WO2022171103A1

WO2022171103A1 - Transfer device, transfer method, and display apparatus

Info

Publication number: WO2022171103A1
Application number: PCT/CN2022/075592
Authority: WO
Inventors: 李维善
Original assignee: 南昌广恒电子中心(有限合伙)
Priority date: 2021-02-09
Filing date: 2022-02-09
Publication date: 2022-08-18
Also published as: CN112820672A

Abstract

Embodiments of the present application disclose a transfer device, a transfer method, and a display apparatus. The transfer device comprises: a transfer substrate, the transfer substrate being provided with light excitation components arranged in an array, and the sides of the light excitation components away from the transfer substrate being used for placing components to be transferred; a light source apparatus, used for generating light for exciting the light excitation components; and a light source control apparatus, located on a light path of the light generated by the light source apparatus, the light source control apparatus being used for irradiating the light generated by the light source apparatus to the corresponding light excitation component, such that at least some of the components to be transferred on the transfer substrate are transferred to a target substrate.

Description

Transfer apparatus, transfer method and display device

This application claims the priority of the Chinese patent application with application number 202110181077.3 filed with the China Patent Office on February 09, 2021, the entire contents of the above application are incorporated into this application by reference.

technical field

The embodiments of the present application relate to the field of display technology, for example, to a transfer device, a transfer method, and a display device.

Background technique

With the continuous development of display technology, the cathode ray picture tube (CRT, Cathode Ray Tube) display mode of the display device is gradually replaced by the liquid crystal (LCD, Liquid Crystal Display) display mode. In recent years, the organic light-emitting diode (OLED, Organic Light-Emitting Diode) ) display method and micro light-emitting diode (Micro LED or MINI LED) display method have been developed rapidly as a new generation of display technology. Among them, Micro LED is known as the future display technology due to its advantages such as high response speed, high color gamut, high brightness and long life. LCD with MINI LED backlight technology, quantum dot technology or high color rendering technology can improve contrast and color gamut. This allows LCDs to reduce contrast and color gamut disadvantages compared to OLEDs while maintaining longevity and brightness advantages.

However, in the production process of Micro LED and MINI LED, mass transfer technology is required. The mass transfer technology adopts mechanical stamping, stamping, electrostatic or fluid assembly, etc. However, the transfer technology has the problems of low precision and low yield, and it is difficult to support the mass production and popularization of Micro LED and MINI LED technology , therefore, transfer technology has become one of the bottlenecks of Micro LED and MINI LED technology.

SUMMARY OF THE INVENTION

Embodiments of the present application provide a transfer device, a transfer method, and a display device.

In a first aspect, an embodiment of the present application provides a transfer device, including:

a transfer substrate, the transfer substrate is provided with optical excitation components arranged in an array, and the side of the optical excitation components away from the transfer substrate is used for placing the components to be transferred;

a light source device for generating light that excites the light-excited component;

The light source control device is located on the optical path of the light generated by the light source device, and the light source control device is used to irradiate the light generated by the light source device to the corresponding light excitation component, so that the light source on the transfer substrate is At least a portion of the part to be transferred is transferred to the target substrate.

In the second aspect, the embodiment of the present application also provides a transfer method, which can adopt the transfer device provided by any embodiment of the present application, and the transfer method includes:

Provide the target substrate;

A transfer substrate is provided, and the transfer substrate is aligned with the target substrate; the transfer substrate is provided with optical excitation components arranged in an array, and the side of the optical excitation component away from the transfer substrate is provided with the to-be-transferred part;

A light source device and a light source control device are provided, and the light source control device is placed on the light path generated by the light source device;

Controlling the light source control device to irradiate the light generated by the light source device to the corresponding light excitation components, so that at least part of the components to be transferred on the transfer substrate are transferred to the target substrate; wherein, the transferred components The parts meet the transfer accuracy.

In a third aspect, an embodiment of the present application further provides a display device, comprising: a driving backplane and a display chip disposed on the driving backplane, wherein the display chip adopts the transfer method described in any embodiment of the present application. The method is transferred to the drive backplane.

Description of drawings

1 is a schematic structural diagram of a transfer device according to an embodiment of the present application;

FIG. 2 is a schematic structural diagram of another transfer device provided by an embodiment of the present application;

FIG. 3 is a schematic structural diagram of an array circuit layer according to an embodiment of the present application;

FIG. 4 is a schematic structural diagram of another transfer device provided by an embodiment of the present application;

FIG. 5 is a schematic structural diagram of another transfer device provided by an embodiment of the present application;

FIG. 6 is a schematic structural diagram of another transfer device provided by an embodiment of the present application;

FIG. 7 is a schematic structural diagram of a transfer substrate according to an embodiment of the present application;

Fig. 8 is the cross-sectional structure schematic diagram along A-A in Fig. 7;

FIG. 9 is a schematic structural diagram of another transfer substrate provided by an embodiment of the present application;

10 is a schematic flowchart of a transfer method provided by an embodiment of the present application;

FIG. 11 is a schematic structural diagram of a transfer device corresponding to each step in a transfer method provided by an embodiment of the present application.

Detailed ways

The present application will be further described below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. It should also be noted that, for the convenience of description, the drawings only show some but not all structures related to the present application.

The embodiment of the present application provides a transfer device. FIG. 1 is a schematic structural diagram of a transfer device according to an embodiment of the present application. Referring to FIG. 1 , the transfer apparatus includes: a transfer substrate 100 , a light source device 800 and a light source control device 600 . The transfer substrate 100 is provided with photo-excited components 130 arranged in an array, and a side of the photo-excited components 130 away from the transfer substrate 100 is used for placing components to be transferred (eg, chips 110 ). The light source device 800 is used to generate light to excite the light excitation part 130 . The light source control device 600 is located on the optical path of the light generated by the light source device 800, and the light source control device 600 is used to irradiate the light generated by the light source device 800 to the corresponding light excitation component 130, so that at least part of the to-be-transferred material on the transfer substrate 100 is irradiated. The parts are transferred to the target substrate 300 .

Among them, the parts to be transferred refer to parts that need to be transferred in large quantities, for example, parts with a size in the range of 1 μm-5 mm. Illustratively, the components to be transferred include chips, other circuits or semiconductor devices, auxiliary components for transfer, and the like. The following description takes the component to be transferred as a chip as an example, but this is not a limitation of this application. The chip 110 can be, for example, a light-emitting device chip, for example, the chip 110 can be a Micro LED chip or a MINI LED chip, and a large number of light-emitting device chips 110 can be transferred, and finally a display device can be formed. The transfer substrate 100 may also be referred to as a transition carrier board or a temporary carrier board for pre-arranging the chips 110 according to the size of the chips to be transferred. Generally speaking, the positions and orientations of the chips 110 placed on the transfer substrate 100 may be imprecise or even chaotic. The photo-excited component 130 refers to a component that undergoes physical and/or chemical changes when excited under the action of specific light. Exemplarily, the photo-excited component 130 changes from a solid state or a liquid state to a gaseous state under the action of light, so as to generate gas expansion, and the chip 110 is transferred (printed) from the transfer substrate 100 to the target substrate 300 , and the main material of the photo-excited component 130 is For example, materials such as ether or oxidizing agent may be included; the specific light includes at least one of laser, visible light or invisible light (such as UV (Ultraviolet) light). Correspondingly, the light source device 800 includes a laser generator, a visible light generator or a non-visible light. At least one of the generators is visible. The target substrate 300 may also be referred to as a target carrier board, that is, the transfer target position of the chip 110 is a position on the target carrier board. By using the transfer device provided by the embodiment of the present application, the positional accuracy of the chips 110 transferred to the target carrier board can be higher than the positional accuracy of the chips on the transfer substrate 100 . In one embodiment, both the transfer substrate 100 and the target substrate 300 are provided with high-precision alignment marks (Mark) to achieve accurate alignment, thereby helping to improve the transfer accuracy of the chip 110, for example, the accuracy of the alignment marks. The range can be from 1 μm to 5 mm.

In this embodiment of the present application, the light excitation components 130 are arranged on the transfer substrate 100, and the light source device 800 and the light source control device 600 are arranged in the transfer equipment, so as to excite the corresponding light excitation components 130 to be excited to generate thrust, so that the corresponding chips are excited. 110 is separated from the transfer substrate 100 . In this way, in the process of one transfer, only the chips 110 that meet the transfer accuracy can be transferred, and other chips 110 that do not meet the transfer accuracy can be transferred through alignment again. Compared with the mass transfer technology in the related art, the embodiment of the present application achieves accurate control and transfer of the chips 110 to be transferred, thereby improving the transfer precision and transfer yield.

In the above-mentioned embodiments, the transfer substrate 100 itself is exemplarily a transparent substrate, so that the light can smoothly pass through the transfer substrate 100 and irradiate on the light excitation component 130 . The transfer substrate 100 itself may also be a colored transparent substrate or a colorless transparent substrate, wherein if the transfer substrate 100 is a colored transparent substrate, the color of the transfer substrate 100 also needs to match the color of the light emitted by the light source device 800 .

In the embodiment of the present application, the light source device 800 and the corresponding light source control device 600 can be set in various ways, as long as the light excitation components 130 on the transfer substrate 100 can be selectively excited to generate thrust, so that the chip 110 can be transferred from Embodiments of separation on the substrate 100 are all within the scope of protection of the present application. Several of them are described below, but are not intended to limit the present application.

FIG. 2 is a schematic structural diagram of another transfer device according to an embodiment of the present application. Referring to FIG. 2 , in an embodiment of the present application, the light source device 800 includes a backlight panel 810 for generating a surface light source. The light source control device 600 includes a liquid crystal on silicon panel 610 , and the liquid crystal on silicon panel 610 includes an array circuit layer 611 and a liquid crystal layer 612 . The array circuit layer 611 includes switching devices arranged in an array, and driving electrodes connected to the switching devices. The liquid crystal layer 612 is disposed on one side of the array circuit layer 611 ; the liquid crystal layer 612 includes liquid crystal molecules, and the liquid crystal molecules are controlled by the corresponding driving electrodes to change their angles, so as to control the light generated by the backlight panel 810 to transmit to the corresponding light excitation components 130 . .

The liquid crystal molecules are controlled by the driving electrodes corresponding to the liquid crystal molecules to change their angles.

The liquid crystal on silicon panel 610 includes a plurality of control elements (similar to pixels in a display panel), and the control elements refer to switching devices, liquid crystal molecules corresponding to the switching devices, and driving electrodes connected to the switching devices. The switching devices include semiconductor devices such as triodes or field effect transistors. For example, the field effect transistor includes a gate electrode, a source electrode and a drain electrode. The switching device can be a triode or a field effect transistor set independently, or a combination of semiconductor devices, such as complementary metal oxide semiconductor (CMOS, Complementary Metal Oxide Semiconductor), etc., which can be set according to actual needs. The fabrication form of the switching device can be a thin film transistor (TFT, Thin Film Transistor), so as to reduce the thickness of the array circuit layer 611 and reduce the size of the transfer device. Exemplarily, the thin film transistor or field effect transistor array can be directly fabricated on the substrate of the liquid crystal on silicon panel 610 by using a semiconductor process.

Exemplarily, when the switching device is turned on, the corresponding driving electrode is energized, so as to control the deflection of the corresponding liquid crystal molecules, and the light passes through or is cut off. One control element corresponds to at least one optical excitation component 130 , or at least one control element corresponds to one optical excitation component 130 . The backlight panel 810 generates a surface light source to illuminate the entire liquid crystal on silicon panel 610. Only when the control element is turned on, can the light in the corresponding area be controlled to be emitted through the liquid crystal on silicon panel 610 and irradiate on the corresponding light excitation component 130. The backlight panel 810 may include at least one of organic light emitting diodes, micro light emitting diodes, or diodes, for example. In one embodiment, the backlight panel 810 may further include a film layer such as a light guide layer, so that the backlight panel 810 emits light uniformly. In the embodiment of the present application, by setting the light source device 800 to include a backlight panel 810 and the light source control device 600 to include a silicon-based liquid crystal panel 610, the structure is simple and easy to implement.

In the above-mentioned embodiment, for example, the liquid crystal on silicon panel 610 may further include structures such as a cover plate 613 and a polarizer, so as to improve the stability of the liquid crystal on silicon panel 610 and optimize the performance of the liquid crystal on silicon panel 610 .

FIG. 3 is a schematic structural diagram of an array circuit layer according to an embodiment of the present application. Referring to FIG. 3 , in an embodiment of the present application, the array circuit layer 611 further includes a gate gate module 614 and a source gate module 615 . The gate gating module 614 is connected to the switching devices; the gate gating module 614 is used to turn on the switching devices row by row, or to turn on the switching devices of at least part of the rows at the same time. The source gating module 615 is connected to the switching device; the source gating module 615 is used to simultaneously send a driving signal to the driving electrodes of at least part of the columns through the switching device, so as to drive the liquid crystal molecules to deflect.

As shown in FIG. 3 , the array circuit layer 611 includes switching devices 6111 arranged in an array.

The driving mode of the gate gating module 614 is to turn on the switching devices row by row, or to simultaneously turn on the switching devices of at least part of the rows, which can be selected according to actual needs. The driving mode of the source gate module 615 is to send driving signals to the driving electrodes of some columns through the switching device at the same time, or to send driving signals to the driving electrodes of all columns, which can be selected according to actual needs.

Exemplarily, the array circuit layer 611 may be scanned in a row/column scanning manner. At this time, the gate gating module 614 controls the on and off of the switching devices row by row. The driving signal is output by the source gate module 615 and connected to the source writing of the corresponding switching device, thereby driving the liquid crystal molecules to deflect, excites the light excitation component 130 to perform the stamping action, and causes the corresponding chip 110 to perform the transfer action. For example, the chips 110 located in the first row, the first column, the second row, the second column, the third row, the third column, the fourth row, the fourth column, the fifth row, the fifth column, and the sixth row and the sixth column meet the transfer accuracy, When the gate gating module 614 scans the switching devices in the first row, the source gating module 615 writes driving signals to the switching devices in the first column; when the gate gating module 614 scans the switching devices in the second row, the source The gating module 615 writes driving signals to the switching devices in the second column; . . . and so on, until the gate gating module 614 scans the switching devices in the sixth row, and the source gating module 615 scans the switching devices in the sixth column. Write the drive signal.

Exemplarily, the array circuit layer 611 may also be scanned in a surface scanning manner. At this time, the gate gating module 614 simultaneously controls the on and off of multiple rows of switching devices. The driving signal is output by the source gate module 615 and connected to the source writing of the corresponding switching device, thereby driving the liquid crystal molecules to deflect, excites the light excitation component 130 to perform the stamping action, and causes the corresponding chip 110 to perform the transfer action. For example, the chips 110 located in the first three columns of the first row, the first three columns of the second row, the first three columns of the third row, and the first three columns of the fourth row meet the transfer accuracy, and the gate gating module 614 simultaneously scans before Four rows of switching devices, and the source gating module 615 simultaneously writes driving signals to the switching devices of the first three columns.

Exemplarily, the gate gate module 614 and the source gate module 615 can be selected from TFT, CMOS, or the like.

The embodiment of the present application adopts an active driving array, which can realize the scanning mode of row/column scanning or area scanning, so that the scanning and printing can be performed quickly, the transfer efficiency and stability are improved, and the operation difficulty is simplified.

It should be noted that, as exemplarily shown in FIG. 3 , the rows extend along the first direction X, the columns extend along the second direction Y, and the first direction X and the second direction Y intersect. This is not a limitation of the present application. In other embodiments, the row and column directions may also be reversed. For example, the row extends along the second direction Y, and the column extends along the first direction X.

FIG. 4 is a schematic structural diagram of another transfer device provided by an embodiment of the present application. Referring to FIG. 4 , in an embodiment of the present application, the light source device 800 includes a first light source 821 and a beam expander module 822 , the first light source 821 emits a light source beam, and the beam expander module 822 is used for diffusing the light source beam to generate a surface Light source; the light source control device 600 includes a digital micromirror (DMD, Digital Micromirror Device) 620, and the digital micromirror 620 includes a driving array (not shown in FIG. 4 ) and a reflecting mirror 621 arranged in an array. The driving array includes switching devices arranged in an array. The reflector 621 is disposed corresponding to the switching device, for example, the reflector 621 is connected to the switching device. The angle of the mirror 621 is adjustable under the control of the driving array, and is used to transmit the light generated by the light source device 800 to the corresponding light excitation component 130 .

Among them, the first light source 821 can generate a laser beam, and the laser beam has good stability and is not easily affected by the environment, thereby helping to improve the transfer accuracy of the transfer backplane. In one embodiment, the light source device 800 includes a collimation module for emitting the surface light source in parallel. For example, the mirrors 621 arranged in an array in the digital micromirror 620 can be controlled by a micro-electromechanical (MEMS, Micro Electro Mechanical System) mirror or the mirror 621 is controlled by a micro-electromechanical, so that the angle can be adjusted. By adjusting the angle of the mirror 621, on the one hand, it can be adjusted whether the light irradiated on the mirror 621 is reflected on the transfer substrate 100; on the excitation component 130. Therefore, in the embodiment of the present application, the mirrors 621 and the photoexcitation components 130 may be set in one-to-one correspondence, at least two mirrors 621 and one photoexcitation component 130 may be set, and one mirror 621 may be set to correspond to at least two photoexcitation components 130, which can be set as required in practical applications.

Exemplarily, if the mirrors 621 correspond to the optical excitation components 130 one-to-one, the driving array can be scanned in a surface scanning manner. For example, the chips 110 located in the first row, the first column, the second row, the second column, the third row, the third column, the fourth row, the fourth column, the fifth row, the fifth column, and the sixth row and the sixth column meet the transfer accuracy, Correspondingly, adjust the mirrors 621 located in the first row, the first column, the second row, the second column, the third row, the third column, the fourth row, the fourth column, the fifth row, the fifth column, and the sixth row and the sixth column. The angle is such that the light irradiates on the corresponding photoexcitation part 130 , and the photoexcitation part 130 is excited to perform a stamping action, so that the corresponding chip 110 performs a transfer action. For the mirrors 621 at other positions, by adjusting their angles, the light cannot be reflected, or the light is reflected to other areas outside the transfer substrate 100 .

Exemplarily, if one mirror 621 corresponds to at least two optical excitation components 130, the driving array may be scanned in a time-division scanning manner. For example, the digital micromirror 620 includes only one mirror 621, which is located in the first row, the first column, the second row, the second column, the third row, the third column, the fourth row, the fourth column, the fifth row, the fifth column, and the sixth column. The chips 110 in the sixth row and the sixth column meet the transfer accuracy. In the first period, the angle of the mirror 621 is adjusted so that the light is irradiated to the photoexcitation components 130 in the first row and the first column; in the second period, the angle of the mirror 621 is adjusted. , so that the light is irradiated to the photoexcited components 130 in the second row and the second column; . . and so on, until the scanning reaches the sixth row and the sixth column. The scanning interval periods such as the first period and the second period need to satisfy the excitation reaction time of the photoexcitation component 130 to ensure reliable excitation of the photoexcitation component 130 and reliable transfer of the chip 110 .

