CN112738990B - 一种印刷电路板、显示模组及led显示屏 - Google Patents
一种印刷电路板、显示模组及led显示屏 Download PDFInfo
- Publication number
- CN112738990B CN112738990B CN202011265238.9A CN202011265238A CN112738990B CN 112738990 B CN112738990 B CN 112738990B CN 202011265238 A CN202011265238 A CN 202011265238A CN 112738990 B CN112738990 B CN 112738990B
- Authority
- CN
- China
- Prior art keywords
- layer
- hole
- copper foil
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011265238.9A CN112738990B (zh) | 2020-11-12 | 2020-11-12 | 一种印刷电路板、显示模组及led显示屏 |
PCT/CN2021/115449 WO2022100210A1 (fr) | 2020-11-12 | 2021-08-30 | Carte de circuit imprimé, module d'affichage et écran d'affichage à del |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011265238.9A CN112738990B (zh) | 2020-11-12 | 2020-11-12 | 一种印刷电路板、显示模组及led显示屏 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112738990A CN112738990A (zh) | 2021-04-30 |
CN112738990B true CN112738990B (zh) | 2022-08-23 |
Family
ID=75597464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011265238.9A Active CN112738990B (zh) | 2020-11-12 | 2020-11-12 | 一种印刷电路板、显示模组及led显示屏 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN112738990B (fr) |
WO (1) | WO2022100210A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112738990B (zh) * | 2020-11-12 | 2022-08-23 | 深圳市艾比森光电股份有限公司 | 一种印刷电路板、显示模组及led显示屏 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130003917A (ko) * | 2011-07-01 | 2013-01-09 | 대덕전자 주식회사 | 부품내장형 인쇄회로기판의 패드 제조 방법 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7112524B2 (en) * | 2003-09-29 | 2006-09-26 | Phoenix Precision Technology Corporation | Substrate for pre-soldering material and fabrication method thereof |
KR101022942B1 (ko) * | 2008-11-12 | 2011-03-16 | 삼성전기주식회사 | 흐름 방지용 댐을 구비한 인쇄회로기판 및 그 제조방법 |
CN103545439A (zh) * | 2013-10-09 | 2014-01-29 | 厦门吉瓦特照明科技有限公司 | 一种倒装结构led cob光源散热基板装置 |
CN107278050B (zh) * | 2017-08-07 | 2019-10-29 | 郑州云海信息技术有限公司 | 一种pcba非对称焊盘钢网开窗方法与系统 |
CN112738990B (zh) * | 2020-11-12 | 2022-08-23 | 深圳市艾比森光电股份有限公司 | 一种印刷电路板、显示模组及led显示屏 |
-
2020
- 2020-11-12 CN CN202011265238.9A patent/CN112738990B/zh active Active
-
2021
- 2021-08-30 WO PCT/CN2021/115449 patent/WO2022100210A1/fr active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130003917A (ko) * | 2011-07-01 | 2013-01-09 | 대덕전자 주식회사 | 부품내장형 인쇄회로기판의 패드 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
CN112738990A (zh) | 2021-04-30 |
WO2022100210A1 (fr) | 2022-05-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
RU2327311C2 (ru) | Способ встраивания компонента в основание | |
KR100792352B1 (ko) | 패키지 온 패키지의 바텀기판 및 그 제조방법 | |
US6625036B1 (en) | Infrared data communication module and method of making the same | |
KR100859004B1 (ko) | 전자소자 내장형 인쇄회로기판의 제조방법 | |
JP2003142831A (ja) | 電子部品内装配線板およびその製造方法 | |
US20120008287A1 (en) | Electronic component module and method of manufacturing the same | |
US10660227B2 (en) | Electronic module and method of manufacturing electronic module | |
CN112738990B (zh) | 一种印刷电路板、显示模组及led显示屏 | |
JP5454681B2 (ja) | モジュール基板およびその製造方法 | |
JP2007189066A (ja) | 電子部品の製造方法及び電子部品の基板集合体 | |
JP5172319B2 (ja) | セラミック部品の製造方法 | |
US11246225B2 (en) | Circuit board with high reflectivity and method for manufacturing the same | |
TWI741891B (zh) | 電路板結構及其製作方法 | |
CN111315131A (zh) | 电路板及其制作方法 | |
EP2750172A1 (fr) | Substrat de câblage | |
JP2009283733A (ja) | セラミック部品の製造方法 | |
TWI780503B (zh) | 發光封裝體及其製造方法 | |
CN118038766B (zh) | Led显示器及其制造方法 | |
JP2005285945A (ja) | 導電路形成方法 | |
WO2021088336A1 (fr) | Procédé de fabrication d'une carte de circuit imprimé contenant une pièce en céramique, et carte de circuit imprimé correspondante | |
KR100771307B1 (ko) | 인쇄회로기판 | |
US11792927B2 (en) | Interconnect substrate | |
US20240159977A1 (en) | Surface mountable optoelectronic device with side walls including slots filled with a laminated encapsulant material | |
US20220071000A1 (en) | Circuit board structure and manufacturing method thereof | |
US20230327056A1 (en) | Surface mountable optoelectronic device with side walls including slots filled with a laminated encapsulant material |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |