CN112739533B - Adhesive tape and method for manufacturing electronic component - Google Patents

Adhesive tape and method for manufacturing electronic component Download PDF

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Publication number
CN112739533B
CN112739533B CN201980062068.3A CN201980062068A CN112739533B CN 112739533 B CN112739533 B CN 112739533B CN 201980062068 A CN201980062068 A CN 201980062068A CN 112739533 B CN112739533 B CN 112739533B
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ultraviolet
adhesive layer
curable adhesive
weight
adhesive tape
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CN201980062068.3A
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CN112739533A (en
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西中久美子
野村高弘
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention aims to provide an adhesive tape which can be used for a support that does not transmit light during the manufacture of an electronic component and which can suppress peeling and adhesive residue from an adherend and the support even when subjected to a high-temperature treatment, and a method for manufacturing an electronic component using the adhesive tape. The present invention is an adhesive tape comprising a non-ultraviolet-curable adhesive layer and an ultraviolet-curable adhesive layer laminated on the non-ultraviolet-curable adhesive layer, wherein the non-ultraviolet-curable adhesive layer has a tensile strength of 5.0N/10mm or more and 20.0N/10mm or less at 23 ℃, and the non-ultraviolet-curable adhesive layer has an air release amount of 10000ppm or less when heated at 260 ℃ for 15 minutes.

Description

Adhesive tape and method for manufacturing electronic component
Technical Field
The present invention relates to an adhesive tape and a method for manufacturing an electronic component using the same.
Background
In the manufacturing process of semiconductor chips, an adhesive tape is used to facilitate handling during processing of wafers or semiconductor chips and to prevent breakage. For example, in the case of grinding a thick film wafer cut from high purity single crystal silicon or the like to a predetermined thickness to produce a thin film wafer, an adhesive tape is attached to the thick film wafer and then grinding is performed.
The adhesive composition used in such an adhesive tape is required to have high adhesion properties to be able to fix an adherend such as a wafer or a semiconductor chip as firmly as possible in a processing step, and to be able to be peeled off without damaging the adherend such as a wafer or a semiconductor chip after the end of the step (hereinafter, also referred to as "high adhesion easy peeling").
As an adhesive composition that realizes high adhesion and easy release, patent document 1 discloses an adhesive tape using a photocurable adhesive that is cured by irradiation of light such as ultraviolet rays, and thus has reduced adhesive force. By using a photocurable adhesive as the adhesive, the adherend can be reliably fixed in the processing step, and can be easily peeled off by irradiation of ultraviolet rays or the like.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 5-32946
Disclosure of Invention
Problems to be solved by the invention
In recent years, due to the thinning and miniaturization of semiconductor products, substrates have been thinned to 100 μm or less (hereinafter, thinned substrates are referred to as thin substrates), and adhesive tapes have been used for preventing warpage and damage in the manufacture of substrates. In the production of such a thin substrate, a base material such as a polyimide film which is a base of the substrate is fixed to a support via an unsupported adhesive tape, and then a process such as wiring is performed. However, from the viewpoints of cost and handling properties, most supports used in the production of thin substrates are made of opaque materials such as copper, aluminum, and glass epoxy, and such opaque supports have a problem that conventional pressure-sensitive adhesive tapes using a photocurable pressure-sensitive adhesive cannot be cured. In order to solve this problem, an adhesive tape having a curable adhesive layer and a non-curable adhesive layer has been proposed. By attaching the curable pressure-sensitive adhesive layer to an adherend such as a thin substrate and then curing the adhesive, and then attaching the non-curable pressure-sensitive adhesive layer to the support, the pressure-sensitive adhesive tape can be cured even when the support is opaque.
On the other hand, in the process of manufacturing electronic components such as thin substrates, a high-temperature treatment for applying heat at 150 ℃ or higher may be performed. In the step involving such a high-temperature treatment, in the case of using a conventional pressure-sensitive adhesive tape having a curable pressure-sensitive adhesive layer and a non-curable pressure-sensitive adhesive layer, the non-curable pressure-sensitive adhesive layer may not be resistant to heat and may be peeled from the support. The temperature of the high-temperature treatment increases with the progress of the technology, and thus, an adhesive tape having further heat resistance is demanded which can be used for an opaque support.
The present invention aims to provide an adhesive tape which can be used for a support that does not transmit light during the manufacture of an electronic component and which can suppress peeling and adhesive residue from an adherend and the support even when subjected to a high-temperature treatment, and a method for manufacturing an electronic component using the adhesive tape.
Means for solving the problems
The 1 st aspect of the present invention is an adhesive tape comprising a non-ultraviolet-curable adhesive layer and an ultraviolet-curable adhesive layer laminated on the non-ultraviolet-curable adhesive layer, wherein the non-ultraviolet-curable adhesive layer has a tensile strength of 5.0N/10mm or more and 20.0N/10mm or less at 23 ℃, and wherein the non-ultraviolet-curable adhesive layer releases gas in an amount of 10000ppm or less when heated at 260 ℃ for 15 minutes.
A 2 nd aspect of the present invention is an adhesive tape comprising a non-ultraviolet-curable adhesive layer and an ultraviolet-curable adhesive layer laminated on the non-ultraviolet-curable adhesive layer, wherein the non-ultraviolet-curable adhesive layer has an air release amount of 10000ppm or less when heated at 260 ℃ for 15 minutes, and wherein the non-ultraviolet-curable adhesive layer comprises: a (meth) acrylic copolymer as a base polymer A' comprising 92 to 97% by weight of an alkyl (meth) acrylate having an alkyl group of 4 to 12 carbon atoms as a constituent; an epoxy compound having a tertiary amine structure as a curing agent B; and filler C.
The present invention is described in detail below.
The pressure-sensitive adhesive tape of the present invention has a non-ultraviolet-curable pressure-sensitive adhesive layer and an ultraviolet-curable pressure-sensitive adhesive layer laminated on the non-ultraviolet-curable pressure-sensitive adhesive layer.
By providing the pressure-sensitive adhesive tape with an ultraviolet-curable pressure-sensitive adhesive layer, the pressure-sensitive adhesive tape can be attached to an adherend with sufficient adhesive force to protect the adherend, and by curing the ultraviolet-curable pressure-sensitive adhesive layer after attachment, the adherend can be reliably protected even when subjected to a high-temperature treatment. In addition, the pressure-sensitive adhesive tape can be easily released without damaging the adherend after the protection is not required. Further, by providing the pressure-sensitive adhesive tape with a non-ultraviolet-curable pressure-sensitive adhesive layer, the ultraviolet-curable pressure-sensitive adhesive layer can be attached to the adherend, and the non-ultraviolet-curable pressure-sensitive adhesive layer can be attached to the support after curing the ultraviolet-curable pressure-sensitive adhesive layer, so that the ultraviolet-curable pressure-sensitive adhesive layer can be cured even when the support is opaque. From the viewpoint of simplifying the manufacturing process, the ultraviolet-curable adhesive layer may be cured by irradiating ultraviolet rays immediately after the adhesive tape is attached to the adherend.
In a preferred embodiment of the present invention, the non-ultraviolet curable adhesive layer is ultraviolet transmissive. Here, the ultraviolet transmittance means that the light absorption wavelength band of the ultraviolet polymerization initiator contained in the ultraviolet curable adhesive layer overlaps with the light transmission wavelength band of the non-ultraviolet curable adhesive layer, and particularly preferably the light absorption wavelength band of the ultraviolet polymerization initiator overlaps with the light absorption wavelength band of not more than 0.2 of the non-ultraviolet curable adhesive layer. By making the non-ultraviolet curable adhesive layer ultraviolet transmissive, ultraviolet rays can be irradiated to the ultraviolet curable adhesive layer through the non-ultraviolet curable adhesive layer.
In embodiment 1 of the present invention, the non-ultraviolet curable adhesive layer has a tensile strength of 5.0N/10mm or more and 20.0N/10mm or less at 23 ℃.
In the invention according to claim 2, the non-ultraviolet curable adhesive layer preferably has a tensile strength of 5.0N/10mm or more and 20.0N/10mm or less at 23 ℃.