Exemplarily, as the number of mirrors 621 provided on the digital micromirror 620 increases, multiple mirrors 621 can work at the same time, thereby reducing the time for scanning and printing parts.

In this embodiment of the present application, the light source device 800 includes a first light source 821 and a beam expander module 822, and the light source control device 600 includes a digital micromirror (DMD) 620, which is beneficial to realize the surface scanning of the light excitation component 130, thereby helping to improve the transfer efficiency .

It should be noted that, in the above embodiments, the light source device 800 is exemplarily shown to generate a surface light source through the beam expander module 822, which is not a limitation of the present application. In other embodiments, a backlight panel may also be set to generate a surface light source, In practical applications, it can be set as required.

Illustratively, the beam expander module 822 may be a lens system.

FIG. 5 is a schematic structural diagram of another transfer device provided by an embodiment of the present application. Referring to FIG. 5 , in an embodiment of the present application, the light source device 800 includes a second light source 830, and the second light source 830 emits a light source beam; the light source control device 600 includes a deflector 630, which is used to scan the light source beam to Corresponding photoexcited components 130 . Among them, the second light source 830 can generate a laser beam, and the laser beam has good stability and is not easily affected by the environment, thereby helping to improve the transfer accuracy of the transfer backplane. Preferably, the deflector 630 includes a lens module 631, the lens module 631 is located on the optical path of the light emitted by the light source beam, and the lens module 631 is used to adjust the angle of the light. Exemplarily, the deflector 630 includes two lens modules 631, one lens module 631 can be rotated horizontally to adjust the horizontal propagation direction of light; the other lens module 631 can be rotated vertically to adjust the vertical propagation direction of light.

Exemplarily, scanning may be performed in a time-division scanning manner. For example, the chips 110 located in the first row, the first column, the second row, the second column, the third row, the third column, the fourth row, the fourth column, the fifth row, the fifth column, and the sixth row and the sixth column meet the transfer accuracy, In the first period, the angle of the deflector 630 is adjusted so that the light is irradiated to the photoexcitation elements 130 in the first row and the first column; in the second period, the angle of the deflector 630 is adjusted so that the light is irradiated on the second row and the second column and so on, until the scanning reaches the sixth row and sixth column. The scanning interval periods such as the first period and the second period need to satisfy the excitation reaction time of the photoexcitation component 130 to ensure reliable excitation of the photoexcitation component 130 and reliable transfer of the chip 110 .

It should be noted that in the above embodiments, the deflector 630 is set as the lens module 631 as an example for illustration, which is not a limitation of the present application. For example, MEMS mirrors), which can be set as needed in practical applications.

It should also be noted that, in the above embodiments, the first light source and/or the second light source 830 may be a monochromatic light generator, or may be composed of multiple monochromatic light generators and light combiners. In practical applications Can be set as required.

FIG. 6 is a schematic structural diagram of another transfer device according to an embodiment of the present application. Referring to FIG. 6 , on the basis of the above embodiments, the transfer apparatus further includes: an optical measurement device 400 and a data processing device 500 . The optical measurement device 400 is used to measure the information contained in the transfer substrate 100 or the target substrate 300 . The data processing device 500 is connected with the optical measuring device, and is used for determining the number and position of the chips 110 to be transferred on the transfer substrate 100 according to the information measured by the optical measuring device 400; and the data processing device 500 is also connected with the light source control device 600, In order to control the light source control device 600 , the light emitted by the light source device 800 is transmitted to the corresponding light excitation component 130 .

Wherein, the optical measurement device 400 may be, for example, an automatic optical inspection device (AOI, Automated Optical Inspection), or an X-ray (X Ray) measurement device. The measured information of the transfer substrate 100 may be, for example, the position of the chip 110 on the transfer substrate 100 , the shape of the chip 110 on the transfer substrate 100 , the crack of the chip 110 on the transfer substrate 100 , the orientation of the chip 110 on the transfer substrate 100 , the transfer substrate 100 The position of the alignment mark on the transfer substrate 100 , the shape of the alignment mark on the transfer substrate 100 , the direction of the alignment mark on the transfer substrate 100 , and the like. The measured position information of the target substrate 300 may be, for example, the position of the alignment mark on the target substrate 300, the shape of the alignment mark on the target substrate 300, the direction of the alignment mark on the target substrate 300, the position of the pad on the target substrate 300, The shape of the pads on the target substrate 300, the direction of the pads on the target substrate 300, and the like. Therefore, the alignment mark detected by the optical measuring device 400 may be an alignment point or an alignment point array. The information detected by the optical measurement device 400 can be used to perform alignment, and can also be used to determine whether the chip 110 meets the alignment requirements.

The data processing device 500 may be, for example, a chip with a data processing function, such as a microprocessor, a single-chip microcomputer, or a digital signal processor (DSP, Digital Signal Processing). For example, the data processing apparatus 500 can process position information such as the position of the chip 110 on the transfer substrate 100 , the position of the alignment mark on the transfer substrate 100 , the shape of the alignment mark on the transfer substrate 100 , or the direction of the alignment mark on the transfer substrate 100 . Through processing and calculation, the position of the transfer substrate 100 and the position of each chip 110 on the transfer substrate 100 can be obtained. And, the data processing device 500 can perform the alignment mark position on the target substrate 300 , the alignment mark shape on the target substrate 300 , the alignment mark direction on the target substrate 300 , the pad position on the target substrate 300 , and the target substrate 300 . By processing and calculating the shape of the pads on the target substrate 300 or the direction of the pads on the target substrate 300 , the position of the target substrate 300 and the precise placement of the chips 110 on the target substrate 300 can be obtained. The data processing device 500 can process and calculate the shape of the chips 110 on the transfer substrate 100 or the cracks of the chips 110 on the transfer substrate 100 , so as to obtain the number and position of the defective chips 110 . The data processing device 500 combines the above information to determine whether the transfer substrate 100 and the target substrate 300 are aligned, and determine whether each chip 110 meets the transfer accuracy, thereby determining the number and position of the chips 110 to be transferred on the transfer substrate 100, and then to control the light source The device 600 is controlled so that the light emitted by the light source device 800 is transmitted to the corresponding light excitation component 130 .

