WO2020093909A1 - Drive substrate manufacturing method, drive substrate, display panel and display device - Google Patents
Drive substrate manufacturing method, drive substrate, display panel and display device Download PDFInfo
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- WO2020093909A1 WO2020093909A1 PCT/CN2019/114087 CN2019114087W WO2020093909A1 WO 2020093909 A1 WO2020093909 A1 WO 2020093909A1 CN 2019114087 W CN2019114087 W CN 2019114087W WO 2020093909 A1 WO2020093909 A1 WO 2020093909A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- the present disclosure relates to the field of display technology, and in particular, to a method for manufacturing a drive substrate, a drive substrate, a display panel, and a display device.
- micro-LED (micro-LED) display panels are manufactured using transfer technology.
- the basic principle of micro-transfer micro-LED arrays is roughly: using a patterned transfer head (Transfer), such as a convex structure Polydimethylsiloxane (PDMS) type transfer head, through the sticky PDMS transfer layer (Transfer layer) to suck the Micro LED from the supply substrate, and then align the PDMS transfer head with the receiving substrate, Then attach the Micro LED attached to the PDMS transfer head to the preset position of the receiving substrate, and then peel off the PDMS transfer head from the receiving substrate to complete the transfer of the Micro LEDs to form the Micro LED array.
- Transfer patterned transfer head
- the purpose of the present disclosure is to provide a method for manufacturing a drive substrate, a drive substrate, a display panel, and a display device.
- a manufacturing method for driving a substrate including: providing a first chip array on a wafer substrate, the first chip array including chips arranged in an array at a first pitch;
- An array of transfer heads provided on a retractable substrate is provided, the array of transfer heads includes transfer heads arranged in an array at a second pitch; the array of transfer heads before expansion is used to pick up a second from the wafer substrate Chip array, the chips in the second chip array are arranged in a third pitch array; the retractable substrate is stretched so that the chips in the second chip array are arranged in a fourth pitch array;
- the transfer head array releasing the target chip in the second chip array to the chip bonding position of the driving substrate.
- the fourth pitch is greater than the third pitch.
- the second pitch is less than or equal to the first pitch.
- the third pitch is greater than or equal to the first pitch.
- the driving substrate includes chip bonding positions arranged in a fifth pitch array; wherein the fifth pitch is greater than or equal to the fourth pitch.
- the first pitch is equal to the second pitch
- the second pitch is equal to the third pitch
- the fourth pitch is equal to the fifth pitch
- the chip is an LED chip
- the first chip array is a first LED array
- providing a first chip array on a wafer substrate includes: Making an epitaxial LED on the wafer substrate; etching the epitaxial LED on the wafer substrate to obtain the first LED array.
- providing an array of transfer heads provided on a retractable substrate includes: providing a fixed structure in which the array is arranged on the retractable substrate; generating on the fixed structure The transfer heads are arranged in an array to form the transfer head array.
- the fixing structure is filled with an elastic material.
- the transfer head includes an electrostatic transfer head or a PDMS transfer head.
- using the transfer head array before stretching to pick up a second chip array from the substrate includes: snapping the transfer head array before stretching to the substrate On the first chip array, so that the transfer head and the corresponding chip are aligned; the loading current causes the transfer head array to generate an electrostatic adsorption force to pick up the required chip from the substrate completely or selectively; The substrate is removed to form the second chip array.
- a driving substrate manufactured by the method described in any of the above embodiments.
- a display panel including the driving substrate as described in the above embodiments.
- a display device including the display panel as described in any one of the above embodiments.
- the transfer head array by scaling the transfer head array to achieve a one-time transfer of the chip on the wafer substrate to the driving substrate, the chip transfer efficiency can be greatly improved, and it can be applied to the micro display Panel production.
- FIG. 1 shows a flowchart of a method of manufacturing a driving substrate in an exemplary embodiment of the present disclosure.
- FIG. 2 shows a flowchart of an exemplary embodiment of step S110 in the embodiment of FIG. 1.
- 3 and 4 show schematic diagrams of an exemplary embodiment of step S110 in the embodiment of FIG. 1.
- FIG. 5 shows a flowchart of an exemplary embodiment of step S120 in the embodiment of FIG. 1.
- FIG. 6 shows a schematic diagram of an exemplary embodiment of step S120 in the embodiment of FIG. 1.
- FIG. 7 shows a schematic diagram of a transfer head array after picking up LED chips on a wafer substrate and before stretching in an exemplary embodiment of the present disclosure.
- FIG. 8 shows a schematic diagram of a stretched transfer head array in an exemplary embodiment of the present disclosure.
- FIG. 9 shows a schematic diagram of a driving substrate in an exemplary embodiment of the present disclosure.
- Example embodiments will now be described more fully with reference to the drawings. However, the example embodiments can be implemented in various forms and should not be construed as being limited to the examples set forth herein; the described features, structures, or characteristics may be combined in one or more embodiments in any suitable manner.
- many specific details are provided to give a sufficient understanding of the embodiments of the present disclosure. However, those skilled in the art will realize that the technical solutions of the present disclosure may be practiced without omitting one or more of the specific details, or other methods, components, devices, steps, etc. may be adopted.
- FIG. 1 shows a flowchart of a method for manufacturing a driving substrate in an exemplary embodiment of the present disclosure.
- the manufacturing method of the driving substrate may include the following steps.
- step S110 a first chip array on a wafer substrate is provided, and the first chip array includes chips arranged in an array at a first pitch.
- the chip may be an LED chip, but the present disclosure is not limited thereto, and it may be any type of chip.
- the wafer substrate is a carrier used in the production of integrated circuits, mostly refers to single crystal silicon wafers.
- Monocrystalline silicon wafers are refined from ordinary silicon sand, and polycrystalline silicon is prepared through a series of measures such as dissolution, purification, and distillation.
- the polycrystalline silicon is then melted and single crystal nuclei are pulled to form a single crystal silicon rod with a certain crystallographic orientation, single crystal silicon After the rod is polished and sliced, it becomes a wafer.
- Wafer is the most commonly used semiconductor material, according to its diameter can be divided into 4 inches, 5 inches, 6 inches, 8 inches and so on. The larger the wafer, the more ICs (Integrated Circuits) that can be produced on the same wafer, which can reduce costs, but the requirements for material technology and production technology are higher.
- step S120 an array of transfer heads provided on a retractable substrate is provided, the array of transfer heads including transfer heads arranged in an array at a second pitch.
- the second distance may be less than or equal to the first distance.
- the second pitch between the transfer heads on the transfer head array before stretching is equal to the first pitch between the chips on the wafer substrate
- all transfers on the transfer head array can be performed The head picks up all the chips on the wafer substrate at once.
- the first pitch is an integer multiple of the second pitch.
- the first pitch is 2 ⁇ m and the second pitch is 1 ⁇ m, which is equivalent to picking up one chip every time a transfer head picks up, all chips can be picked up at once.
- the second pitch may also be greater than the first pitch.
- the transfer head array portion on the retractable substrate may be used to pick up the wafer substrate. The required chip.
- step S130 the transfer head array before expansion is used to pick up a second chip array from the wafer substrate, and the chips in the second chip array are arranged in a third pitch array.
- the third distance may be greater than or equal to the first distance.
- the third pitch of the second chip array on the transfer head array before expansion is equal to the crystal The first pitch of the first chip array on the round substrate.
- the third pitch of the second chip array on the transfer head array before scaling is larger than the wafer liner The first pitch of the first chip array on the bottom.
- the transfer head array may pick up all the chips on the wafer substrate at once, or may pick up part of the chips on the wafer substrate at once, the present disclosure There are no restrictions on this.
- step S140 the retractable substrate is stretched so that the chips in the second chip array are arranged in a fourth pitch array.
- the retractable substrate may be bi-directionally stretched, for example, simultaneously stretched in the horizontal direction and the vertical direction, so that the distance between the chips in the second chip array after stretching reaches the set The fourth pitch.
- the present disclosure is not limited to this, and it is also possible to expand and contract only the horizontal direction, or only the vertical direction, or expand and contract one direction first, and then expand and contract the other direction, as long as the distance after expansion and contraction can be satisfied Just meet the set requirements.
- the fourth pitch may be greater than the third pitch.
- the chip pitch on the wafer such as the LED pitch
- the pixel pitch is usually larger than the LED array on the wafer, for example, the general wafer size is 8 inches, and the medium-sized notebook has 15 inches
- the stretching of the retractable substrate is taken as an example for illustration, but the disclosure is not limited thereto, and the case of compressing the retractable substrate may refer to stretching the retractable substrate Examples of substrates.
- the micro-display panel includes a driving substrate, the LED spacing on the wafer is generally 2 ⁇ m, and the scalable substrate is stretched so that The distance between the chips in the array becomes larger, so that the chips in the second chip array on the transfer head array are arranged in a fourth pitch (for example, 10 ⁇ m), so that all the wafers can be transferred at once The LED is transferred to the driving substrate, which improves the chip transfer efficiency.
