CN112771206B - 柔性装置用基板 - Google Patents
柔性装置用基板 Download PDFInfo
- Publication number
- CN112771206B CN112771206B CN201980059695.1A CN201980059695A CN112771206B CN 112771206 B CN112771206 B CN 112771206B CN 201980059695 A CN201980059695 A CN 201980059695A CN 112771206 B CN112771206 B CN 112771206B
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- China
- Prior art keywords
- substrate
- oxide film
- glass
- stainless steel
- layer
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 119
- 239000011521 glass Substances 0.000 claims abstract description 145
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 67
- 239000010935 stainless steel Substances 0.000 claims abstract description 62
- 239000000463 material Substances 0.000 claims abstract description 34
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 22
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000011651 chromium Substances 0.000 claims description 20
- 229910052804 chromium Inorganic materials 0.000 claims description 17
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 7
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 238000005452 bending Methods 0.000 abstract description 14
- 230000004888 barrier function Effects 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract description 7
- 238000003908 quality control method Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 107
- 239000010408 film Substances 0.000 description 65
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 21
- 238000011156 evaluation Methods 0.000 description 18
- 238000010304 firing Methods 0.000 description 17
- 238000004804 winding Methods 0.000 description 16
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 11
- 239000000843 powder Substances 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000010298 pulverizing process Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000005238 degreasing Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000012461 cellulose resin Substances 0.000 description 2