By setting the tensile strength of the non-ultraviolet curable adhesive layer to the above range, the adhesive tape is less likely to be torn off during release. The lower limit of the tensile strength of the non-ultraviolet curable adhesive layer is preferably 5.5N/10mm, more preferably 6.0N/10mm, and the upper limit is preferably 19.5N/10mm, more preferably 19.0N/10mm, from the viewpoint of further suppressing tearing of the adhesive tape at the time of release.
The tensile strength of the non-uv curable adhesive layer can be measured as follows: the non-ultraviolet curable adhesive layer was cut into a sample having a thickness of 200 μm and a width of 10mm, and the tensile strength was measured at a speed of 300 mm/min and a distance between the marks of 40mm using Tensilon UCE500 (manufactured by Orientech Co., ltd.) at 23℃and 50% RH.
In the non-ultraviolet curable adhesive layer, the release amount of the non-ultraviolet curable adhesive layer when heated at 260 ℃ for 15 minutes is 10000ppm or less.
In the production of electronic components accompanied by high-temperature treatment, when a general adhesive tape having a non-ultraviolet-curable adhesive layer and an ultraviolet-curable adhesive layer is used for protecting the electronic components, the non-ultraviolet-curable adhesive layer is decomposed by heat of the high-temperature treatment, and a large amount of outgas is generated. The generated outgas causes the non-ultraviolet-curable adhesive layer to foam and lower the strength and adhesive force, so that peeling occurs between the support and the non-ultraviolet-curable adhesive layer at the time of peeling, and there is a problem that the adhesive tape remains on the adherend side (residual adhesive). In the pressure-sensitive adhesive tape of the present invention, the amount of outgas generated from the non-ultraviolet-curable pressure-sensitive adhesive layer is small, that is, the non-ultraviolet-curable pressure-sensitive adhesive layer is less likely to decompose by heat, whereby foaming of the non-ultraviolet-curable pressure-sensitive adhesive layer can be suppressed and the pressure-sensitive adhesive tape is less likely to remain on an adherend. The outgas amount is preferably 7500ppm or less, more preferably 5500ppm or less, still more preferably 4000ppm or less, particularly preferably 3500ppm or less, from the viewpoint of further suppressing the residual adhesive of the pressure-sensitive adhesive tape on the adherend. The lower limit of the amount of outgas is not particularly limited, and the lower the amount, the more preferable, for example, the lower limit is 1000ppm.
The outgas amount can be obtained, for example, as a gas amount (ppm in terms of toluene: μg/g) measured by cutting out the non-ultraviolet curable adhesive layer by 5mm×5mm and using thermal desorption GC-MS (thermal desorption apparatus: turboMatrix 350, manufactured by Perkinelmer Co., ltd., GC-MS apparatus: JMS Q1000, manufactured by Japan electronics Co.).
The detailed measurement conditions were as follows.
Sample heating conditions: 260℃for 15min (20 mL/min)
And (3) secondary desorption: 350 ℃,40min
Splitting: inlet 25mL/min and outlet 25mL/min
Injection amount: 2.5%
Column: EQUITY-1 (nonpolar, manufactured by SIGMA-ALDRICH Co.) 0.32 mm. Times.60 m.times.0.25 μm
GC temperature rise: 40 ℃ (4 min) →heating at a rate of 10 ℃/min→300 ℃ (10 min)
He flow rate: 1.5mL/min
Ionization voltage: 70eV
MS measurement range: 29-600 amu (scanning 500 ms)
MS temperature: an ion source; 230 ℃, interface; 250 DEG C
The adhesive strength of the non-ultraviolet curable adhesive layer is preferably 10 to 300gf/3mm phi.
By setting the adhesive strength of the non-ultraviolet curable adhesive layer to the above range, the non-ultraviolet curable adhesive layer and the support are more reliably adhered, and the adhesive tape can be more easily released from the interface between the ultraviolet curable adhesive layer and the adherend at the time of release. The lower limit of the adhesive strength is more preferably 15gf/3mm phi, the lower limit is more preferably 20gf/3mm phi, the upper limit is more preferably 270gf/3mm phi, and the upper limit is more preferably 250gf/3mm phi, from the viewpoint of further facilitating the release of the adhesive tape from the interface of the ultraviolet curable adhesive layer and the adherend.
The above-mentioned adhesive strength can be measured as follows: a measurement sample was prepared by cutting out the non-ultraviolet curable adhesive layer 10mm×10mm, and probe tack was measured on the obtained measurement sample. The instrument and measurement conditions used may be as follows.
Tack tester: TAC1000 manufactured by RHECA corporation (or equivalent thereof)
Probe diameter: 3mm phi
Crimping load: 100g of
Crimping time: 1 second
Contact speed: 30mm min
Peeling speed: 600mm/min
The gel fraction of the non-ultraviolet curable adhesive layer is preferably 80% or more.
The adhesive tape of the present invention can be used in a step accompanied by a chemical agent treatment because the gel fraction of the non-ultraviolet curable adhesive layer is 80% or more, thereby improving the chemical agent resistance of the non-ultraviolet curable adhesive layer.
The gel fraction is more preferably 95% or more, and still more preferably 97% or more, from the viewpoint of further improving the chemical resistance. The upper limit of the gel fraction is not particularly limited, but is usually 100% or less. The gel fraction can be measured by the following method.
Only 0.1g of the obtained non-ultraviolet curable adhesive layer of the adhesive tape was scraped off and immersed in 50mL of ethyl acetate, and the resultant adhesive tape was shaken by a shaker at a temperature of 23℃and 120rpm for 24 hours (hereinafter, the scraped-off non-ultraviolet curable adhesive layer was referred to as an adhesive composition). After shaking, the ethyl acetate was separated from the adhesive composition swollen by absorbing ethyl acetate using a metal mesh (mesh # 200). The separated adhesive composition was dried at 110℃for 1 hour. The weight of the dried adhesive composition including the metal mesh was measured, and the gel fraction of the non-ultraviolet curable adhesive layer was calculated using the following formula.
Gel fraction (wt%) =100× (W 1 -W 2 )/W 0
(W 0 : initial adhesive composition weight, W 1 : weight of dried adhesive composition containing metal net, W 2 : initial weight of metal mesh
The non-ultraviolet curable adhesive constituting the non-ultraviolet curable adhesive layer is not particularly limited as long as it is of a non-ultraviolet curable type and satisfies the tensile strength and outgas amount, and it is preferable that the base polymer has a functional group capable of reacting with an epoxy group.
Examples of the functional group capable of reacting with an epoxy group include: carboxyl, hydroxyl, phenolic, ester, amino, carbonyl, methoxy, sulfo, and the like. Among them, at least 1 selected from the group consisting of carboxyl groups, hydroxyl groups, phenol groups, ester groups and amino groups is preferable from the viewpoint of high reactivity.
Examples of the base polymer include acrylic polymers, silicone polymers, and urethane polymers.
In the invention according to claim 1, the non-ultraviolet curable pressure-sensitive adhesive layer preferably comprises: the base polymer A is a (meth) acrylic copolymer having a weight average molecular weight c of 70 ten thousand or more and a molecular weight distribution d of 2 to 6, and contains 92 to 97% by weight of an alkyl (meth) acrylate a having 4 to 12 carbon atoms and 3.0 to 8.0% by weight of a carboxyl group-containing monomer b as constituent components.
In the 2 nd aspect of the present invention, the non-ultraviolet curable pressure-sensitive adhesive layer contains: the (meth) acrylic copolymer as the base polymer A' contains 92 to 97% by weight of an alkyl (meth) acrylate having an alkyl group having 4 to 12 carbon atoms as a constituent. In embodiment 2 of the present invention, it is also preferable that the (meth) acrylic copolymer has a weight average molecular weight of 70 ten thousand or more and a molecular weight distribution of 2 to 6, and that the (meth) acrylic copolymer contains 92 to 97% by weight of an alkyl (meth) acrylate having 4 to 12 carbon atoms and 3.0 to 8.0% by weight of a carboxyl group-containing monomer.