The transfer apparatus provided in the embodiment of the present application further includes an optical measurement device and a data processing device, which measure the transfer substrate 100 and the target substrate 300, thereby further improving the transfer accuracy.

It should be noted that, in the above embodiments, the optical detection device 400 is exemplarily shown to detect the positions of the target substrate 300 and the transfer substrate 100 , which is not a limitation of the present application. In other embodiments, the optical detection device 400 may not be provided, and the number and position of the chips 110 to be transferred may also be pre-stored, or the chips 110 on the transfer substrate 100 have been regularly and accurately aligned. In practical applications Whether or not to install an optical detection device can be selected as required.

It should be noted that, in the above-mentioned embodiments, it is exemplarily shown that the arrangement density of the light excitation components 130 is the same as the arrangement density of the chips 110, that is, the light excitation components 130 correspond to the chips 110 one-to-one. Application limitations. In other embodiments, the arrangement density of the light excitation components 130 may also be set to be different from the arrangement density of the chips 110 . For example, the arrangement density of the optical excitation components 130 is n times the arrangement density of the chips 110 , and n is a positive integer such as 2, 3, 4, 5, 10, etc.

FIG. 7 is a schematic structural diagram of a transfer substrate according to an embodiment of the present application, and FIG. 8 is a cross-sectional structural schematic diagram along A-A in FIG. 7 . Referring to FIG. 7 and FIG. 8 , on the basis of the above embodiments, in one embodiment, the optical excitation component 130 changes from a solid state or a liquid state to a gas state under the action of light. The transfer substrate 100 further includes: at least one via hole 101, the via hole 101 is located in the middle, the edge, or the area between the middle and the edge of the transfer substrate 100, the via hole 101 forms a negative pressure gas passage, and the negative pressure gas passage is used to discharge the generated gas. gas, so as to avoid excessive energy of the gas (explosive gas) excited by the light excitation component 130 and cause damage to the chip 110 .

In an embodiment of the present application, a neutralizing component is mixed in the optical excitation component 130, and the neutralizing component is used to neutralize harmful substances in the gas, or the neutralizing component generates a neutralizing gas under optical excitation to neutralize harmful materials. Among them, the harmful substances may be, for example, toxic or acidic or alkaline substances. The neutralizing member can be activated carbon, for example. The neutralizing gas produced by the neutralizing component corresponds to the harmful substance. If the harmful substance is acidic, the corresponding neutralizing gas is alkaline; if the harmful substance is alkaline, the corresponding neutralizing gas is acidic.

FIG. 9 is a schematic structural diagram of another transfer substrate 100 according to an embodiment of the present application. Referring to FIG. 9 , in an embodiment of the present application, the transfer apparatus further includes an execution film 140 , and the execution film 140 is disposed on a side of the light excitation component 130 away from the transfer substrate 100 . The material of the execution film 140 can be, for example, a flexible material, a material with a higher tensile rupture ratio. In this way, after the optical excitation component 130 is excited to generate gas, the deformation of the execution film 140 is greater than the deformation of the transfer substrate 100 , so that the chip 110 is separated from the execution film 140 . The setting of the execution film 140 can make the gas expansion generated by the excited light excitation component 130 not directly act on the chip 110, but act on the to-be-transferred chip 110 through the execution film 140, which plays the role of buffering and uniform stress, Improved transfer accuracy. In addition, the arrangement of the film 140 can reduce the contact between the gas generated by the optical excitation component 130 and the to-be-transferred chip 110 , thereby avoiding damages such as corrosion of the to-be-transferred chip 110 by the gas generated by the excited part 120 .

On the basis of the above-mentioned embodiments, in one embodiment, the transfer apparatus further includes an auxiliary triggering component, and the auxiliary triggering component may be, for example, a magnetic triggering component that can provide additional force to the chips 110 to be transferred on the transfer substrate 100 . Trigger components to assist in the transfer of the chip 110 .

In the above embodiments, in one embodiment, the target substrate 300 is another transfer substrate, a backlight driving backplane or a display driving backplane. Wherein, if the target substrate 300 is another transfer substrate, the chip transfer operation can be repeated multiple times, and the precision of the chip 110 is higher each time the transfer is performed. In this way, a larger number of chips 110 can meet the transfer precision in each transfer operation, which is beneficial to improve the transfer efficiency. The target substrate 300 can be, for example, a glass substrate or a quartz substrate, etc., which is beneficial to improve the dimensional stability, thermal stability and chemical stability of the target substrate 300 , thereby improving the transfer accuracy.

If the target substrate 300 is a backlight driving backplane, at this time, the chip 110 is a backlight chip. After all the chips 110 are transferred to the backlight driving backplane, it is necessary to use hot pressing, UV curing and reflow soldering to connect the chip 110 to the backlight. The pads on the drive backplane are soldered to form a backlight source in a display device. If the target substrate 300 is a display driver backplane, at this time, the chip 110 is a display chip. After all the chips 110 are transferred to the display driver backplane, the chip 110 needs to be connected to the display driver by hot pressing, UV curing, and reflow soldering. The pads on the drive backplane are soldered to form the pixels in the display device. Among them, a driving circuit such as a backlight driving backplane or a display driving backplane is provided with a driving circuit. When the transfer substrate 100 and the driving backplane are aligned and transferred, the transfer substrate 100 and the driving backplane can also support and protect the chip. , to protect the function of the lines on the drive backplane. For example, the drive backplane can use flexible materials such as polyimide (PI, Polyimide), polycarbonate (PC, Polycarbonate) or polyethylene terephthalate (PET, polyethylene glycol terephthalate) as a substrate to achieve Flexible display. The circuit film layer in the driving backplane can be an organic thin film transistor (OTFT, Organic Thin Film Transistor) or an organic field effect transistor (OMOS, Organic MOS). The driving backplane can be a glass substrate or a quartz substrate with driving lines engraved on it, or a flexible printed circuit board (FPC, Flexible Printed Circuit), a printed circuit board (PCB, Printed Circuit Board), and the like.

