JP2009132867A - Double-sided self-adhesive sheet for processing plate-like member and method of processing plate-like member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a double-sided adhesive sheet for processing a plate member which allows an easy release of an adhered object from the plate-like member and prevents the plate-like member from getting loose or peeling from the adhered object even at an elevated temperature. <P>SOLUTION: The double-sided adhesive sheet 1 for processing a plate-like member includes a base material 2, a first adhesive layer 3 being laminated on one surface of the base material 2 and being adhered to a rigid support plate 6, and a second adhesive layer 4 which is laminated on the other side of the base material 2 and being adhered to a semiconductor wafer 7. The first adhesive layer 3 contains a silicone compound having percent weight loss by thermogravimetry (TG) of ≤20% at 150°C. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention provides a double-sided pressure-sensitive adhesive sheet for processing a plate-like member used for fixing the plate-like member to, for example, a hard support substrate when processing a plate-like member such as a semiconductor wafer, glass, metal, or ceramic. And a plate member processing method using such a double-sided PSA sheet.

  In a process for processing a semiconductor wafer that is a plate-like member, there is a step of thinly grinding the semiconductor wafer. At this time, the semiconductor wafer is fixed to the hard support substrate with an adhesive or a double-sided tape. By supporting the semiconductor wafer with the hard support substrate in this way, it is possible to prevent the semiconductor wafer from being damaged in the thin grinding process and to prevent the semiconductor wafer from being damaged when the thin wafer after grinding is transported. is there. In addition, after thin grinding process, in order to form a circuit on the ground surface of the semiconductor wafer, processing such as sputtering, vapor deposition and CVD may be performed. It is possible to prevent the semiconductor wafer from being damaged by supporting it with.

  However, after a series of steps, it is very difficult to peel the hard support substrate from the thinly ground semiconductor wafer, and the semiconductor wafer is easily damaged. For this reason, Patent Document 1 proposes that a hard support substrate is peeled from a semiconductor wafer by adding a thermal foaming agent to the adhesive and foaming the foaming agent with heat to reduce the adhesive force. Yes.

Moreover, in patent document 2, the compound (gas generating agent) which generate | occur | produces gas, such as nitrogen by irradiation of an energy beam, is added to the adhesive, and a hard support substrate is removed from a semiconductor wafer by the gas generated by irradiation of an energy beam. Propose to peel.
Japanese Patent No. 2613389 JP 2003-231875 A

  However, in the method of Patent Document 1 or Patent Document 2, for example, when sputtering is performed after the thin grinding step, the foaming agent foams at the sputtering temperature (about 150 ° C.), or the gas generating agent reacts to generate gas. May occur, and the hard support substrate and the semiconductor wafer may be separated during the sputtering process. If the hard support substrate and the semiconductor wafer are peeled off during the sputtering process as described above, uniform sputtering becomes difficult, and the semiconductor wafer may be damaged during conveyance after the sputtering process.

  The present invention has been made in view of the actual situation as described above, and can easily peel off a sticking object from a plate-like member such as a semiconductor wafer, and the plate-like member and the sticking object even at high temperatures. It is an object of the present invention to provide a double-sided pressure-sensitive adhesive sheet for processing a plate-like member and a plate-like member processing method capable of preventing the occurrence of peeling and lifting between the two.

  In order to achieve the above object, first, the present invention comprises a base material, a first pressure-sensitive adhesive layer laminated on one surface of the base material, and a plate laminated on the other surface of the base material. A double-sided pressure-sensitive adhesive sheet for processing a plate-like member provided with a second pressure-sensitive adhesive layer to which a shaped member is attached, wherein the first pressure-sensitive adhesive layer has a mass reduction rate at 150 ° C. by thermogravimetry (TG). The present invention provides a double-sided pressure-sensitive adhesive sheet for processing plate-like members characterized by containing a silicone compound having a content of 20% or less (Invention 1).

  In the double-sided pressure-sensitive adhesive sheet for processing a plate-like member of the present invention, a release sheet may be laminated on the pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer and / or the pressure-sensitive adhesive surface of the second pressure-sensitive adhesive layer. It is included in the double-sided pressure-sensitive adhesive sheet for processing plate-like members of the present invention.

  In the said invention (invention 1), it is preferable that the Si amount by the X ray electron spectroscopy analysis in the adhesion surface of the said 1st adhesive layer is 1.0 to 15.0% (invention 2).

  In the said invention (invention 1 and 2), it is preferable that a said 1st adhesive layer consists of energy-beam curable adhesives (invention 3).

  In the said invention (invention 1-3), it is preferable that the heat shrinkage rate when the said base material is heated at 150 degreeC for 30 minutes is 3% or less (invention 4).

  In the said invention (invention 1-4), it is preferable that a hard support substrate is stuck on the said 1st adhesive layer (invention 5).

  Secondly, the present invention bonds the first pressure-sensitive adhesive layer and the hard support substrate of the double-sided pressure-sensitive adhesive sheet for processing the plate-shaped member (Invention 3), and also the second pressure-sensitive adhesive layer and the plate-shaped member. And the plate-like member is subjected to predetermined processing, and then the double-sided pressure-sensitive adhesive sheet is irradiated with energy rays to separate the plate-like member and the double-sided pressure-sensitive adhesive sheet. A member processing method is provided (Invention 6).

  In the said invention (invention 6), the said predetermined process may also include the process whose process temperature is 100-150 degreeC (invention 7). If processing temperature is in this range, a plate-shaped member and a double-sided adhesive sheet can be isolate | separated without a problem also by the said method.

  Thirdly, the present invention bonds the first pressure-sensitive adhesive layer and the rigid support substrate of the double-sided pressure-sensitive adhesive sheet for processing the plate-shaped member (Invention 3), and the second pressure-sensitive adhesive layer and the plate-shaped member. And then irradiating the double-sided pressure-sensitive adhesive sheet with energy rays, then subjecting the plate-like member to predetermined processing, and separating the plate-like member and the double-sided pressure-sensitive adhesive sheet. A processing method is provided (Invention 8).

  In the said invention (invention 8), the said predetermined process may also include the process whose process temperature is 100-200 degreeC (invention 9). Even if the processing temperature is thus high, according to the above method, the plate-like member and the double-sided PSA sheet can be separated without any problem.

  In the said invention (invention 6-9), the said hard support substrate has energy-beam permeability | transmittance, You may make it irradiate the said energy beam with respect to the said double-sided adhesive sheet from the said hard support substrate side (invention). 10). The present invention is effective, for example, when a treatment (for example, sputtering) for forming an energy ray-impermeable layer is performed on a plate-like member.

  According to the double-sided pressure-sensitive adhesive sheet for plate-like member processing and the plate-like member processing method of the present invention, the object to be pasted can be easily peeled off from a plate-like member such as a semiconductor wafer, glass, metal, or ceramic, and sputtering is performed. Further, it is possible to prevent peeling / floating between the plate-like member and the object to be pasted even under high temperature in processing such as vapor deposition and CVD process.

  Hereinafter, embodiments of the present invention will be described. In the present embodiment, a semiconductor wafer will be described as an example of a plate-like member that is a workpiece.

[Double-sided pressure-sensitive adhesive sheet for plate-like member processing]
FIG. 1 is a cross-sectional view of a double-sided pressure-sensitive adhesive sheet for processing plate-like members according to an embodiment of the present invention. As shown in FIG. 1, the double-sided pressure-sensitive adhesive sheet 1 for processing a plate-like member according to this embodiment (hereinafter sometimes abbreviated as “double-sided pressure-sensitive adhesive sheet 1”) is a base material 2 and one of the base materials 2. The first pressure-sensitive adhesive layer 3 laminated on the surface (the lower surface in FIG. 1), the second pressure-sensitive adhesive layer 4 laminated on the other surface (the upper surface in FIG. 1), and the first The release sheet 5 laminated on the adhesive layer 3 and the release sheet 5 ′ laminated on the second adhesive layer 4.

  As shown in FIG. 2, the first pressure-sensitive adhesive layer 3 from which the release sheet 5 has been peeled is attached with a hard support substrate 6 as an example, and the second pressure-sensitive adhesive layer 4 from which the release sheet 5 ′ has been peeled off is As an example, the semiconductor wafer 7 is attached.

  The substrate 2 is not particularly limited as long as it can support the first pressure-sensitive adhesive layer 3 and the second pressure-sensitive adhesive layer 4, but when the substrate 2 is placed under a high temperature such as a sputtering process, It preferably has heat resistance against temperature. Specifically, the heat shrinkage rate when heated at 150 ° C. for 30 minutes is preferably 3% or less, particularly preferably 1% or less. Since the base material 2 has such a heat shrinkage ratio, the semiconductor wafer 7 and the object to be pasted (the hard support substrate 6) are caused by the heat shrinkage of the base material 2 at a high temperature in processing such as a sputtering process. Can prevent peeling and lifting.

  As the material as described above, for example, a film having heat resistance made of resin such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyimide, polyetherimide, polycarbonate, polymethylpentene, polyphenylene sulfide, liquid crystal polymer is preferable. Moreover, the film which consists of a single layer may be sufficient, and the film which laminated | stacked the multiple layer may be sufficient.

  The surface of the substrate 2 may be subjected to surface treatment such as primer treatment, corona treatment, plasma treatment or the like in order to enhance the adhesion with the pressure-sensitive adhesive layers 3 and 4.

  The thickness of the substrate 2 is preferably 12 to 200 μm, particularly preferably 25 to 100 μm.

  The 1st adhesive layer 3 is comprised from the adhesive containing the silicone compound whose mass decreasing rate in 150 degreeC by thermogravimetry (TG) is 20% or less, Preferably it is 10% or less. When the first pressure-sensitive adhesive layer 3 contains a silicone compound, the adhesive applied to the first pressure-sensitive adhesive layer 3 by applying an external force without impairing the adhesive force to the object to be applied (hard support substrate 6). The object (hard support substrate 6) can be easily peeled off.

  Further, since the silicone compound has a mass reduction rate of 20% or less at 150 ° C., the amount of vaporization of the silicone compound is small even when the first pressure-sensitive adhesive layer 3 is placed at a high temperature of 150 ° C. . Therefore, for example, in the sputtering process, peeling / floating occurs between the hard support substrate 6 and the semiconductor wafer 7 due to the gas generated by the first pressure-sensitive adhesive layer 3, and the semiconductor wafer 7 is damaged. Can be prevented. Moreover, since there is no peeling / floating between the hard support substrate 6 and the semiconductor wafer 7, sputtering can be performed uniformly. However, in order to obtain such an effect, the first pressure-sensitive adhesive layer 3 preferably does not substantially contain a gas generating agent or a foaming agent that generates gas at 150 ° C.

Silicone compounds, is preferably a kinematic viscosity 50~1,000,000cSt ^(mm 2 / s), more preferably 100~100,000cSt ^(mm 2 / s), more preferably 200~10,000cSt ^(mm 2 / The compound is not particularly limited as long as it is a compound having a polysiloxane skeleton which is s). When the kinematic viscosity of the silicone compound is less than 50 cSt, the silicone compound evaporates during heating when the first pressure-sensitive adhesive layer 3 is formed, and the content of the silicone compound in the first pressure-sensitive adhesive layer 3 is appropriately adjusted. It becomes difficult to control the amount. Moreover, when the kinematic viscosity of the silicone compound exceeds 1,000,000 cSt, the dispersibility of the silicone compound in the first pressure-sensitive adhesive layer 3 may be significantly lowered.

  An alkyl group such as a methyl group or an ethyl group, an aryl group such as a phenyl group or a methylphenyl group, a hydroxyl group, a vinyl group, an alkylene oxide, or a polyether may be added to a part of the polysiloxane skeleton. In addition, polysiloxane may be added to the main component of the pressure-sensitive adhesive such as an acrylic polymer.

  Specific examples of the silicone compound include polyphenylmethylsiloxane, polydimethylsiloxane, and polydiphenylsiloxane.

  As content of the silicone compound in the 1st adhesive layer 3, Si by X-ray electron spectroscopy analysis in the adhesive surface (contact surface with the peeling sheet 5 or the hard support substrate 6) of the 1st adhesive layer 3 is used. The amount is preferably 1.0 to 15.0%, particularly preferably 2.0 to 13.0%. If the Si amount is less than 1.0%, it is difficult to obtain the effect of easy peeling by the silicone compound, and if the Si amount exceeds 15.0%, the hard support substrate may be peeled or lifted during heating. is there.