By using the alkyl (meth) acrylate having 4 to 12 carbon atoms as the constituent component, a non-ultraviolet curable pressure-sensitive adhesive layer having more excellent adhesive force (preferably having ultraviolet transmittance) can be produced. In addition, by using a carboxyl group-containing monomer as a constituent component, the cohesive force of the non-ultraviolet curable adhesive can be improved and a greater adhesive force can be imparted. In addition, in the case where the ultraviolet-curable adhesive layer contains a silicone compound, the carboxyl group as a polar group blocks the access of the low-polar silicone compound, and thus can suppress the bleeding of the silicone compound to the non-ultraviolet-curable adhesive layer side.
Examples of the alkyl (meth) acrylate in which the alkyl group has 4 to 12 carbon atoms include butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, and the like. Among them, butyl acrylate is preferable in view of excellent adhesion.
Examples of the carboxyl group-containing monomer include acrylic acid and methacrylic acid. Among them, acrylic acid is preferable in that it can impart high adhesion.
The adhesive tape having more excellent adhesive force can be produced by setting the content of the alkyl (meth) acrylate having 4 to 12 carbon atoms in the alkyl group to 92 to 97 wt%. When the carboxyl group-containing monomer is 3.0% by weight or more, bleeding of the silicone compound into the non-ultraviolet-curable adhesive layer can be further suppressed when the ultraviolet-curable adhesive layer contains the silicone compound. When the carboxyl group-containing monomer is 8.0 wt% or less, the acidity of the (meth) acrylic copolymer can be adjusted to an appropriate range, and when the ultraviolet-curable adhesive layer contains a silicone compound, bleeding of the silicone compound into the non-ultraviolet-curable adhesive layer can be further suppressed.
From the viewpoint of further suppressing bleeding, the more preferable lower limit of the content of the alkyl (meth) acrylate in the (meth) acrylic copolymer is 93% by weight, the more preferable lower limit is 94% by weight, and the more preferable upper limit is 96% by weight. From the viewpoint of further suppressing bleeding, the more preferable lower limit of the content of the carboxyl group-containing monomer in the (meth) acrylic copolymer is 4.0% by weight, the more preferable upper limit is 7.0% by weight, and the more preferable upper limit is 6.0% by weight.
By providing the (meth) acrylic copolymer with a weight average molecular weight as large as 70 ten thousand or more and a molecular weight distribution as narrow as 2 to 6, the tensile strength of the non-ultraviolet curable pressure-sensitive adhesive layer and the outgas amount can be easily adjusted to the above ranges. Here, the molecular weight distribution refers to a ratio (Mw/Mn) of a weight average molecular weight (Mw) to a number average molecular weight (Mn). The lower limit of the weight average molecular weight is more preferably 75 ten thousand, and the lower limit is more preferably 80 ten thousand. The upper limit of the weight average molecular weight is not particularly limited, but is preferably 120 ten thousand, for example, from the viewpoint of handleability. The lower limit of the molecular weight distribution is more preferably 2.5, the lower limit is more preferably 3, the upper limit is more preferably 5.5, and the upper limit is more preferably 5. The weight average molecular weight and the molecular weight distribution described above can be determined using GPC measurement, and specifically, the methods shown in examples can be used.
Examples of the method for obtaining the (meth) acrylic copolymer having the weight average molecular weight and molecular weight distribution include solution polymerization, emulsion polymerization, living radical polymerization, and the like.
In embodiment 1 of the present invention, the non-ultraviolet curable pressure-sensitive adhesive layer preferably contains an epoxy compound as the curing agent B, and more preferably contains an epoxy compound having a tertiary amine structure.
In the invention according to the 2 nd aspect, the non-ultraviolet curable pressure-sensitive adhesive layer contains an epoxy compound having a tertiary amine structure as the curing agent B.
By containing the epoxy compound in the non-ultraviolet curable pressure-sensitive adhesive layer, the base polymer can be crosslinked, and the chemical resistance and heat resistance of the non-ultraviolet curable pressure-sensitive adhesive layer can be improved. In addition, the crosslinked base polymer has a molecular structure in which the gel fraction increases and movement is difficult. Therefore, when the ultraviolet-curable adhesive layer contains a silicone compound, the silicone compound is prevented from exuding to the non-ultraviolet-curable adhesive layer, and sufficient adhesive force can be exhibited even when the adhesive layer is stored for a long period of time. Examples of the epoxy compound include N, N' -tetraglycidyl-1, 3-xylylenediamine, methyl glycidyl ether, 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexane carboxylate, bis- (3, 4-epoxycyclohexyl) adipate, bisphenol a diglycidyl ether, diglycidyl ether condensate of bisphenol a, phenol resin, and epichlorohydrin modified products of cresol resin. Among them, an epoxy compound having a tertiary amine structure is preferable.
Since the base polymer before the crosslinking reaction with the epoxy compound has a structure with a low gel fraction and easily movable molecules, when the ultraviolet curable pressure-sensitive adhesive layer contains a silicone compound, the silicone compound easily bleeds out. Therefore, if the rate of the crosslinking reaction is low, the silicone compound may bleed out to a large extent into the non-ultraviolet curable adhesive layer. If a tertiary amino group is present in the above-mentioned non-ultraviolet curable adhesive layer, the tertiary amino group functions as a catalyst for the crosslinking reaction, and the rate of the crosslinking reaction of the base polymer increases, so that the reaction is completed early. By completing the crosslinking reaction at an early stage, the silicone compound is less likely to bleed out to the non-ultraviolet curable adhesive layer, and therefore an adhesive tape having sufficient adhesive force even in the case of long-term storage can be produced. Examples of the epoxy compound having a tertiary amine include N, N, N ', N' -tetraglycidyl-1, 3-xylylenediamine and the like.
The lower limit of the content of the curing agent (the epoxy compound) in the non-ultraviolet curable adhesive layer is preferably 0.1 part by weight, more preferably 0.2 part by weight, still more preferably 0.3 part by weight, and the upper limit is preferably 0.5 part by weight, more preferably 0.45 part by weight, and still more preferably 0.4 part by weight, based on 100 parts by weight of the base polymer. When the content of the epoxy compound is within the above range, the base polymer can be sufficiently and rapidly crosslinked, and bleeding of the silicone compound into the non-ultraviolet curable pressure-sensitive adhesive layer can be further suppressed.
In embodiment 1 of the present invention, the non-ultraviolet curable adhesive layer preferably contains a filler C.
In the invention according to claim 2, the non-ultraviolet curable adhesive layer contains a filler C.
By incorporating the filler in the non-ultraviolet curable pressure-sensitive adhesive layer, heat resistance can be improved. Examples of the filler include silica filler, aluminum filler, calcium filler, boron filler, magnesium filler, and zirconia filler. Among them, silica filler is preferable.
In the case where the ultraviolet-curable adhesive layer contains a silicone compound, the silica filler is preferably a silica filler oxide, because bleeding out of the silicone compound can be further suppressed. Since the silica filler oxide has a hydrophilic group and has a high polarity, the silica filler oxide is contained in the non-ultraviolet curable pressure-sensitive adhesive layer, whereby the approach of a substance having a low polarity can be prevented. Therefore, when the ultraviolet-curable adhesive layer contains a low-polarity silicone compound, bleeding of the silicone compound into the non-ultraviolet-curable adhesive layer can be suppressed.
The silica filler oxide is not particularly limited, and examples thereof include silicon-aluminum-boron composite oxide, silicon-titanium composite oxide, silicon dioxide-titanium composite oxide, magnesium-aluminum-silicon composite oxide, hexamethylcyclotrisiloxane, tetramethoxysilane, chlorosilane, monosilane, and the like. Among them, silicon-aluminum-boron composite oxide, silicon-titanium composite oxide, and silicon dioxide-titanium composite oxide are preferable because they have physical properties similar to those of silicon dioxide which is generally used as an inorganic filler.
In the case where the silica filler is a silica filler oxide, at least a part of the surface of the silica filler oxide is preferably subjected to a hydrophobization treatment.
By replacing at least a part of the hydrophilic groups present in the silica filler oxide with hydrophobic groups, dispersibility in the base polymer can be improved. The hydrophobic group is not particularly limited, and examples thereof include methyl, ethyl, propyl, butyl, and the like. Among them, from the viewpoint of dispersibility in the base polymer, it is preferable that the silica filler oxide after the hydrophobization has a monomethylsilyl group, a dimethylsilyl group or a trimethylsilyl group. In particular, it is more preferable that at least a part of the silica filler oxide has a monomethylsilyl group, from the viewpoint of excellent balance between the effect of inhibiting bleeding of the silicone compound into the non-ultraviolet-curable adhesive layer and dispersibility in the base polymer. Since the silica filler oxide hinders the access of the silicone compound due to its hydrophilicity as described above, it is difficult to exert the effect as a silica filler oxide by substituting the entire surface of the silica filler oxide with a hydrophobic group.
In the case where at least a part of the silica filler oxide has a monomethylsilyl group, a dimethylsilyl group or a trimethylsilyl group, the silica filler oxide preferably has a specific surface area of 100m in terms of the original specific surface area (Japanese: original specific surface area) 2 The above functional group per gram or more, more preferably 140m 2 The above functional group per gram. By providing the silica filler oxide with the above functional groups in the above range on the surface, the dispersibility of the silica filler oxide with respect to the base polymer can be further improved.
The average particle diameter of the filler is not particularly limited, but is preferably 0.06 μm in lower limit, more preferably 0.07 μm in lower limit, and is preferably 2 μm in upper limit, more preferably 1 μm in upper limit. By setting the average particle diameter of the filler to the above range, dispersibility with respect to the non-ultraviolet curable adhesive can be further improved.
The content of the filler is not particularly limited, but is preferably 3 parts by weight, and is preferably 20 parts by weight, based on 100 parts by weight of the base polymer.
By setting the filler content to 3 parts by weight or more, the heat resistance of the obtained adhesive tape can be further improved. By setting the content of the silica filler to 20 parts by weight or less, an adhesive tape having sufficient adhesive force can be produced. From the viewpoint of further improving the heat resistance of the adhesive tape, the content of the silica filler relative to 100 parts by weight of the base polymer is more preferably 6 parts by weight, still more preferably 8 parts by weight, yet more preferably 18 parts by weight, yet more preferably 15 parts by weight, and particularly preferably 13 parts by weight.
The non-ultraviolet curable adhesive layer may contain a tackifier.
By containing the tackifier in the ultraviolet curable pressure-sensitive adhesive layer, the adhesive force can be further improved. However, the tackifier is responsible for outgas during high-temperature treatment, and therefore, it is preferable to use as little or as small an amount as possible. Therefore, in the case of using a tackifier, the non-ultraviolet curable pressure-sensitive adhesive layer preferably contains 30 parts by weight or less of the tackifier per 100 parts by weight of the (meth) acrylic copolymer. By setting the content of the thickener to the above range, generation of outgas due to heat can be suppressed, and the amount of outgas can be easily adjusted. The upper limit of the tackifier is more preferably 20 parts by weight, and the upper limit is still more preferably 10 parts by weight. The lower limit of the tackifier is not particularly limited, but is preferably 0 parts by weight in terms of minimizing the generation amount of outgas, and is preferably 3 parts by weight in terms of further improving the adhesive force.
The non-ultraviolet curable adhesive layer may contain known additives such as plasticizers, resins, surfactants, waxes, and particulate fillers. The above additive may be used in an amount of 1 or 2 or more.
The thickness of the non-ultraviolet curable adhesive layer is not particularly limited, but is preferably 5 μm in lower limit, more preferably 10 μm in lower limit, and is preferably 100 μm in upper limit, more preferably 60 μm in upper limit. If the thickness of the non-ultraviolet curable adhesive layer is in the above range, the adherend can be bonded to the support with sufficient adhesive force and can be reliably fixed.
Examples of the ultraviolet-curable adhesive component constituting the ultraviolet-curable adhesive layer include an ultraviolet-curable adhesive containing a polymerizable polymer as a main component and an ultraviolet polymerization initiator as a polymerization initiator. The polymerizable polymer can be obtained, for example, by: a (meth) acrylic polymer having a functional group in a molecule (hereinafter referred to as a functional group-containing (meth) acrylic polymer) is synthesized in advance and reacted with a compound having a functional group reactive with the functional group and a radical-polymerizable unsaturated bond in a molecule (hereinafter referred to as a functional group-containing unsaturated compound).
The functional group-containing (meth) acrylic polymer is obtained by copolymerizing an alkyl acrylate and/or an alkyl methacrylate, which generally have an alkyl group having 2 to 18 carbon atoms, as a main monomer, with a functional group-containing monomer and, if necessary, another modifying monomer copolymerizable with the functional group-containing monomer by a conventional method. The weight average molecular weight of the functional group-containing (meth) acrylic polymer is usually about 20 to 200 tens of thousands. In this specification, the weight average molecular weight can be generally determined by GPC, and specifically, the methods shown in examples can be used.
Examples of the functional group-containing monomer include carboxyl group-containing monomers, hydroxyl group-containing monomers, epoxy group-containing monomers, isocyanate group-containing monomers, amino group-containing monomers, and the like. Examples of the carboxyl group-containing monomer include acrylic acid and methacrylic acid. Examples of the hydroxyl group-containing monomer include hydroxyethyl acrylate and hydroxyethyl methacrylate. Examples of the epoxy group-containing monomer include glycidyl acrylate and glycidyl methacrylate. Examples of the isocyanate group-containing monomer include isocyanate ethyl acrylate and isocyanate ethyl methacrylate. Examples of the amino group-containing monomer include aminoethyl acrylate and aminoethyl methacrylate.
Examples of the other copolymerizable modifying monomer include various monomers used in general (meth) acrylic polymers such as vinyl acetate, acrylonitrile and styrene.
As the functional group-containing unsaturated compound that reacts with the functional group-containing (meth) acrylic polymer, the same compound as the functional group-containing monomer may be used depending on the functional group of the functional group-containing (meth) acrylic polymer. For example, when the functional group of the functional group-containing (meth) acrylic polymer is a carboxyl group, an epoxy group-containing monomer or an isocyanate group-containing monomer may be used. In the case where the functional group is a hydroxyl group, an isocyanate group-containing monomer may be used. In the case where the functional group is an epoxy group, an amide group-containing monomer such as a carboxyl group-containing monomer or acrylamide may be used. In the case where the functional group is an amino group, an epoxy group-containing monomer may be used.
Examples of the ultraviolet polymerization initiator include ultraviolet polymerization initiators activated by irradiation with ultraviolet rays having a wavelength of 200 to 410 nm. Examples of such ultraviolet polymerization initiators include: acetophenone derivative compounds, benzoin ether compounds, ketal derivative compounds, phosphine oxide derivative compounds, bis (. Eta.5-cyclopentadienyl) titanocene derivative compounds, benzophenone, michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, α -hydroxycyclohexylphenyl ketone, 2-hydroxymethylphenyl propane, and the like. Examples of the acetophenone derivative compound include methoxyacetophenone. Examples of the benzoin ether compound include benzoin propyl ether and benzoin isobutyl ether. Examples of the ketal derivative compounds include benzildimethyl ketal and acetophenone diethyl ketal. These ultraviolet polymerization initiators may be used alone or in combination of 2 or more.
The ultraviolet curable pressure-sensitive adhesive layer preferably contains a radically polymerizable polyfunctional oligomer or monomer. The ultraviolet-curable pressure-sensitive adhesive layer contains a radically polymerizable polyfunctional oligomer or monomer, thereby improving ultraviolet curability.
The polyfunctional oligomer or monomer preferably has a weight average molecular weight of 1 ten thousand or less, more preferably has a weight average molecular weight of 5000 or less and a number of radically polymerizable unsaturated bonds in the molecule of 2 to 20, so that the ultraviolet curable adhesive layer can be efficiently three-dimensionally networked by ultraviolet irradiation. The weight average molecular weight may be determined by GPC measurement, for example, and specifically, the method shown in examples may be used.
Examples of the polyfunctional oligomer or monomer include: trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, or the same methacrylates as described above. Further, examples thereof include: 1, 4-butanediol diacrylate, 1, 6-hexanediol diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylates such as polyethylene glycol diacrylate, and methacrylate similar to those described above. These multifunctional oligomers or monomers may be used alone or in combination of 2 or more.
