching device comprises a triode or a field effect transistor;
alternatively, the energy triggering part includes at least one of an electromagnetic device, a heat source device, an optical device, a mechanical device, and a chemical and electrostatic device.
4. The transfer apparatus according to claim 2, characterized by further comprising:
an auxiliary part arranged on the surface of the transfer substrate close to the target substrate; the auxiliary parts correspond to the components to be transferred one by one and are used for clamping the components to be transferred or arranged between the components to be transferred and the transfer substrate; the auxiliary part is used for releasing the component to be transferred under the action of the energy triggering component; or the transfer device is used for assisting the alignment of the component to be transferred and the target substrate.
5. The transfer apparatus of claim 2, wherein the driving array substrate further comprises:
the gate gating module is connected with the switching device on the driving array substrate; the gate gating module is used for conducting the switching devices line by line or conducting at least part of the switching devices of the lines simultaneously;
the source gating module is connected with the switching device on the driving array substrate; the source gating module is used for simultaneously sending the driving signals to the energy triggering components of at least partial columns through the switching devices;
wherein the rows extend in a first direction and the columns extend in a second direction; alternatively, the rows extend in the second direction and the columns extend in the first direction; the first direction and the second direction intersect.
6. The transfer apparatus according to claim 1, further comprising:
an optical measuring device for measuring information contained in the transfer substrate or the target substrate;
the data processing device is connected with the optical measuring device; the data processing device is used for determining the number and the positions of the components to be transferred on the transfer substrate according to the information measured by the optical measuring device;
the array driving device is connected with the data processing device; the array driving device is used for driving the corresponding driving execution part on the driving array substrate to work according to the number and the position of the components to be transferred, which need to be transferred.
7. The transfer apparatus according to claim 1, further comprising:
the moving device is used for controlling the driving array substrate, the transfer substrate and the target substrate to move; the driving array substrate and the target substrate are kept relatively static, and the transfer substrate and the target substrate are aligned in the displacement process;
alternatively, the transfer apparatus includes:
and the moving device is used for driving the transfer substrate to move so as to align the transfer substrate with the target substrate.
8. The transfer apparatus of claim 1, wherein the target substrate is another transfer substrate, a backlight driving backplane, or a display driving backplane.
9. The transfer apparatus according to claim 1, wherein an arrangement density of the drive performing part that drives the array substrate is the same as an arrangement density of components to be transferred of the target substrate;
or the arrangement density of the driving execution part for driving the array substrate is 1/n of the arrangement density of the components to be transferred of the target substrate, and n is a positive integer.
10. A method of transferring, comprising:
providing a target substrate;
providing a transfer substrate, and aligning the transfer substrate with the target substrate; the parts to be transferred are arranged on one side of the transfer substrate and are arranged in an array;
providing a driving array substrate, placing the driving array substrate on one side of the transfer substrate, which is far away from the target substrate, aligning with the target substrate and keeping the driving array substrate relatively static; the driving array substrate is provided with driving execution parts which are arranged in an array;
driving at least a part of the driving performing part to separate the corresponding component to be transferred from the transfer substrate to be transferred onto the target substrate; wherein the transferred component satisfies a transfer accuracy.
11. The transfer method according to claim 10, wherein the driving at least part of the driving performing part to separate the corresponding component to be transferred from the transfer substrate onto the target substrate includes:
measuring the positions of the transfer substrate and the target substrate by adopting an optical measuring device to obtain transfer information;
the data processing device processes according to the transfer information, determines whether the positions of the components on the transfer substrate meet the transfer precision, and obtains quantity information and position information;
the array driving device drives the corresponding driving execution part on the driving array substrate to work according to the quantity information and the position information;
or, the driving at least a part of the driving performing part to separate the corresponding component to be transferred from the transfer substrate to be transferred onto the target substrate includes:
acquiring pre-stored quantity information and position information of the components needing to be transferred;
and the array driving device drives the corresponding driving execution part on the driving array substrate to work according to the quantity information and the position information.
12. The transfer method according to claim 11, wherein the transfer information includes at least one of:
a position of a component to be transferred on the transfer substrate, a shape of the component to be transferred on the transfer substrate, a crack of the component to be transferred on the transfer substrate, a direction of the component to be transferred on the transfer substrate, a position of an alignment mark on the transfer substrate, a shape of the alignment mark on the transfer substrate, a direction of the alignment mark on the transfer substrate; the alignment mark position on the target substrate, the alignment mark shape on the target substrate, the alignment mark direction on the target substrate, the pad position on the target substrate, the pad shape on the target substrate, and the pad direction on the target substrate.
13. The transfer method according to claim 10, wherein the step of transferring the member to be transferred is performed once, the target substrate being a driving back plate;
or, the step of transferring the component to be transferred is repeatedly performed at least twice, the transfer accuracy in the step performed later being higher than the transfer accuracy in the step performed earlier; wherein the target substrate is another transfer substrate before being transferred to the driving backplane.
14. The transfer method according to claim 10,
the arrangement density of the driving execution part of the driving array substrate is the same as that of the components to be transferred of the target substrate; if a part of the components to be transferred is transferred in the step of transferring the components to be transferred for the first time, after the part of the components to be transferred is transferred, the method further includes:
carrying out realignment on the transfer substrate and the target substrate, and executing the step of transferring the components to be transferred until all the remaining components to be transferred are transferred to the target substrate;
or the arrangement density of the driving execution part of the driving array substrate is 1/n of the arrangement density of the components of the target substrate, and n is a positive integer; after part of the components to be transferred are transferred, the method further comprises the following steps: and performing the step of realigning the transfer substrate with the target substrate and the step of transferring the component to be transferred at least n-1 times.
15. A display device, comprising: a driving backplane and a display chip disposed on the driving backplane, wherein the display chip is transferred onto the driving backplane using the transfer method of any of claims 10-14.
CN202110181082.4A 2021-02-09 2021-02-09 Transfer apparatus, transfer method, and display device Pending CN112820673A (en)

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