  The pressure-sensitive adhesive as the main component constituting the first pressure-sensitive adhesive layer 3 exhibits sufficient adhesion to the object to be pasted (hard support substrate 6) and can be re-peeled. For example, an acrylic, rubber-based, urethane-based, or polyvinyl ether-based pressure-sensitive adhesive can be used as long as the effect of the property is obtained. However, it is desirable not to use a silicone-based pressure-sensitive adhesive because it is difficult to obtain an effect of easy peeling by containing the silicone compound of the present invention.

  As the pressure-sensitive adhesive constituting the first pressure-sensitive adhesive layer 3, it is preferable to use an energy ray-curable pressure-sensitive adhesive. When the energy ray curable adhesive is used, the adhesive force of the first adhesive layer 3 is reduced by the irradiation of energy rays, and the sticking object (hard support substrate 6) attached to the first adhesive layer 3 is removed. It can be peeled off very easily. In addition, when the 1st adhesive layer 3 consists of an energy-beam curable adhesive which does not contain a silicone compound, even if it irradiates an energy ray, the sticking target object (hard support) stuck to the 1st adhesive layer 3 It is difficult to peel off the substrate 6).

  The energy ray curable pressure-sensitive adhesive may be mainly composed of a polymer having energy ray curable properties, a polymer not having energy ray curable properties, and an energy ray curable polyfunctional monomer and / or oligomer. The main component may be a mixture of

  The case where the energy ray curable pressure-sensitive adhesive is mainly composed of a polymer having energy ray curable properties will be described below.

  The polymer having energy ray curability is a (meth) acrylic acid ester (co) polymer (A) (hereinafter referred to as “energy ray”) in which a functional group having energy ray curability (energy ray curable group) is introduced into the side chain. It may be referred to as “curable polymer (A)”). This energy ray curable polymer (A) includes a (meth) acrylic copolymer (a1) having a functional group-containing monomer unit, and an unsaturated group-containing compound (a2) having a substituent bonded to the functional group. It is preferable that it is obtained by making it react. In the present specification, “(meth) acrylic acid ester” means acrylic acid ester and / or methacrylic acid ester, and “(co) polymer” means polymer and / or copolymer. It shall be.

  The acrylic copolymer (a1) is composed of a structural unit derived from a functional group-containing monomer and a structural unit derived from a (meth) acrylic acid ester monomer or a derivative thereof.

  The functional group-containing monomer as a constituent unit of the acrylic copolymer (a1) is a monomer having a polymerizable double bond and a functional group such as a hydroxyl group, an amino group, a substituted amino group, or an epoxy group in the molecule. It is preferable that

  More specific examples of the functional group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and the like. These may be used alone or in combination of two or more.

  Examples of the (meth) acrylic acid ester monomer constituting the acrylic copolymer (a1) include alkyl (meth) acrylates having 1 to 20 carbon atoms in the alkyl group, cycloalkyl (meth) acrylates, and benzyl (meth) acrylates. Is used. Among these, an alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms, particularly methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, is particularly preferable. 2-ethylhexyl (meth) acrylate or the like is used.

  The acrylic copolymer (a1) usually contains 3 to 100% by mass, preferably 5 to 40% by mass of a structural unit derived from the functional group-containing monomer, and is a (meth) acrylic acid ester monomer or its The structural unit derived from the derivative is usually contained in a proportion of 0 to 97% by mass, preferably 60 to 95% by mass.

  The acrylic copolymer (a1) can be obtained by copolymerizing a functional group-containing monomer as described above with a (meth) acrylic acid ester monomer or a derivative thereof in a conventional manner. Dimethylacrylamide, vinyl formate, vinyl acetate, styrene and the like may be copolymerized.

  By reacting the acrylic copolymer (a1) having the functional group-containing monomer unit with an unsaturated group-containing compound (a2) having a substituent bonded to the functional group, an energy beam curable polymer (A ) Is obtained.

  The substituent which an unsaturated group containing compound (a2) has can be suitably selected according to the kind of functional group of the functional group containing monomer unit which an acrylic copolymer (a1) has. For example, when the functional group is a hydroxyl group, an amino group or a substituted amino group, the substituent is preferably an isocyanate group or an epoxy group, and when the functional group is an epoxy group, the substituent is an amino group, a carboxyl group or an aziridinyl group. preferable.

The unsaturated group-containing compound (a2) contains 1 to 5, preferably 1 to 2, energy-polymerizable carbon-carbon double bonds per molecule.
Specific examples of such unsaturated group-containing compound (a2) include, for example, 2-methacryloyloxyethyl isocyanate, meta-isopropenyl-α, α-dimethylbenzyl isocyanate, methacryloyl isocyanate, allyl isocyanate, 1,1- ( Bisacryloyloxymethyl) ethyl isocyanate; acryloyl monoisocyanate compound obtained by reaction of diisocyanate compound or polyisocyanate compound with hydroxyethyl (meth) acrylate; diisocyanate compound or polyisocyanate compound, polyol compound, and hydroxyethyl (meth) Acryloyl monoisocyanate compound obtained by reaction with acrylate; glycidyl (meth) acrylate; (meth) acrylic acid, 2- (1 -Aziridinyl) ethyl (meth) acrylate, 2-vinyl-2-oxazoline, 2-isopropenyl-2-oxazoline and the like.

  The unsaturated group-containing compound (a2) is usually used in a proportion of 10 to 100 equivalents, preferably 20 to 95 equivalents, per 100 equivalents of the functional group-containing monomer of the acrylic copolymer (a1).

  In the reaction between the acrylic copolymer (a1) and the unsaturated group-containing compound (a2), depending on the combination of the functional group and the substituent, the reaction temperature, pressure, solvent, time, presence of catalyst, catalyst Can be selected as appropriate. As a result, the functional group present in the acrylic copolymer (a1) reacts with the substituent in the unsaturated group-containing compound (a2), so that the unsaturated group is contained in the acrylic copolymer (a1). It introduce | transduces into a side chain and an energy-beam curable polymer (A) is obtained.

  The mass average molecular weight of the energy ray curable polymer (A) thus obtained is preferably 10,000 or more, particularly preferably 150,000 to 1,500,000, and more preferably 200,000 000 to 1,000,000 is preferred. In addition, the mass mean molecular weight (Mw) in this specification is the value of polystyrene conversion measured by the gel permeation chromatography method (GPC method).

  Even when the energy ray-curable pressure-sensitive adhesive is mainly composed of a polymer having energy ray-curability, the energy ray-curable pressure-sensitive adhesive further contains an energy ray-curable monomer and / or oligomer (B). May be.

  As the energy ray-curable monomer and / or oligomer (B), for example, an ester of a polyhydric alcohol and (meth) acrylic acid or the like can be used.

  Examples of the energy ray-curable monomer and / or oligomer (B) include monofunctional acrylic acid esters such as cyclohexyl (meth) acrylate and isobornyl (meth) acrylate, trimethylolpropane tri (meth) acrylate, penta Erythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, polyethylene glycol Polyfunctional acrylic acid esters such as di (meth) acrylate and dimethyloltricyclodecane di (meth) acrylate, polyester oligo (meth) acrylate, polyurethane oligo (meth) Acrylate, and the like.

  When the energy ray curable monomer and / or oligomer (B) is blended, the content of the energy ray curable monomer and / or oligomer (B) in the energy ray curable pressure-sensitive adhesive is 5 to 80% by mass. It is preferable that there is especially 20-60 mass%.

  Here, when using ultraviolet rays as an energy ray for curing the energy ray curable resin composition, it is preferable to add a photopolymerization initiator (C), and by using this photopolymerization initiator (C). The polymerization curing time and the amount of light irradiation can be reduced.

  Specific examples of the photopolymerization initiator (C) include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, 2,4-diethylthioxanthone, 1-hydroxycyclohexyl phenyl ketone, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, β-chloranthraquinone, (2,4 6-trimethylbenzyldiphenyl) phosphine oxide, 2-benzothiazole-N, N-diethyldithiocarbamate, oligo {2-hydroxy-2-methyl 1- [4- (1-propenyl) phenyl] propanone}, and 2,2-dimethoxy-1,2-and the like. These may be used alone or in combination of two or more.

  The photopolymerization initiator (C) is energy beam curable copolymer (A) (when energy beam curable monomer and / or oligomer (B) is blended, energy beam curable copolymer (A). And a total amount of 100 parts by mass of the energy ray-curable monomer and / or oligomer (B)) used in an amount in the range of 0.1 to 10 parts by mass, particularly 0.5 to 6 parts by mass. It is preferred that

  In the energy ray curable pressure-sensitive adhesive, other components may be appropriately blended in addition to the above components. Examples of other components include a polymer component or oligomer component (D) that does not have energy beam curability, and a crosslinking agent (E).

  Examples of the polymer component or oligomer component (D) having no energy beam curability include polyacrylates, polyesters, polyurethanes, polycarbonates, polyolefins, and the like, and a mass average molecular weight (Mw) of 3,000 to 2, 500,000 polymers or oligomers are preferred.

  As a crosslinking agent (E), the polyfunctional compound which has the reactivity with the functional group which an energy-beam curable copolymer (A) etc. have can be used. Examples of such polyfunctional compounds include isocyanate compounds, epoxy compounds, amine compounds, melamine compounds, aziridine compounds, hydrazine compounds, aldehyde compounds, oxazoline compounds, metal alkoxide compounds, metal chelate compounds, metal salts, ammonium salts. And reactive phenol resins.

  By blending these other components (D) and (E) into the energy ray-curable pressure-sensitive adhesive, tackiness and peelability before curing, strength after curing, adhesion to other layers, storage stability, etc. Can improve. The compounding quantity of these other components is not specifically limited, It determines suitably in the range of 0-40 mass parts with respect to 100 mass parts of energy-beam curable copolymers (A).

  Next, the case where the energy ray-curable adhesive is mainly composed of a mixture of a polymer component not having energy ray curability and an energy ray curable polyfunctional monomer and / or oligomer will be described below.

  As a polymer component which does not have energy-beam sclerosis | hardenability, the component similar to the acrylic copolymer (a1) mentioned above can be used, for example. The content of the polymer component having no energy beam curability in the energy beam curable resin composition is preferably 20 to 99.9% by mass, and more preferably 30 to 80% by mass.

  As the energy ray-curable polyfunctional monomer and / or oligomer, the same one as the above-mentioned component (B) is selected. The blending ratio of the polymer component having no energy beam curability and the energy beam curable polyfunctional monomer and / or oligomer is 10 to 150 parts by mass of the polyfunctional monomer and / or oligomer with respect to 100 parts by mass of the polymer component. It is preferable that it is, and it is especially preferable that it is 25-100 mass parts.

  Also in this case, the photopolymerization initiator (C) and the crosslinking agent (E) can be appropriately blended as described above.

  The thickness of the first pressure-sensitive adhesive layer 3 is preferably 1 to 300 μm, particularly preferably 2 to 150 μm, and further preferably 5 to 50 μm.

  The pressure-sensitive adhesive constituting the second pressure-sensitive adhesive layer 4 is a material that exhibits sufficient adhesive strength to the semiconductor wafer 7 as an object to be pasted and can be peeled off again without adversely affecting the semiconductor wafer 7. For example, an acrylic, rubber-based, urethane-based, or polyvinyl ether-based pressure-sensitive adhesive can be used without particular limitation. In addition, since the silicone compound mentioned above may have a bad influence on the semiconductor wafer 7, it is preferable that it is not contained in the adhesive of the 2nd adhesive layer 4. FIG. Moreover, when the double-sided pressure-sensitive adhesive sheet 1 is placed at a high temperature (for example, at a sputtering temperature), the second pressure-sensitive adhesive layer 4 substantially contains a gas generating agent or a foaming agent that generates gas at the temperature. Preferably not.

  Here, it is preferable to select each adhesive so that the adhesive force of the 2nd adhesive layer 4 at the time of peeling may become higher than the adhesive force of the 1st adhesive layer 3. FIG. Thus, by changing the adhesive force of both adhesive layers 3 and 4, when peeling, the double-sided pressure-sensitive adhesive sheet 1 always remains on the semiconductor wafer 7 side, and the double-sided pressure-sensitive adhesive sheet 1 is peeled off from the semiconductor wafer 7 side. Therefore, the operation of removing the double-sided pressure-sensitive adhesive sheet 1 can be easily automated. For example, when an energy ray curable adhesive is used as the adhesive constituting the first adhesive layer 3, an energy ray non-curable adhesive is used as the adhesive constituting the second adhesive layer 4. By doing so, high adhesive strength can be maintained on both sides when the semiconductor wafer 7 is processed, and the adhesive strength of the first adhesive layer 3 can be easily made lower than that of the second adhesive layer 4 at the time of peeling. .

  The thickness of the second pressure-sensitive adhesive layer 4 is preferably 1 to 300 μm, particularly preferably 2 to 150 μm, and further preferably 5 to 50 μm.

  The material of the release sheets 5 and 5 ′ is not particularly limited. For example, a film made of a resin such as polyethylene terephthalate, polypropylene, or polyethylene, or a silicone-based, fluorine-based, long-chain alkyl group-containing carbamate, or the like. What was peel-processed with the release agent of this can be used.

  However, considering the release workability of the release sheets 5 and 5 ′, the release sheet on the side to be peeled first is the light release type release sheet, and the release sheet on the side to be released later is the heavy release type release sheet Is preferred.

  The thickness of the release sheets 5 and 5 ′ is usually about 10 to 250 μm, preferably about 20 to 200 μm. Moreover, the thickness of the release agent in the release sheets 5 and 5 ′ is usually 0.05 to 5 μm, preferably 0.1 to 3 μm.

The double-sided pressure-sensitive adhesive sheet 1 can be manufactured as follows.
A coating agent containing a pressure-sensitive adhesive constituting the first pressure-sensitive adhesive layer 3 and, if desired, further a solvent is prepared. A roll coater, a knife coater, a roll knife coater, an air knife coater, a die coater, a bar coater, a gravure coater, The first pressure-sensitive adhesive layer 3 is formed by coating the release sheet 5 with a coating machine such as a curtain coater and drying it.

  Similarly, a coating agent containing a pressure-sensitive adhesive constituting the second pressure-sensitive adhesive layer 4 and, if desired, further a solvent is prepared, and a roll coater, a knife coater, a roll knife coater, an air knife coater, a die coater, a bar coater, The second pressure-sensitive adhesive layer 4 is formed by applying to the release treatment surface of the release sheet 5 ′ with a coating machine such as a gravure coater or curtain coater and drying.

  Next, the base material 2 is pressure-bonded to the surface of the formed first pressure-sensitive adhesive layer 3 (or the second pressure-sensitive adhesive layer 4), and the second pressure-sensitive adhesive layer 4 (or the first pressure-sensitive adhesive layer 4) is further applied to the surface of the base material 2. 1 pressure-sensitive adhesive layer 3) is pressure-bonded.

[Usage Method-First Embodiment]
Here, 1st Embodiment of the usage method of the said double-sided adhesive sheet 1 is demonstrated.
First, the second adhesive layer 4 exposed by peeling the release sheet 5 ′ (light release type) is pressure-bonded to the circuit surface of the semiconductor wafer 7, and then the release sheet 5 (heavy release type) is peeled and exposed. The hard support substrate 6 is pressure-bonded to the first pressure-sensitive adhesive layer 3, or the first pressure-sensitive adhesive layer 3 exposed by peeling the release sheet 5 (light release type) is pressure-bonded to the hard support substrate 6. Then, the circuit surface of the semiconductor wafer 7 is pressure-bonded to the second pressure-sensitive adhesive layer 4 exposed by peeling the release sheet 5 ′ (heavy release type) (see FIG. 2). Such a sticking step can be performed using a laminator device dedicated to the wafer, and vacuuming is performed as necessary in order to stick so as not to include air. In addition, in FIG. 2, what peeled peeling sheet 5 and peeling sheet 5 'from double-sided adhesive sheet 1 is shown as double-sided adhesive sheet 1'.

  The hard support substrate 6 is not particularly limited as long as it can protect the semiconductor wafer 7 during processing, transportation, etc. For example, a glass plate having a thickness of about 0.1 to 10 mm, a hard resin plate, A ceramic plate, a metal plate, or the like can be used. However, when an energy ray-curable adhesive is used in the first pressure-sensitive adhesive layer 3 or the second pressure-sensitive adhesive layer 4 and ultraviolet rays are used as energy rays, the hard support substrate 6 transmits ultraviolet rays. It is necessary to use a transparent material. In this case, it is preferable to use a glass plate having a total light transmittance of 40% or more at a wavelength of 365 nm.

  When the semiconductor wafer 7 and the hard support substrate 6 are bonded together as described above, the hard support substrate 6 is fixed with a predetermined apparatus, and the semiconductor wafer 7 is thinly ground. In this thin grinding process, the back surface of the semiconductor wafer 7 is ground to a predetermined thickness by a grinder or the like, and chemical grinding by etching or the like is performed as necessary. By such thin grinding, the semiconductor wafer 7 is ground to a thickness of about 30 to 100 μm, for example.

  Since the semiconductor wafer 7 is supported by the hard support substrate 6, it can be prevented from being damaged in the thin grinding process described above, or in the subsequent transfer process, processing process, and the like.

  Next, sputtering processing is performed on the semiconductor wafer 7. It is preferable that the temperature of this sputtering process is 100-150 degreeC. Thereby, the double-sided pressure-sensitive adhesive sheet 1 ′ is placed at a high temperature of about 150 ° C. at maximum, but the silicone compound contained in the first pressure-sensitive adhesive layer 3 is a mass at 150 ° C. by thermogravimetry (TG). Since the reduction rate is 20% or less, the amount of vaporization is small. Therefore, it is possible to prevent peeling / floating between the hard support substrate 6 and the semiconductor wafer 7 and damage to the semiconductor wafer 7 due to the gas generated by the first pressure-sensitive adhesive layer 3. it can. Moreover, since there is no peeling / floating between the hard support substrate 6 and the semiconductor wafer 7, sputtering can be performed uniformly.

  Subsequently, when the first pressure-sensitive adhesive layer 3 or the second pressure-sensitive adhesive layer 4 is made of an energy ray-curable pressure-sensitive adhesive, the double-sided pressure-sensitive adhesive sheet 1 ′ is irradiated with energy rays. When ultraviolet rays are used as energy rays, the ultraviolet rays are irradiated from the hard support substrate 6 side. Thereby, the adhesive force of the 1st adhesive layer 3 or the 2nd adhesive layer 4 falls.

  Subsequently, after sticking the semiconductor wafer 7 on the dicing sheet as desired, the hard support substrate 6 is peeled from the first pressure-sensitive adhesive layer 3. Since the first pressure-sensitive adhesive layer 3 contains a silicone compound, the hard support substrate 6 can be easily peeled from the first pressure-sensitive adhesive layer 3 by applying an external force. In particular, when the first pressure-sensitive adhesive layer 3 is made of an energy ray-curable pressure-sensitive adhesive, and the adhesive force of the first pressure-sensitive adhesive layer 3 is reduced by energy ray irradiation, the hard support substrate 6 can be made extremely easy. Can be peeled off. Therefore, the semiconductor wafer 7 is prevented from being damaged in this peeling step.

  The hard support substrate 6 may be peeled off by hooking a jig on the edge portion of the hard support substrate 6, or may be peeled off by applying an adhesive tape to the entire surface or a part of the hard support substrate 6.

  Finally, the double-sided pressure-sensitive adhesive sheet 1 ′ is peeled from the semiconductor wafer 7. Since the hard support substrate 6 has already been peeled and removed, the double-sided pressure-sensitive adhesive sheet 1 ′ can be easily peeled off by a conventional method. For example, the double-sided pressure-sensitive adhesive sheet 1 ′ can be easily peeled off by applying a heat seal tape to the double-sided pressure-sensitive adhesive sheet 1 ′.

[Usage Method-Second Embodiment]
Next, 2nd Embodiment of the usage method of the said double-sided adhesive sheet 1 is demonstrated. In the second embodiment, at least the first pressure-sensitive adhesive layer 3 is made of an energy ray-curable pressure-sensitive adhesive. Note that the processes up to thin grinding are the same as those in the first embodiment.

  After thin grinding, the double-sided pressure-sensitive adhesive sheet 1 'is irradiated with energy rays. When ultraviolet rays are used as energy rays, the ultraviolet rays are irradiated from the hard support substrate 6 side.

  Next, sputtering processing is performed on the semiconductor wafer 7. It is preferable that the temperature of this sputtering process is 100-200 degreeC. Thus, the double-sided pressure-sensitive adhesive sheet 1 ′ is placed at a high temperature of about 200 ° C. at the maximum, but the silicone compound whose mass reduction rate at 150 ° C. by thermogravimetry (TG) is 20% or less is the first. When the pressure-sensitive adhesive layer 3 is contained, the first pressure-sensitive adhesive layer 3 has a small amount of vaporization even at 200 ° C., and there is no practical problem. Therefore, it is possible to prevent peeling / floating between the hard support substrate 6 and the semiconductor wafer 7 and damage to the semiconductor wafer 7 due to the gas generated by the first pressure-sensitive adhesive layer 3. it can. Moreover, since there is no peeling / floating between the hard support substrate 6 and the semiconductor wafer 7, sputtering can be performed uniformly.

  In addition, although the adhesive force of the 1st adhesive layer 3 falls by irradiation of the said energy ray, the adhesive force of the grade which does not peel between the hard support substrates 6 remains in a sputtering process process.

  The subsequent peeling process of the hard support substrate 6 and the semiconductor wafer 7 is the same as that of the first embodiment of the above usage method. Here, since the first pressure-sensitive adhesive layer 3 is cured by being irradiated with energy rays before sputtering, even when placed at a high temperature of about 200 ° C., the first pressure-sensitive adhesive layer 3 is more than necessary on the hard support substrate 6. Contact is prevented. In addition to the adhesion preventing effect, the first pressure-sensitive adhesive layer 3 contains the silicone compound, and the first pressure-sensitive adhesive layer 3 is bonded to the first pressure-sensitive adhesive layer 3 by reducing the pressure-sensitive adhesive force due to energy ray irradiation. It can be easily peeled off from the agent layer 3.

  As can be seen from the first embodiment and the second embodiment of the above method of use, when the upper limit of the sputtering temperature is 150 ° C., the irradiation of energy rays to the double-sided pressure-sensitive adhesive sheet 1 ′ is performed after sputtering. When the upper limit of the sputtering temperature is 200 ° C., it is preferable to irradiate the double-sided pressure-sensitive adhesive sheet 1 ′ with energy rays before sputtering.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, one or both of the release sheets 5 and 5 ′ may be omitted. Further, the object to be processed may not be the semiconductor wafer 7 but may be a plate-like member such as glass, metal or ceramic, particularly a fragile plate-like member. Furthermore, the high-temperature treatment (processing) for the object to be processed may be, for example, vapor deposition, CVD, or the like instead of sputtering.

  EXAMPLES Hereinafter, although an Example etc. demonstrate this invention further more concretely, the scope of the present invention is not limited to these Examples etc.

[Example 1]
For 100 parts by mass of copolymer (mass average molecular weight: 500 to 600,000) obtained by copolymerizing 45 parts by mass of 2-ethylhexyl acrylate, 35 parts by mass of vinyl acetate, and 20 parts by mass of 2-hydroxyethyl acrylate An acrylic pressure-sensitive adhesive to which 16 parts by mass of 2-methacryloyloxyethyl isocyanate was added was prepared.

  100 parts by mass of the acrylic pressure-sensitive adhesive, 0.5 parts by mass of an isocyanate curing agent (manufactured by Nippon Polyurethane Co., Ltd., Coronate L), and 1-hydroxycyclohexyl phenyl ketone (Ciba Specialty Chemicals) as a photopolymerization initiator Manufactured by Irgacure 184) and 1.5 parts by mass of a polyphenylmethylsiloxane as a silicone compound (manufactured by GELEST, POLYPHENYLMETHYLSILOXANE PMM-0025, kinematic viscosity: 500 cSt). The pressure-sensitive adhesive composition was applied to the release-treated surface of a release sheet (PIN38NA manufactured by Lintec Co., Ltd., thickness: 38 μm) with a roll knife coater so that the thickness upon drying was 20 μm, and dried at 100 ° C. for 1 minute. A first pressure-sensitive adhesive layer was formed.

  One of the first pressure-sensitive adhesive layers of polyethylene naphthalate (Teijin DuPont, Teonex Q51DW-50, thickness: 50 μm, heat shrinkage (150 ° C., 30 minutes): 0.4%) as a base material Crimped to the surface.

  100 parts by mass of an acrylic pressure-sensitive adhesive (mass average molecular weight: 500 to 600,000) obtained by copolymerizing n-butyl acrylate, methyl methacrylate, acrylic acid and 2-hydroxy acrylate at a mass ratio of 80: 10: 3: 7 , An acrylic adhesive composition obtained by blending 6 parts by mass of an isocyanate curing agent (manufactured by Nippon Polyurethane Co., Ltd., Coronate L) with a release film manufactured by Lintec Co., Ltd. so that the thickness upon drying is 20 μm. A second pressure-sensitive adhesive layer was formed by applying the film to a release-treated surface having a thickness of 38 μm (PET 381031, 38 μm) using a roll knife coater and drying at 100 ° C. for 1 minute.