The ultraviolet curable pressure-sensitive adhesive layer preferably contains a silicone compound.
By containing the silicone compound in the ultraviolet-curable adhesive layer, the silicone compound oozes out at the interface between the ultraviolet-curable adhesive layer and the adherend, and therefore the adhesive tape can be easily released after the treatment is completed. Further, since the silicone compound has excellent heat resistance, even when the silicone compound is subjected to a treatment accompanied by heating at 150 ℃ or higher, scorching and the like of the ultraviolet-curable adhesive layer can be suppressed, and the residual adhesive can be suppressed.
The silicone compound preferably has a functional group capable of crosslinking with the ultraviolet-curable pressure-sensitive adhesive component.
By providing the silicone compound with a functional group capable of crosslinking with the ultraviolet-curable adhesive component, the silicone compound chemically reacts with the ultraviolet-curable adhesive component by ultraviolet irradiation and enters the ultraviolet-curable adhesive component, and thus contamination due to adhesion of the silicone compound to an adherend is suppressed. The functionality of the silicone compound is, for example, 2 to 6, preferably 2 to 4, and more preferably 2. The functional group is appropriately determined according to the functional group contained in the ultraviolet-curable adhesive component, and for example, in the case where the ultraviolet-curable adhesive component is a photocurable adhesive containing a polymerizable polymer of an alkyl (meth) acrylate type as a main component, a functional group capable of crosslinking with a (meth) acrylic group is selected.
The functional group crosslinkable with the (meth) acrylic group is a functional group having an unsaturated double bond, and specifically, for example, a silicone compound containing a vinyl group, a (meth) acrylic group, an allyl group, a maleimide group, or the like is selected.
The silicone compound preferably has a weight average molecular weight of 300 to 50000.
By setting the weight average molecular weight of the silicone compound to 300 or more, bleeding into the non-ultraviolet curable adhesive layer can be further suppressed by the size of the molecular size thereof. By setting the weight average molecular weight to 50000 or less, the adhesive layer can ooze out at the interface between the ultraviolet-curable adhesive layer and the adherend, and further, the adhesion promotion can be suppressed. The silicone compound has a more preferable lower limit of 400, a more preferable lower limit of 500, a more preferable upper limit of 10000, and a more preferable upper limit of 5000. In the present invention, the weight average molecular weight of the silicone compound can be determined by GPC analysis, and specifically, the method shown in examples can be used.
As the silicone compound having the above functional group and the weight average molecular weight, for example, silicon diacrylate (japanese コ) is mentioned. If silicon diacrylate is used, heat resistance and peelability become better.
The preferable content of the silicone compound is 1 part by weight at the lower limit, 50 parts by weight at the upper limit, 10 parts by weight at the lower limit, and 40 parts by weight at the upper limit, based on 100 parts by weight of the polymerizable polymer. By setting the content of the silicone compound to the above range, the adherend can be protected with sufficient adhesive force, and the adhesive tape can be peeled more easily after the end of protection.
The ultraviolet curable pressure-sensitive adhesive layer may contain known additives such as inorganic fillers such as fumed silica, plasticizers, resins, surfactants, waxes, and particulate fillers.
The thickness of the ultraviolet curable adhesive layer is not particularly limited, but is preferably limited to 5 μm at the lower limit and 100 μm at the upper limit. When the thickness of the ultraviolet curable pressure-sensitive adhesive layer is in the above range, the adherend can be protected with a sufficient adhesive force, and further, the residual adhesive at the time of peeling can be suppressed. The lower limit of the thickness of the ultraviolet curable pressure-sensitive adhesive layer is more preferably 10 μm, and the upper limit is more preferably 60 μm, from the viewpoint of further improving the adhesive force and further suppressing the residual adhesive at the time of peeling.
The pressure-sensitive adhesive tape of the present invention is preferably a non-supporting double-sided pressure-sensitive adhesive tape having no substrate. In the case of a support type having a base material, the silicone compound does not bleed out at the interface on the support side, but a base material having heat resistance must be used, and therefore, the cost is inferior to that of a non-support type.
In the pressure-sensitive adhesive tape of the present invention, a release film (preferably, uv-transmissive) is preferably laminated on the surface of the non-uv-curable pressure-sensitive adhesive layer opposite to the surface on which the uv-curable pressure-sensitive adhesive layer is laminated.
By providing the release film on the non-ultraviolet curable adhesive layer, the non-ultraviolet curable adhesive layer can be protected until the non-ultraviolet curable adhesive layer is attached to an adherend, and the handleability of the adhesive tape can be improved. In the case where the release film is ultraviolet transmissive, the curing step described later may be performed in a state where the non-ultraviolet curable pressure-sensitive adhesive layer is protected.
The release film is not particularly limited, and examples thereof include: ultraviolet-transmitting films such as polyethylene naphthalate (PEN), polyimide (PI), polyether ether ketone (PEEK), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polycaprolactone, polybutylene naphthalate, polybutylene terephthalate-polytetramethylene glycol copolymer, and polybutylene terephthalate-polycaprolactone copolymer. Among them, polyethylene terephthalate (PET) is preferable.
In the pressure-sensitive adhesive tape of the present invention, as long as the ultraviolet-curable pressure-sensitive adhesive layer and the non-ultraviolet-curable pressure-sensitive adhesive layer are located on the outermost layer (layer in contact with the adherend), other layers may be further provided between the ultraviolet-curable pressure-sensitive adhesive layer and the non-ultraviolet-curable pressure-sensitive adhesive layer.
The adhesive tape of the present invention preferably has a tensile strength of 2.5 to 10N/10mm at 23℃before curing.
By setting the tensile strength of the adhesive tape before curing to the above range, the adhesive tape can be made less likely to tear at the time of peeling. From the viewpoint of further suppressing tearing of the adhesive tape at the time of release, the lower limit of the tensile strength of the adhesive tape before curing is more preferably 3.0N/10mm, the lower limit is more preferably 3.5N/10mm, the upper limit is more preferably 9.5N/10mm, and the upper limit is more preferably 9.0N/10mm. The tensile strength of the adhesive tape before curing can be measured by the same method as that of the non-ultraviolet curable adhesive layer.
The adhesive tape of the present invention preferably has a gel fraction of the ultraviolet-curable adhesive layer of 80% or more after ultraviolet curing.
By setting the gel fraction of the ultraviolet-curable adhesive layer to the above lower limit or more, the chemical resistance of the adhesive tape can be further improved, and bleeding of the silicone compound into the non-ultraviolet-curable adhesive layer over time can be further suppressed. The lower limit of the gel fraction of the ultraviolet curable adhesive layer is more preferably 85%, and the lower limit is more preferably 90%. The upper limit of the gel fraction of the ultraviolet curable pressure-sensitive adhesive layer is not particularly limited, but is preferably 99%. In the case where the pressure-sensitive adhesive tape has a layer other than the ultraviolet-curable pressure-sensitive adhesive layer and the non-ultraviolet-curable pressure-sensitive adhesive layer, the gel fraction is preferably satisfied by the layer.
The method for producing the pressure-sensitive adhesive tape of the present invention is not particularly limited, and conventionally known methods can be used. For example, the ultraviolet-curable adhesive layer can be produced by coating a film subjected to a mold release treatment with a solution of the ultraviolet-curable adhesive component, drying the film, forming a non-ultraviolet-curable adhesive layer on another film subjected to a mold release treatment by the same method, and then bonding the ultraviolet-curable adhesive layer to the non-ultraviolet-curable adhesive layer.
The use of the pressure-sensitive adhesive tape of the present invention is not particularly limited, and the pressure-sensitive adhesive tape can be suitably used as: an opaque support and a protective tape used in the manufacture of electronic components such as electronic substrates and semiconductor chips having a manufacturing process accompanied by high-temperature processing are used.
