JP2010243229A - Probe card, and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card capable of connecting simply probes to a substrate, and to provide a method for manufacturing the probe card. <P>SOLUTION: This probe card includes: an ST substrate 100 having a plurality of gold bumps 110; a transparent plate 200 provided on the surface of the ST substrate 100; and a plurality of probes 300 arrayed on the end of the transparent plate 200, and connected respectively to each gold bump 110. The probes 300 are allowed to adhere onto the transparent plate 200 by a UV curing type adhesive 700. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a probe card used for measuring electrical characteristics of a semiconductor device and a method for manufacturing the probe card.

  This type of probe card includes a board having a plurality of electrodes provided on the lower surface and a plurality of probes each soldered to the electrodes (see paragraph 0029 of FIG. 5 and FIG. 5). .

JP 2006-10588 A

  Such a probe card connects the probes to the substrate one by one by irradiating the solder plating portion of the probe with a laser while preheating the substrate. For this reason, it takes time to connect the probe, which has been a factor in increasing costs. In addition, when the probe is joined, a thermal load is applied, so that the substrate and / or the probe may thermally expand, and the position accuracy of the tip of the probe may deteriorate.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a probe card that can easily connect a probe to a substrate and a method for manufacturing the probe card.

  In order to solve the above problems, a probe card according to the present invention includes a substrate having a plurality of electrodes, a transparent plate provided on the surface of the substrate, and arranged on the transparent plate and connected to the electrodes. And a plurality of probes, wherein the probes are bonded on a transparent plate with an adhesive.

  In the case of such a probe card, each of the probes is applied to the transparent plate by applying an adhesive to the probe and placing it on the transparent plate, and then irradiating the adhesive with light through the transparent plate. Can be fixed on top. By simply attaching the transparent plate on the substrate and connecting the probes to the electrodes, a plurality of the probes can be connected to the substrate at a time. Therefore, it is very easy to connect the probes to the substrate. become. Moreover, since it is not necessary to preheat the substrate in order to connect the probe to the substrate, it is possible to prevent the accuracy of the tip position of the probe from deteriorating due to the preheating. In addition, since the adhesive is irradiated with light through the transparent plate, it is possible to prevent problems such as the adhesive being a shadow of the probe and not being exposed to light.

  The probe has a base bonded to the transparent plate, and a leg extending from the base toward the transparent plate. It is preferable that the leg is in pressure contact with the electrode in a state where the transparent plate is attached to the substrate. In this case, when the transparent plate is attached to the substrate, the leg portion of the probe is pressed against the electrode of the substrate, and the probe is electrically connected to the electrode of the substrate. Thus, the electrical connection of the probe to the substrate is simplified.

  In the method for manufacturing a probe card of the present invention, an adhesive is applied to a probe and placed on a transparent plate, and then the adhesive is irradiated with light through the transparent plate, whereby the probe is made transparent. Then, the transparent plate is attached on the surface of the substrate, and the probe is connected to the electrode of the substrate.

  According to such a probe card manufacturing method, an adhesive is applied to the probe and placed on a transparent plate, and the probe is placed on the transparent plate simply by irradiating the adhesive with light through the transparent plate. It can be fixed to. The probe can be connected to the substrate by attaching the transparent plate to the substrate and connecting the probe to the electrode of the substrate. Therefore, the connection of the probe to the substrate is very simple. Moreover, since it is not necessary to preheat the substrate in order to connect the probe to the substrate, it is possible to prevent the accuracy of the tip position of the probe from deteriorating due to the preheating. In addition, since the adhesive is irradiated with light through the transparent plate, it is possible to prevent problems such as the adhesive being a shadow of the probe and not being exposed to light.

  In the case where the electrode is a metal bump and the probe has a base bonded to the transparent plate and a leg portion extending toward the transparent plate at the base, the transparent plate is When attached to the substrate, the legs are pressed against the electrodes. In this case, the leg is pressed against the electrode only by attaching the transparent plate to the substrate, so that the electrical connection of the probe to the substrate is simplified.