In an embodiment of the present application, the transfer apparatus further includes a moving device, and the moving device is used to drive the transfer substrate 100 to move, so that the transfer substrate 100 and the target substrate 300 are aligned. Exemplarily, it is only necessary to adjust the position of the transfer substrate 100 through the moving device. In the embodiment of the present application, only the transfer substrate 100 is set to be displaced and aligned, which is beneficial to reduce the manufacturing cost of the transfer device.

In an embodiment of the present application, the transfer apparatus includes a movement device, and the movement device is used to control the displacement of the transfer substrate 100 and the target substrate 300 . The motion device may be, for example, a device capable of controlling the displacement of the substrate, such as a robot arm. Exemplarily, the motion device can drive the transfer substrate 100 and the target substrate 300 to perform alignment during the displacement process. For example, dynamic punching is performed by calculating the motion advance, which is beneficial to further improve the transfer accuracy.

To sum up, in the embodiment of the present application, the light excitation component 130 is arranged on the transfer substrate 100, and the light source device 800 and the light source control device 600 are arranged in the transfer equipment, so as to excite the corresponding light excitation component 130 to be excited to generate thrust, Thereby, the corresponding chips 110 are separated from the transfer substrate 100 . In this way, in the process of one transfer, only the chips 110 that meet the transfer accuracy can be transferred, and the other chips 110 that do not meet the transfer accuracy can be transferred again through alignment. Compared with the mass transfer technology in the related art, the embodiment of the present application achieves accurate control and transfer of the chips 110 to be transferred, thereby improving the transfer precision and transfer yield. In one embodiment, the light source device 800 may be a backlight panel, and the light source control device 600 may be a liquid crystal on silicon panel to implement row/column scanning or area scanning, thereby improving the efficiency of mass transfer. In one embodiment, the light source device 800 may include a first light source for generating a light source beam and a beam expander module, and the light source control device 600 may be a digital micromirror to realize row/column scanning or area scanning, thereby improving the efficiency of mass transfer. efficiency. In one embodiment, the light source device 800 may include a second light source that generates a light source beam, and the light source control device 600 may be a deflector to enable row/column scanning. In one embodiment, by arranging the optical measuring device 400, the alignment accuracy can be improved, thereby further improving the transfer accuracy.

The embodiment of the present application provides a transfer method, and the transfer device provided by any embodiment of the present application can be used to perform mass transfer of chips. FIG. 10 is a schematic flowchart of a transfer method provided by an embodiment of the present application, and FIG. 11 is a schematic structural diagram of a transfer device corresponding to each step in the transfer method provided by an embodiment of the present application. 10 and 11, the transfer method includes the following steps:

S110 , providing the target substrate 300 .

The target substrate 300 may also be referred to as a target carrier board, that is, the transfer target position of the chip 110 is a position on the target substrate 300 .

S120, providing a transfer substrate 100, and aligning the transfer substrate 100 with the target substrate 300; the transfer substrate 100 is provided with photoexcitation components 130 arranged in an array, and the photoexcitation components 130 are provided with chips to be transferred on the side away from the transfer substrate 100 110.

The transfer substrate 100 may also be called a transition carrier board or a temporary carrier board, and is used to pre-arrange the chips 110 according to the size of the chips to be transferred. Generally speaking, the positions and orientations of the chips 110 placed on the transfer substrate 100 may be imprecise or even chaotic. In other embodiments, the chips 110 on the transfer substrate 100 are regularly and precisely aligned, and the number and position of the chips 110 to be transferred may be stored in advance.

The photo-excited component 130 refers to a component that undergoes physical and/or chemical changes when excited under the action of specific light. Exemplarily, the photo-excited component 130 changes from a solid state or a liquid state to a gaseous state under the action of light, so as to generate gas expansion, and the chip 110 is transferred (printed) from the transfer substrate 100 to the target substrate 300 , and the main material of the photo-excited component 130 is For example, materials such as ether or oxidant may be included; the specific light includes at least one of laser light, visible light or invisible light (eg UV light), and correspondingly, the light source device 800 includes a laser generator, a visible light generator or an invisible light generator. at least one.

In one embodiment, the transfer substrate 100 and the target substrate 300 are aligned during the displacement process. For example, dynamic punching is performed by calculating the motion advance, which is beneficial to further improve the transfer accuracy.

S130 , providing a light source device 800 and a light source control device 600 , and placing the light source control device 600 on the light path generated by the light source device 800 .

The light source device 800 and the light source control device 600 cooperate to realize the control of the light signal, so as to excite the corresponding light excitation component 130 . In one embodiment, the light source device 800 may be a backlight panel, and the light source control device 600 may be a liquid crystal on silicon panel to implement row/column scanning or area scanning, thereby improving the efficiency of mass transfer. In one embodiment, the light source device 800 may include a first light source for generating a light source beam and a beam expander module, and the light source control device 600 may be a digital micromirror to realize row/column scanning or area scanning, thereby improving the efficiency of mass transfer. efficiency. In one embodiment, the light source device 800 may include a second light source that generates a light source beam, and the light source control device 600 may be a deflector to enable row/column scanning.

S140 , controlling the light source control device 600 to irradiate the light generated by the light source device 800 to the corresponding light excitation component 130 , so as to transfer at least part of the chips 110 on the transfer substrate 100 to the target substrate 300 .

There are various ways to scan the light excitation component 130 with the light generated by the light source device 800 , for example, controlling the light source device 800 to generate a surface light source; Or, for example, the light source device 800 is controlled to generate a light source beam; the light source control device 600 is driven to perform single-point scanning on the chip 110 that satisfies the transfer accuracy.

At least part means part or all. If all the chips 110 to be transferred meet the transfer accuracy, then the number of chips transferred to the target substrate 300 is the full number; if only part of the chips 110 to be transferred meet the transfer accuracy, then the chips are transferred to The number of chips of the target substrate 300 is the number of parts. In one embodiment, the method for determining whether the position of the chip on the transfer substrate 100 meets the transfer requirement is to compare the position of the chip on the transfer substrate 100 with a preset position on the target substrate 300 or the position of the chip pads (for example, making a Poor), judge whether the two positions overlap completely or partially, if they overlap completely, the transfer requirements are met; if they overlap partially, compare the minimum overlapping area with the set threshold to determine whether the threshold requirements are met.

FIG. 11 exemplarily shows that all the chips 110 satisfy the transfer accuracy, and all the chips 110 are transferred to the target substrate 300 . In other embodiments, only some of the chips 110 on the transfer substrate 100 can meet the transfer accuracy, and the chips 110 that meet the transfer accuracy are transferred by the corresponding optical excitation components 130 to complete the first stamping action. Then, the transfer substrate 100 and the target substrate 300 are aligned again, so that the remaining at least part of the chips 110 can satisfy the alignment accuracy. And so on, until all the remaining chips 110 are transferred.