- the fourth pitch for example, 10 ⁇ m
- the fourth pitch may be set according to the pixel density or pixel pitch of the display panel or display device to be manufactured, and is not limited to the above-mentioned numerical values.
- the fourth pitch is greater than the third pitch as an example for description, the disclosure is not limited thereto, and in other embodiments, the fourth pitch may also be less than Is equal to the third pitch, and the scene that can be adapted at this time is that the first pitch between the chips on the wafer substrate is greater than or equal to the pixel density or pixel pitch of the display panel or display device to be fabricated, at this time, it can be passed
- the retractable substrate is compressed to suit the pixel density or pixel pitch of the display panel.
- step S150 the target chip in the second chip array is released to the chip bonding position of the driving substrate through the telescopic transfer head array.
- the transfer head array may pick up all the chips on the wafer all at once, and then release part of the picked up chips to the chip bonding position on the drive substrate. In other embodiments, the transfer head array may also pick up all the chips on the wafer all at once, and then release all the picked up chips to the chip bonding position on the drive substrate. In still other embodiments, the transfer head array may also pick up some chips on the wafer at one time, and then release all the picked up chips to the chip bonding position on the drive substrate. In other embodiments, the transfer head array may also pick up some chips on the wafer at one time, and then release the picked up chips to the chip bonding position on the drive substrate. This disclosure does not limit this.
- each display panel design corresponds to a different pixel pitch
- the related art needs to redesign the transfer head array, and the method provided by the embodiments of the present disclosure adopts a telescopic scheme, which can realize the multi-use of the transfer head array and can be used repeatedly for many times.
- the transfer head array needs to be redesigned according to different pixel pitches of the display panel to be manufactured, and the transfer head array does not need to be replaced.
- the transfer heads in different rows and columns of the transfer head array can be used to absorb part of the LEDs on the wafer according to the difference in pixel pitch, or to absorb all of them at once and then selectively release some of the picked up LEDs to the driving substrate. flexible.
- the driving substrate may include chip bonding positions arranged in a fifth pitch array; wherein the fifth pitch is greater than or equal to the fourth pitch.
- the fifth pitch corresponds to the pixel density (Pixels Per Inch, PPI) or pixel pitch of the display panel to be manufactured.
- PPIs correspond to arrays of chip bonding positions with different pitches on the driving substrate.
- the larger the PPI the smaller the fifth pitch of the driving substrate, and the smaller the corresponding fourth pitch after expansion.
- the first pitch is equal to the second pitch
- the second pitch is equal to the third pitch
- the fourth pitch is equal to the fifth pitch for example, but The present disclosure is not limited to this.
- the first pitch is equal to the second pitch and the second pitch is equal to the third pitch
- all the transfer heads on the transfer head array are used to pick up all the chips on the wafer at once
- the fourth pitch is equal to the fifth pitch
- the pitch between the array of transfer heads that pick up chips on the wafer is expanded to the fourth pitch, that is, the pixel pitch of the display panel to be manufactured, so that the transfer efficiency can be greatly improved , You can make drive substrate or display panel in one transfer.
- the manufacturing method of the driving substrate improved by the embodiment of the present disclosure can be applied to the process of manufacturing a display panel by using a transfer technology to transfer chips.
- a transfer head array with a retractable substrate Through a transfer head array with a retractable substrate, the chip on the wafer is stretched to a set value after being picked up Pitch, and then transfer the picked chip to the drive substrate to achieve electrical connection with the drive circuit of the display panel, thereby achieving pixel addressing drive.
- the transfer head array with a retractable substrate provided by an embodiment of the present disclosure can be used in one machine and can be reused multiple times. , Medium and large size PPI display panels.
- the array of transfer heads with retractable substrates provided by the embodiments of the present disclosure can use different transfer heads to suck the chips on the wafer according to different pixel pitches, or all the selective release chips, which is flexible in process.
- the method can be used to achieve a one-time transfer, and the efficiency is greatly improved.
- FIG. 2 shows a flowchart of an exemplary embodiment of step S110 in the embodiment of FIG. 1.
- the chip is an LED chip
- the first chip array is a first LED array as an example for illustration.
- step S110 may further include the following steps.
- step S111 LED epitaxy is fabricated on the wafer substrate.
- step S112 the LED epitaxial on the wafer substrate is etched to obtain the first LED array.
