CN112739533A - Adhesive tape and method for producing electronic component - Google Patents

Adhesive tape and method for producing electronic component Download PDF

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Publication number
CN112739533A
CN112739533A CN201980062068.3A CN201980062068A CN112739533A CN 112739533 A CN112739533 A CN 112739533A CN 201980062068 A CN201980062068 A CN 201980062068A CN 112739533 A CN112739533 A CN 112739533A
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China
Prior art keywords
ultraviolet
adhesive layer
sensitive adhesive
curable
pressure
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CN201980062068.3A
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Chinese (zh)
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CN112739533B (en
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西中久美子
野村高弘
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The purpose of the present invention is to provide an adhesive tape that can be used for a support that does not transmit light during the production of an electronic component, and that can prevent peeling and adhesive residue from an adherend and the support even when subjected to high-temperature processing, and to provide a method for producing an electronic component using the adhesive tape. The present invention is an adhesive tape comprising a non-ultraviolet-curable adhesive layer and an ultraviolet-curable adhesive layer laminated on the non-ultraviolet-curable adhesive layer, wherein the tensile strength of the non-ultraviolet-curable adhesive layer at 23 ℃ is 5.0N/10mm or more and 20.0N/10mm or less, and the amount of gas released when the non-ultraviolet-curable adhesive layer is heated at 260 ℃ for 15 minutes is 10000ppm or less.

Description

Adhesive tape and method for producing electronic component
Technical Field
The present invention relates to an adhesive tape and a method for manufacturing an electronic component using the adhesive tape.
Background
In the manufacturing process of semiconductor chips, an adhesive tape is used to facilitate handling during processing of wafers or semiconductor chips and to prevent breakage. For example, when a thick wafer cut out from high-purity single crystal silicon or the like is ground to a predetermined thickness to produce a thin wafer, an adhesive tape is bonded to the thick wafer, and then the thick wafer is ground.
The adhesive composition used for such an adhesive tape is required to have high adhesiveness to fix an adherend such as a wafer or a semiconductor chip as firmly as possible in a processing step and to be peelable without damaging the adherend such as a wafer or a semiconductor chip after the completion of the processing step (hereinafter, also referred to as "highly adhesive and easily peelable").
As an adhesive composition that achieves high adhesion and easy peeling, patent document 1 discloses an adhesive tape using a photocurable adhesive that is cured by irradiation with light such as ultraviolet light and thus has reduced adhesive force. By using a photocurable pressure-sensitive adhesive as the pressure-sensitive adhesive, the adherend can be reliably fixed in the processing step, and can be easily peeled off by irradiation with ultraviolet rays or the like.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 5-32946
Disclosure of Invention
Problems to be solved by the invention
In recent years, due to the thinning and miniaturization of semiconductor products, substrates are also thinned to 100 μm or less (hereinafter, the thinned substrate is referred to as a thin substrate), and an adhesive tape is used for preventing warpage and damage in the production of the substrate. In the production of such a thin substrate, a substrate such as a polyimide film which is a base of the substrate is fixed to a support via a non-support type adhesive tape, and then wiring or the like is performed. However, from the viewpoint of cost and handleability, the support used for producing a thin substrate is often made of an opaque material such as copper, aluminum, or a glass epoxy resin (japanese patent No. ガラスエポキシ), and such an opaque support has a problem that a conventional pressure-sensitive adhesive tape using a photocurable pressure-sensitive adhesive cannot be cured. In order to solve this problem, an adhesive tape having a curable adhesive layer and a non-curable adhesive layer has been proposed. The adhesive tape can be cured even when the support is opaque by attaching the non-curable adhesive layer to the support after the curable adhesive layer is attached to an adherend such as a thin substrate and cured.
On the other hand, in a process for manufacturing an electronic component such as a thin substrate, high-temperature treatment of applying heat of 150 ℃ or higher may be performed. In the step involving such high-temperature treatment, when a conventional pressure-sensitive adhesive tape having a curable pressure-sensitive adhesive layer and a non-curable pressure-sensitive adhesive layer is used, the non-curable pressure-sensitive adhesive layer may not be able to withstand heat and may be peeled from the support. Since the temperature of the high-temperature treatment is increased with the progress of the technology, an adhesive tape which can be used for an opaque support and has further heat resistance has been desired.
The purpose of the present invention is to provide an adhesive tape that can be used for a support that does not transmit light during the production of an electronic component, and that can prevent peeling and adhesive residue from an adherend and the support even when subjected to high-temperature processing, and to provide a method for producing an electronic component using the adhesive tape.
Means for solving the problems
The invention of claim 1 is an adhesive tape comprising a non-ultraviolet-curable adhesive layer and an ultraviolet-curable adhesive layer laminated on the non-ultraviolet-curable adhesive layer, wherein the non-ultraviolet-curable adhesive layer has a tensile strength of 5.0N/10mm or more and 20.0N/10mm or less at 23 ℃, and the amount of outgas (Japanese: アウトガス) when the non-ultraviolet-curable adhesive layer is heated at 260 ℃ for 15 minutes is 10000ppm or less.
The invention of claim 2 is a pressure-sensitive adhesive tape comprising a non-ultraviolet-curable pressure-sensitive adhesive layer and an ultraviolet-curable pressure-sensitive adhesive layer laminated on the non-ultraviolet-curable pressure-sensitive adhesive layer, wherein the amount of gas released when the non-ultraviolet-curable pressure-sensitive adhesive layer is heated at 260 ℃ for 15 minutes is 10000ppm or less, and the non-ultraviolet-curable pressure-sensitive adhesive layer contains: a (meth) acrylic copolymer as a base polymer A', the (meth) acrylic copolymer containing 92 to 97% by weight of an alkyl (meth) acrylate having 4 to 12 carbon atoms in the alkyl group as a constituent; an epoxy compound having a tertiary amine structure as a curing agent B; and a filler C.
The present invention is described in detail below.
The adhesive tape of the present invention has a non-ultraviolet-curable adhesive layer and an ultraviolet-curable adhesive layer laminated on the non-ultraviolet-curable adhesive layer.
The pressure-sensitive adhesive tape having the ultraviolet-curable pressure-sensitive adhesive layer can be bonded to an adherend with sufficient adhesive force to protect the adherend, and the ultraviolet-curable pressure-sensitive adhesive layer is cured after bonding, whereby the adherend can be reliably protected even when subjected to high-temperature treatment. In addition, the pressure-sensitive adhesive tape can be easily peeled without damaging the adherend after the protection is not required. Further, by providing the pressure-sensitive adhesive tape with the non-ultraviolet-curable pressure-sensitive adhesive layer, the ultraviolet-curable pressure-sensitive adhesive layer can be attached to an adherend, and the non-ultraviolet-curable pressure-sensitive adhesive layer can be attached to the support after curing the ultraviolet-curable pressure-sensitive adhesive layer. In addition, from the viewpoint of simplifying the production process, the ultraviolet-curable pressure-sensitive adhesive layer may be cured by irradiating ultraviolet rays immediately after the pressure-sensitive adhesive tape is attached to the adherend.
In a preferred embodiment of the present invention, the non-ultraviolet-curable pressure-sensitive adhesive layer is ultraviolet-transmissive. Here, the ultraviolet transmittance means that the light absorption wavelength band of the ultraviolet polymerization initiator contained in the ultraviolet-curable pressure-sensitive adhesive layer overlaps with the wavelength band of the non-ultraviolet-curable pressure-sensitive adhesive layer through which light is transmitted, and particularly preferably the light absorption wavelength band of the ultraviolet polymerization initiator overlaps with the wavelength band of the non-ultraviolet-curable pressure-sensitive adhesive layer in which the absorbance is 0.2 or less. By making the non-ultraviolet-curable pressure-sensitive adhesive layer ultraviolet-transmissive, the ultraviolet-curable pressure-sensitive adhesive layer can be irradiated with ultraviolet light through the non-ultraviolet-curable pressure-sensitive adhesive layer.
In the 1 st aspect of the present invention, the tensile strength of the non-ultraviolet-curable pressure-sensitive adhesive layer at 23 ℃ is 5.0N/10mm or more and 20.0N/10mm or less.
In the 2 nd aspect of the present invention, the tensile strength of the non-ultraviolet-curable pressure-sensitive adhesive layer at 23 ℃ is preferably 5.0N/10mm or more and 20.0N/10mm or less.