It can be seen from the above steps that in this embodiment of the present application, the light source device 800 and the light source control device 600 are used to excite the corresponding light excitation components 130 on the transfer substrate 100 to perform a stamping operation, so that the corresponding chips 110 are separated from the transfer substrate 100 . In this way, in the process of one transfer, only the chips 110 that meet the transfer accuracy can be transferred, and the other chips 110 that do not meet the transfer accuracy can be transferred again through alignment. Compared with the mass transfer technology in the related art, the embodiment of the present application achieves accurate control and transfer of the chips 110 to be transferred, thereby improving the transfer precision and transfer yield.

In the above embodiments, exemplary, the transfer method further includes the following steps:

First, the positions of the transfer substrate 100 and the target substrate 300 are measured using an optical measuring device to obtain transfer information.

The optical measuring device 400 may be, for example, an automatic optical inspection device (AOI), or an X-ray (X-ray) measuring device. The measured information of the transfer substrate 100 may be, for example, the position of the chip 110 on the transfer substrate 100 , the shape of the chip 110 on the transfer substrate 100 , the crack of the chip 110 on the transfer substrate 100 , the orientation of the chip 110 on the transfer substrate 100 , the transfer substrate 100 The position of the alignment mark on the transfer substrate 100 , the shape of the alignment mark on the transfer substrate 100 , the direction of the alignment mark on the transfer substrate 100 , and the like. The measured position information of the target substrate 300 may be, for example, the position of the alignment mark on the target substrate 300, the shape of the alignment mark on the target substrate 300, the direction of the alignment mark on the target substrate 300, the position of the pad on the target substrate 300, The shape of the pads on the target substrate 300 or the direction of the pads on the target substrate 300, and the like. Therefore, the alignment mark detected by the optical measuring device 400 may be an alignment point or an alignment point array. The information detected by the optical measurement device 400 can be used to perform alignment, and can also be used to determine whether the chip 110 meets the alignment requirements.

Then, the data processing device performs processing according to the transfer information, determines whether the position of the chip 110 on the transfer substrate 100 meets the transfer accuracy, and obtains quantity information and position information; the light source control device 600 adjusts the light generated by the light source device 800 according to the quantity information and the position information path of.

The data processing device 500 may be, for example, a chip with a data processing function, such as a microprocessor, a single-chip microcomputer, or a digital signal processor (DSP). For example, the data processing apparatus 500 can process position information such as the position of the chip 110 on the transfer substrate 100 , the position of the alignment mark on the transfer substrate 100 , the shape of the alignment mark on the transfer substrate 100 , or the direction of the alignment mark on the transfer substrate 100 . Through processing and calculation, the position of the transfer substrate 100 and the position of each chip 110 on the transfer substrate 100 can be obtained. And, the data processing device 500 can perform the alignment mark position on the target substrate 300 , the alignment mark shape on the target substrate 300 , the alignment mark direction on the target substrate 300 , the pad position on the target substrate 300 , and the target substrate 300 . By processing and calculating the shape of the pads on the target substrate 300 or the direction of the pads on the target substrate 300 , the position of the target substrate 300 and the precise placement of the chips 110 on the target substrate 300 can be obtained. The data processing device 500 can process and calculate the shape of the chips 110 on the transfer substrate 100 or the cracks of the chips 110 on the transfer substrate 100 , so as to obtain the number and position of the defective chips 110 . The data processing device 500 combines the above information to determine whether the transfer substrate 100 and the target substrate 300 are aligned, and determine whether each chip 110 meets the transfer accuracy, thereby determining the number and position of the chips 110 to be transferred on the transfer substrate 100, and then to control the light source The device 600 is controlled so that the light emitted by the light source device 800 is transmitted to the corresponding light excitation component 130 .

The embodiment of the present application also provides a display device, which can be an LCD display device equipped with a Mini LED backlight, an LCD display device equipped with a Micro LED backlight, a Mini LED display device or a Micro LED display device. The display device includes: a driving backplane and a display chip (for example, a Mini LED chip or a Micro LED chip) disposed on the driving backplane, wherein the display chip is transferred to the driving backplane using the transfer method provided in any embodiment of the present application superior.

Wherein, the driving backplane may use flexible materials such as polyimide (PI), polycarbonate (PC), or polyethylene terephthalate (PET) as a substrate to realize flexible display. The circuit film layer in the driving backplane can be an organic thin film transistor (OTFT) or an organic field effect transistor (OMOS). The driving backplane may be a glass substrate or a quartz substrate with driving lines engraved on it, or a flexible printed circuit board (FPC), a printed circuit board (PCB), or the like.

Embodiments of the present application provide a transfer apparatus, a transfer method, and a display device, so as to improve the precision and yield of mass transfer.

An embodiment of the present application further provides a display device, comprising: a driving backplane and a component to be transferred disposed on the driving backplane, wherein the component to be transferred is transferred as described in any embodiment of the present application The method is transferred to the drive backplane.

Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present application. Therefore, although the present application has been described in detail through the above embodiments, the present application is not limited to the above embodiments, and may also include more other equivalent embodiments without departing from the concept of the present invention. The scope is determined by the scope of the appended claims.

Claims

A transfer device comprising:

A transfer substrate (100), the transfer substrate (100) is provided with optical excitation components (130) arranged in an array, and the side of the optical excitation components (130) away from the transfer substrate (100) is used for placing parts to be transferred;

a light source device (800) for generating light to excite the light excitation component (130);

A light source control device (600), located on the optical path of the light generated by the light source device (800), the light source control device (600) is configured to irradiate the light generated by the light source device (800) to the corresponding light The parts (130) are excited, so that at least part of the parts to be transferred on the transfer substrate (100) are transferred to the target substrate (300).
The transfer apparatus according to claim 1, wherein the light source device (800) comprises a backlight panel (810) for generating a surface light source; the light source control device (600) comprises a silicon-based A liquid crystal panel (610), the liquid crystal on silicon panel (610) comprising:

an array circuit layer (611), comprising switching devices arranged in an array, and driving electrodes connected to the switching devices;