Examples of such a method for manufacturing an electronic component include the following method for manufacturing an electronic component. Namely, the method comprises the following steps: an adherend attaching step of attaching the ultraviolet-curable adhesive layer to an adherend; a curing step of curing the ultraviolet-curable adhesive layer by irradiating ultraviolet rays; a support attaching step of attaching a support to the non-ultraviolet-curable adhesive layer; a heat treatment step of treating the adherend at a high temperature of 150 ℃ or higher; and a peeling step of peeling the adherend from the adhesive tape. In such a method for manufacturing an electronic component, the effects of the present invention can be particularly advantageously exhibited.
A method for manufacturing an electronic component includes the steps of: an adherend attaching step of attaching the adhesive tape of the present invention to an adherend with an ultraviolet-curable adhesive layer; a curing step of curing the ultraviolet-curable adhesive layer by irradiating ultraviolet rays; a support attaching step of attaching a support to the non-ultraviolet-curable adhesive layer; a heat treatment step of treating the adherend at a high temperature of 150 ℃ or higher; and a peeling step of peeling the adherend from the adhesive tape.
In the method for manufacturing an electronic component of the present invention, first, an attaching step is performed: the pressure-sensitive adhesive tape of the present invention having an ultraviolet-curable pressure-sensitive adhesive layer and a non-ultraviolet-curable pressure-sensitive adhesive layer is attached to an adherend with the ultraviolet-curable pressure-sensitive adhesive layer.
Examples of the adherend include a silicon wafer, a semiconductor chip, a base material which is a base in manufacturing an electronic substrate, and a material of an electronic component. Examples of the base material include a polyimide film and a glass epoxy substrate (japanese: a laver substrate).
In the method for manufacturing an electronic component of the present invention, a curing step of curing the ultraviolet-curable adhesive layer by irradiation with ultraviolet rays is performed next.
By curing the ultraviolet-curable adhesive layer, the adhesive tape can be easily released from the adherend after the completion of the treatment while suppressing the residual adhesive. In the method for manufacturing an electronic component of the present invention, the ultraviolet-curable adhesive layer is cured before the adhesive tape is attached to the support, so that the ultraviolet-curable adhesive layer can be cured even if the support is a light-opaque material. In addition, in the case where the non-ultraviolet-curable adhesive layer of the pressure-sensitive adhesive tape is ultraviolet-transmissive, the ultraviolet-curable adhesive layer can be sufficiently cured even when ultraviolet rays are irradiated from the non-ultraviolet-curable adhesive layer side to the ultraviolet-curable adhesive layer. Since the ultraviolet-curable adhesive layer is cured after being attached to the adherend, the adhesive tape does not peel off from the adherend immediately even when the ultraviolet-curable adhesive layer is cured before the treatment of the adherend.
The irradiation condition of light for curing the ultraviolet-curable adhesive layer can be appropriately adjusted by a combination of the polymerizable polymer used and the ultraviolet polymerization initiator. For example, in the case of using a polymerizable polymer having an unsaturated double bond such as a vinyl group in a side chain and an ultraviolet polymerization initiator activated at a wavelength of 200 to 410nm, the ultraviolet curable pressure-sensitive adhesive layer can be crosslinked and cured by irradiation with light having a wavelength of 365nm or more.
For example, the ultraviolet curable adhesive layer is preferably irradiated with light having a wavelength of 365nm at an illuminance of 5mW or more, more preferably irradiated with light having an illuminance of 10mW or more, still more preferably irradiated with light having an illuminance of 20mW or more, and particularly preferably irradiated with light having an illuminance of 50mW or more. The light having a wavelength of 365nm is preferably irradiated with an accumulated illuminance of 300mJ or more, more preferably with an accumulated illuminance of 500mJ or more and 10000mJ or less, still more preferably with an accumulated illuminance of 500mJ or more and 7500mJ or less, and particularly preferably with an accumulated illuminance of 1000mJ or more and 5000mJ or less.
In the method for manufacturing an electronic component of the present invention, a support attaching step of attaching a support to the non-ultraviolet curable adhesive layer is performed next.
In the method for manufacturing an electronic component of the present invention, since the adhesive layer of the adhesive tape is divided into the ultraviolet-curable adhesive layer and the non-ultraviolet-curable adhesive layer, the non-ultraviolet-curable adhesive layer is not cured even when the curing step is performed before the support is attached. Therefore, the adhesive tape can be attached to the support with a sufficient adhesive force. In the case where the pressure-sensitive adhesive tape has the ultraviolet-transmitting release film, the release film is peeled from the end of the curing step to the front of the support attaching step.
In the method for manufacturing an electronic component of the present invention, a heat treatment step of treating the adherend at a high temperature of 150 ℃ or higher is performed next.
Examples of the heat treatment step include a substrate manufacturing step and a chip mounting step. The substrate manufacturing step is usually performed with a heat treatment of 150 ℃ or higher, and the chip mounting step is usually performed with a heat treatment of 200 ℃ or higher. In the method for manufacturing an electronic component of the present invention, since the ultraviolet curable adhesive layer is cured before the heat treatment step, even when the treatment accompanied by a high temperature of 150 ℃ or higher is performed in the heat treatment step, the adhesion promotion can be suppressed, and the adherend can be easily peeled off after the treatment is completed. Further, since the ultraviolet curable pressure-sensitive adhesive layer contains a silicone compound, the adhesion can be further suppressed from becoming excessive.
The method for manufacturing an electronic component of the present invention further includes a peeling step of peeling the adherend from the adhesive tape. Since the ultraviolet-curable pressure-sensitive adhesive layer is crosslinked and cured in the curing step, the adherend can be easily peeled from the pressure-sensitive adhesive tape while suppressing the residual adhesive. In addition, since the amount of outgas of the non-ultraviolet curable adhesive layer of the adhesive tape is 10000ppm or less, the non-ultraviolet curable adhesive layer is less likely to foam due to outgas in the heat treatment step. As a result, the pressure-sensitive adhesive tape is less likely to peel between the support and the non-ultraviolet-curable pressure-sensitive adhesive layer, and therefore, the pressure-sensitive adhesive tape can be prevented from remaining on the adherend side during peeling. In addition, since the tensile strength of the non-ultraviolet curable adhesive layer is within a certain range, the adhesive tape is not easily torn at the time of release.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, it is possible to provide an adhesive tape which can be used for a support that does not transmit light in the production of an electronic component and which can suppress peeling and adhesive residue from an adherend and the support even when subjected to a high-temperature treatment, and a method for producing an electronic component using the adhesive tape.
Detailed Description
The following examples illustrate the mode of the present invention in more detail, but the present invention is not limited to these examples.
Example 1
(production of non-ultraviolet curable adhesive)
97 parts by weight of butyl acrylate as an alkyl (meth) acrylate, 3 parts by weight of acrylic acid as a carboxyl group-containing monomer and 120 parts by weight of ethyl acetate were charged into a reactor equipped with a thermometer, a stirrer and a condenser, and after nitrogen substitution, the reactor was heated to start reflux. Next, 0.1 part by weight of azobisisobutyronitrile as a polymerization initiator was added to the above reactor. Reflux was carried out at 70℃for 5 hours to obtain a solution of a (meth) acrylic copolymer (base polymer). The weight average molecular weight and molecular weight distribution in terms of polystyrene were measured by GPC method for the obtained (meth) acrylic copolymer, and the results were 100 ten thousand and 3, respectively. The measurement apparatus and measurement conditions were as follows.
Measurement device: 2690 Separations Model from Waters Co
Column: GPC KF-806L, manufactured by Showa electric company
A detector: differential refractometer
Sample flow rate: 1mL/min
Column temperature: 40 DEG C
Eluent: acetic acid ethyl ester
Next, 0.35 parts by weight of an epoxy curing agent and 10 parts by weight of a silica filler in terms of a solid content ratio were added to 100 parts by weight of the solid content of the (meth) acrylic copolymer contained in the obtained (meth) acrylic copolymer solution, and the mixture was stirred to obtain an ethyl acetate solution of the non-ultraviolet curable adhesive. The following were used as the epoxy curing agent and the silica filler.