When the tensile strength of the non-ultraviolet-curable pressure-sensitive adhesive layer is in the above range, the pressure-sensitive adhesive tape is less likely to be torn when peeled off. From the viewpoint of further suppressing the tearing of the pressure-sensitive adhesive tape at the time of peeling, the lower limit of the tensile strength of the non-ultraviolet-curable pressure-sensitive adhesive layer is preferably 5.5N/10mm, the more preferred lower limit is 6.0N/10mm, the more preferred upper limit is 19.5N/10mm, and the more preferred upper limit is 19.0N/10 mm.
The tensile strength of the non-uv-curable pressure-sensitive adhesive layer can be measured as follows: the non-ultraviolet-curable adhesive layer was cut into a thickness of 200 μm and a width of 10mm to obtain a sample, and the tensile strength was measured at a speed of 300 mm/min and a distance between gauge lines of 40mm using Tensilon UCE500 (manufactured by Orientech) at 23 ℃ and 50% RH.
The non-ultraviolet-curable pressure-sensitive adhesive layer has an amount of gas released when the non-ultraviolet-curable pressure-sensitive adhesive layer is heated at 260 ℃ for 15 minutes of 10000ppm or less.
In the production of electronic components involving high-temperature treatment, when a general adhesive tape having a non-ultraviolet-curable adhesive layer and an ultraviolet-curable adhesive layer is used for protecting the electronic components, the non-ultraviolet-curable adhesive layer is decomposed by the heat of the high-temperature treatment, and a large amount of outgas is generated. The generated outgas foams the non-ultraviolet-curable pressure-sensitive adhesive layer to reduce the strength and the adhesive force thereof, and therefore, the support is peeled from the non-ultraviolet-curable pressure-sensitive adhesive layer at the time of peeling, and the pressure-sensitive adhesive tape is left on the adherend side (adhesive residue). In the pressure-sensitive adhesive tape of the present invention, the non-ultraviolet-curable pressure-sensitive adhesive layer generates a small amount of outgas, that is, the non-ultraviolet-curable pressure-sensitive adhesive layer is less likely to be decomposed by heat, and thus foaming of the non-ultraviolet-curable pressure-sensitive adhesive layer can be suppressed, and the pressure-sensitive adhesive tape is less likely to remain on an adherend. From the viewpoint of further suppressing the adhesive residue of the pressure-sensitive adhesive tape on the adherend, the above-mentioned gas release amount is preferably 7500ppm or less, more preferably 5500ppm or less, further preferably 4000ppm or less, and particularly preferably 3500ppm or less. The lower limit of the amount of gas evolved is not particularly limited, but is preferably as low as possible, and for example, the lower limit is preferably 1000 ppm.
The gas release amount can be obtained, for example, as a gas amount (ppm in terms of toluene, μ g/g) when the non-ultraviolet curable pressure-sensitive adhesive layer is cut to 5mm × 5mm and measured by thermal desorption GC-MS (thermal desorption apparatus: Turbomatrix 350, Perkinelmer, GC-MS apparatus: JMS Q1000, Japan electronic Co., Ltd.).
The detailed measurement conditions are as follows.
Sample heating conditions: 260 ℃ for 15min (20mL/min)
Secondary desorption: 350 ℃ for 40min
Shunting: inlet 25mL/min, outlet 25mL/min
Injection amount: 2.5 percent
Column: EQUITY-1 (nonpolar, SIGMA-ALDRICH Co., Ltd.) 0.32mm X60 m X0.25 μm
And (3) GC temperature rise: 40 deg.C (4min) → heating at a rate of 10 deg.C/min → 300 deg.C (10min)
He flow rate: 1.5mL/min
Ionization voltage: 70eV
MS measurement range: 29 to 600amu (scanning 500ms)
MS temperature: an ion source; interface at 230 ℃; 250 deg.C
The non-ultraviolet curable adhesive layer preferably has a tack strength of 10 to 300gf/3mm phi.
When the tack strength of the non-ultraviolet-curable pressure-sensitive adhesive layer is in the above range, the non-ultraviolet-curable pressure-sensitive adhesive layer and the support are more reliably adhered to each other, and the pressure-sensitive adhesive tape can be more easily peeled from the interface between the ultraviolet-curable pressure-sensitive adhesive layer and the adherend at the time of peeling. From the viewpoint of further facilitating the peeling of the pressure-sensitive adhesive tape from the interface between the ultraviolet curable pressure-sensitive adhesive layer and the adherend, a more preferable lower limit of the above tack strength is 15gf/3mm, a more preferable lower limit is 20gf/3mm, a more preferable upper limit is 270gf/3mm, and a more preferable upper limit is 250gf/3 mm.
The above tack strength can be measured as follows: the non-ultraviolet-curable pressure-sensitive adhesive layer was cut out to 10mm × 10mm to prepare a measurement sample, and the probe tack measurement was performed on the obtained measurement sample. The instruments used and the measurement conditions may be as follows.
A viscosity tester: TAC1000 manufactured by RHESCA Inc. (or equivalent thereof)
Diameter of the probe: 3mm phi
Crimping load: 100g
Crimping time: 1 second
Contact speed: 30 mm. min
Stripping speed: 600mm/min
The gel fraction of the non-ultraviolet-curable pressure-sensitive adhesive layer is preferably 80% or more.
The adhesive tape of the present invention can be used in a step involving a chemical treatment because the chemical resistance of the non-ultraviolet-curable adhesive layer is improved by setting the gel fraction of the non-ultraviolet-curable adhesive layer to 80% or more.
From the viewpoint of further improving the chemical resistance, the gel fraction is more preferably 95% or more, and still more preferably 97% or more. The upper limit of the gel fraction is not particularly limited, and is usually 100% or less. The gel fraction can be measured by the following method.
Only 0.1g of the non-ultraviolet-curable pressure-sensitive adhesive layer of the obtained pressure-sensitive adhesive tape was scraped off and immersed in 50mL of ethyl acetate, and shaken by a shaker at a temperature of 23 ℃ and a speed of 120rpm for 24 hours (hereinafter, the scraped-off non-ultraviolet-curable pressure-sensitive adhesive layer is referred to as a pressure-sensitive adhesive composition). After shaking, the adhesive composition swollen by absorbing ethyl acetate was separated from ethyl acetate using a metal mesh (mesh # 200). The separated adhesive composition was dried at 110 ℃ for 1 hour. The weight of the adhesive composition containing the metal mesh after drying was measured, and the gel fraction of the non-ultraviolet-curable adhesive layer was calculated using the following formula.
Gel fraction (wt%) < 100 × (W)1-W2)/W0
(W0: initial adhesive composition weight, W1: weight of adhesive composition including wire netting after drying, W2: initial weight of Metal mesh)
The non-ultraviolet-curable adhesive constituting the non-ultraviolet-curable adhesive layer is not particularly limited as long as it is a non-ultraviolet-curable adhesive and satisfies the tensile strength and the gas release amount, and the base polymer preferably has a functional group capable of reacting with an epoxy group.
Examples of the functional group capable of reacting with an epoxy group include: carboxyl, hydroxyl, phenolic, ester, amino, carbonyl, methoxy, sulfo, and the like. Among them, at least 1 kind selected from the group consisting of a carboxyl group, a hydroxyl group, a phenol group, an ester group and an amino group is preferable from the viewpoint of high reactivity.
Examples of the base polymer include acrylic polymers, silicone polymers, and urethane polymers.
In the 1 st aspect of the present invention, the non-ultraviolet-curable pressure-sensitive adhesive layer preferably contains: the (meth) acrylic copolymer as the base polymer A has a weight average molecular weight c of 70 ten thousand or more and a molecular weight distribution d of 2 to 6, and contains 92 to 97 wt% of an alkyl (meth) acrylate a having an alkyl group with 4 to 12 carbon atoms and 3.0 to 8.0 wt% of a carboxyl group-containing monomer b as constituent components.
In the 2 nd aspect of the present invention, the non-ultraviolet-curable pressure-sensitive adhesive layer includes: the (meth) acrylic copolymer as the base polymer A' contains 92 to 97 wt% of an alkyl (meth) acrylate having 4 to 12 carbon atoms in the alkyl group as a constituent. In the 2 nd aspect of the present invention, it is also preferable that the weight average molecular weight of the (meth) acrylic copolymer is 70 ten thousand or more and the molecular weight distribution is 2 to 6, and the (meth) acrylic copolymer contains 92 to 97 wt% of an alkyl (meth) acrylate having an alkyl group and 4 to 12 carbon atoms and 3.0 to 8.0 wt% of a carboxyl group-containing monomer.