The liquid crystal layer (612) is disposed on one side of the array circuit layer (611); the liquid crystal layer (612) includes liquid crystal molecules, and the liquid crystal molecules are controlled by the corresponding driving electrodes to change in angle, so as to The light generated by the backlight panel (810) is controlled to be transmitted to the corresponding light excitation component (130).
The transfer apparatus of claim 2, wherein the array circuit layer (611) further comprises:

a gate gating module (614), connected to the switching device; the gate gating module (614) is configured to turn on the switching device row by row, or simultaneously turn on the switches of at least part of the row device;

A source gating module (615) is connected to the switching device; the source gating module (615) is configured to simultaneously send a driving signal to the driving electrodes of at least part of the columns through the switching device, so as to drive all the The liquid crystal molecules are deflected;

Wherein, the row extends along a first direction, and the column extends along a second direction; or, the row extends along the second direction, and the column extends along the first direction; the first direction and The second direction intersects.
The transfer apparatus according to claim 1, wherein the light source device (800) comprises a first light source (821) and a beam expanding module (822), the first light source (821) emitting a light source beam, the beam expanding The module (822) is used for diffusing the light source beam to generate a surface light source; the light source control device (600) includes a digital micromirror (620), and the digital micromirror (620) includes:

a drive array, including switching devices arranged in an array;

Reflecting mirrors (621) arranged in an array, the reflecting mirrors (621) are arranged corresponding to the switching devices; the angle of the reflecting mirrors (621) is adjustable under the control of the driving array, and is used to convert the The light generated by the light source device (800) is transmitted to the corresponding light excitation component (130).
The transfer apparatus according to claim 1, wherein the light source device (800) comprises a second light source (830) which emits a light source beam; the light source control device (600) comprises a deflector (630), the deflector (630) is used to scan the light source beam to the corresponding light excitation component (130).
The transfer apparatus according to claim 5, wherein the deflector (630) comprises a lens module (631) located on the optical path of the light emitted by the light source beam, the lens module (631) 631) for adjusting the angle of the light.
The transfer device of claim 1, further comprising:

an optical measurement device (400) for measuring information contained in the transfer substrate (100) or the target substrate (300);

A data processing device (500), connected to the optical measuring device (400); the data processing device (500) is configured to determine the quantity and position of the components to be transferred on the transfer substrate (100) according to the information ;

The data processing device (500) is further connected with the light source control device (600) to control the light source control device (600), so that the light emitted by the light source device (800) is transmitted to the corresponding light excitation device component (130).
The transfer apparatus of claim 1, wherein the light source device (800) comprises at least one of a laser generator, a visible light generator, or a non-visible generator.
The transfer apparatus of claim 1, wherein at least one of the photo-excited components (130) corresponds to one of the components to be transferred.
The transfer device according to claim 1, wherein the optical excitation component (130) changes from a solid state or a liquid state to a gas state under the action of light;

The transfer substrate (100) further comprises: at least one via hole (101), each of the via holes (101) is located in the middle, the edge or the region between the middle and the edge of the transfer substrate (100), the At least one via hole (101) forms a negative pressure gas passage, and the negative pressure gas passage is used to discharge the generated gas;

Alternatively, a neutralizing component is mixed in the optical excitation component (130), and the neutralizing component is used to neutralize harmful substances in the gas, or the neutralizing component generates a neutralizing gas under optical excitation to neutralize harmful materials.
The transfer apparatus according to claim 1, further comprising: an execution film (140), the execution film (140) being disposed on a side of the light excitation component (130) away from the transfer substrate (100).
A transfer method comprising:

providing a target substrate (300);

A transfer substrate (100) is provided, and the transfer substrate (100) is aligned with the target substrate (300); the transfer substrate (100) is provided with optical excitation components (130) arranged in an array, the A part to be transferred is provided on a side of the light excitation component (130) away from the transfer substrate (100);

A light source device (800) and a light source control device (600) are provided, and the light source control device (600) is placed on the light path generated by the light source device (800);

The light source control device (600) is controlled to irradiate the light generated by the light source device (800) to the corresponding light excitation component (130), so that at least part of the light source on the transfer substrate (100) is irradiated The part to be transferred is transferred onto the target substrate (300); wherein the part to be transferred satisfies the transfer accuracy.
The transfer method according to claim 12, wherein the controlling the light source control device (600) to irradiate the light generated by the light source device (800) to the corresponding light excitation component (130) comprises: :

controlling the light source device (800) to generate a surface light source; driving the light source control device (600) to perform surface scanning on the part to be transferred that meets the transfer accuracy;

Alternatively, the light source device (800) is controlled to generate a light source beam; the light source control device (600) is driven to perform single-point scanning on the part to be transferred that meets the transfer accuracy.
The transfer method according to claim 12, wherein the controlling the light source control device (600) to irradiate the light generated by the light source device (800) to the corresponding light excitation component (130) comprises: :

Using an optical measuring device (400) to measure the positions of the transfer substrate (100) and the target substrate (300) to obtain transfer information;

The data processing device (500) performs processing according to the transfer information, determines whether the position of the component to be transferred on the transfer substrate (100) meets the transfer accuracy, and obtains quantity information and position information;

The light source control device (600) adjusts the path of the light generated by the light source device (800) according to the quantity information and the position information;

Alternatively, the controlling the light source control device (600) to irradiate the light generated by the light source device (800) to the corresponding light excitation component (130) includes:

Acquiring pre-stored quantity information and location information of the components to be transferred that need to be transferred;

The light source control device (600) adjusts the path of the light generated by the light source device (800) according to the quantity information and the position information.
The transfer method according to claim 14, wherein the transfer information includes at least one of the following:

The position of the part to be transferred on the transfer substrate (100), the shape of the part to be transferred on the transfer substrate (100), the crack of the part to be transferred on the transfer substrate (100), the transfer substrate The orientation of the component to be transferred on the (100), the position of the alignment mark on the transfer substrate (100), the shape of the alignment mark on the transfer substrate (100), the alignment on the transfer substrate (100) mark direction; the position of the alignment mark on the target substrate (300), the shape of the alignment mark on the target substrate (300), the direction of the alignment mark on the target substrate (300), the target substrate ( 300), the shape of the pads on the target substrate (300), and the direction of the pads on the target substrate (300).
A display device, comprising: a driving backplane and a display chip disposed on the driving backplane, wherein the display chip is transferred to the driving backplane using the transfer method according to any one of claims 12-15 superior.