- 229910000423 chromium oxide Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000002609 medium Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical compound CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LNAZSHAWQACDHT-XIYTZBAFSA-N (2r,3r,4s,5r,6s)-4,5-dimethoxy-2-(methoxymethyl)-3-[(2s,3r,4s,5r,6r)-3,4,5-trimethoxy-6-(methoxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6r)-4,5,6-trimethoxy-2-(methoxymethyl)oxan-3-yl]oxyoxane Chemical compound CO[C@@H]1[C@@H](OC)[C@H](OC)[C@@H](COC)O[C@H]1O[C@H]1[C@H](OC)[C@@H](OC)[C@H](O[C@H]2[C@@H]([C@@H](OC)[C@H](OC)O[C@@H]2COC)OC)O[C@@H]1COC LNAZSHAWQACDHT-XIYTZBAFSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- 229910015371 AuCu Inorganic materials 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001087 glyceryl triacetate Substances 0.000 description 1
- 235000013773 glyceryl triacetate Nutrition 0.000 description 1
- 235000003642 hunger Nutrition 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- -1 polypropylene carbonate Polymers 0.000 description 1
- 229920000379 polypropylene carbonate Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000037351 starvation Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229960002622 triacetin Drugs 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
- C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/14—Silica-free oxide glass compositions containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/042—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
-
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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Abstract
本发明涉及一种柔性装置用基板，其特征在于具有不锈钢基材、形成在不锈钢基材的表面上的氧化物膜、和作为电绝缘性铋系玻璃的层的玻璃层，所述层形成在氧化物膜的表面上。根据本发明的柔性装置用基板在防锈性、水分阻隔性、玻璃层的密合性、耐弯曲性和玻璃层表面的表面平滑性方面是优异的，同时在生产、和品质控制等方面是容易的。
Description
技术领域
本发明涉及柔性装置用基板。更具体地，本发明涉及防锈性、水分阻隔性、耐弯曲性和绝缘层的密合性优异，因此，优选用于有机EL用途中的柔性装置用基板。
背景技术