By using the alkyl (meth) acrylate having an alkyl group of 4 to 12 carbon atoms as a constituent component, a non-ultraviolet-curable pressure-sensitive adhesive layer having more excellent adhesive force (preferably having ultraviolet light transmittance) can be obtained. Further, by using a carboxyl group-containing monomer as a constituent component, the cohesive force of the non-ultraviolet-curable pressure-sensitive adhesive can be increased to provide a larger adhesive force. In addition, in the case where the ultraviolet-curable pressure-sensitive adhesive layer contains a silicone compound, since the carboxyl group as a polar group inhibits the approach of the low-polarity silicone compound, the silicone compound can be inhibited from bleeding out to the non-ultraviolet-curable pressure-sensitive adhesive layer side.
Examples of the alkyl (meth) acrylate having an alkyl group of 4 to 12 carbon atoms include butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, and isononyl (meth) acrylate. Among them, butyl acrylate is preferable in terms of excellent adhesion.
Examples of the carboxyl group-containing monomer include acrylic acid and methacrylic acid. Among them, acrylic acid is preferable in that high adhesive force can be imparted.
The adhesive tape having a higher adhesive force can be obtained by setting the content of the alkyl (meth) acrylate having an alkyl group with 4 to 12 carbon atoms to 92 to 97% by weight. When the ultraviolet-curable pressure-sensitive adhesive layer contains a silicone compound, bleeding of the silicone compound into the non-ultraviolet-curable pressure-sensitive adhesive layer can be further suppressed by setting the carboxyl group-containing monomer to 3.0 wt% or more. When the carboxyl group-containing monomer is 8.0 wt% or less, the acidity of the (meth) acrylic copolymer can be adjusted to an appropriate range, and when the ultraviolet-curable pressure-sensitive adhesive layer contains a silicone compound, bleeding of the silicone compound into the non-ultraviolet-curable pressure-sensitive adhesive layer can be further suppressed.
From the viewpoint of further suppressing bleeding out, a more preferable lower limit of the content of the alkyl (meth) acrylate in the (meth) acrylic copolymer is 93% by weight, a more preferable lower limit is 94% by weight, and a more preferable upper limit is 96% by weight. From the viewpoint of further suppressing bleeding out, the content of the carboxyl group-containing monomer in the (meth) acrylic copolymer has a more preferable lower limit of 4.0 wt%, a more preferable upper limit of 7.0 wt%, and a further more preferable upper limit of 6.0 wt%.
The tensile strength and the outgassing amount of the non-ultraviolet-curable pressure-sensitive adhesive layer can be easily adjusted to the above ranges by providing the (meth) acrylic copolymer with a weight average molecular weight of 70 ten thousand or more and a molecular weight distribution of 2 to 6 which is narrow. Here, the molecular weight distribution refers to a ratio (Mw/Mn) of a weight average molecular weight (Mw) to a number average molecular weight (Mn). A more preferable lower limit of the weight average molecular weight is 75 ten thousand, and a still more preferable lower limit is 80 ten thousand. The upper limit of the weight average molecular weight is not particularly limited, and from the viewpoint of handling property, for example, a preferable upper limit is 120 ten thousand. Further, a more preferable lower limit of the molecular weight distribution is 2.5, a further preferable lower limit is 3, a further preferable upper limit is 5.5, and a further preferable upper limit is 5. The weight average molecular weight and the molecular weight distribution can be determined by GPC measurement, and specifically, the methods shown in examples can be used.
Examples of the method for obtaining the (meth) acrylic copolymer having the weight average molecular weight and the molecular weight distribution include solution polymerization, emulsion polymerization, and living radical polymerization.
In the 1 st aspect of the present invention, the non-ultraviolet-curable pressure-sensitive adhesive layer preferably contains an epoxy compound as the curing agent B, and more preferably contains an epoxy compound having a tertiary amine structure.
In embodiment 2 of the present invention, the non-ultraviolet-curable pressure-sensitive adhesive layer contains an epoxy compound having a tertiary amine structure as the curing agent B.
By containing an epoxy compound in the non-ultraviolet-curable pressure-sensitive adhesive layer, the base polymer can be crosslinked, and chemical resistance and heat resistance of the non-ultraviolet-curable pressure-sensitive adhesive layer can be improved. The crosslinked base polymer has a molecular structure in which the gel fraction is increased and the movement is difficult. Therefore, when the ultraviolet-curable pressure-sensitive adhesive layer contains a silicone compound, the bleeding of the silicone compound into the non-ultraviolet-curable pressure-sensitive adhesive layer is inhibited, and sufficient adhesive force can be exhibited even when the pressure-sensitive adhesive layer is stored for a long period of time. Examples of the epoxy compound include N, N' -tetraglycidyl-1, 3-benzenebis (methylamine), methylglycidyl ether, 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexane carboxylate, bis- (3, 4-epoxycyclohexyl) adipate, bisphenol a diglycidyl ether, diglycidyl ether condensate of bisphenol a, phenol resin, and epichlorohydrin-modified cresol resin. Among them, epoxy compounds containing a tertiary amine structure are preferable.
Since the base polymer before the crosslinking reaction with the epoxy compound has a structure in which the gel fraction is low and the molecules are easily moved, when the ultraviolet-curable pressure-sensitive adhesive layer contains a silicone compound, the silicone compound is easily exuded. Therefore, if the rate of the crosslinking reaction is slow, the silicone compound bleeds out to the non-ultraviolet-curable pressure-sensitive adhesive layer in a large amount. If a tertiary amino group is present in the non-ultraviolet-curable pressure-sensitive adhesive layer, the tertiary amino group functions as a catalyst for the crosslinking reaction, and the rate of the crosslinking reaction of the base polymer increases, so that the reaction is completed at an early stage. By completing the crosslinking reaction at an early stage, the silicone compound is less likely to bleed out to the non-ultraviolet-curable pressure-sensitive adhesive layer, and therefore a pressure-sensitive adhesive tape having sufficient adhesive force even when stored for a long period of time can be produced. Examples of the epoxy compound having a tertiary amine include N, N' -tetraglycidyl-1, 3-benzenedi (methylamine).
The content of the curing agent (the epoxy compound) in the non-ultraviolet curable pressure-sensitive adhesive layer is preferably 0.1 part by weight in terms of the lower limit, more preferably 0.2 part by weight, even more preferably 0.3 part by weight, and still more preferably 0.5 part by weight in terms of the upper limit, more preferably 0.45 part by weight, and still more preferably 0.4 part by weight, based on 100 parts by weight of the base polymer. When the content of the epoxy compound is within the above range, the base polymer can be sufficiently and rapidly crosslinked, and the bleeding of the silicone compound into the non-ultraviolet-curable pressure-sensitive adhesive layer can be further suppressed.
In the 1 st aspect of the present invention, the non-ultraviolet-curable pressure-sensitive adhesive layer preferably contains a filler C.
In the 2 nd aspect of the present invention, the non-ultraviolet-curable pressure-sensitive adhesive layer contains a filler C.
The filler is contained in the non-ultraviolet-curable pressure-sensitive adhesive layer, whereby the heat resistance can be improved. Examples of the filler include a silica filler, an aluminum filler, a calcium filler, a boron filler, a magnesium filler, and a zirconia filler. Among them, silica fillers are preferable.
In the case where the ultraviolet-curable pressure-sensitive adhesive layer contains a silicone compound, the silica filler is preferably a silica filler oxide, because bleeding of the silicone compound can be further suppressed. Since the silica filler oxide has a hydrophilic group and high polarity, the approach of a substance having low polarity can be prevented by including the silica filler oxide in the non-ultraviolet-curable pressure-sensitive adhesive layer. Therefore, when the ultraviolet-curable pressure-sensitive adhesive layer contains a silicone compound having low polarity, the silicone compound can be inhibited from bleeding out into the non-ultraviolet-curable pressure-sensitive adhesive layer.
The silica filler oxide is not particularly limited, and examples thereof include a silicon-aluminum-boron composite oxide, a silicon-titanium composite oxide, a silica-titanium dioxide composite oxide, a magnesium-aluminum-silicon composite oxide, hexamethylcyclotrisiloxane, tetramethoxysilane, chlorosilane, and monosilane. Among them, silicon-aluminum-boron composite oxide, silicon-titanium composite oxide, and silica-titania composite oxide are preferable because they have physical properties similar to those of silica which is generally used as an inorganic filler.
When the silica filler is a silica filler oxide, at least a part of the surface of the silica filler oxide is preferably subjected to a hydrophobic treatment.
By replacing at least a part of the hydrophilic groups present in the silica filler oxide with hydrophobic groups, the dispersibility in the base polymer can be improved. The hydrophobic group is not particularly limited, and examples thereof include methyl, ethyl, propyl, and butyl. Among them, from the viewpoint of dispersibility in the base polymer, it is preferable that the silica filler oxide after the hydrophobization treatment has a monomethylsilyl group, a dimethylsilyl group, or a trimethylsilyl group. In particular, it is more preferable that at least a part of the silica filler oxide has a monomethylsilyl group, because the effect of suppressing the bleeding of the silicone compound into the non-ultraviolet-curable pressure-sensitive adhesive layer and the dispersibility in the base polymer are excellent in balance. Since the silica filler oxide hinders the approach of the silicone compound due to its hydrophilicity as described above, it is difficult for the silica filler oxide in which the entire surface of the silica filler oxide is replaced with a hydrophobic group to exhibit the effect as the silica filler oxide.
When at least a part of the silica filler oxide has a monomethylsilyl group, a dimethylsilyl group or a trimethylsilyl group, the silica filler oxide preferably has a specific surface area of 100m (Japanese: natural specific surface area)2The functional group is preferably 140m or more2(iii) the above functional group in an amount of more than g. By making the silica filler oxide on the tableThe above range of the functional group allows further improvement in dispersibility of the silica filler oxide with respect to the base polymer.
The average particle diameter of the filler is not particularly limited, but is preferably 0.06. mu.m, more preferably 0.07. mu.m, still more preferably 2 μm, and still more preferably 1 μm. When the average particle diameter of the filler is in the above range, the dispersibility in the non-ultraviolet-curable adhesive can be further improved.
The content of the filler is not particularly limited, and a preferable lower limit is 3 parts by weight and a preferable upper limit is 20 parts by weight with respect to 100 parts by weight of the base polymer.
By setting the content of the filler to 3 parts by weight or more, the heat resistance of the obtained adhesive tape can be further improved. By setting the content of the silica filler to 20 parts by weight or less, an adhesive tape having sufficient adhesive force can be produced. From the viewpoint of further improving the heat resistance of the adhesive tape, the content of the silica filler with respect to 100 parts by weight of the base polymer has a more preferable lower limit of 6 parts by weight, a further preferable lower limit of 8 parts by weight, a further preferable upper limit of 18 parts by weight, a further preferable upper limit of 15 parts by weight, and a particularly preferable upper limit of 13 parts by weight.
The non-ultraviolet-curable pressure-sensitive adhesive layer may contain a tackifier.
The ultraviolet-curable pressure-sensitive adhesive layer may contain a tackifier, whereby the adhesive strength can be further improved. However, since the thickener causes outgassing during high-temperature processing, it is preferable to use it in as small an amount as possible. Therefore, when a tackifier is used, the non-ultraviolet-curable pressure-sensitive adhesive layer preferably contains 30 parts by weight or less of the tackifier per 100 parts by weight of the (meth) acrylic copolymer. By setting the content of the thickener to the above range, the generation of outgas due to heat can be suppressed, and the amount of outgas can be easily adjusted. The thickener is preferably used in an amount of 20 parts by weight or more, and more preferably 10 parts by weight or more. The lower limit of the tackifier is not particularly limited, but is preferably 0 part by weight from the viewpoint of minimizing the amount of outgas generated, and is preferably 3 parts by weight from the viewpoint of further improving the adhesive strength.
The non-ultraviolet-curable pressure-sensitive adhesive layer may contain known additives such as a plasticizer, a resin, a surfactant, a wax, and a fine particle filler. The above additives may be used in 1 or 2 or more.
The thickness of the non-ultraviolet-curable pressure-sensitive adhesive layer is not particularly limited, but is preferably 5 μm at the lower limit, more preferably 10 μm at the lower limit, and preferably 100 μm at the upper limit, more preferably 60 μm at the upper limit. When the thickness of the non-ultraviolet-curable pressure-sensitive adhesive layer is in the above range, the pressure-sensitive adhesive layer can be bonded to a support with sufficient adhesive force, and an adherend can be reliably fixed.
Examples of the ultraviolet-curable pressure-sensitive adhesive component constituting the ultraviolet-curable pressure-sensitive adhesive layer include an ultraviolet-curable pressure-sensitive adhesive containing a polymerizable polymer as a main component and an ultraviolet polymerization initiator as a polymerization initiator. The polymerizable polymer can be obtained, for example, by: a (meth) acrylic polymer having a functional group in a molecule (hereinafter referred to as a functional group-containing (meth) acrylic polymer) is synthesized in advance, and reacted with a compound having a functional group reactive with the functional group and a radical polymerizable unsaturated bond in a molecule (hereinafter referred to as a functional group-containing unsaturated compound).
The functional group-containing (meth) acrylic polymer is obtained by copolymerizing, as a main monomer, an alkyl acrylate and/or alkyl methacrylate having an alkyl group with a carbon number generally in the range of 2 to 18, with a functional group-containing monomer and, if necessary, another modifying monomer copolymerizable with the functional group-containing monomer by a conventional method. The weight average molecular weight of the functional group-containing (meth) acrylic polymer is usually about 20 to 200 ten thousand. In the present specification, the weight average molecular weight can be generally determined by a GPC method, and specifically, the method shown in examples can be used.
Examples of the functional group-containing monomer include a carboxyl group-containing monomer, a hydroxyl group-containing monomer, an epoxy group-containing monomer, an isocyanate group-containing monomer, and an amino group-containing monomer. Examples of the carboxyl group-containing monomer include acrylic acid and methacrylic acid. Examples of the hydroxyl group-containing monomer include hydroxyethyl acrylate and hydroxyethyl methacrylate. Examples of the epoxy group-containing monomer include glycidyl acrylate and glycidyl methacrylate. Examples of the isocyanate group-containing monomer include isocyanate ethyl acrylate and isocyanate ethyl methacrylate. Examples of the amino group-containing monomer include aminoethyl acrylate and aminoethyl methacrylate.
Examples of the other copolymerizable modifying monomer include various monomers used in general (meth) acrylic polymers such as vinyl acetate, acrylonitrile, and styrene.
As the functional group-containing unsaturated compound to be reacted with the functional group-containing (meth) acrylic polymer, the same compounds as the functional group-containing monomer can be used depending on the functional group of the functional group-containing (meth) acrylic polymer. For example, when the functional group of the functional group-containing (meth) acrylic polymer is a carboxyl group, an epoxy group-containing monomer or an isocyanate group-containing monomer can be used. In the case where the functional group is a hydroxyl group, an isocyanate group-containing monomer may be used. When the functional group is an epoxy group, an amide group-containing monomer such as a carboxyl group-containing monomer or acrylamide may be used. When the functional group is an amino group, an epoxy group-containing monomer can be used.
Examples of the ultraviolet polymerization initiator include ultraviolet polymerization initiators activated by irradiation with ultraviolet rays having a wavelength of 200 to 410 nm. Examples of such an ultraviolet polymerization initiator include: acetophenone derivative compounds, benzoin ether-based compounds, ketal derivative compounds, phosphine oxide derivative compounds, bis (. eta.5-cyclopentadienyl) titanocene derivative compounds, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, alpha-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenyl propane, and the like. Examples of the acetophenone derivative compound include methoxyacetophenone and the like. Examples of the benzoin ether-based compound include benzoin propyl ether and benzoin isobutyl ether. Examples of the ketal derivative compound include benzildimethylketal and acetophenone diethylketal. These ultraviolet polymerization initiators may be used alone, or 2 or more of them may be used in combination.
The ultraviolet-curable pressure-sensitive adhesive layer preferably contains a radically polymerizable polyfunctional oligomer or monomer. The ultraviolet-curable pressure-sensitive adhesive layer contains a radically polymerizable polyfunctional oligomer or monomer, thereby improving ultraviolet curability.
The polyfunctional oligomer or monomer preferably has a weight average molecular weight of 1 ten thousand or less, more preferably a weight average molecular weight of 5000 or less and the number of radical polymerizable unsaturated bonds in the molecule is 2 to 20, so that the ultraviolet-curable pressure-sensitive adhesive layer can be efficiently three-dimensionally reticulated by irradiation with ultraviolet light. The weight average molecular weight can be determined by GPC measurement, for example, and specifically, the method shown in examples can be used.
Examples of the above-mentioned polyfunctional oligomer or monomer include: trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, and the like methacrylates as described above. Further, there may be mentioned: 1, 4-butanediol diacrylate, 1, 6-hexanediol diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylates (Japanese patent: オリゴエステルアクリレ - ト), and the same methacrylates as described above. These polyfunctional oligomers or monomers may be used alone, or 2 or more kinds may be used in combination.
The ultraviolet-curable pressure-sensitive adhesive layer preferably contains a silicone compound.
When the ultraviolet-curable pressure-sensitive adhesive layer contains a silicone compound, the silicone compound bleeds out at the interface between the ultraviolet-curable pressure-sensitive adhesive layer and the adherend, and therefore the pressure-sensitive adhesive tape can be easily peeled off after the completion of the treatment. Further, since the silicone compound has excellent heat resistance, even when the treatment is performed with heating at 150 ℃ or higher, scorching or the like of the ultraviolet-curable pressure-sensitive adhesive layer can be suppressed, and the adhesive residue can be suppressed.
The silicone compound preferably has a functional group capable of crosslinking with the ultraviolet-curable pressure-sensitive adhesive component.
By providing the silicone compound with a functional group capable of crosslinking with the ultraviolet-curable pressure-sensitive adhesive component, the silicone compound chemically reacts with the ultraviolet-curable pressure-sensitive adhesive component by irradiation with ultraviolet light and enters the ultraviolet-curable pressure-sensitive adhesive component, and therefore contamination due to adhesion of the silicone compound to an adherend is suppressed. The functionality of the silicone compound is, for example, 2 to 6 valent, preferably 2 to 4 valent, and more preferably 2 valent. The functional group is appropriately determined depending on the functional group contained in the ultraviolet-curable pressure-sensitive adhesive component, and for example, in the case of a photocurable pressure-sensitive adhesive containing an alkyl (meth) acrylate-based polymerizable polymer as a main component as the ultraviolet-curable pressure-sensitive adhesive component, a functional group capable of crosslinking with a (meth) acrylic group is selected.
The functional group capable of crosslinking with a (meth) acrylic group is a functional group having an unsaturated double bond, and specifically, for example, a silicone compound containing a vinyl group, a (meth) acrylic group, an allyl group, a maleimide group, or the like is selected.
The silicone compound preferably has a weight average molecular weight of 300 to 50000.
When the weight average molecular weight of the silicone compound is 300 or more, bleeding into the non-ultraviolet-curable pressure-sensitive adhesive layer can be further suppressed by the size of the molecular size. By setting the weight average molecular weight to 50000 or less, bleeding at the interface between the ultraviolet-curable pressure-sensitive adhesive layer and the adherend can be suppressed, and adhesion promotion can be further suppressed. The weight average molecular weight of the silicone compound has a more preferable lower limit of 400, a further preferable lower limit of 500, a more preferable upper limit of 10000, and a further preferable upper limit of 5000. In the present invention, the weight average molecular weight of the silicone compound can be determined by GPC analysis, and specifically, the method shown in examples can be used.
Examples of the silicone compound having the functional group and the weight average molecular weight include silicon diacrylate (Japanese patent No. シリコンジアクリレ - ト). When silicon diacrylate is used, heat resistance and releasability become better.
The lower limit of the content of the silicone compound is 1 part by weight and the upper limit is 50 parts by weight, the more preferable lower limit is 10 parts by weight, and the more preferable upper limit is 40 parts by weight, based on 100 parts by weight of the polymerizable polymer. When the content of the silicone compound is in the above range, the adherend can be protected with sufficient adhesive force, and the pressure-sensitive adhesive tape can be more easily peeled off after the end of protection.
The ultraviolet-curable pressure-sensitive adhesive layer may contain known additives such as an inorganic filler such as fumed silica, a plasticizer, a resin, a surfactant, a wax, and a fine particle filler.
The thickness of the ultraviolet-curable pressure-sensitive adhesive layer is not particularly limited, but the lower limit is preferably 5 μm and the upper limit is preferably 100 μm. When the thickness of the ultraviolet-curable pressure-sensitive adhesive layer is in the above range, the adherend can be protected with sufficient adhesive force, and adhesive residue during peeling can be suppressed. From the viewpoint of further improving the adhesive strength and further suppressing the adhesive residue at the time of peeling, a more preferable lower limit of the thickness of the ultraviolet-curable pressure-sensitive adhesive layer is 10 μm, and a more preferable upper limit is 60 μm.
The pressure-sensitive adhesive tape of the present invention is preferably a non-supporting double-sided pressure-sensitive adhesive tape having no substrate. In the case of the support type having a base material, the silicone compound does not bleed out at the interface on the support side, but a heat-resistant base material is required, and therefore the cost is lower than that of the non-support type.
The pressure-sensitive adhesive tape of the present invention is preferably such that a (preferably ultraviolet-transmitting) release film is laminated on the surface of the non-ultraviolet-curable pressure-sensitive adhesive layer opposite to the surface on which the ultraviolet-curable pressure-sensitive adhesive layer is laminated.
By providing the release film on the non-ultraviolet-curable pressure-sensitive adhesive layer, the non-ultraviolet-curable pressure-sensitive adhesive layer can be protected until the non-ultraviolet-curable pressure-sensitive adhesive layer is attached to an adherend, and the handleability of the pressure-sensitive adhesive tape can be improved. In the case where the release film is ultraviolet-transmissive, the curing step described later may be performed in a state where the non-ultraviolet-curable pressure-sensitive adhesive layer is protected.
The release film is not particularly limited, and examples thereof include: ultraviolet-transmitting films such as polyethylene naphthalate (PEN), Polyimide (PI), polyether ether ketone (PEEK), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyhexamethylene terephthalate, polybutylene naphthalate, polybutylene terephthalate-polytetramethylene glycol copolymer, and polybutylene terephthalate-polycaprolactone copolymer. Among them, polyethylene terephthalate (PET) is preferable.
The pressure-sensitive adhesive tape of the present invention may further include another layer between the ultraviolet-curable pressure-sensitive adhesive layer and the non-ultraviolet-curable pressure-sensitive adhesive layer, as long as the ultraviolet-curable pressure-sensitive adhesive layer and the non-ultraviolet-curable pressure-sensitive adhesive layer are positioned at the outermost layers (layers that are in contact with an adherend).
The adhesive tape of the present invention preferably has a tensile strength of 2.5 to 10N/10mm at 23 ℃ before curing.
When the tensile strength of the pressure-sensitive adhesive tape before curing is in the above range, the pressure-sensitive adhesive tape can be hardly torn at the time of peeling. From the viewpoint of further suppressing the tearing of the pressure-sensitive adhesive tape at the time of peeling, a more preferable lower limit of the tensile strength of the pressure-sensitive adhesive tape before curing is 3.0N/10mm, a more preferable lower limit is 3.5N/10mm, a more preferable upper limit is 9.5N/10mm, and a more preferable upper limit is 9.0N/10 mm. The tensile strength of the pressure-sensitive adhesive tape before curing can be measured by the same method as the tensile strength of the non-ultraviolet-curable pressure-sensitive adhesive layer.
The adhesive tape of the present invention preferably has a gel fraction of the ultraviolet-curable adhesive layer of 80% or more after ultraviolet curing.
When the gel fraction of the ultraviolet-curable pressure-sensitive adhesive layer is equal to or higher than the lower limit, the chemical resistance of the pressure-sensitive adhesive tape can be further improved, and the silicone compound can be further inhibited from bleeding out to the non-ultraviolet-curable pressure-sensitive adhesive layer over time. A more preferable lower limit of the gel fraction of the ultraviolet-curable pressure-sensitive adhesive layer is 85%, and a further preferable lower limit is 90%. The upper limit of the gel fraction of the ultraviolet-curable pressure-sensitive adhesive layer is not particularly limited, and is preferably 99%. In addition, when the pressure-sensitive adhesive tape has a layer other than the ultraviolet-curable pressure-sensitive adhesive layer and the non-ultraviolet-curable pressure-sensitive adhesive layer, the layer preferably satisfies the gel fraction.
The method for producing the adhesive tape of the present invention is not particularly limited, and conventionally known methods can be used. For example, the pressure-sensitive adhesive sheet can be produced by applying a solution of the above-mentioned ultraviolet-curable pressure-sensitive adhesive component to a film subjected to a mold release treatment, drying the applied solution to form an ultraviolet-curable pressure-sensitive adhesive layer, forming a non-ultraviolet-curable pressure-sensitive adhesive layer on another film subjected to a mold release treatment by the same method, and then bonding the ultraviolet-curable pressure-sensitive adhesive layer to the non-ultraviolet-curable pressure-sensitive adhesive layer.
The use of the adhesive tape of the present invention is not particularly limited, and the adhesive tape can be particularly suitably used as: a protective tape for use in the production of electronic components such as electronic boards and semiconductor chips, which uses an opaque support and has a production step involving high-temperature treatment.
Examples of the method for producing such an electronic component include the following methods for producing an electronic component. Namely, the method comprises the following steps: an adherend attaching step of attaching the ultraviolet-curable pressure-sensitive adhesive layer to an adherend; a curing step of curing the ultraviolet-curable pressure-sensitive adhesive layer by irradiating ultraviolet rays; a support attaching step of attaching a support to the non-ultraviolet-curable pressure-sensitive adhesive layer; a heat treatment step of treating the adherend at a high temperature of 150 ℃ or higher; and a peeling step of peeling the adherend from the pressure-sensitive adhesive tape. In such a method for manufacturing an electronic component, the effects of the present invention can be particularly advantageously exhibited.
A method for manufacturing an electronic component including the steps of: an adherend attaching step of attaching the pressure-sensitive adhesive tape of the invention to an adherend via an ultraviolet-curable pressure-sensitive adhesive layer; a curing step of curing the ultraviolet-curable pressure-sensitive adhesive layer by irradiating ultraviolet rays; a support attaching step of attaching a support to the non-ultraviolet-curable pressure-sensitive adhesive layer; a heat treatment step of treating the adherend at a high temperature of 150 ℃ or higher; and a peeling step of peeling the adherend from the pressure-sensitive adhesive tape.
In the method for manufacturing an electronic component according to the present invention, the attaching step is first performed: the pressure-sensitive adhesive tape of the present invention having an ultraviolet-curable pressure-sensitive adhesive layer and a non-ultraviolet-curable pressure-sensitive adhesive layer is attached to an adherend via the ultraviolet-curable pressure-sensitive adhesive layer.
Examples of the adherend include a silicon wafer, a semiconductor chip, a base material which is a foundation in the production of an electronic substrate, and a material of an electronic component. Examples of the substrate include a polyimide film, a glass epoxy substrate (Japanese patent: ガラエポ substrate), and the like.
In the method for manufacturing an electronic component of the present invention, a curing step of irradiating ultraviolet rays to cure the ultraviolet-curable adhesive layer is performed next.
By curing the ultraviolet-curable pressure-sensitive adhesive layer, the pressure-sensitive adhesive tape can be easily peeled from the adherend after the completion of the treatment while suppressing adhesive residue. In the method for manufacturing an electronic component according to the present invention, the ultraviolet-curable adhesive layer is cured before the adhesive tape is attached to the support, and therefore, the ultraviolet-curable adhesive layer can be cured even if the support is made of a material that does not transmit light. In addition, when the non-ultraviolet-curable pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape is ultraviolet-transmissive, the ultraviolet-curable pressure-sensitive adhesive layer can be sufficiently cured even if the ultraviolet-curable pressure-sensitive adhesive layer is irradiated with ultraviolet light from the non-ultraviolet-curable pressure-sensitive adhesive layer side. Since the ultraviolet-curable pressure-sensitive adhesive layer is cured after being attached to an adherend, the pressure-sensitive adhesive tape does not peel off from the adherend immediately even when the ultraviolet-curable pressure-sensitive adhesive layer is cured before the treatment of the adherend.
The irradiation conditions of light for curing the ultraviolet-curable pressure-sensitive adhesive layer can be appropriately adjusted by the combination of the polymerizable polymer and the ultraviolet polymerization initiator used. For example, when a polymerizable polymer having an unsaturated double bond such as a vinyl group in a side chain and an ultraviolet polymerization initiator activated at a wavelength of 200 to 410nm are used, the ultraviolet-curable pressure-sensitive adhesive layer can be crosslinked and cured by irradiating light having a wavelength of 365nm or more.
The ultraviolet-curable pressure-sensitive adhesive layer is preferably irradiated with light having a wavelength of 365nm at an illuminance of, for example, 5mW or more, more preferably 10mW or more, still more preferably 20mW or more, and particularly preferably 50mW or more. The light having a wavelength of 365nm is preferably irradiated with a cumulative illuminance of 300mJ or more, more preferably 500mJ or more and 10000mJ or less, still more preferably 500mJ or more and 7500mJ or less, and particularly preferably 1000mJ or more and 5000mJ or less.
In the method for manufacturing an electronic component of the present invention, a support attaching step of attaching a support to the non-ultraviolet curable adhesive layer is performed next.
In the method for manufacturing an electronic component according to the present invention, the adhesive layer of the adhesive tape is divided into the ultraviolet-curable adhesive layer and the non-ultraviolet-curable adhesive layer, and therefore, even when the curing step is performed before the support is attached, the non-ultraviolet-curable adhesive layer is not cured. Therefore, the adhesive tape can be attached to the support with sufficient adhesive force. In the case where the pressure-sensitive adhesive tape has the ultraviolet-transmitting release film, the release film is peeled from the end of the curing step to the time before the support attaching step.
In the method for manufacturing an electronic component of the present invention, a heat treatment step of treating an adherend at a high temperature of 150 ℃ or higher is performed next.
Examples of the heat treatment step include a substrate manufacturing step and a chip mounting step. The substrate manufacturing step is usually performed with a heat treatment at 150 ℃ or higher, and the chip mounting step is usually performed with a heat treatment at 200 ℃ or higher. In the method for manufacturing an electronic component according to the present invention, since the ultraviolet-curable pressure-sensitive adhesive layer is cured before the heat treatment step, even when the heat treatment step is performed at a high temperature of 150 ℃. Further, since the ultraviolet-curable pressure-sensitive adhesive layer contains a silicone compound, it is possible to further suppress the increase in adhesion.
The method for producing an electronic component of the present invention includes a peeling step of peeling the adherend from the adhesive tape. Since the ultraviolet-curable pressure-sensitive adhesive layer is crosslinked and cured in the curing step, the adherend can be easily peeled from the pressure-sensitive adhesive tape while suppressing adhesive residue. Further, since the amount of outgas of the non-ultraviolet-curable pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape is 10000ppm or less, the non-ultraviolet-curable pressure-sensitive adhesive layer is less likely to foam due to outgas in the heat treatment step. As a result, the pressure-sensitive adhesive tape is less likely to be peeled off between the support and the non-ultraviolet-curable pressure-sensitive adhesive layer, and therefore the pressure-sensitive adhesive tape can be prevented from remaining on the adherend side when peeled off. Further, since the non-ultraviolet-curable pressure-sensitive adhesive layer has a tensile strength within a certain range, the pressure-sensitive adhesive tape is less likely to be torn when peeled off.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, it is possible to provide an adhesive tape which can be used for a support that does not transmit light in the production of an electronic component, and which can suppress peeling from an adherend and a support and adhesive residue even when subjected to high-temperature treatment, and a method for producing an electronic component using the adhesive tape.
Detailed Description
The mode of the present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.
(example 1)
(production of non-ultraviolet-curable adhesive)
97 parts by weight of butylacrylate as an alkyl (meth) acrylate, 3 parts by weight of acrylic acid as a carboxyl group-containing monomer and 120 parts by weight of ethyl acetate were charged into a reactor equipped with a thermometer, a stirrer and a condenser, and after nitrogen substitution, the reactor was heated to start reflux. Next, 0.1 part by weight of azobisisobutyronitrile as a polymerization initiator was added to the reactor. Refluxing was carried out at 70 ℃ for 5 hours to obtain a solution of a (meth) acrylic copolymer (base polymer). The weight average molecular weight and the molecular weight distribution in terms of polystyrene of the obtained (meth) acrylic copolymer were measured by GPC methods, and the results were 100 ten thousand and 3, respectively. The measurement equipment and the measurement conditions are as follows.
