JP2018147987A - Method for manufacturing semiconductor chip and adhesive tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor chip capable of maintaining an enough adhesive force during a semiconductor chip processing step and peeling the adhesive tape without leaving adhesive deposit after the semiconductor chip processing step, and the adhesive tape used for the method for manufacturing the adhesive tape.SOLUTION: A method for manufacturing a semiconductor chip comprises the steps of: sticking an adhesive tape 2 including a photocurable adhesive layer 21 and a base material 22 to one surface of a stage substrate provided with a plurality of through holes; installing a semiconductor chip 3 on the photocurable adhesive layer of the adhesive tape exposed from the through holes; curing the photocurable adhesive layer by applying stimulus to a curable pressure sensitive adhesive ; filling the surface on which the semiconductor chip is installed with a mold resin; thermally curing the mold resin; and peeling the adhesive tape from the stage substrate.SELECTED DRAWING: Figure 3

Description

The present invention maintains a sufficient adhesive force and protective performance during the semiconductor chip processing step, and has an adhesive tape without adhesive residue after the semiconductor chip processing step, despite having a semiconductor chip processing step for performing heat treatment. The present invention relates to a method for producing a peelable semiconductor chip and an adhesive tape used for the method for producing the semiconductor chip.

In a semiconductor chip manufacturing process, an adhesive tape is used to facilitate handling during processing of a wafer or a semiconductor chip and to prevent breakage. For example, when a thick film wafer cut out from a high-purity silicon single crystal or the like is ground to a predetermined thickness to form a thin film wafer, grinding is performed after an adhesive tape is bonded to the thick film wafer.

Adhesive compositions used for such adhesive tapes can be peeled off without damaging the wafers and semiconductor chips after the process, as well as high adhesiveness that can firmly fix the wafers and semiconductor chips during the processing process. (Hereinafter also referred to as “high adhesion easy peeling”).
As an adhesive composition realizing high adhesion and easy peeling, Patent Document 1 describes a wafer processing method using a double-sided adhesive tape having an adhesive layer containing a gas generating agent that generates a gas upon stimulation with an azo compound or the like. Has been. In the wafer processing method described in Patent Document 1, first, a wafer is fixed to a support plate via a double-sided adhesive tape. When stimulation is performed after the grinding process or the like is performed in this state, the gas generated from the gas generating agent is released to the interface between the surface of the tape and the wafer, and at least a part is peeled off by the pressure. If the double-sided adhesive tape of patent document 1 is used, it can peel, without damaging a wafer and without the adhesive residue.

In recent years, heat treatment and chemical treatment have been performed with an adhesive tape attached. For example, in a molding process of covering a semiconductor chip with a mold resin, an adhesive tape is attached to one side of a stage substrate having a plurality of through holes, the semiconductor chip is fixed to the adhesive surface of the adhesive tape exposed from the through holes, and then molded. Fill with resin and heat cure.
In such a molding process, a high temperature treatment is performed to cure the mold resin. However, the conventional method for manufacturing a semiconductor chip has a problem in that adhesion of the adhesive tape occurs due to high-temperature treatment, and adhesive residue is generated when the adhesive tape is peeled off. In particular, since heat pressing is performed when the mold resin is filled in the molding process, adhesion progress tends to be larger than that in normal heat treatment at the portion where the adhesive tape and the heated mold resin are in contact, and the problem of adhesive residue is more prominent. It was.

JP 2003-231872 A

In view of the above situation, the present invention maintains a sufficient adhesive force at the time of the semiconductor chip processing step and has no adhesive residue after completion of the semiconductor chip processing step in spite of having the semiconductor chip processing step for performing the heat treatment. It aims at providing the manufacturing method of the semiconductor chip which can peel a tape, and the adhesive tape used for the manufacturing method of this semiconductor chip.

The first aspect of the present invention is a pressure-sensitive adhesive tape having a curable pressure-sensitive adhesive layer containing a curable pressure-sensitive adhesive comprising a polymerizable polymer and a polymerization initiator and a base material on one surface of a stage substrate provided with a plurality of through holes. And a semiconductor chip installation step of installing a semiconductor chip on the curable adhesive layer of the adhesive tape exposed from the through hole on the surface of the stage substrate where the adhesive tape is not applied. An adhesive curing step for stimulating the curable adhesive to cure the curable adhesive layer, a mold resin filling step for filling a mold resin on the surface on which the semiconductor chip is installed, and the mold resin It is a manufacturing method of a semiconductor chip which has a mold resin curing step for thermosetting and an adhesive tape peeling step for peeling the adhesive tape from a stage substrate.

The second aspect of the present invention is a pressure-sensitive adhesive tape having a curable pressure-sensitive adhesive layer containing a curable pressure-sensitive adhesive composed of a polymerizable polymer and a polymerization initiator and a base material on one surface of a stage substrate provided with a plurality of through holes. And a semiconductor chip installation step of installing a semiconductor chip on the curable adhesive layer of the adhesive tape exposed from the through hole on the surface of the stage substrate where the adhesive tape is not applied. A mold resin filling step of filling the surface on which the semiconductor chip is installed with a mold resin, an adhesive curing step of stimulating the curable adhesive to cure the curable adhesive layer, and the mold resin. It is a manufacturing method of a semiconductor chip which has a mold resin curing step for thermosetting and an adhesive tape peeling step for peeling the adhesive tape from a stage substrate.
The present invention is described in detail below.

As a result of intensive studies, the present inventor has made the pressure-sensitive adhesive of the pressure-sensitive adhesive tape a curable pressure-sensitive adhesive, and cures the curable pressure-sensitive adhesive before curing the mold resin, thereby preventing the adhesion from progressing and leaving the adhesive on the mold resin. The present inventors have found that the pressure-sensitive adhesive tape can be peeled without causing the present invention to be completed.

In the first and second semiconductor chip manufacturing methods of the present invention, first, curing containing a curable adhesive composed of a polymerizable polymer and a polymerization initiator on one surface of a stage substrate provided with a plurality of through holes. An adhesive tape attaching process for attaching an adhesive tape having a mold adhesive layer and a substrate is performed.
By sticking the adhesive tape, handling during processing can be facilitated, and damage to the stage substrate and the semiconductor chip can be prevented.
The figure which represented the mode of the said adhesive tape sticking process typically was shown in FIG. As shown in FIG. 1B, the stage substrate 1 has a plurality of through holes 12. An adhesive tape 2 having a base material 22 and a curable adhesive layer 21 is attached to one side of such a stage substrate 1 as shown in FIG.
The material for the stage substrate is not particularly limited, but generally an epoxy resin or the like is used.

Examples of the curable pressure-sensitive adhesive include a photo-curable pressure-sensitive adhesive that crosslinks and cures by light irradiation and a thermosetting pressure-sensitive adhesive that crosslinks and cures by heating.
As said photocurable adhesive, the photocurable adhesive which has a polymeric polymer as a main component and used the photoinitiator as a polymerization initiator is mentioned, for example.
Examples of the thermosetting pressure-sensitive adhesive include a thermosetting pressure-sensitive adhesive that contains a polymerizable polymer as a main component and uses a thermal polymerization initiator as a polymerization initiator.

The polymerizable polymer is prepared by, for example, previously synthesizing a (meth) acrylic polymer having a functional group in the molecule (hereinafter referred to as a functional group-containing (meth) acrylic polymer) and reacting with the functional group in the molecule. It can be obtained by reacting a compound having a functional group and a radical polymerizable unsaturated bond (hereinafter referred to as a functional group-containing unsaturated compound).

The functional group-containing (meth) acrylic polymer is an acrylic having an alkyl group usually in the range of 2 to 18 as a polymer having adhesiveness at room temperature, as in the case of a general (meth) acrylic polymer. By copolymerizing an acid alkyl ester and / or methacrylic acid alkyl ester as a main monomer, a functional group-containing monomer, and, if necessary, another modifying monomer copolymerizable therewith by a conventional method It is obtained. The weight average molecular weight of the functional group-containing (meth) acrylic polymer is usually about 200,000 to 2,000,000.

Examples of the functional group-containing monomer include carboxyl group-containing monomers such as acrylic acid and methacrylic acid, hydroxyl group-containing monomers such as hydroxyethyl acrylate and hydroxyethyl methacrylate, and epoxy such as glycidyl acrylate and glycidyl methacrylate. Examples thereof include group-containing monomers, isocyanate group-containing monomers such as isocyanate ethyl acrylate and isocyanate ethyl methacrylate, and amino group-containing monomers such as aminoethyl acrylate and aminoethyl methacrylate.

Examples of other modifying monomers that can be copolymerized include various monomers used in general (meth) acrylic polymers such as vinyl acetate, acrylonitrile, and styrene.

The functional group-containing unsaturated compound to be reacted with the functional group-containing (meth) acrylic polymer is the same as the functional group-containing monomer described above according to the functional group of the functional group-containing (meth) acrylic polymer. it can. For example, when the functional group of the functional group-containing (meth) acrylic polymer is a carboxyl group, an epoxy group-containing monomer or an isocyanate group-containing monomer is used, and when the functional group is a hydroxyl group, an isocyanate group-containing monomer is used. When the functional group is an epoxy group, a carboxyl group-containing monomer or an amide group-containing monomer such as acrylamide is used, and when the functional group is an amino group, an epoxy group-containing monomer is used.

In the present invention, the polymerizable polymer preferably has a hydroxyl value of 40 mgKOH / g or more.
Since the hydroxyl value of the polymerizable polymer is 40 mgKOH / g or more, the reaction between the curable pressure-sensitive adhesive and the mold resin due to heat can be suppressed, so that the adhesive residue on the mold resin can be prevented more reliably. In particular, in the second aspect of the present invention, since the curable pressure-sensitive adhesive layer is cured after the mold resin filling step, the polymerization is performed because the curable pressure-sensitive adhesive and the heated mold resin are easily reacted by hot pressing during the mold resin filling step. The hydroxyl value of the conductive polymer is preferably 40 mgKOH / g or more. A more preferred lower limit of the hydroxyl value is 45 mgKOH / g, a more preferred lower limit is 50 mgKOH / g, a preferred upper limit is 70 mgKOH / g, and a more preferred upper limit is 65 mgKOH / g.

Examples of the photopolymerization initiator include those activated by irradiation with light having a wavelength of 250 to 800 nm. Examples of such a photopolymerization initiator include acetophenone derivative compounds such as methoxyacetophenone, Benzoin ether compounds such as benzoinpropyl ether and benzoin isobutyl ether, ketal derivative compounds such as benzyldimethyl ketal and acetophenone diethyl ketal, phosphine oxide derivative compounds, bis (η5-cyclopentadienyl) titanocene derivative compounds, Benzophenone, Michler's ketone, chlorothioxanthone, todecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenyl group Examples include photo radical polymerization initiators such as lopan. These photoinitiators may be used independently and 2 or more types may be used together.

Examples of the thermal polymerization initiator include those that decompose by heat and generate active radicals that initiate polymerization and curing, such as dicumyl peroxide, di-t-butyl peroxide, and t-butyl peroxybenzoale. , T-butyl hydroperoxide, benzoyl peroxide, cumene hydroperoxide, diisopropylbenzene hydroperoxide, paramentane hydroperoxide, di-t-butyl peroxide and the like. Although it does not specifically limit as what is marketed among these thermal polymerization initiators, For example, perbutyl D, perbutyl H, perbutyl P, perpenta H (all are the NOF Corporation make) etc. are suitable. These thermal polymerization initiators may be used independently and 2 or more types may be used together.

The curable pressure-sensitive adhesive layer preferably contains a radical polymerizable polyfunctional oligomer or monomer. By containing a radically polymerizable polyfunctional oligomer or monomer, photocurability and thermosetting are improved.
The polyfunctional oligomer or monomer preferably has a molecular weight of 10,000 or less, and more preferably has a molecular weight of 5000 so that the three-dimensional network of the curable pressure-sensitive adhesive layer can be efficiently formed by heating or light irradiation. The number of radically polymerizable unsaturated bonds in the molecule is 2 to 20 below.

The polyfunctional oligomer or monomer is, for example, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, or the same methacrylate as described above. And the like. Other examples include 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylate, and methacrylates similar to those described above. These polyfunctional oligomers or monomers may be used alone or in combination of two or more.

The curable pressure-sensitive adhesive layer may contain a gas generating agent that generates gas upon stimulation. When the curable pressure-sensitive adhesive layer contains the gas generating agent, when peeling the pressure-sensitive adhesive tape from the stage substrate, it is easier to generate gas from the gas generating agent by giving a stimulus, and The adhesive tape can be peeled without any adhesive residue.

Although the said gas generating agent is not specifically limited, Since it is excellent in the tolerance with respect to the process with a heating, carboxylic acid compounds, such as phenylacetic acid, diphenylacetic acid, and triphenylacetic acid, or its salt, 1H-tetrazole, 5-phenyl-1H- A tetrazole compound such as tetrazole or 5,5-azobis-1H-tetrazole or a salt thereof is preferred. Such a gas generating agent generates gas when irradiated with light such as ultraviolet rays, and has high heat resistance that does not decompose even at a high temperature of about 200 ° C.

As for the content of the gas generating agent, a preferable lower limit with respect to 100 parts by weight of the curable adhesive is 5 parts by weight, and a preferable upper limit is 50 parts by weight. When the content of the gas generating agent is less than 5 parts by weight, the generation of carbon dioxide gas or nitrogen gas due to stimulation may be reduced, and sufficient peeling may not be performed. The adhesive may not be able to be dissolved in the adhesive and the adhesive strength may be reduced. The minimum with more preferable content of the said gas generating agent is 10 weight part, and a more preferable upper limit is 30 weight part.

The curable pressure-sensitive adhesive layer may further contain a photosensitizer.
Since the photosensitizer has an effect of amplifying stimulation by light on the gas generating agent, gas can be released by irradiation with less light. In addition, gas can be emitted by light in a wider wavelength region.

The curable pressure-sensitive adhesive layer may contain a silicone compound having a functional group capable of crosslinking with the curable pressure-sensitive adhesive. Since the silicone compound is excellent in heat resistance, it prevents the adhesive from being burnt even after a treatment with heating at 200 ° C. or higher, and bleeds out to the adherend interface at the time of peeling to facilitate peeling. Since the silicone compound has a functional group capable of cross-linking with the curable pressure-sensitive adhesive, it is chemically reacted with the curable pressure-sensitive adhesive by light irradiation or heating, and is thus incorporated into the curable pressure-sensitive adhesive. Silicone compounds do not adhere to the body and become contaminated. Moreover, the effect which prevents the adhesive residue on a semiconductor chip is exhibited by mix | blending a silicone compound.

The curable pressure-sensitive adhesive layer appropriately contains various polyfunctional compounds blended in general pressure-sensitive adhesives such as isocyanate compounds, melamine compounds, and epoxy compounds as needed for the purpose of adjusting the cohesive force as the pressure-sensitive adhesive. May be.
The curable pressure-sensitive adhesive layer may contain known additives such as an inorganic filler such as fumed silica, a plasticizer, a resin, a surfactant, a wax, and a fine particle filler.

The curable pressure-sensitive adhesive layer preferably has a gel fraction of 30% or more during the tape attaching step. When the gel fraction of the curable pressure-sensitive adhesive layer before curing is within this range, the adhesive tape will not be unintentionally peeled off during the manufacturing process of the semiconductor chip. It is possible to prevent adhesive residue from being generated on the surface of the mold resin. A more preferable lower limit of the gel fraction is 40% or more. In addition, although the upper limit of the said gel fraction is not specifically limited, It is preferable that it is 80% or less.

The curable pressure-sensitive adhesive layer preferably has a tensile storage elastic modulus of 1 × 10 ⁵ Pa or more at 23 ° C. before the pressure-sensitive adhesive curing step described later.
When the tensile storage elastic modulus of the curable pressure-sensitive adhesive layer before crosslinking and curing is within this range, the semiconductor chip can be sufficiently protected and warpage of the stage substrate and the semiconductor chip due to high-temperature treatment can be prevented. Further, since adhesive residue on the semiconductor chip and the mold resin due to adhesion progress can be prevented, the adhesive tape can be peeled without adhesive residue after the processing is completed. A more preferable lower limit of the tensile storage elastic modulus is 5 × 10 ⁵ Pa. The upper limit of the tensile storage elastic modulus is not particularly limited, but is preferably 1 × 10 ⁸ Pa or less.
The tensile storage elastic modulus is measured using a dynamic viscoelasticity measuring device (for example, DVA-200 manufactured by IT Measurement Control Co., Ltd.) under the tensile mode of dynamic viscoelasticity measurement and the angular frequency of 10 Hz. Can be obtained.

Although the thickness of the said curable adhesive layer is not specifically limited, A preferable minimum is 5 micrometers and a preferable upper limit is 100 micrometers. When the thickness of the pressure-sensitive adhesive layer is within this range, it can be adhered to the wafer with sufficient adhesive force, and the semiconductor chip being processed can be protected. The minimum with more preferable thickness of the said adhesive layer is 10 micrometers, and a more preferable upper limit is 50 micrometers.

Examples of the base material include polyethylene naphthalate (PEN), polyimide (PI), polyether ether ketone (PEEK), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyhexamethylene. Examples thereof include a sheet made of a resin having transparency and excellent heat resistance, such as terephthalate, polybutylene naphthalate, butanediol terephthalate polytetramethylene glycol copolymer, butanediol terephthalate polycaprolactone copolymer. Of these, polyethylene naphthalate is preferred because of its excellent heat resistance.

The thickness of the substrate is not particularly limited, but a preferable lower limit is 10 μm and a preferable upper limit is 200 μm. When the thickness of the base material is within this range, the stage substrate and the semiconductor chip can be sufficiently reinforced, and the adhesive tape can be easily peeled off after the process is completed.

In the semiconductor chip manufacturing method according to the first and second aspects of the present invention, the semiconductor is then formed on the curable pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape exposed from the through hole on the surface of the stage substrate where the pressure-sensitive adhesive tape is not applied. A semiconductor chip installation process for installing chips is performed.
FIG. 2B schematically shows the state of the stage substrate on which the semiconductor chip is installed. When the stage substrate 1 is placed with the surface to which the adhesive tape 2 has been applied facing downward, the curable adhesive layer 21 of the adhesive tape 2 is exposed at the bottom of the through hole 12. The semiconductor chip 3 is placed on the curable pressure-sensitive adhesive layer 21 exposed from the through hole 12. Here, as shown in FIG. 2A, the installed semiconductor chip 3 has a height lower than the thickness of the stage substrate 1, that is, the height of the through hole 12. By making the height of the semiconductor chip lower than the height of the through hole, the upper surface of the semiconductor chip can be surely covered with the mold resin when the mold resin is filled in a later process.

In the semiconductor chip manufacturing method of the first aspect of the present invention, an adhesive curing step is then performed in which the curable adhesive is stimulated to cure the curable adhesive layer.
By cross-linking and curing the curable pressure-sensitive adhesive layer by stimulation, the elastic modulus of the curable pressure-sensitive adhesive layer is increased, and it is difficult for the adhesive to progress even at high temperatures. As a result, when the pressure-sensitive adhesive tape is peeled off after completion of the molding process, the pressure-sensitive adhesive tape can be peeled without leaving adhesive residue on the mold resin. As will be described later, in the second aspect of the present invention, the adhesive curing step is performed after the mold resin filling step.

The curable pressure-sensitive adhesive is a photo-curable pressure-sensitive adhesive, and contains a polymer having an unsaturated double bond such as a vinyl group in a side chain and a photopolymerization initiator activated at a wavelength of 250 to 800 nm. When an agent is used, the photocurable pressure-sensitive adhesive can be crosslinked and cured by irradiating light with a wavelength of 365 nm or more.
For such a photocurable pressure-sensitive adhesive, for example, light with a wavelength of 365 nm is preferably irradiated with an illuminance of 5 mW or more, more preferably with an illuminance of 10 mW or more, and irradiation with an illuminance of 20 mW or more. More preferably, irradiation with an illuminance of 50 mW or more is particularly preferable. In addition, it is preferable to irradiate light with a wavelength of 365 nm with an integrated illuminance of 300 mJ or more, more preferably with an integrated illuminance of 500 mJ or more and 10,000 mJ or less, and more preferably with an integrated illuminance of 500 mJ or more and 7500 mJ or less. It is particularly preferable to irradiate with an integrated illuminance of 1000 mJ or more and 5000 mJ or less.

The curable pressure-sensitive adhesive is a thermosetting pressure-sensitive adhesive and contains a polymer having an unsaturated double bond such as a vinyl group in the side chain and a thermal polymerization initiator that is activated by heating at about 50 to 150 ° C. When a thermosetting pressure-sensitive adhesive is used, the thermosetting pressure-sensitive adhesive can be crosslinked and cured by heating to a temperature of about 50 to 150 ° C.

In the semiconductor chip manufacturing method according to the first and second aspects of the present invention, the method further includes a mold resin filling step of filling the surface on which the semiconductor chip is installed with a mold resin.
A view schematically showing the state of the mold resin filling step is shown in FIG. In the mold resin filling step, the through hole is filled with the mold resin 4 with the surface of the stage substrate 1 on which the adhesive tape 2 is applied as the lower surface. The mold resin 4 is filled up to fill the through hole and cover the area where the through hole is provided on the upper surface of the stage substrate as shown in FIG. Thereafter, hot pressing at about 120 ° C. and about 12 kg / cm ² is performed.

Examples of the mold resin include an epoxy resin and a phenol resin. Among these, an epoxy resin is preferable from the viewpoint of reliability.

In the semiconductor chip manufacturing method of the second aspect of the present invention, an adhesive curing step is then performed in which the curable adhesive is stimulated to cure the curable adhesive layer.
In the manufacture of semiconductor chips, depending on the manufacturing equipment, the process up to the mold resin filling step may be a series of steps. In that case, since the curable pressure-sensitive adhesive layer cannot be cured before the mold resin filling step, the first aspect of the present invention cannot be used. Therefore, by performing the pressure-sensitive adhesive curing step after the mold resin filling step, it is possible to flexibly cope with restrictions due to manufacturing equipment. In addition, about the conditions of the said adhesive hardening process, the same conditions as 1st this invention can be used.

In the semiconductor chip manufacturing method according to the first and second aspects of the present invention, the method further includes a mold resin curing step of thermally curing the mold resin.
When the mold resin is an epoxy resin, the temperature for curing the mold resin is preferably 170 ° C. to 190 ° C.

The semiconductor chip manufacturing method according to the first and second aspects of the present invention includes an adhesive tape peeling step for peeling the adhesive tape from the stage substrate after the mold resin curing step. Since the curable pressure-sensitive adhesive is crosslinked and cured in the pressure-sensitive adhesive curing step, the pressure-sensitive adhesive tape can be easily peeled off without leaving adhesive residue on the mold resin or the semiconductor chip.

When the curable pressure-sensitive adhesive layer contains the gas generating agent, the stage substrate is more easily generated by generating a gas from the gas generating agent by stimulating the pressure-sensitive adhesive tape after the treatment in the pressure-sensitive adhesive tape peeling step. The adhesive tape can be peeled off.

For example, when a gas generating agent that generates gas by irradiating light with a wavelength of 300 nm or less is used as the gas generating agent, gas is emitted from the gas generating agent by irradiating light with a wavelength of 300 nm or less. The support plate can be easily peeled off from the wafer.
For such a gas generating agent, for example, light with a wavelength of 254 nm is preferably irradiated with an illuminance of 5 mW or more, more preferably with an illuminance of 10 mW or more, and irradiation with an illuminance of 20 mW or more. More preferably, irradiation with an illuminance of 50 mW or more is particularly preferable. Moreover, it is preferable to irradiate light with a wavelength of 254 nm with an integrated illuminance of 1000 mJ or more, more preferably with an integrated illuminance of 1000 mJ or more and 20 J or less, and more preferably with an integrated illuminance of 1500 mJ or more and 15 J or less. It is particularly preferable to irradiate with an integrated illuminance of 2000 mJ or more and 10 J or less.

Further, for example, when a gas generating agent that generates gas by heating at 200 ° C. or higher is used as the gas generating agent, the gas is generated from the gas generating agent by heating to a temperature of 200 ° C. or higher, The support plate can be easily peeled from the wafer.

The pressure-sensitive adhesive tape used in the first and second aspects of the present invention is also one aspect of the present invention.

According to the present invention, despite having a semiconductor chip processing step for performing heat treatment, sufficient adhesive force is maintained during the semiconductor chip processing step, and the adhesive tape is peeled off without any adhesive residue after the semiconductor chip processing step. The manufacturing method of the semiconductor chip which can be manufactured, and the adhesive tape used for the manufacturing method of this semiconductor chip can be provided.

It is sectional drawing (a) and the top view (b) which represented the mode of the adhesive tape sticking process typically. In a semiconductor chip installation process, it is sectional drawing (a) and the top view (b) which represented the mode of the stage board | substrate with which the semiconductor chip was installed typically. It is sectional drawing (a) and the top view (b) which represented the mode of the mold resin filling process typically.

Hereinafter, embodiments of the present invention will be described in more detail with reference to examples. However, the present invention is not limited only to these examples.

Example 1
(1) A reactor equipped with a thermosetting adhesive thermometer, a stirrer, and a cooling tube was prepared. In this reactor, 94 parts by weight of 2-ethylhexyl acrylate as a (meth) acrylic acid alkyl ester, containing a functional group After adding 6 parts by weight of hydroxyethyl methacrylate, 0.01 parts by weight of lauryl mercaptan and 80 parts by weight of ethyl acetate as monomers, the reactor was heated to start refluxing. Subsequently, 0.01 parts by weight of 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane was added as a polymerization initiator in the reactor, and polymerization was started under reflux. It was. Next, after 1 hour and 2 hours from the start of polymerization, 0.01 parts by weight of 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane was added, and the polymerization was started. 4 hours later, 0.05 part by weight of t-hexylperoxypivalate was added to continue the polymerization reaction. Then, 8 hours after the start of polymerization, an ethyl acetate solution of a functional group-containing (meth) acrylic polymer having a solid content of 55% by weight and a weight average molecular weight of 600,000 was obtained.
The resin solid content of 100 parts by weight of the ethyl acetate solution containing the functional group-containing (meth) acrylic polymer was added and reacted with 3.5 parts by weight of 2-isocyanatoethyl methacrylate as the functional group-containing unsaturated compound. To obtain a polymerizable polymer A (hydroxyl value 59 mgKOH / g). Thereafter, 20 parts by weight of silicone acrylate (EBECRYL 350, manufactured by Daicel Ornex Co., Ltd.) and silica filler (Reorosil MT-10, manufactured by Tokuyama) per 100 parts by weight of the resin solid content of the ethyl acetate solution of the obtained polymerizable polymer 20 parts by weight, chemical cross-linking agent (Coronate L-45, manufactured by Sekisui Fuller) 0.5 part by weight, and photopolymerization initiator (Esacure One, manufactured by Nippon Siebel Hegner) 1 part by weight are mixed, and ethyl acetate as a curable adhesive is mixed. A solution was obtained.

(2) Production of pressure-sensitive adhesive tape An ethyl acetate solution of the obtained curable pressure-sensitive adhesive was applied on the corona-treated surface of a transparent polyethylene naphthalate film having a thickness of 50 μm and subjected to corona treatment on one side. Coating was performed with a doctor knife so that the thickness was 30 μm, and the coating solution was dried by heating at 110 ° C. for 5 minutes. Thereafter, static curing was performed at 40 ° C. for 3 days to obtain an adhesive tape.

(3) Measurement of gel fraction of curable pressure-sensitive adhesive before curing The obtained pressure-sensitive adhesive tape was cut into a plane rectangular shape of 20 mm × 40 mm to prepare a test piece, and the weight was measured. After immersing the test piece in ethyl acetate at 23 ° C. for 24 hours, the test piece was taken out from ethyl acetate and dried at 110 ° C. for 1 hour. The weight of the test piece after drying was measured, and the gel fraction was calculated using the following formula (1). The results are shown in Table 1.
Gel fraction (% by weight) = 100 × (W ₂ −W ₀ ) / (W ₁ −W ₀ ) (1)
(W ₀ : weight of substrate, W ₁ : weight of test piece before immersion, W ₂ : weight of test piece after immersion and drying)

(4) Measurement of tensile storage modulus of curable pressure-sensitive adhesive layer before curing The ethyl acetate solution of the curable pressure-sensitive adhesive obtained in “(1) Synthesis of curable pressure-sensitive adhesive” was subjected to release treatment on one side. On the surface of the release treatment of a transparent PET film having a thickness of 50 μm, coating was performed with a doctor knife so that the thickness of the curable adhesive layer after drying was 50 μm, and release treatment was performed on the opposite side. A transparent PET film having a thickness of 50 μm was bonded, heated at 110 ° C. for 5 minutes to dry the coating solution, and then subjected to static curing at 40 ° C. for 3 days. Next, the PET film was peeled off, the adhesives were folded over to form a 400 μm thick adhesive tape, and the obtained adhesive tape was cut into a rectangular shape having a length of 0.6 cm and a width of 1.0 cm to obtain a sample for evaluation. .
The obtained sample for evaluation was measured using a dynamic viscoelasticity measuring device (DVA-200 manufactured by IT Measurement Control Co., Ltd.) in a tensile mode of dynamic viscoelasticity measurement at an angular frequency of 10 Hz. A storage modulus value was obtained. The results are shown in Table 1.