It is the schematic of the probe card which concerns on embodiment of this invention, Comprising: (a) is sectional drawing, (b) is a bottom view. It is an enlarged view of (alpha) part of the said probe card. It is a schematic sectional drawing of the spring pin of the probe card. It is a schematic diagram which shows the transfer process of UV curable adhesive among the manufacturing processes of the said probe card, Comprising: (a) is a figure which shows the state before transferring an adhesive agent to a probe, (b) adheres to a probe. The figure which shows the state which transcribe | transfers an agent, (c) is a figure which shows the state after transcribe | transferring an adhesive agent to a probe. It is a schematic diagram which shows the installation structure of a probe among the manufacturing processes of the said probe card, Comprising: (a) is a figure which shows the state before mounting a probe on a transparent board, (b) is a probe on a transparent board. It is a figure which shows the state mounted in. It is a schematic diagram which shows the process of irradiating a UV curing type adhesive agent with an ultraviolet-ray among the manufacturing processes of the said probe card. It is a schematic diagram which shows the process of bonding a transparent plate on a board | substrate and connecting a probe to the electrode of a board | substrate among the manufacturing processes of the said probe card.

  Hereinafter, a probe card according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3. The probe card shown in FIGS. 1 and 2 includes a space transformer substrate 100 (hereinafter referred to as an ST substrate), a transparent plate 200, a plurality of probes 300, a main substrate 400, a plurality of spring pins 500, and a guide. And a substrate 600. Hereinafter, each part will be described in detail.

  A single layer ceramic substrate is used as the ST substrate 100. This ST substrate 100 corresponds to the substrate in the claims. The central portion of the first surface of the ST substrate 100 is an adhesion region to which the transparent plate 200 is adhered. In addition, a plurality of gold bumps 110 are disposed on both sides of the adhesion region on the first surface of the ST substrate 100. This gold bump 110 corresponds to the electrode of the substrate in the claims. A plurality of electrodes 120 are provided on the second surface on the back side of the first surface of the ST substrate 100. Gold bump 110 and electrode 120 are connected to each other by wiring provided on and / or inside the surface of ST substrate 100.

  A glass plate such as sapphire glass is used as the transparent plate 200. The outer shape of the transparent plate 200 is a shape corresponding to the adhesion region of the ST substrate 200.

  The probe 300 is a conductive plate. As shown in FIG. 1B, the probe 300 is bonded to each end portion of the transparent plate 200 with a UV curable adhesive 700 at intervals. As shown in FIG. 2, each probe 300 has a base portion 310, an arm portion 320, a contact portion 330, and a leg portion 340. The base 310 is a plate-like body that is substantially L-shaped when viewed from the front, and includes a horizontal portion 311 and a vertical portion 312. The tip of the horizontal portion 311 of the base portion 310 is a portion that is bonded to the end portion of the transparent plate 200 by the UV curable adhesive 700. On the other hand, the base end portion of the horizontal portion 311 protrudes outward from the end portion of the transparent plate 200 in a state where the distal end portion is bonded to the end portion of the transparent plate 200. In this embodiment, a UV epoxy adhesive is used as the UV curable adhesive 700.

  The arm part 320 is a substantially long plate-like body extending from the vertical part 312 of the base part 310 in the same direction as the tip part of the horizontal part 311. The contact portion 330 is a substantially rectangular plate provided at a substantially right angle at the tip of the arm portion 320. The contact portion 330 is a portion that contacts the electrode 11 of the semiconductor device 10. The leg portion 340 is a substantially rectangular plate extending obliquely from the base end portion of the horizontal portion 311 toward the ST substrate 100. The legs 340 can be elastically deformed. The position of the tip of the leg portion 340 is disposed closer to the transparent plate 200 than the virtual straight line X passing through the transparent plate contact surface of the horizontal portion 311 of the base portion 310. For this reason, when the transparent plate 200 is bonded to the ST substrate 100, the legs 340 elastically contact (that is, press contact) the gold bumps 110 of the ST substrate 100. When the leg 340 is pressed against the gold bump 110, the probe 300 is electrically connected to the gold bump 110 of the ST substrate 100.

  The main substrate 400 is a well-known printed circuit board, and is disposed on the second surface side of the ST substrate 100. A plurality of electrodes 410 are disposed on the first surface of the main substrate 400. A plurality of external electrodes 420 are provided on the second surface of the main substrate 400. The electrode 410 and the external electrode 420 are connected by wiring provided on and / or inside the main substrate 400. The external electrode 420 is connected to a tester.

  The guide substrate 600 is disposed between the ST substrate 100 and the main substrate 400. The guide substrate 600 is provided with a through hole 610 penetrating in the thickness direction. The spring pins 500 are inserted into the through holes 610, respectively.