A measuring device: 2690 Separations Model, made by Waters corporation
Column: GPC KF-806L manufactured by SHOWA DENKO K.K
A detector: differential refractometer
Sample flow rate: 1mL/min
Column temperature: 40 deg.C
Eluent: ethyl acetate
Next, 0.35 parts by weight of an epoxy curing agent and 10 parts by weight of a silica filler in terms of solid content ratio were added to 100 parts by weight of the solid content of the (meth) acrylic copolymer contained in the obtained solution of the (meth) acrylic copolymer, and the mixture was stirred to obtain an ethyl acetate solution of the non-ultraviolet-curable adhesive. The following epoxy curing agents and silica fillers were used.
Epoxy curing agent: TETRAD-X, MITSUBISHI GAS CHEMICAL, TETRAD-X, Tertiary amino group-containing epoxy curing agent
Silica filler: REOLOSIL MT-10, manufactured by Tokuyama corporation
(production of ultraviolet ray-curable adhesive)
A reactor equipped with a thermometer, a stirrer and a condenser was prepared, and 94 parts by weight of 2-ethylhexyl acrylate as an alkyl (meth) acrylate, 6 parts by weight of hydroxyethyl methacrylate as a functional group-containing monomer, 0.01 part by weight of dodecyl mercaptan and 80 parts by weight of ethyl acetate were charged into the reactor, followed by heating the reactor to start reflux. Next, 0.01 part by weight of 1, 1-bis (t-hexylperoxy) -3, 3, 5-trimethylcyclohexane as a polymerization initiator was added to the reactor, and polymerization was started under reflux. Then, 1-bis (t-hexylperoxy) -3, 3, 5-trimethylcyclohexane in an amount of 0.01 part by weight was added 1 hour and 2 hours after the start of the polymerization, and tert-hexylperoxypivalate in an amount of 0.05 part by weight was added 4 hours after the start of the polymerization, and the polymerization reaction was continued. Then, 8 hours after the start of the polymerization, an ethyl acetate solution of a functional group-containing (meth) acrylic polymer having a solid content of 55% by weight and a weight average molecular weight of 60 ten thousand was obtained.
To 100 parts by weight of the resin solid content of the obtained ethyl acetate solution containing the functional group-containing (meth) acrylic polymer was added 3.5 parts by weight of 2-isocyanatoethyl methacrylate as a functional group-containing unsaturated compound, and the mixture was reacted to obtain a polymerizable polymer. Then, 20 parts by weight of silicon diacrylate as a silicone compound, 3 parts by weight of a silica filler, 30 parts by weight of a urethane acrylate, 0.7 part by weight of an isocyanate-based crosslinking agent, and 1 part by weight of a photopolymerization initiator were mixed with respect to 100 parts by weight of a resin solid content of the obtained ethyl acetate solution of the polymerizable polymer to obtain an ethyl acetate solution of the ultraviolet curable pressure sensitive adhesive. The following were used as the silicon diacrylate, silica filler, urethane acrylate, isocyanate-based crosslinking agent, and photopolymerization initiator.
Silicon diacrylate: EBECRYL 350, manufactured by DAICEL-allnex, having a weight-average molecular weight of 1000
Silica filler: REOLOSIL MT-10, manufactured by Tokuyama
Urethane acrylate: UN-5500 manufactured by Genseiko industries Ltd
Isocyanate-based crosslinking agent: coronate L, manufactured by Nippon Urethane Industries, Inc
Photopolymerization initiator: manufactured by Escapure One, Nihon Siber Hegner Co
(production of adhesive tape)
The obtained ultraviolet-curable pressure-sensitive adhesive solution was applied to a 50 μm polyethylene terephthalate (PET) film, one surface of which was subjected to a release treatment, with a doctor blade so that the thickness of the dried film became 40 μm, and the applied solution was dried by heating at 110 ℃ for 5 minutes to obtain an ultraviolet-curable pressure-sensitive adhesive layer.
The obtained non-ultraviolet-curable pressure-sensitive adhesive solution was applied to a transparent PET film having a thickness of 50 μm, which had been subjected to a mold release treatment on one surface thereof, with a doctor blade so that the thickness of the dried film became 40 μm, and the coating solution was dried by heating at 110 ℃ for 5 minutes to obtain a non-ultraviolet-curable pressure-sensitive adhesive layer.
The surfaces of the obtained ultraviolet-curable pressure-sensitive adhesive layer and non-ultraviolet-curable pressure-sensitive adhesive layer on which the PET film was not laminated were bonded to each other to obtain a pressure-sensitive adhesive tape.
(measurement of tensile Strength)
An adhesive tape including only a non-ultraviolet curable adhesive layer was produced by the above method. The obtained non-ultraviolet-curable pressure-sensitive adhesive layer was cut into a thickness of 200 μm and a width of 10mm, and the tensile strength was measured at a speed of 300 mm/min and a standard line-to-line distance of 40mm using TENSILON UCE500 (manufactured by ORIENTEC) as a sample at 23 ℃ and 50% RH. The obtained adhesive tape was measured for tensile strength before curing by the same method.
(measurement of gas Release quantity)
An adhesive tape including only the non-ultraviolet-curable adhesive layer was prepared by the above method, and the obtained adhesive tape including only the non-ultraviolet-curable adhesive layer was cut into 5mm × 5mm to prepare a measurement sample. The obtained measurement sample was measured by thermal desorption GC-MS, and the amount of the obtained gas (ppm in terms of toluene/. mu.g/g) was defined as the gas release amount. The instruments used and the measurement conditions were as follows.
A thermal desorption device: turbomatrix 350 manufactured by PerkinElmer
GC-MS apparatus: JMS Q1000 manufactured by Japan electronic official
Sample heating conditions: 260, 15min (20mL/min)
Secondary desorption: 350 ℃ for 40min
Shunting: inlet 25mL/min, outlet 25mL/min
Injection amount: 2.5 percent
Column: EQUITY-1 (nonpolar, SIGMA-ALDRICH Co., Ltd.) 0.32mm X60 m X0.25 μm
And (3) GC temperature rise: 40 deg.C (4min) → heating at a rate of 10 deg.C/min → 300 deg.C (10min)
He flow rate: 1.5mL/min
Ionization voltage: 70eV
MS measurement range: 29 to 600amu (scanning 500ms)
MS temperature: an ion source; interface at 230 ℃; 250 deg.C
(measurement of adhesive Strength)
An adhesive tape including only a non-ultraviolet curable adhesive layer was prepared as a measurement sample by the above method. The obtained adhesive tape including only the non-ultraviolet curable adhesive layer was cut into pieces of 10mm × 10mm to prepare measurement samples. For the obtained measurement sample, probe tack measurement was performed. The instruments used and the measurement conditions were as follows.
A viscosity tester: TAC1000 manufactured by RHESCA
Diameter of the probe: 3mm phi
Crimping load: 100g
Crimping time: 1 second
Contact speed: 30 mm. min
Stripping speed: 600mm/min
(measurement of gel fraction)
Only 0.1g of the non-ultraviolet-curable pressure-sensitive adhesive layer of the obtained pressure-sensitive adhesive tape was scraped off and immersed in 50ml of ethyl acetate, and shaken by a shaker at a temperature of 23 ℃ and a speed of 120rpm for 24 hours (hereinafter, the scraped-off non-ultraviolet-curable pressure-sensitive adhesive layer is referred to as a pressure-sensitive adhesive composition). After shaking, the adhesive composition swollen by absorbing ethyl acetate was separated from ethyl acetate using a metal mesh (mesh # 200). The separated adhesive composition was dried at 110 ℃ for 1 hour. The weight of the adhesive composition containing the metal mesh after drying was measured, and the gel fraction of the non-ultraviolet-curable adhesive layer was calculated using the following formula. The results are shown in tables 1 and 2.
Gel fraction (wt%) < 100 × (W)1-W2)/W0
(W0: initial adhesive composition weight, W1: weight of adhesive composition including wire netting after drying, W2: initial weight of Metal mesh)
(examples 2 to 11, comparative examples 1 to 11)
Adhesive tapes were produced in the same manner as in example 1 except that the blending amounts of butyl acrylate, acrylic acid and silica filler in the non-ultraviolet-curable adhesive layer were as shown in tables 1 and 2, the polymerization conditions were changed to make the weight average molecular weight and the molecular weight distribution of the base polymer as shown in tables 1 and 2, and the amounts of the tackifiers shown in tables 1 and 2 were added, and the physical properties were measured. Incidentally, UN5500 manufactured by Kokusan Kogyo Co., Ltd was used as a thickener. As the isocyanate curing agent, Coronate L manufactured by Tosoh corporation was used.