(5) Evaluation of adhesive residue An adhesive tape obtained on a stage substrate solidified with an epoxy resin in which through holes of 10 mm □ were provided in a lattice shape at intervals of 5 mm in 200 × 200 mm □ was attached in vacuum. The surface to which the adhesive tape was applied was the lower surface, and an 8 mm □, 100 μm thick Si bare semiconductor chip was attached to the adhesive layer exposed from the through hole of the stage substrate in a vacuum.
Next, using an ultra-high pressure mercury lamp from the pressure-sensitive adhesive tape side, irradiation with 365 nm ultraviolet light is performed for 1 minute while adjusting the illuminance so that the irradiation intensity of the pressure-sensitive adhesive tape is 80 mW / cm ^2, and the curable pressure-sensitive adhesive layer is crosslinked. Cured.
An epoxy resin was filled as a mold resin from the side where the adhesive tape of the laminate after the curable adhesive layer was crosslinked and cured. Filling was performed until the through hole was filled and the portion of the stage substrate surface provided with the through hole was covered. After filling with the mold resin, hot pressing was performed at 120 ° C. and 12 kg / cm ² for 2 minutes.
Next, the laminated body after hot pressing was heat treated at 180 ° C. for 1 hour to cure the mold resin. After cooling, the adhesive tape was peeled off.
When the surface of the laminate from which the adhesive tape has been peeled is visually observed, “◎” indicates that no adhesive residue is present, and “◯” indicates that the adhesive residue is less than 5% of the total area. The case where it was 5% or more of the entire remaining area was evaluated as “x”. The results are shown in Table 1.

(Examples 2 to 4, Comparative Example 1)
In “(1) Synthesis of curable pressure-sensitive adhesive”, a curable pressure-sensitive adhesive and a pressure-sensitive adhesive tape were obtained in the same manner as in Example 1 except that the compounds used and the blending amounts were as shown in Table 1. Measurements and evaluations similar to those of Example 1 were performed using the obtained adhesive tape.
In Examples 3 and 4, the photocuring of the curable pressure-sensitive adhesive layer was performed between hot pressing and heat treatment in “(5) Evaluation of adhesive residue”. In Comparative Example 1, the curable pressure-sensitive adhesive layer was not photocured in “(5) Evaluation of adhesive residue”.
The results are shown in Table 1.

According to the present invention, despite having a semiconductor chip processing step for performing heat treatment, sufficient adhesive force is maintained during the semiconductor chip processing step, and the adhesive tape is peeled off without any adhesive residue after the semiconductor chip processing step. The manufacturing method of the semiconductor chip which can be manufactured, and the adhesive tape used for the manufacturing method of this semiconductor chip can be provided.

DESCRIPTION OF SYMBOLS 1 Stage substrate 12 Through-hole 2 Adhesive tape 21 Curable adhesive layer 22 Base material 3 Semiconductor chip 4 Mold resin

Claims (6)

Adhesive tape affixing a curable adhesive layer containing a curable adhesive composed of a polymerizable polymer and a polymerization initiator and an adhesive tape having a base material on one surface of a stage substrate provided with a plurality of through holes Process,
A semiconductor chip installation step of installing a semiconductor chip on the curable adhesive layer of the adhesive tape exposed from the through-hole on the surface of the stage substrate where the adhesive tape is not attached;
An adhesive curing step for stimulating the curable adhesive to cure the curable adhesive layer;
A mold resin filling step of filling the surface on which the semiconductor chip is installed with a mold resin;
A mold resin curing step for thermosetting the mold resin;
A method for producing a semiconductor chip, comprising: an adhesive tape peeling step for peeling the adhesive tape from a stage substrate. Adhesive tape affixing a curable adhesive layer containing a curable adhesive composed of a polymerizable polymer and a polymerization initiator and an adhesive tape having a base material on one surface of a stage substrate provided with a plurality of through holes Process,
A semiconductor chip installation step of installing a semiconductor chip on the curable adhesive layer of the adhesive tape exposed from the through-hole on the surface of the stage substrate where the adhesive tape is not attached;
A mold resin filling step of filling the surface on which the semiconductor chip is installed with a mold resin;
An adhesive curing step for stimulating the curable adhesive to cure the curable adhesive layer;
A mold resin curing step for thermosetting the mold resin;
A method for producing a semiconductor chip, comprising: an adhesive tape peeling step for peeling the adhesive tape from a stage substrate. The method for producing a semiconductor chip according to claim 2, wherein the polymerizable polymer has a hydroxyl value of 40 mgKOH / g or more. The method for producing a semiconductor chip according to claim 1, 2 or 3, wherein the gel fraction during the tape attaching step of the curable pressure-sensitive adhesive layer is 30% or more. The semiconductor chip according to claim 1, 2, 3, or 4, wherein the tensile storage elastic modulus at 23 ° C of the curable pressure-sensitive adhesive layer before the pressure-sensitive adhesive curing step is 1 x 10 ⁵ Pa or more. Method. An adhesive tape used in the method for producing a semiconductor chip according to any one of claims 1, 2, 3, 4 and 5.

Images