  The said 2nd adhesive layer was crimped | bonded to the other surface of the said base material, and the double-sided adhesive sheet was obtained.

[Example 2]
A double-sided PSA sheet was prepared in the same manner as in Example 1 except that the blending amount of the silicone compound in the first PSA layer was changed to 0.14 parts by mass.

Example 3
A double-sided PSA sheet was prepared in the same manner as in Example 1 except that the amount of the silicone compound in the first PSA layer was changed to 0.29 parts by mass.

Example 4
A polyether addition type polysiloxane (manufactured by Toray Dow Corning, SH28, kinematic viscosity: 260 cSt) is used as the silicone compound for the first pressure-sensitive adhesive layer, and the blending amount is changed to 0.57 parts by mass, A double-sided PSA sheet was prepared in the same manner as Example 1.

Example 5
A double-sided PSA sheet was prepared in the same manner as in Example 1 except that the blending amount of the silicone compound in the first PSA layer was changed to 1.30 parts by mass.

[Comparative Example 1]
A double-sided PSA sheet was prepared in the same manner as in Example 1 except that no silicone compound was added to the first PSA layer.

[Comparative Example 2]
A silanol-terminated polydimethylsiloxane (manufactured by GELET, SILANOL TERMINATED POLYDIMETHYLSILOXANE DMS-S12, kinematic viscosity: 24 cSt) was used as the silicone compound for the first pressure-sensitive adhesive layer, and the blending amount was changed to 0.43 parts by mass, A double-sided PSA sheet was prepared in the same manner as Example 1.

[Test Example 1] (Adhesive strength measurement)
Method for measuring adhesive strength: Each adhesive strength was measured by the following method according to JIS Z0237. The results are shown in Table 1, respectively.

1. Adhesive strength before ultraviolet (UV) irradiation of the first pressure-sensitive adhesive layer The first pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive sheet obtained in Example or Comparative Example was used as an adherend in an environment of 23 ° C. and 50 RH%. A non-alkali glass plate (Corning Corp., 1737) was attached using a 2 kg rubber roller. After 20 minutes from the pasting, the peel strength was measured at a peel angle of 180 ° and a peel speed of 300 mm / min using a universal tensile tester (Orientec Corp., Tensilon UTM-4-100). It was set as the adhesive force before the ultraviolet irradiation of a layer.

2. Adhesive strength after ultraviolet ray (UV) irradiation of the first pressure-sensitive adhesive layer The first pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive sheet obtained in Example or Comparative Example was used as an adherend in an environment of 23 ° C. and 50 RH%. A non-alkali glass plate (Corning Corp., 1737) was attached using a 2 kg rubber roller. After 20 minutes from pasting, ultraviolet irradiation (using RAD-2000 / m8 manufactured by Lintec Corporation, illuminance 220 mW / cm ² , light amount 160 mJ / cm ² ) was performed from the alkali-free glass plate side. Thereafter, the peel strength was measured in the same manner as described above, and the adhesive strength of the first pressure-sensitive adhesive layer after irradiation with ultraviolet rays was determined.

3. Adhesive strength of the second pressure-sensitive adhesive layer The second pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive sheet obtained in Example or Comparative Example was mirror-treated stainless steel plate as an adherend in an environment of 23 ° C. and 50 RH%. (SUS304) was affixed using a 2 kg rubber roller. After 20 minutes from pasting, the peeling force was measured at a peeling angle of 180 ° and a peeling speed of 300 mm / min using a universal tensile tester (Orientec, Tensilon UTM-4-100), and the second adhesive The adhesive strength of the layer was taken.

[Test Example 2] (Measurement of mass reduction rate)
The mass reduction rate of the silicone compound used in the examples or comparative examples was measured by thermogravimetry (TG) under the following conditions. The results are shown in Table 1.
Measuring device: Shimadzu Corporation, Shimadzu differential thermal and thermogravimetric simultaneous measuring device DTG-60 (measurement lower limit 0.001 mg)
Measurement conditions: sample amount 10 mg, air atmosphere, measurement temperature range 40 to 300 ° C. (confirm mass reduction rate at 150 ° C.), temperature increase 10 ° C./min

[Test Example 3] (X-ray electron spectroscopic analysis: Si amount)
The amount of Si on the surface of the first pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive sheet obtained in Example or Comparative Example was measured by X-ray electron spectroscopic analysis (ESCA) under the following conditions. The results are shown in Table 1.
Measuring device: Quantera SXM manufactured by ULVAC-PHI
X-ray: AlKα (1486.6 eV)
Sample: A double-sided PSA sheet 7 days after the formation of the PSA layer is used as a sample.
Measuring elements: silicon (Si), carbon (C), oxygen (O), nitrogen (N)
The amount of Si was calculated by {Si / (C + O + N)} × 100.

[Test Example 4] (Heating test / Peeling performance test / Peeling force measurement-1)
One release film was peeled from the double-sided pressure-sensitive adhesive sheet obtained in Example or Comparative Example, and the exposed second pressure-sensitive adhesive layer was attached to a mirror wafer (8-inch silicon wafer manufactured by Advantech). RAD-3500m / 8 manufactured by Lintec Corporation was used for this sticking, the press pressure was 1.0 MPa, and the sticking speed was 50 mm / sec.

  Next, the other release film is peeled from the double-sided pressure-sensitive adhesive sheet, and the exposed first pressure-sensitive adhesive layer is coated with a soda lime glass plate as a hard support substrate (Mito Rika Glass Company, Tempaks float, diameter 201 mm, thickness Length: 0.7 mm) was temporarily attached. The laminated body was pressed with a parallel flat plate under an environment of 100 Pa with a load of 1 MPa for 1 minute, and a mirror wafer and a hard support substrate were bonded together via a double-sided pressure-sensitive adhesive sheet, and this was used as a sample.