< evaluation >
The adhesive tapes obtained in examples and comparative examples were evaluated by the following methods. The results are shown in tables 1 and 2.
(1) Evaluation of substrate after Heat treatment
The surface of the pressure-sensitive adhesive tape on the side of the ultraviolet-curable pressure-sensitive adhesive layer was attached to a substrate (TPWB-S02-READCUT, manufactured by Dachang electronic Co., Ltd.) to obtain a laminate. Next, a high-pressure mercury UV irradiation machine was used so that the irradiation intensity on the surface of the adhesive tape became 100mW/cm2The ultraviolet-curable pressure-sensitive adhesive layer was crosslinked and cured by irradiating 365nm ultraviolet light for 30 seconds from the non-ultraviolet-curable pressure-sensitive adhesive layer side while adjusting the illuminance. Then, the non-ultraviolet curable adhesive layer of the laminate was bonded to a CCL support (copper clad laminate), and heat treatment was performed at 260 ℃ for 6 minutes for 3 times in total. After the heat treatment is completed, the adhesive tape is peeled off from the substrate. The peeling of the pressure-sensitive adhesive tape, the foaming of the non-ultraviolet-curable pressure-sensitive adhesive layer, and the adhesive residue of the substrate were evaluated as follows.
(evaluation of peeling of adhesive tape)
The pressure-sensitive adhesive tape after the heat treatment was visually observed, and the peeling of the pressure-sensitive adhesive tape was evaluated by marking the case where there was no peeling or voids at the interface between the ultraviolet-curable pressure-sensitive adhesive layer and the substrate as "o", the case where there was some peeling or voids as "Δ", and the case where there was peeling or voids over the entire surface as "x".
(evaluation of foaming of non-ultraviolet-curable pressure-sensitive adhesive layer)
The non-ultraviolet-curable pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape after the heat treatment was visually observed, and the foaming of the non-ultraviolet-curable pressure-sensitive adhesive layer was evaluated, wherein the non-foaming state was "excellent", the substantially non-foaming state was "o", the partially foaming state was "Δ", and the entire surface was foamed, and the whole surface was "x".
(evaluation of residual adhesive on substrate)
The peeled substrate was observed with an optical microscope, and the residual glue of the substrate was evaluated by marking as "excellent" when no residual glue was present, marking as "o" when no residual glue was present substantially, marking as "Δ" when a portion of the substrate had residual glue, and marking as "x" when residual glue was present on the entire surface.
(2) Evaluation of chemical resistance
A polyimide film was attached to the ultraviolet-curable pressure-sensitive adhesive layer of the obtained pressure-sensitive adhesive tape, and a CCL plate (copper clad laminate) was attached to the non-ultraviolet-curable pressure-sensitive adhesive layer to prepare a measurement sample. The obtained measurement sample was immersed in PINE ALPHA (manufactured by Mitsukawa chemical industries, Ltd.) at 70 ℃ for 2 hours, and dried in an oven at 110 ℃ for 1 hour. The weight loss rate before and after the impregnation was measured.
Chemical resistance was evaluated by designating the weight reduction rate before and after immersion as "very good" when the weight reduction rate was 3.0% or less, by designating the weight reduction rate as "good" when the weight reduction rate was more than 3.0% and 5.0% or less, by designating the weight reduction rate as "good" when the weight reduction rate was more than 5.0% and 8.0% or less, by designating the weight reduction rate as "Δ" when the weight reduction rate was more than 5.0% and 8.0% or less, and by designating the weight reduction rate as.
Figure BDA0002986705940000261
Figure BDA0002986705940000271
Industrial applicability
According to the present invention, it is possible to provide an adhesive tape which can be used for a support that does not transmit light in the production of an electronic component, and which can suppress peeling from an adherend and a support and adhesive residue even when subjected to high-temperature treatment, and a method for producing an electronic component using the adhesive tape.

Claims (10)

1. A pressure-sensitive adhesive tape comprising a non-ultraviolet-curable pressure-sensitive adhesive layer and an ultraviolet-curable pressure-sensitive adhesive layer laminated on the non-ultraviolet-curable pressure-sensitive adhesive layer,
the non-ultraviolet-curable pressure-sensitive adhesive layer has a tensile strength of 5.0N/10mm or more and 20.0N/10mm or less at 23 ℃, and,
the amount of gas released when the non-ultraviolet-curable adhesive layer is heated at 260 ℃ for 15 minutes is 10000ppm or less.
2. The adhesive tape according to claim 1, wherein the adhesive strength of the non-ultraviolet curable adhesive layer is 10gf/3mm φ to 300gf/3mm φ.
3. The adhesive tape according to claim 1 or 2, wherein the non-ultraviolet curable adhesive layer contains:
a (meth) acrylic copolymer having a weight average molecular weight c of 70 ten thousand or more and a molecular weight distribution d of 2 to 6 as a base polymer A, the (meth) acrylic copolymer containing, as constituent components, 92 to 97% by weight of an alkyl (meth) acrylate a having an alkyl group with 4 to 12 carbon atoms and 3.0 to 8.0% by weight of a carboxyl group-containing monomer b;
an epoxy compound having a tertiary amine structure as a curing agent B; and
the amount of the filler C is greater than the amount of the filler C,
the curing agent is contained in an amount of 0.1 to 0.5 parts by weight per 100 parts by weight of the base polymer, and the filler is contained in an amount of 3 to 20 parts by weight.
4. The adhesive tape according to claim 1, 2 or 3, wherein the non-ultraviolet curable adhesive layer contains 30 parts by weight or less of a tackifier relative to 100 parts by weight of the (meth) acrylic copolymer.
5. The adhesive tape according to claim 1, 2, 3 or 4, wherein the ultraviolet-curable adhesive layer contains an ultraviolet-curable adhesive component and a silicone compound having a functional group capable of crosslinking with the ultraviolet-curable adhesive component and a weight average molecular weight of 300 to 50000.
6. The adhesive tape according to claim 1, 2, 3, 4, or 5, wherein the gel fraction of the non-ultraviolet curable adhesive layer is 80% or more.
7. The adhesive tape according to claim 1, 2, 3, 4, 5 or 6, wherein the tensile strength at 23 ℃ before curing is from 2.5N/10mm to 10N/10 mm.
8. A pressure-sensitive adhesive tape comprising a non-ultraviolet-curable pressure-sensitive adhesive layer and an ultraviolet-curable pressure-sensitive adhesive layer laminated on the non-ultraviolet-curable pressure-sensitive adhesive layer,
the amount of gas released when the non-ultraviolet-curable adhesive layer is heated at 260 ℃ for 15 minutes is 10000ppm or less, and,
the non-ultraviolet-curable adhesive layer contains:
a (meth) acrylic copolymer as a base polymer A', the (meth) acrylic copolymer containing, as a constituent component, 92 to 97% by weight of an alkyl (meth) acrylate having an alkyl group with 4 to 12 carbon atoms;
an epoxy compound having a tertiary amine structure as a curing agent B; and
and (4) a filler C.
9. The adhesive tape according to claim 1, 2, 3, 4, 5, 6, 7, or 8, which is used in a method for manufacturing an electronic component, the method comprising:
an adherend attaching step of attaching the ultraviolet-curable pressure-sensitive adhesive layer to an adherend;
a curing step of curing the ultraviolet-curable pressure-sensitive adhesive layer by irradiating ultraviolet rays;
a support attaching step of attaching a support to the non-ultraviolet-curable adhesive layer;
a heat treatment step of treating the adherend at a high temperature of 150 ℃ or higher; and
and a peeling step of peeling the adherend from the pressure-sensitive adhesive tape.
10. A method of manufacturing an electronic component, comprising:
an adherend attaching step of attaching the pressure-sensitive adhesive tape according to claim 1, 2, 3, 4, 5, 6, 7, 8 or 9 to an adherend via the ultraviolet-curable pressure-sensitive adhesive layer;
a curing step of curing the ultraviolet-curable pressure-sensitive adhesive layer by irradiating ultraviolet rays;
a support attaching step of attaching a support to the non-ultraviolet-curable adhesive layer;
a heat treatment step of treating the adherend at a high temperature of 150 ℃ or higher; and
and a peeling step of peeling the adherend from the pressure-sensitive adhesive tape.
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