要求在有机EL照明、有机EL显示器、有机薄膜太阳能电池、IC印刷电路、或电子纸等中使用的柔性装置用基板具有例如水分阻隔性和气体阻隔性等阻隔性，并且进一步具有平滑性和绝缘性。另外，要求基板具有优异的柔韧性(耐弯曲性)，使得可以将其应用于弯曲的表面，或者可以在卷对卷(roll-to-roll)工艺中制造。
下述专利文献1公开了通过将透明导电层、有机发光介质层和阴极层依次层叠在塑料膜基材上，并且将金属箔经由粘接层进一步层叠在其上而制备的有机EL装置的结构。然而，从水分阻隔性和耐热性的观点，塑料膜基材不令人满意。
下述专利文献2公开了在不锈钢基材上设置有聚酰亚胺树脂的平坦化层的柔性装置用基板。然而，由于聚酰亚胺树脂的高吸水性，其不能提供令人满意的水分阻隔性。
下述专利文献3公开了通过将二氧化硅系玻璃的膜形成在不锈钢基材上而制备的柔性太阳能电池基板。然而，一般的二氧化硅系玻璃的热膨胀系数小于不锈钢的热膨胀系数，并且因此，它缺乏对不锈钢基材的密合性。二氧化硅系玻璃的另一个问题是它易受弯曲和冲击影响。
为了解决这些问题，本发明人在专利文献4中提出了一种柔性装置用金属基板。该基板通过将镍镀层形成在金属基材的表面上，并且将电绝缘性铋系玻璃层叠在镍镀层的表面上来制备。
现有技术文献：
专利文献：
专利文献1：JP 2004-171806 A
专利文献2：JP 2011-97007 A
专利文献3：JP 2006-80370 A
专利文献4：JP 2014-107053A
发明内容
发明要解决的问题
柔性装置用金属基板通过将铋系玻璃层叠在金属基材上来制备。由于铋系玻璃具有优异的水分阻隔性和优异的对金属基材的密合性，因此基板具有优异的绝缘性和平滑性。此外，基板是轻质和柔性的。然而，烧制后的玻璃层表面会具有返粗(seeding)(微小突起)和收缩(cissing)。这些微小缺陷会损害玻璃层的平滑性。
当将耐生锈的不锈钢基材用作金属基材时，不能在不锈钢基材和玻璃层之间实现充分的密合性。这会使耐弯曲性劣化，并且引起例如玻璃层的破裂和剥离等问题。
为了解决所述问题，本发明人在WO 2018/235759中提出了柔性装置用基板。该基板包括不锈钢基材、在不锈钢基材的表面上形成的镍镀层、和在镍镀层的表面上以层状形成的电绝缘性铋系玻璃的玻璃层。
通过使用不锈钢基材来有效地防止柔性装置用基板中的生锈。此外，不锈钢基材和玻璃层之间的密合性通过将镍镀层形成在不锈钢基材上而得到显著改善。由于基板具有优异的耐弯曲性，因此其具有当用作柔性装置用基板时不会发生玻璃层的剥离等的充分的柔韧性。
本发明人进一步在上述在先申请的发明上进行研究，以便简化制造过程和品质控制，并且减少制造成本。结果，他们发现在不锈钢基材上形成具有特定厚度和组成的氧化物膜可以赋予与形成镍镀层的情况基本相同水平的玻璃层的密合性。换言之，可不需要形成镍镀层。
因此，本发明的一个目的是提供防锈性、水分阻隔性、玻璃层的密合性、耐弯曲性和玻璃层表面的表面平滑性优异、并且容易制造和品质控制的柔性装置用基板。
用于解决问题的方案
本发明提供一种柔性装置用基板，并且该基板包括不锈钢基材、在不锈钢基材的表面上形成的氧化物膜、和在氧化物膜的表面上以层状形成的电绝缘性铋系玻璃的玻璃层。
在本发明的柔性装置用基板中，优选的是：
1.氧化物膜的厚度为30nm以上；
2.氧化物膜的厚度为80nm以上；
3.在氧化物膜的厚度方向上与氧化物膜和玻璃层之间的界面相距20nm的点处的铬浓度为30原子％以上；
4.在氧化物膜的厚度方向上与氧化物膜和玻璃层之间的界面相距20nm的点处的铬浓度为50原子％以上；
5.铋系玻璃包含Bi2O3、ZnO和B2O3。
本发明进一步提供一种柔性装置用基板，并且该基板包括不锈钢基材和在不锈钢基材的表面上形成的氧化物膜。氧化物膜的厚度为30nm以上。
在本发明的柔性装置用基板中，优选的是，氧化物膜的厚度为80nm以上。
发明的效果
在本发明的柔性装置用基板中，可以通过使用不锈钢基材来有效地防止生锈。另外，通过将特定的氧化物膜形成在不锈钢基材的表面上，不锈钢基材和玻璃层之间的密合性可以得到显著改善。由于基材具有优异的耐弯曲性，即使当将其用作柔性装置用基板时，它也具有充分的柔韧性，以防止剥离等。
由于没有在不锈钢基材的表面上形成镍镀层的必要，可以减少制造步骤数，并且可以促进形成玻璃层之前的品质控制，导致优异的生产性。
此外，由于基板包括用于完全防止水分渗透的具有致密结构的玻璃层，因此其水分阻隔性也优异，并且因此，可以将其有效地用作有机EL用基板。
附图说明
[图1]：示出本发明的柔性装置用基板的一个实例的结构的截面图；和
[图2]：示出包括图1中示出的本发明的柔性装置用基板的有机EL装置用基板的结构的截面图。
具体实施方式
(柔性装置用基板)
本发明的柔性装置用基板通过将氧化物膜形成在不锈钢基材的表面上，并且将玻璃层形成在该基材的该氧化物膜的表面上来制备。结果，氧化物膜和玻璃彼此反应以形成密合层，使得不锈钢基材和玻璃层之间的密合性可以得到显著改善。如上所述，这起到改善耐弯曲性的作用，并且基板可以适合于卷对卷工艺，而不引起玻璃层的剥离。
在本发明的柔性装置用基板中，认为形成在不锈钢基材上的氧化物膜包含高浓度的铬，使得氧化物膜和玻璃彼此反应以形成密合层，由此改善不锈钢基材和玻璃层之间的密合性。
图1为示出本发明的柔性装置用基板的一个实例的截面图。附图标记1表示柔性装置用基板，其包含柔性装置用基板用基材2。该基材2包含不锈钢基材10和形成在不锈钢基材10的表面上的氧化物膜11。在氧化物膜11的表面上，以层状形成电绝缘性铋系玻璃的玻璃层12。
[不锈钢基材]
可以将任意通常公知的不锈钢材料用于本发明的柔性装置用基板用不锈钢基材。在所述材料当中，可以特别优选使用铁素体不锈钢。优选使用热膨胀系数为9.9×10-6至21×10-6/℃、特别是10×10-6至14×10-6/℃的材料。
优选的是，不锈钢基材的厚度在10至200μm的范围内，并且特别是在25至100μm的范围内，以获得充分的柔韧性。
[氧化物膜]
本发明的柔性装置用基板的不锈钢基材上的氧化物膜通过在例如空气等含氧气氛中烧制不锈钢基材表面来形成。因此，氧化物膜包含从不锈钢基材扩散的铁、铬和其它添加元素的氧化物。
具体地，在本发明的柔性装置用基板中，由于氧化物膜形成在不锈钢基材的表面上，在使玻璃层附着至不锈钢基材的表面(相互扩散)的过程中，不会剥夺玻璃层中包含的氧，或者可以减小氧的剥夺。因此，在玻璃层中基本上不发生氧不足。结果，玻璃层和不锈钢基材之间的界面处的组成的不同的程度小于不形成氧化物膜(即，不在含氧气氛中烧制不锈钢基材表面)的情况，并且这起到有效抑制密合性降低的作用。
如上所述，该氧化物膜形成为富铬氧化物膜。具体地，在氧化物膜的厚度方向上与氧化物膜和玻璃层之间的界面相距20nm的点处的铬浓度(即，当Cr和Fe的总量为100时Cr的量)为30原子％以上，优选50原子％以上，进一步优选70原子％以上，并且还进一步优选80原子％以上。
由于富铬氧化物膜以该方式形成，玻璃层和不锈钢基材之间的密合性得到显著改善。尽管氧化铬是极高致密的，但与氧化铬相比，氧化铁是易碎的。结果，由于不锈钢基材的表面(包含氧化物膜)上的铬浓度增加，形成易碎氧化铁的概率降低，并且不锈钢基材和玻璃层之间的密合性将得到改善。
在本发明中，期望的是，氧化物膜的厚度为30nm以上，优选80nm以上，更优选90nm以上，并且进一步优选100nm以上。当氧化物膜比该范围更薄时，与厚度在该范围内的情况相比，不能获得充分的玻璃层的密合性。此外，如后述实施例的结果明显所示，当使在外表面上设置有玻璃层的基板弯曲时，有可能不能获得充分的耐弯曲性。
氧化物膜越厚，氧化物膜中包含的铬的量越大，由此改善不锈钢基材和玻璃层之间的密合性并且改善耐弯曲性。然而，当氧化物膜的厚度超过2000nm时，氧化物膜会脆化并且耐弯曲性会降低。因此，氧化物膜的厚度优选为2000nm以下，特别是1500nm以下。
[玻璃层]
本发明的柔性装置用基板包含在上述氧化物膜上作为绝缘层形成的玻璃层。该玻璃层为水分阻隔性优异并且对不锈钢基材的密合性优异的铋系玻璃的玻璃层。
在本发明中，可以优选使用包含Bi2O3、ZnO和B2O3的铋系玻璃。即，与作为主要组分的Bi2O3一起包含ZnO和B2O3作为必要组分，并且因此，这些组分在共晶点的范围内。这可以形成几乎不结晶的玻璃网络结构。通过将玻璃与上述氧化物膜组合，可以提供可以有效地抑制和控制玻璃表面上的收缩的柔性装置用基板。
对于铋系玻璃，优选应用软化点在300至500℃范围内的电绝缘性玻璃。对于玻璃组成，包含Bi2O3作为主要组分(特别是70重量％以上)的玻璃是优选的。特别优选的是，玻璃为包含70至84重量％的Bi2O3、10至12重量％的ZnO、和6至12重量％的B2O3的铋系无铅玻璃，尽管本发明不限于该实例。当这些组分的含量在这些范围内时，玻璃层的结晶化得到抑制或控制，并且收缩可以得到有效地抑制。
除了上述必要组分以外，铋系玻璃进一步包含SiO2和/或Al2O3。优选的是，SiO2的含量为0至2重量％，并且Al2O3的含量为0至1重量％。作为将这些组分的至少一种共混的结果，水分阻隔性等可以得到改善，以使玻璃层稳定化。
优选的是，除了上述必要组分以外，铋系玻璃进一步包含CuO和/或NiO。玻璃的熔融性可以通过共混2重量％以下的CuO和2重量％以下的NiO来改善。
此外，除了上述必要组分以外，铋系玻璃可以包含1.5重量％以下的Y2O3、ZrO2、La2O3、CeO2、TiO2、CoO、或Fe2O3中的任意者。这些组分可以改善玻璃的耐久性，尽管这些组分的过多共混量会降低玻璃的耐久性。这些组分可以以其两种以上的组合来使用。在该情况下，总量优选为1.5重量％以下。
在本发明中，玻璃层的厚度在2至45μm的范围内，优选在5至20μm的范围内，并且进一步优选5至16μm。当玻璃层的厚度小于该范围时，与厚度在该范围内的情况相比，不能实现充分的绝缘性，并且不能使不锈钢基材上的凹凸充分平滑化。当厚度大于该范围时，与厚度在该范围内的情况相比，柔韧性会劣化。
(柔性装置用基板的生产方法)
本发明的柔性装置用基板可以通过包括将氧化物膜形成在不锈钢基材的至少一个表面上的氧化物膜形成步骤；和将铋系玻璃层形成在氧化物膜上的玻璃层形成步骤的方法来生产。
[氧化物膜形成步骤]
在本发明的柔性装置用基板的生产方法中并且还在基板的生产中使用的基材的生产方法中，在含氧气氛中烧制不锈钢基材，由此在不锈钢基材的表面上形成氧化物膜。
对烧制的条件没有特别限定，只要可以形成上述氧化物膜即可，但是优选地，用于烧制的温度在200至1300℃的范围内，优选1000至1250℃，并且进一步优选1000至1100℃。当烧制温度低于该范围时，与温度在该范围内的情况相比，不能有效地形成氧化物膜。当烧制温度高于该范围时，不锈钢基材会变形，尽管风险会根据不锈钢基材的厚度而变化。
烧制时间可以根据含氧气氛的氧浓度和烧制温度来适当地改变。在空气中在上述温度范围内烧制的情况下，优选在烧制温度下烧制10至500秒。
如上所述，形成氧化物膜以使厚度为30nm以上，优选80nm以上，2000nm以下，并且优选1500nm以下。
[玻璃层形成步骤]
接下来，将铋系玻璃层形成在氧化物膜上。
在玻璃层的形成步骤中，通常将玻璃粉末和媒介混合并且分散，以制备玻璃糊剂。将该糊剂涂布在氧化物膜上并且干燥，并且烧制，尽管步骤不限于该实例。
<玻璃糊剂的制备>
在玻璃糊剂的制备中，将上述铋系玻璃的玻璃熔块(glass frit)粉碎，以形成玻璃粉末，然后将其与媒介混合并且分散。
玻璃粉末通过将玻璃原料混合，在800至1200℃范围内的温度下加热以形成熔融玻璃，淬火以获得玻璃熔块，然后将玻璃熔块粉碎来获得。粉碎可以通过任意通常公知的方法来进行，并且实例包括JET粉碎、快速磨机粉碎、和球磨机粉碎。
为了使玻璃表面平滑，玻璃粉末的平均粒径为20μm以下，优选在1至10μm的范围内，并且更优选1至5μm。为了获得细粉末，在上述粉碎方法当中，JET粉碎是最优选的。
然后，将由此获得的玻璃粉末和媒介混合并且分散。
混合-分散方法的实例包括使用具有搅拌叶片的旋转式混合器、珠磨机、油漆搅拌器、辊磨机、玛瑙研钵、或超声波进行分散。优选的是，混合和分散通过使用珠磨机、油漆搅拌器、或辊磨机来进行。
根据需要，可以将公知的增稠剂、或分散剂等根据公知的配方添加至玻璃糊剂中。
待与玻璃粉末混合以便构成糊剂的媒介通过将粘结剂溶解在溶剂中来制备，并且用于调节糊剂的粘性。
优选的是，玻璃糊剂以30至80重量％的量包含玻璃粉末，以大于0且10重量％以下的量包含粘结剂，并且以10至70重量％的量包含溶剂。当玻璃粉末的量小于该范围时，糊剂粘度降低，使得难以形成具有期望的厚度的玻璃层。当玻璃粉末的量大于该范围时，糊剂粘度变得极高而使涂布性劣化。当粘结剂的量小于该范围时，涂布性会劣化。当粘结剂的量大于该范围时，在烧制步骤之后会残留未分解的残留物。此外，当溶剂的量小于该范围时，糊剂粘度变得极高而使涂布性劣化。并且当溶剂的量大于该范围时，糊剂粘度变得极低，使得难以形成具有期望的厚度的玻璃层。
对于媒介，可以使用任意通常公知的溶剂系或水系媒介，并且实例包括以下粘结剂和溶剂，尽管本发明不限于这些实例。
粘结剂的实例包括：例如甲基纤维素、乙基纤维素、羧甲基纤维素、羟乙基纤维素、苄基纤维素、丙基纤维素、和硝化纤维素等纤维素系树脂；例如甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸丁酯、甲基丙烯酸2-羟乙酯、丙烯酸丁酯、和丙烯酸2-羟乙酯等如通过使一种以上的丙烯酸系单体聚合而获得的丙烯酸系树脂等有机树脂；和例如聚碳酸亚丙酯等脂肪族聚烯烃系碳酸酯树脂，尽管本发明不限于这些实例。
溶剂可以根据所使用的粘结剂来适当地选择。实例包括：对于纤维素系树脂，水、松油醇、丁基卡必醇乙酸酯、或乙基卡必醇乙酸酯等；对于丙烯酸系树脂，甲基乙基酮、松油醇、丁基卡必醇乙酸酯、或乙基卡必醇乙酸酯等；并且对于脂肪族聚烯烃系碳酸酯树脂，碳酸亚丙酯、或三乙酸甘油酯等，尽管本发明不限于这些实例。
<玻璃糊剂的涂布、干燥和烧制>
将由此制备的玻璃糊剂通过根据玻璃糊剂的粘度选择的涂布方法涂布在氧化物膜上。涂布可以通过使用棒涂机、模涂机、辊涂机、凹版涂布机、丝网印刷、胶版印刷、或涂抹器等来进行，尽管本发明不限于这些实例。
将涂布的玻璃糊剂在80至180℃范围内的温度下干燥。在干燥之后，根据需要进行脱脂(debinding)处理。优选地，脱脂处理通过在180至450℃范围内的温度下加热10分钟以上来进行。
在干燥之后，将根据需要预先进行脱脂处理的涂布表面在550至900℃、优选650至900℃的温度下烧制10至300秒，以便形成玻璃层。当烧制温度低于该范围时，与温度在该范围内的情况相比，熔融会是不充分的。当烧制温度高于该范围时，与温度在该范围内的情况相比，玻璃表面会受到影响。
(有机EL装置用基板)
图2为示出包含图1中示出的本发明的柔性装置用基板的有机EL装置用基板的一个实例的截面图。
附图标记1表示柔性装置用基板，其包含在两个表面上都形成有氧化物膜11a、11b的不锈钢基材10。在氧化物膜11a上，形成玻璃层12。
附图标记3表示有机EL装置用基板。该基板3包含柔性装置用基板1，所述基板3至少具有形成在柔性装置用基板1的玻璃层12上的电极层(Ag、Al)20、形成在电极层20上的有机薄膜发光层21、和形成在有机薄膜发光层21上的透明电极层22。在图2中示出的具体实例中，透明密封层23和透明密封构件24进一步层叠在透明电极层22上，并且耐腐蚀层25层叠在氧化物膜11b上。
还可以在图2中示出的玻璃层12上形成显示优异的对电极层的密合性的基底层(未示出)。
基底层可以通过例如溅射、气相沉积、或CVD等任意通常公知的方法由选自镍(Ni)、氧化铟锡(ITO)、银(Ag)、金(Au)、铜(Cu)、镁-银(MgAg)、金-铜(AuCu)、银-铜(AgCu)、氧化锌(ZnO)、钴(Co)、或钯(Pd)等金属或金属氧化物形成。对于膜形成，溅射是特别优选的。
该基底层可以显示优异的对用于有机EL基板的包含铝(Al)、银(Ag)、金(Au)或其合金的每个电极层的密合性。特别是在由铝(Al)或银(Ag)形成电极层的情况下，在上述金属或金属氧化物当中，基底层优选由镍或氧化铟锡形成。
基底层的厚度优选在5至100nm的范围内。
实施例
1.不锈钢基材
使用四种厚度为0.05mm的不锈钢基材。
SUS430MA：铁素体系不锈钢箔(由Nippon Kinzoku Co.,Ltd.制造)
JFE443CT：铁素体系不锈钢箔(由JFE Steel Corporation制造)
NCA-1：铁素体系不锈钢箔(由Nisshin Steel Co.,Ltd.制造)
SUS430：铁素体系不锈钢箔(由Nisshin Steel Co.,Ltd.制造)
2.烧制处理(氧化物膜的形成)
在表2中示出的条件下，将不锈钢基材的表面加热20秒。
3.玻璃层的形成
在脱脂步骤中，为了脱脂的目的，用浸泡于乙醇的纱布擦拭各试样的表面。
在涂膜形成步骤中，制备作为有机溶剂和粘结剂的混合物的媒介。将媒介与表1中描述的铋系玻璃粉末以25:75的重量比在研钵中混合。使用陶瓷辊磨机将混合物分散，以生产涂膜形成用玻璃糊剂。通过使用棒涂机将玻璃糊剂涂布在试样上，使得烧制之后的膜厚度将为10μm。之后，玻璃烧制步骤使用电炉通过干燥(温度：150℃，时间：3分钟)、脱脂(温度：330℃，时间：20分钟)和烧制(温度：850℃，时间：30秒)来进行，以形成玻璃层。
[表1]
| 组分 | 组成(重量％) |
| Bi2O3 | 81.00 |
| ZnO | 10.87 |
| B2O3 | 6.21 |
| SiO2 | 1.31 |
| Al2O3 | 0.47 |
| CuO | 0.14 |
| 总计 | 100.00 |
4.评价
(1)氧化物膜的厚度
在实施例和比较例中获得的柔性装置用基板用基材的各氧化物膜的厚度通过使用场发射俄歇显微镜(AES：由JEOL制造的产品JAMP-9500F)来测量。
(2)耐弯曲性
将在实施例和比较例中生产的柔性装置用基板卷绕在直径(φ)各自为30mm、20mm或10mm的圆柱不锈钢棒上，使得玻璃层成为外/内侧。目视观察这些物体，以检查剥离和裂纹。结果在表2中示出。
评价标准如下。
由卷绕试验引起的剥离和裂纹(目视观察)
◎：玻璃/基材界面无剥离，并且无裂纹。
○：玻璃/基材界面无剥离，同时裂纹少。
△：玻璃/基材界面无剥离，但是有一些裂纹。
×：玻璃/基材界面有剥离，并且有裂纹。
综合评价如下。
◎：对于“玻璃层外侧卷绕的φ20”的评价为◎，并且对于“玻璃层内侧卷绕”的所有评价为◎。
○：对于“玻璃层外侧卷绕的φ30”的评价为◎，对于“玻璃层外侧卷绕的φ20”的评价为○，并且对于“玻璃层内侧卷绕”的所有评价为◎。
△：对于“玻璃层外侧卷绕的φ30”的评价为◎，对于“玻璃层外侧卷绕的φ20”的评价为△，并且对于“玻璃层内侧卷绕”的所有评价为◎。
△△：对于“玻璃层外侧卷绕的φ30”的评价为○或△，并且对于“玻璃层内侧卷绕”的所有评价为◎。
△△△：对于“玻璃层外侧卷绕”的所有评价为×，对于“玻璃层内侧卷绕的φ30和φ20”的评价为◎或者对于“玻璃层内侧卷绕”的所有评价为◎。
×：对于“玻璃层外侧卷绕”的所有评价为×，并且仅对于“玻璃层内侧卷绕的φ30”的评价为◎。
(3)铬浓度(深度分布)
对于在实施例2、4、9-14、21、24、25、27和比较例1-4中获得的柔性装置用基板用基材，在氧化物膜的厚度方向上与玻璃层和氧化物膜之间的界面相距20nm的点处的铬(Cr)量和铁(Fe)量通过X射线光电子能谱(XPS)分析来测量，并且铬浓度通过以下公式来计算。结果在表2中示出。
Cr浓度(原子％)＝Cr/(Cr+Fe)×100
产业上的可利用性
本发明的柔性装置用基板在防锈性、水分阻隔性、绝缘性、耐弯曲性、以及玻璃层的表面平滑性和密合性方面优异。可以将其适合地用作用于有机EL照明、有机EL显示器、有机薄膜太阳能电池、IC印刷电路、和电子纸等的基板。
附图标记说明：
1：柔性装置用基板
10：不锈钢基材
11：氧化物膜
12：玻璃层
20：电极层(Ag、Al)
21：有机薄膜发光层
22：透明电极层
23：透明密封层
24：透明密封构件
25：耐腐蚀层
Claims (6)
1.一种柔性装置用基板，其包括不锈钢基材、在所述不锈钢基材的表面上形成的氧化物膜、和在所述氧化物膜的表面上以层状形成的电绝缘性铋系玻璃的玻璃层，
所述氧化物膜的厚度为30nm以上，
在所述氧化物膜的厚度方向上与所述氧化物膜和所述玻璃层之间的界面相距20nm的点处的铬浓度为30原子%以上。
2.根据权利要求1所述的柔性装置用基板，其中所述氧化物膜的厚度为80nm以上。
3.根据权利要求1或2所述的柔性装置用基板，其中在所述氧化物膜的厚度方向上与所述氧化物膜和所述玻璃层之间的界面相距20nm的点处的铬浓度为50原子%以上。
4.根据权利要求1或2所述的柔性装置用基板，其中所述铋系玻璃包含Bi2O3、ZnO和B2O3。
5.一种不锈钢基材用于柔性装置用基板的用途，所述基板包括不锈钢基材、在所述不锈钢基材的表面上形成的氧化物膜、和在所述氧化物膜的表面上以层状形成的电绝缘性铋系玻璃的玻璃层，
其中所述氧化物膜的厚度为30nm以上，
所述氧化物膜包含从所述不锈钢基材扩散的铁、铬和其它添加元素的氧化物，
在所述氧化物膜的厚度方向上与所述氧化物膜和所述玻璃层之间的界面相距20nm的点处的铬浓度为30原子%以上。
6.根据权利要求5所述的用途，其中所述氧化物膜的厚度为80nm以上。
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| WO2017170038A1 (ja) * | 2016-03-28 | 2017-10-05 | 東洋製罐グループホールディングス株式会社 | フレキシブルデバイス用基板及びその製造方法 |
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| TWI808256B (zh) | 2023-07-11 |
| KR102546912B1 (ko) | 2023-06-22 |
| CN112771206A (zh) | 2021-05-07 |
| US20210343953A1 (en) | 2021-11-04 |
| KR20210057111A (ko) | 2021-05-20 |
| WO2020054441A1 (ja) | 2020-03-19 |
| JPWO2020054441A1 (ja) | 2021-09-24 |
| TW202020236A (zh) | 2020-06-01 |
| EP3851557A1 (en) | 2021-07-21 |
| EP3851557A4 (en) | 2022-01-05 |
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