Epoxy curing agent: epoxy curing agent containing tertiary amino group and made by MITSUBISHI GAS CHEMICAL company, TETRAD-X
Silica filler: REOLOSIL MT-10 manufactured by Tokuyama Co
(production of ultraviolet-curable adhesive)
A reactor equipped with a thermometer, a stirrer and a condenser was prepared, 94 parts by weight of 2-ethylhexyl acrylate as an alkyl (meth) acrylate, 6 parts by weight of hydroxyethyl methacrylate as a functional group-containing monomer, 0.01 part by weight of dodecyl mercaptan and 80 parts by weight of ethyl acetate were added to the reactor, and then the reactor was heated to start reflux. Next, 0.01 parts by weight of 1, 1-bis (t-hexylperoxy) -3, 5-trimethylcyclohexane as a polymerization initiator was added to the above reactor, and polymerization was started under reflux. Next, 0.01 parts by weight of 1, 1-bis (t-hexylperoxy) -3, 5-trimethylcyclohexane was also added 1 hour and 2 hours after the start of the polymerization, and further, 0.05 parts by weight of t-hexyl peroxypivalate was added 4 hours after the start of the polymerization to continue the polymerization. Then, after 8 hours from the start of polymerization, an ethyl acetate solution of a functional group-containing (meth) acrylic polymer having a solid content of 55% by weight and a weight average molecular weight of 60 ten thousand was obtained.
3.5 parts by weight of 2-isocyanatoethyl methacrylate as the functional group-containing unsaturated compound was added to 100 parts by weight of the resin solid content of the obtained ethyl acetate solution containing the functional group-containing (meth) acrylic polymer, and the resultant was reacted to obtain a polymerizable polymer. Then, 20 parts by weight of a silicon diacrylate as a silicone compound, 3 parts by weight of a silica filler, 30 parts by weight of a urethane acrylate, 0.7 part by weight of an isocyanate-based crosslinking agent, and 1 part by weight of a photopolymerization initiator were mixed with respect to 100 parts by weight of a resin solid content of the obtained ethyl acetate solution of the polymerizable polymer, to obtain an ethyl acetate solution of the ultraviolet-curable adhesive. The following were used as the silicon diacrylate, the silica filler, the urethane acrylate, the isocyanate-based crosslinking agent, and the photopolymerization initiator.
Silicon diacrylate: EBECRYL 350, manufactured by DAICEL-allnex Corp., weight average molecular weight 1000
Silica filler: REOLOSIL MT-10 manufactured by Tokuyama Co
Urethane acrylate: UN-5500 manufactured by Gen Industrial Co Ltd
Isocyanate-based crosslinking agent: coronate L, nippon Urethane Industries Co
Photopolymerization initiator: esacure One, nihon SiberHegner Co
(production of adhesive tape)
The obtained ultraviolet curable adhesive solution was coated on a 50 μm polyethylene terephthalate (PET) film, one surface of which was subjected to a mold release treatment, with a doctor blade so that the thickness of the dried coating film became 40 μm, and the coating solution was heated at 110 ℃ for 5 minutes, whereby an ultraviolet curable adhesive layer was obtained.
The obtained non-ultraviolet curable adhesive solution was coated on a transparent PET film having a thickness of 50 μm, which was subjected to a mold release treatment on one side, with a doctor blade so that the thickness of the dried coating film became 40 μm, and the coated solution was heated at 110 ℃ for 5 minutes, whereby a non-ultraviolet curable adhesive layer was obtained.
The obtained ultraviolet-curable adhesive layer and the non-ultraviolet-curable adhesive layer were bonded to each other on the face of the non-laminated PET film to obtain an adhesive tape.
(measurement of tensile Strength)
An adhesive tape comprising only a non-ultraviolet-curable adhesive layer was produced by the above method. The obtained non-ultraviolet curable adhesive layer was cut into a thickness of 200 μm and a width of 10mm, and the tensile strength was measured at a speed of 300 mm/min and a distance between the marks of 40mm using a TENSILON UCE500 (manufactured by ORIENTEC Co.) as a sample at 23℃and 50% RH. The tensile strength of the resulting adhesive tape before curing was measured by the same method.
(determination of outgassing amount)
The pressure-sensitive adhesive tape containing only the non-ultraviolet-curable pressure-sensitive adhesive layer was produced by the above method, and the obtained pressure-sensitive adhesive tape containing only the non-ultraviolet-curable pressure-sensitive adhesive layer was cut out by 5mm×5mm to produce a measurement sample. The obtained measurement sample was measured by thermal desorption GC-MS, and the amount of the obtained gas (ppm in terms of toluene: μg/g) was used as the gas release amount. The instrument and measurement conditions used were as follows.
Thermal desorption device: turboMatrix 350, manufactured by Perkinelmer Co
GC-MS device: JMS Q1000 manufactured by Japanese electronics Co., ltd
Sample heating conditions: 260 15min (20 mL/min)
And (3) secondary desorption: 350 ℃,40min
Splitting: inlet 25mL/min and outlet 25mL/min
Injection amount: 2.5%
Column: EQUITY-1 (nonpolar, manufactured by SIGMA-ALDRICH Co.) 0.32 mm. Times.60 m.times.0.25 μm
GC temperature rise: 40 ℃ (4 min) →heating at a rate of 10 ℃/min→300 ℃ (10 min)
He flow rate: 1.5mL/min
Ionization voltage: 70eV
MS measurement range: 29-600 amu (scanning 500 ms)
MS temperature: an ion source; 230 ℃, interface; 250 DEG C
(determination of adhesive Strength)
An adhesive tape containing only a non-ultraviolet-curable adhesive layer was produced as a measurement sample by the above method. The obtained pressure-sensitive adhesive tape containing only the non-ultraviolet-curable pressure-sensitive adhesive layer was cut out to 10mm×10mm, and a measurement sample was prepared. For the obtained measurement sample, probe tack measurement was performed. The instrument and measurement conditions used were as follows.
Tack tester: TAC1000 manufactured by RHECA Co
Probe diameter: 3mm phi
Crimping load: 100g of
Crimping time: 1 second
Contact speed: 30mm min
Peeling speed: 600mm/min
(determination of gel fraction)
Only 0.1g of the obtained non-ultraviolet curable adhesive layer of the adhesive tape was scraped and immersed in 50ml of ethyl acetate, and the resultant adhesive tape was shaken by a shaker at a temperature of 23℃and 120rpm for 24 hours (hereinafter, the scraped non-ultraviolet curable adhesive layer was referred to as an adhesive composition). After shaking, the ethyl acetate was separated from the adhesive composition swollen by absorbing ethyl acetate using a metal mesh (mesh # 200). The separated adhesive composition was dried at 110℃for 1 hour. The weight of the dried adhesive composition including the metal mesh was measured, and the gel fraction of the non-ultraviolet curable adhesive layer was calculated using the following formula. The results are shown in tables 1 and 2.
Gel fraction (wt%) =100× (W 1 -W 2 )/W 0
(W 0 : initial adhesive composition weight, W 1 : weight of dried adhesive composition containing metal net, W 2 : initial weight of metal mesh
Examples 2 to 11 and comparative examples 1 to 11
Adhesive tapes were produced in the same manner as in example 1 except that the amounts of butyl acrylate, acrylic acid and silica filler in the non-uv curable adhesive layer were changed as shown in tables 1 and 2, the weight average molecular weight and molecular weight distribution of the base polymer were changed as shown in tables 1 and 2, and the amounts of the tackifiers shown in tables 1 and 2 were added, and the physical properties were measured. As the tackifier, UN5500 manufactured by the industrial company of the root corporation was used. As the isocyanate-based curing agent, coronate L manufactured by eastern co.
< evaluation >
The adhesive tapes obtained in examples and comparative examples were evaluated by the following methods. The results are shown in tables 1 and 2.