  Each spring pin 500 is a spring probe that connects between the main board 400 and the ST board 100. As shown in FIG. 3, the spring pin 500 includes a cylindrical barrel 510 having conductivity, first and second plungers 521 and 522 protruding from both ends of the barrel 510, and first and second plungers 521, 522 and a coil spring 530 interposed therebetween.

  The first and second plungers 521 and 522 are conductive members having a substantially convex shape in cross section. The coil spring 530 biases the first plunger 521 upward and elastically contacts the electrode 410 of the main board 400, while biasing the second plunger 522 downward and elastically acts on the electrode 120 of the ST board 100. Contact. The main board 400 and the ST board 100 are electrically connected via the first and second plungers 521 and 522 and the barrel 510.

  The probe card having such a configuration is manufactured as follows. Hereinafter, a description will be given with reference to FIGS. FIG. 4 is a schematic view showing a UV curable adhesive transfer process in the probe card manufacturing process, wherein FIG. 4A shows a state before the adhesive is transferred to the probe, and FIG. The figure which shows the state which transfers an adhesive agent to a probe, (c) The figure which shows the state after transferring an adhesive agent to a probe, FIG. 5 is a schematic diagram which shows the installation structure of a probe among the manufacturing processes of the said probe card. FIG. 6A is a diagram showing a state before the probe is placed on the transparent plate, FIG. 6B is a diagram showing a state where the probe is placed on the transparent plate, and FIG. FIG. 7 is a schematic diagram showing a step of irradiating UV curable adhesive with ultraviolet rays among the steps. FIG. 7 shows a step of bonding the transparent plate on the substrate and connecting the probe to the electrode of the substrate in the probe card manufacturing step. It is a schematic diagram which shows. In addition, about the code | symbol of the UV curable adhesive before hardening, it attaches | subjects and distinguishes from the UV curable adhesive 700 after hardening.

  First, as shown in FIG. 4, the probe 300 and the transfer table T are brought relatively close to each other, and the UV curable adhesive 700 ′ applied on the transfer table T is transferred to the tip of the horizontal part 311 of the probe 300. Let Thereafter, as shown in FIG. 5, the distal end portion of the horizontal portion 311 of the probe 300 is placed on the end portion of the transparent plate 200 placed on the glass stage S. After that, as shown in FIG. 6, the UV lamp L (ultraviolet irradiation device) is irradiated with ultraviolet rays through the stage S and the transparent plate 200 toward the UV curable adhesive 700 ′. As a result, the UV curable adhesive 700 ′ is cured to become the UV curable adhesive 700, and the probe 300 is bonded to the end of the transparent plate 200. By repeating such a process, the plurality of probes 300 are arranged at both ends of the transparent plate 200, and the plurality of probes 300 and the transparent plate 200 are modularized. In order to mount the probe 300 with high accuracy, it is preferable to mark the corner portion of the transparent plate 200 by etching or the like. The probe 300 is arranged while measuring the position of the contact portion 330 of the probe 300 with a CCD camera or the like on the basis of the position of the mark. Alternatively, a groove may be formed in the transparent plate 200 with high accuracy by etching or the like, and the horizontal portion 311 of the probe 300 may be fitted into this groove.

  Thereafter, the adhesive G is applied to the bonding area of the ST substrate 100, and the transparent plate 200 is placed and bonded to the bonding area. At this time, the leg portion 340 of the probe 300 is elastically pressed against the gold bump 110 of the ST substrate 100. Thereby, the leg part 340 is electrically connected to the gold bump 110.

  Thereafter, the guide substrate 600 is disposed opposite to the second surface of the ST substrate 100. The spring pins 500 are inserted into the through holes 610 of the guide substrate 600, respectively. Then, the second plungers 522 of the spring pins 500 are in contact with the electrodes 120 of the ST substrate 100, respectively. Thereafter, the main substrate 400 is disposed to face the guide substrate 600. At this time, the first plungers 521 of the spring pins 500 are in contact with the electrodes 410 of the main board 400. Then, the main board 400 is brought relatively close to the guide board 600. Thereby, the coil spring 530 of the spring pin 500 is compressed and compressed between the first and second plungers 521 and 522.

  The probe card manufactured in this way is attached to a prober of a tester and used to measure electrical characteristics of the semiconductor device 10. Specifically, the prober is operated to bring the probe card and the semiconductor device 10 closer to each other. Then, the contact portion 330 of the probe 300 of the probe card comes into contact with the electrode 11 of the semiconductor device 10 and the electrical characteristics of the semiconductor device 10 are measured.

  In the case of the probe card as described above, the UV curable adhesive 700 ′ is transferred to the probe 300, the probe 300 is placed on the end of the transparent plate 200, and then the UV lamp L is placed through the stage S and the transparent plate 200. By simply repeating UV irradiation on the UV curable adhesive 700 ′, the plurality of probes 300 can be fixed on the transparent plate 200 and modularized. Thereafter, by simply bonding the transparent plate 200 to the ST substrate 100, the leg portions 340 of the probe 300 are pressed against the gold bumps 110 of the ST substrate 100, respectively, and the probe 300 is connected to the ST substrate 100. Therefore, the connection of the probe 300 to the ST substrate 100 becomes very simple. Moreover, since it is not necessary to preheat the ST substrate 100 in order to connect the probe 300 to the ST substrate 100, the accuracy of the tip position of the probe 300 (that is, the tip position of the contact portion 330) deteriorates due to the preheating. Can be prevented. In addition, since the UV curable adhesive 700 ′ is irradiated with ultraviolet rays through the transparent plate 200, the UV curable adhesive 700 ′ becomes a shadow of the probe 300, and it is possible to prevent problems such as the ultraviolet rays not being applied. .

  The probe card described above is not limited to the above-described embodiment, and can be arbitrarily changed in design within the scope of the claims. Details will be described below.

  The probe card is arbitrarily changed in design as long as it has at least one substrate, a transparent plate attached to the substrate, and a probe bonded to the transparent plate with an adhesive and connected to the electrode of the substrate. Is possible. That is, whether or not the main board 400, the spring pin 500, and the guide board 600 are provided is arbitrary.

  In the above embodiment, the UV curable adhesive is used as the adhesive. However, any adhesive may be used as long as it is cured by irradiating light. In this case, a light irradiation device for irradiating light for curing the photocurable adhesive may be used instead of an ultraviolet irradiation device such as a UV lamp L.

  For the ST substrate 100, other substrates such as a printed circuit board can be used. The gold bumps 110 can be replaced with metal bumps such as solder bumps and copper bumps, or other electrodes. The transparent plate 200 does not need to be a glass plate, and any material may be used as long as it has transparency that allows light such as ultraviolet rays to pass through. The probe 300 may be connected to the gold bump 110 of the ST substrate 100 using something other than the leg portion 340 (for example, wire bonding or the like). Of course, the leg 340 can be joined not only to the metal bumps but also to the metal bumps. In addition, the shape of the probe 300 is illustrated and is not limited to the above embodiment.

  In the above embodiment, the UV lamp L is used as an apparatus for irradiating ultraviolet rays. However, the present invention is not limited to this. That is, as described above, an ultraviolet irradiation device or a light irradiation device other than the UV lamp L can be used.

  In the above embodiment, the materials, shapes, dimensions, etc. constituting each part of the probe card have been described as examples, and can be arbitrarily changed as long as the same function can be realized. .

100 ... ST substrate
110 ... Gold bump 200 ... Transparent plate 300 ... Probe 340 ... Leg 400 ... Main substrate 500 ... Probe pin 600 ... Guide substrate 700 ... UV curable adhesive

Claims (4)

A substrate having a plurality of electrodes;
A transparent plate provided on the surface of the substrate;
A plurality of probes arranged on the transparent plate and connected to the electrodes,
A probe card, wherein the probe is bonded onto a transparent plate with an adhesive. The probe card according to claim 1,
The probe has a base bonded to the transparent plate, and a leg extending toward the transparent plate on the base, and the leg is attached to the substrate. A probe card, wherein the electrode is pressed against the electrode. Apply adhesive to the probe and place it on a transparent plate,
Thereafter, the adhesive is irradiated with light through the transparent plate, thereby causing the probe to adhere onto the transparent plate,
Thereafter, the transparent plate is mounted on the surface of the substrate, and the probe is connected to the electrode of the substrate. In the manufacturing method of the probe card according to claim 3,
The electrode is a metal bump;
The probe has a base that is bonded to the transparent plate, and a leg that extends to the base toward the transparent plate,
When the transparent plate is attached to the substrate, the leg portion is in pressure contact with the electrode.

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