The obtained sample was placed on a table heated to 150 ° C. with the mirror wafer side up, and heated for 10 minutes, assuming a process in which heat such as sputtering was applied. Thereafter, the peeled state (existence of peeling / floating) of the hard support substrate was visually confirmed. The results of this heating test are shown in Table 2. The result of the heating test is represented by the following symbols.
○: There was no peeling / floating ×: There was peeling / floating

Next, the sample heated as described above was irradiated with ultraviolet rays from the hard support substrate side (using RAD-2000 / m12 manufactured by Lintec Corporation, illuminance 220 mW / cm ² , light amount 160 mJ / cm ² ).

Thereafter, the sample was placed on the suction table with the hard support substrate side facing up. Then, a key jig (CPU CAUGE 9500SERIES) is hooked on the edge of the hard support substrate, and the sample is pulled at an angle of 90 ° to examine the peeling performance of the pressure-sensitive adhesive layer. The load (peeling force) was measured. The results are shown in Table 2. The peeling performance of the pressure-sensitive adhesive layer is represented by the following symbols.
○: Peeling was easy Δ: Peeling was possible although it was somewhat difficult ×: Peeling was not possible

[Test Example 5] (heating test / peeling performance test / peeling force measurement-2)
In Test Example 4, a heating test, a peel performance test, and a peel force measurement were performed in the same manner as in Test Example 4 except that the heating conditions (150 ° C. · 10 minutes) were changed to 200 ° C. · 60 minutes. The results are shown in Table 2.

[Test Example 6] (Heating test / Peeling performance test / Peeling force measurement-3)
The sample prepared in Test Example 4 was irradiated with ultraviolet rays from the hard support substrate side (using RAD-2000 / m12 manufactured by Lintec Corporation, illuminance 220 mW / cm ² , light amount 160 mJ / cm ² ).

  Next, the sample after ultraviolet irradiation was placed on a table heated to 150 ° C. with the mirror wafer side up, and heated for 10 minutes. Thereafter, the peeled state (existence of peeling / floating) of the hard support substrate was visually confirmed (heating test). Further, in the same manner as in Test Example 4, a peel performance test and a peel force measurement were performed. The results are shown in Table 2.

[Test Example 7] (Heating test / Peeling performance test / Peeling force measurement-4)
In Test Example 6, a heating test, a peel performance test, and a peel force measurement were performed in the same manner as in Test Example 6 except that the heating condition (150 ° C. · 10 minutes) was changed to 200 ° C. · 60 minutes. The results are shown in Table 2.

  As is clear from Tables 1 and 2, the double-sided PSA sheet produced in the examples did not peel or float during heating, and the hard support substrate could be peeled off. Further, as is clear from Table 2, the hard support substrate can be peeled off by applying ultraviolet irradiation before heating even when a larger thermal stress is applied.

  The double-sided pressure-sensitive adhesive sheet for processing a plate member according to the present invention can be suitably used as a protective sheet when processing a plate member such as a semiconductor wafer. The plate-like member processing method according to the present invention is suitable for a semiconductor wafer thin grinding process to a sputtering process.

It is sectional drawing of the double-sided adhesive sheet for plate-shaped member processing which concerns on one Embodiment of this invention. It is sectional drawing which shows the use condition of the double-sided adhesive sheet for plate-shaped member processing concerning the embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Double-sided adhesive sheet 1 'for plate-shaped member processing ... Plate-shaped member double-sided adhesive sheet (what peeled off the peeling sheet from the double-sided adhesive sheet 1 for plate-shaped member processing)
DESCRIPTION OF SYMBOLS 2 ... Base material 3 ... 1st adhesive layer 4 ... 2nd adhesive layer 5, 5 '... Release sheet 6 ... Hard support substrate 7 ... Semiconductor wafer

Claims (10)

A substrate;
A first pressure-sensitive adhesive layer laminated on one surface of the substrate;
A double-sided pressure-sensitive adhesive sheet for processing a plate-shaped member, comprising a second pressure-sensitive adhesive layer laminated on the other surface of the base material, to which a plate-shaped member is attached,
The first pressure-sensitive adhesive layer contains a silicone compound having a mass reduction rate at 150 ° C. of 20% or less by thermogravimetry (TG), which is a double-sided pressure-sensitive adhesive sheet for processing plate members.   2. The double-sided pressure-sensitive adhesive sheet for processing a plate member according to claim 1, wherein the Si amount in the pressure-sensitive adhesive surface of the first pressure-sensitive adhesive layer is 1.0 to 15.0% by X-ray electron spectroscopy. .   The double-sided pressure-sensitive adhesive sheet for plate-like member processing according to claim 1 or 2, wherein the first pressure-sensitive adhesive layer is made of an energy ray-curable pressure-sensitive adhesive.   The double-sided pressure-sensitive adhesive sheet for plate member processing according to any one of claims 1 to 3, wherein the substrate has a heat shrinkage rate of 3% or less when heated at 150 ° C for 30 minutes.   The double-sided pressure-sensitive adhesive sheet for processing a plate member according to any one of claims 1 to 4, wherein a hard support substrate is attached to the first pressure-sensitive adhesive layer. The first pressure-sensitive adhesive layer and the hard support substrate of the double-sided pressure-sensitive adhesive sheet for processing a plate-like member according to claim 3 are bonded together, and the second pressure-sensitive adhesive layer and the plate-shaped member are bonded together,
After applying predetermined processing to the plate member,
Irradiate the double-sided pressure-sensitive adhesive sheet with energy rays,
The plate-shaped member processing method, wherein the plate-shaped member and the double-sided pressure-sensitive adhesive sheet are separated.   The plate-like member processing method according to claim 6, wherein the predetermined processing includes a step in which a processing temperature is 100 to 150 ° C. The first pressure-sensitive adhesive layer and the hard support substrate of the double-sided pressure-sensitive adhesive sheet for processing a plate-like member according to claim 3 are bonded together, and the second pressure-sensitive adhesive layer and the plate-shaped member are bonded together,
After irradiating the double-sided pressure-sensitive adhesive sheet with energy rays,
Apply predetermined processing to the plate-like member,
The plate-shaped member processing method, wherein the plate-shaped member and the double-sided pressure-sensitive adhesive sheet are separated.   The plate-like member processing method according to claim 8, wherein the predetermined processing includes a step in which a processing temperature is 100 to 200 ° C. The hard support substrate has energy ray permeability,
The plate-like member processing method according to any one of claims 6 to 9, wherein the energy beam is applied to the double-sided pressure-sensitive adhesive sheet from the hard support substrate side.

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