- the first LED array when manufacturing the first LED array on the wafer, the first LED array may be directly formed on the wafer substrate, and the carrier substrate and the sacrificial layer are omitted And other manufacturing processes.
- 3 and 4 show schematic diagrams of an exemplary embodiment of step S110 in the embodiment of FIG. 1.
- LED epitaxy is fabricated on a wafer (for example, sapphire), for example, GaN, p-doped, and QW (quantum well) are placed on the wafer in sequence. , N-doped and metal layer.
- the LED epitaxial is the so-called LED semiconductor wafer.
- the semiconductor wafer is composed of two parts, one part is a P-type semiconductor, in which holes are dominant, and the other part is an N-type semiconductor, where mainly electrons.
- epitaxial methods can be divided into three types: liquid phase epitaxy (Liquid Phase Epitaxy, LPE), organometallic vapor phase epitaxy (Metal-organic Chemical Vapor Deposition, MOCVD), molecular beam epitaxy (Molecular Beam Epitaxy, MBE) .
- LPE liquid phase epitaxy
- MOCVD Metal-organic Chemical Vapor Deposition
- MBE molecular beam epitaxy
- MOCVD is the mainstream machine in the LED industry. Its advantages are fast epitaxy, good mass production capacity, and wide application fields.
- P-type (N-type) materials changes the concentration of the main conductive carrier holes in the epitaxial layer.
- the first LED array 402 is obtained by epitaxially etching the LED on the wafer substrate 401.
- FIG. 5 shows a flowchart of an exemplary embodiment of step S120 in the embodiment of FIG. 1.
- the step S120 may further include the following steps.
- step S121 a fixed structure arranged in an array is provided on the retractable substrate.
- the fixing structure is filled with an elastic material.
- the retractable substrate may be an island structure, the island is fixed and not retractable, and is surrounded by a stretchable elastic material.
- the manufacturing process may include: light curing the polyacrylate substrate to form an island pattern.
- the elastic material may be organic materials such as polyurethane and rubber.
- step S122 the transfer heads are generated on the fixed structure, and the transfer heads are arranged in an array to form the transfer head array.
- the array head is used to make the transfer head array on the island, so that the pitch of the transfer head array is consistent with the pitch of the first LED array on the wafer.
- the array process is a process of forming an array on a carrier (such as a substrate), and generally the process includes cleaning ⁇ film formation ⁇ cleaning ⁇ photoresist coating ⁇ exposure ⁇ etching ⁇ photoresist stripping ⁇ cleaning ⁇ Test and other steps. It should be understood that some of the above steps may be omitted, split, or combined. The specific steps and implementation of the array process are well known to those of ordinary skill in the art, so they will not be described here.
- the transfer head on the transfer head array may be an electrostatic transfer head, a PDMS (Polydimethylsiloxane, polydimethylsilane) transfer head, etc., which is not limited in this disclosure.
- PDMS Polydimethylsiloxane, polydimethylsilane
- the island structure on the retractable substrate is fixed, and the transfer head is made on the fixed island structure, which can expand and contract the retractable substrate while ensuring the stability of the transfer head .
- FIG. 6 shows a schematic diagram of an exemplary embodiment of step S120 in the embodiment of FIG. 1.
- a fixed island 602 is provided on the retractable substrate 601. Then, a transfer head 603 is generated on the fixed island 602, and the transfer heads 603 are arranged in an array to form a transfer head array.
- buckle the transfer head array on the first LED array on the wafer load the current after alignment to generate electrostatic attraction (all or selective) to pick up the required LED chips, and finally remove the wafer substrate (for example, Etch or laser method).
- FIG. 7 shows a schematic diagram of a transfer head array after picking up LED chips on a wafer substrate and before stretching in an exemplary embodiment of the present disclosure.
- the LED 701 on the stretchable substrate 601 before stretching is shown in FIG. 7.
- Fig. 8 shows a schematic view of a stretched transfer head array in an exemplary embodiment of the present disclosure.
- the LED 701 on the stretchable substrate 601 after stretching is shown in FIG. 8.
- the drive backplane to be manufactured has positions for LED chip bonding, and is arranged in an array.
- the stretchable substrate where the transfer head array that picks up the LED chips is bi-directionally stretched to a set interval to ensure that the distance between the stretched LED chips and the distance between the bonding positions on the drive substrate remain the same.
- FIG. 9 shows a schematic diagram of a driving substrate in an exemplary embodiment of the present disclosure.
- the transfer head array of the LED chip after being stretched is aligned with the driving substrate, and then a current signal is loaded to control the release of the LED chip, so that the LED chip is docked with the driving substrate, and then bonded to the display panel.