(1) Evaluation of substrates after heat treatment
The ultraviolet-curable adhesive layer-side surface of the adhesive tape was attached to a substrate (TPWB-S02-readut, manufactured by dacron electronics corporation) to obtain a laminate. Next, a high-pressure mercury ultraviolet irradiator was used so that the irradiation intensity to the surface of the adhesive tape became 100mW/cm 2 The illuminance was adjusted by irradiating 365nm ultraviolet rays from the non-ultraviolet-curable adhesive layer side for 30 seconds to crosslink and cure the ultraviolet-curable adhesive layer. Then, the non-ultraviolet curable adhesive layer of the laminate was adhered to a CCL support (copper clad laminate), and heat treatment was performed at 260 ℃ for 6 minutes in total 3 times. After the heat treatment is completed, the adhesive tape is released from the substrate. The release of the pressure-sensitive adhesive tape, foaming of the non-ultraviolet-curable pressure-sensitive adhesive layer, and residual adhesion of the substrate were evaluated as follows.
(evaluation of peeling of adhesive tape)
The pressure-sensitive adhesive tape after completion of the heat treatment was visually inspected, and the pressure-sensitive adhesive tape was evaluated by marking the case where the ultraviolet-curable pressure-sensitive adhesive layer was not peeled off or gaps were left at the interface with the substrate as "o", the case where some of the pressure-sensitive adhesive layer was peeled off or gaps were left as "Δ", and the case where the entire surface was peeled off or gaps was left as "x".
(evaluation of foaming of non-ultraviolet-curable adhesive layer)
The non-ultraviolet-curable adhesive layer of the adhesive tape after the completion of the heat treatment was visually observed, and the non-foaming was evaluated as "verygood", the substantially non-foaming was marked as "good", the partially foaming was marked as "Δ", and the entire surface of the adhesive tape was foamed as "×".
(evaluation of residual glue of substrate)
The peeled substrate was observed with an optical microscope, the case where no residual glue was recorded as "verygood", the case where substantially no residual glue was recorded as "good", the case where a part of residual glue was recorded as "Δ", the case where residual glue was present over the entire surface was recorded as "×", and the residual glue of the substrate was evaluated.
(2) Evaluation of chemical resistance
A polyimide film was attached to the uv-curable adhesive layer of the obtained adhesive tape, and a CCL panel (copper-clad laminate) was attached to the non-uv-curable adhesive layer, thereby producing a measurement sample. The obtained measurement sample was immersed in PINE ALPHA (manufactured by the chemical industry Co., ltd.) at 70℃for 2 hours, and dried in an oven at 110℃for 1 hour. The weight reduction rate before and after impregnation was measured.
The weight loss rate before and after impregnation was 3.0% or less, the weight loss rate was "good", the weight loss rate greater than 3.0% and 5.0% or less was "good", the weight loss rate greater than 5.0% and 8.0% or less was "delta", and the weight loss rate greater than 8.0% or the weight loss rate of the pressure-sensitive adhesive tape from the adherend was "poor", and the chemical resistance was evaluated.
Figure BDA0002986705940000261
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Figure BDA0002986705940000271
Industrial applicability
According to the present invention, it is possible to provide an adhesive tape which can be used for a support that does not transmit light in the production of an electronic component and which can suppress peeling and adhesive residue from an adherend and the support even when subjected to a high-temperature treatment, and a method for producing an electronic component using the adhesive tape.

Claims (16)

1. An adhesive tape comprising a non-ultraviolet-curable adhesive layer and an ultraviolet-curable adhesive layer laminated on the non-ultraviolet-curable adhesive layer,
the non-ultraviolet curable adhesive layer has a tensile strength of 5.0N/10mm or more and 20.0N/10mm or less at 23 ℃ and,
the release amount of the non-ultraviolet curable adhesive layer when heated at 260 ℃ for 15 minutes is 10000ppm or less.
2. The adhesive tape according to claim 1, wherein the adhesive strength of the non-ultraviolet curable adhesive layer is 10gf/3mm phi-300 gf/3mm phi.
3. The adhesive tape according to claim 1 or 2, wherein the non-ultraviolet curable adhesive layer contains:
a (meth) acrylic copolymer having a weight average molecular weight c of 70 ten thousand or more and a molecular weight distribution d of 2 to 6, the (meth) acrylic copolymer comprising 92 to 97% by weight of an alkyl (meth) acrylate a having 4 to 12 carbon atoms and 3.0 to 8.0% by weight of a carboxyl group-containing monomer b as constituent components;
An epoxy compound having a tertiary amine structure as a curing agent B; and
a filler C, which is used for filling the filler,
the curing agent B is contained in an amount of 0.1 to 0.5 parts by weight, and the filler C is contained in an amount of 3 to 20 parts by weight, based on 100 parts by weight of the base polymer A.
4. The adhesive tape according to claim 3, wherein the non-ultraviolet curable adhesive layer comprises 30 parts by weight or less of a tackifier with respect to 100 parts by weight of the (meth) acrylic copolymer.
5. The adhesive tape according to claim 1 or 2, wherein the ultraviolet-curable adhesive layer contains an ultraviolet-curable adhesive component and a silicone compound having a weight-average molecular weight of 300 to 50000 and having a functional group capable of crosslinking with the ultraviolet-curable adhesive component.
6. The adhesive tape according to claim 1 or 2, wherein the gel fraction of the non-ultraviolet-curable adhesive layer is 80% or more.
7. Adhesive tape according to claim 1 or 2, wherein the adhesive tape has a tensile strength of 2.5N/10mm to 10N/10mm at 23 ℃ before curing.
8. An adhesive tape comprising a non-ultraviolet-curable adhesive layer and an ultraviolet-curable adhesive layer laminated on the non-ultraviolet-curable adhesive layer,
The non-ultraviolet curable adhesive layer is heated at 260 ℃ for 15 minutes to release 10000ppm or less of air and,
the non-ultraviolet curable adhesive layer contains:
a (meth) acrylic copolymer as a base polymer A' comprising 92 to 97% by weight of an alkyl (meth) acrylate having an alkyl group having 4 to 12 carbon atoms as a constituent;
an epoxy compound having a tertiary amine structure as a curing agent B; and
and a filler C.
9. The adhesive tape according to claim 8, wherein the (meth) acrylic copolymer contains 3.0 to 8.0 wt% of a carboxyl group-containing monomer as a constituent component, and the (meth) acrylic copolymer has a weight average molecular weight of 70 ten thousand or more and a molecular weight distribution of 2 to 6.
10. The adhesive tape according to claim 8 or 9, wherein the curing agent B is contained in an amount of 0.1 to 0.5 parts by weight and the filler C is contained in an amount of 3 to 20 parts by weight with respect to 100 parts by weight of the base polymer a'.
11. The adhesive tape according to claim 8 or 9, wherein the non-ultraviolet curable adhesive layer comprises 30 parts by weight or less of a tackifier with respect to 100 parts by weight of the (meth) acrylic copolymer.
12. The adhesive tape according to claim 8 or 9, wherein the gel fraction of the non-ultraviolet-curable adhesive layer is 80% or more.
13. Adhesive tape according to claim 8 or 9, wherein the adhesive tape has a tensile strength of 2.5N/10mm to 10N/10mm at 23 ℃ before curing.
14. The adhesive tape according to claim 8 or 9, wherein the ultraviolet-curable adhesive layer contains an ultraviolet-curable adhesive component and a silicone compound having a weight-average molecular weight of 300 to 50000 having a functional group capable of crosslinking with the ultraviolet-curable adhesive component.
15. The adhesive tape according to claim 1, 2, 8 or 9, which is used in a manufacturing method of an electronic component, the manufacturing method of the electronic component comprising:
an adherend attaching step of attaching the ultraviolet-curable adhesive layer to the adherend;
a curing step of irradiating ultraviolet rays to cure the ultraviolet-curable adhesive layer;
a support attaching step of attaching a support to the non-ultraviolet-curable adhesive layer;
a heat treatment step of treating the adherend at a high temperature of 150 ℃ or higher; and
and a peeling step of peeling the adherend from the adhesive tape.
16. A method of manufacturing an electronic component, comprising:
an adherend attaching step of attaching the adhesive tape according to claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, or 15 to an adherend with the ultraviolet-curable adhesive layer;
a curing step of irradiating ultraviolet rays to cure the ultraviolet-curable adhesive layer;
a support attaching step of attaching a support to the non-ultraviolet-curable adhesive layer;
a heat treatment step of treating the adherend at a high temperature of 150 ℃ or higher; and
and a peeling step of peeling the adherend from the adhesive tape.
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