- Drive circuit
- the driving substrate may be any one of a printed circuit board, a TFT (Thin Film Transistor, thin film transistor) substrate, a CMOS (Complementary Metal Oxide Semiconductor, complementary metal oxide semiconductor) substrate, etc., which may be used to drive an LED chip Illuminated display.
- a TFT Thin Film Transistor, thin film transistor
- CMOS Complementary Metal Oxide Semiconductor, complementary metal oxide semiconductor
- the chip bonding position thereon is provided with an LED 802.
- an embodiment of the present disclosure further provides a display panel, which may include the driving substrate described in any of the foregoing embodiments.
- the display panel may be a micro display panel.
- an embodiment of the present disclosure further provides a display device, which may include the display panel described in the foregoing examples.
- a drive substrate in a method for manufacturing a drive substrate, a drive substrate, a display panel, and a display device, after a second array of chips on a wafer substrate is picked up by a retractable transfer head array, it is expanded to After setting the fourth pitch, the target chip of the picked chips is then transferred to the driving substrate, so that the electrical connection between the target chip and the driving substrate to be made can be achieved for pixel addressing driving of the display panel.
- the technical solution provided by the embodiments of the present disclosure can adapt to the production of display panels with different pixel densities or pixel intervals without replacing the transfer head array.
Abstract
Description
Claims (18)
- 一种驱动基板的制作方法,包括:A method for manufacturing a driving substrate, including:提供位于晶圆衬底上的第一芯片阵列,所述第一芯片阵列包括以第一间距阵列排布的芯片;Providing a first chip array on a wafer substrate, the first chip array including chips arranged in an array at a first pitch;提供设置于可伸缩衬底上的转移头阵列,所述转移头阵列包括以第二间距阵列排布的转移头;Providing an array of transfer heads arranged on a retractable substrate, the array of transfer heads including transfer heads arranged in an array at a second pitch;利用伸缩前的所述转移头阵列从所述晶圆衬底上拾取第二芯片阵列,所述第二芯片阵列中的芯片以第三间距阵列排布;Picking up a second chip array from the wafer substrate using the transfer head array before expansion, and the chips in the second chip array are arranged in a third pitch array;伸缩所述可伸缩衬底,以使所述第二芯片阵列中的芯片以第四间距阵列排布;Retracting the retractable substrate so that the chips in the second chip array are arranged in a fourth pitch array;通过伸缩后的所述转移头阵列,将所述第二芯片阵列中的目标芯片释放至驱动基板的芯片键合位置。Through the transfer head array after expansion and contraction, the target chip in the second chip array is released to the chip bonding position of the driving substrate.
- 根据权利要求1所述的方法,其中,所述第四间距大于所述第三间距。The method of claim 1, wherein the fourth pitch is greater than the third pitch.
- 根据权利要求1或2所述的方法,其中,所述第二间距小于等于所述第一间距。The method according to claim 1 or 2, wherein the second pitch is less than or equal to the first pitch.
- 如权利要求3所述的方法,其中,所述第一间距是所述第二间距的整数倍。The method of claim 3, wherein the first pitch is an integer multiple of the second pitch.
- 根据权利要求1-4任一项所述的方法,其中,所述第三间距大于等于所述第一间距。The method according to any one of claims 1 to 4, wherein the third pitch is greater than or equal to the first pitch.
- 根据权利要求1-5任一项所述的方法,其中,所述驱动基板上包括以第五间距阵列排布的芯片键合位置;The method according to any one of claims 1-5, wherein the driving substrate includes chip bonding positions arranged in an array at a fifth pitch;其中,所述第五间距大于等于所述第四间距。Wherein, the fifth pitch is greater than or equal to the fourth pitch.
- 根据权利要求6所述的方法,其中,所述第一间距等于所述第二间距,所述第二间距等于所述第三间距,所述第四间距等于所述第五间距。The method of claim 6, wherein the first pitch is equal to the second pitch, the second pitch is equal to the third pitch, and the fourth pitch is equal to the fifth pitch.
- 根据权利要求1-7任一项所述的方法,其中,所述芯片为LED芯片,所述第一芯片阵列为第一LED阵列;其中,提供位于晶圆衬底上的第一芯片阵列,包括:The method according to any one of claims 1-7, wherein the chip is an LED chip, and the first chip array is a first LED array; wherein, a first chip array on a wafer substrate is provided, include:在所述晶圆衬底上制作LED磊晶;Making an LED epitaxial on the wafer substrate;刻蚀所述晶圆衬底上的LED磊晶获得所述第一LED阵列。Etching the LED epitaxial on the wafer substrate to obtain the first LED array.
- 根据权利要求1-8任一项所述的方法,其中,提供设置于可伸缩衬底上的转移头阵列,包括:The method according to any one of claims 1-8, wherein providing an array of transfer heads disposed on a retractable substrate includes:在所述可伸缩衬底上设置阵列排布的固定结构;A fixed structure arranged in an array is arranged on the retractable substrate;在所述固定结构上生成所述转移头,所述转移头呈阵列排布形成所述转移头阵列。The transfer heads are generated on the fixed structure, and the transfer heads are arranged in an array to form the transfer head array.
- 根据权利要求9所述的方法,其中,所述固定结构周围填充弹性材料。The method according to claim 9, wherein the fixed structure is filled with an elastic material.
- 根据权利要求9所述的方法,其中,所述固定结构包括固定不动的岛结构。The method of claim 9, wherein the fixed structure includes a fixed island structure.
- 根据权利要求11所述的方法上,其中,所述转移头的阵列通过array工艺形成在所述岛结构上。The method according to claim 11, wherein the array of transfer heads is formed on the island structure by an array process.
- 根据权利要求1-12任一项所述的方法,其中,所述转移头包括静电转移头或者PDMS转移头。The method according to any one of claims 1-12, wherein the transfer head comprises an electrostatic transfer head or a PDMS transfer head.
- 根据权利要求1-13任一项所述的方法,其中,利用伸缩前的所述转移头阵列从所述晶圆衬底上拾取第二芯片阵列,包括:The method according to any one of claims 1 to 13, wherein picking up a second chip array from the wafer substrate using the transfer head array before expansion includes:将伸缩前的所述转移头阵列扣到所述晶圆衬底上的所述第一芯片阵列上,以使转移头与相应的芯片进行对位;Snap the transfer head array before expansion onto the first chip array on the wafer substrate, so that the transfer head is aligned with the corresponding chip;加载电流使所述转移头阵列产生静电吸附力选择性地从所述晶圆衬底上拾取所需芯片;The loading current causes the transfer head array to generate electrostatic adsorption force to selectively pick up the required chips from the wafer substrate;移除所述晶圆衬底形成所述第二芯片阵列。The wafer substrate is removed to form the second chip array.
- 根据权利要求14所述的方法,其中,所述移除所述晶圆衬底形成所述第二芯片阵列包括利用刻蚀或激光方法移除所述晶圆衬底。The method of claim 14, wherein the removing the wafer substrate to form the second chip array includes removing the wafer substrate using an etching or laser method.
- 一种驱动基板,采用如权利要求1至15任一项所述的方法制作。A driving substrate manufactured by the method according to any one of claims 1 to 15.
- 一种显示面板,包括如权利要求16所述的驱动基板。A display panel comprising the driving substrate according to claim 16.
- 一种显示装置,包括如权利要求17所述的显示面板。A display device comprising the display panel according to claim 17.
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CN201811334368.6A CN109449102B (en) | 2018-11-09 | 2018-11-09 | Manufacturing method of driving substrate, display panel and display device |
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CN109449102B (en) * | 2018-11-09 | 2021-03-19 | 京东方科技集团股份有限公司 | Manufacturing method of driving substrate, display panel and display device |
CN109950194B (en) * | 2019-04-11 | 2021-04-16 | 京东方科技集团股份有限公司 | Chip transfer substrate and chip transfer method |
JP7377656B2 (en) * | 2019-09-19 | 2023-11-10 | 株式会社ジャパンディスプレイ | Device transfer equipment and device module fabrication method |
US11574895B2 (en) * | 2019-12-19 | 2023-02-07 | Innolux Corporation | Method of manufacturing electronic device |
CN111162037B (en) * | 2019-12-31 | 2023-09-26 | 中芯集成电路(宁波)有限公司 | Method for transferring chip to wafer |
CN113782560B (en) * | 2021-09-17 | 2023-08-11 | 厦门大学 | Nitride transistor-based light emitting device and integrated micro LED micro display device |
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CN108364581A (en) * | 2018-03-29 | 2018-08-03 | 南方科技大学 | A kind of preparation method and micro display screen of light emitting diode micro display screen |
CN109449102A (en) * | 2018-11-09 | 2019-03-08 | 京东方科技集团股份有限公司 | Production method, drive substrate, display panel and the display device of drive substrate |
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