CN112735982B9 - 晶圆蓝膜取晶固晶装置 - Google Patents
晶圆蓝膜取晶固晶装置 Download PDFInfo
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- CN112735982B9 CN112735982B9 CN202011605839.XA CN202011605839A CN112735982B9 CN 112735982 B9 CN112735982 B9 CN 112735982B9 CN 202011605839 A CN202011605839 A CN 202011605839A CN 112735982 B9 CN112735982 B9 CN 112735982B9
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- guide rail
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- 239000013078 crystal Substances 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 11
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims 5
- 235000012431 wafers Nutrition 0.000 abstract description 73
- 239000007787 solid Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000012528 membrane Substances 0.000 description 4
- 238000012858 packaging process Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011605839.XA CN112735982B9 (zh) | 2020-12-30 | 2020-12-30 | 晶圆蓝膜取晶固晶装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202011605839.XA CN112735982B9 (zh) | 2020-12-30 | 2020-12-30 | 晶圆蓝膜取晶固晶装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
CN112735982A CN112735982A (zh) | 2021-04-30 |
CN112735982B CN112735982B (zh) | 2021-09-14 |
CN112735982B9 true CN112735982B9 (zh) | 2021-10-08 |
Family
ID=75611748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202011605839.XA Active CN112735982B9 (zh) | 2020-12-30 | 2020-12-30 | 晶圆蓝膜取晶固晶装置 |
Country Status (1)
Country | Link |
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CN (1) | CN112735982B9 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114211248A (zh) * | 2021-12-31 | 2022-03-22 | 深圳新益昌科技股份有限公司 | 晶片自动安装装置 |
CN114883223B (zh) * | 2022-05-23 | 2023-09-05 | 江苏新智达新能源设备有限公司 | 一种半导体共晶焊的封装装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09283543A (ja) * | 1996-04-19 | 1997-10-31 | Sony Corp | ダイボンド装置 |
CN103311171A (zh) * | 2013-06-14 | 2013-09-18 | 邹志峰 | 一种多吸头芯片固定设备 |
CN109786311A (zh) * | 2019-01-28 | 2019-05-21 | 深圳市新益昌自动化设备有限公司 | 一种mini-LED高速固晶机及固晶方法 |
CN109979856A (zh) * | 2019-04-03 | 2019-07-05 | 深圳市联得自动化装备股份有限公司 | 倒装固晶设备及其方法 |
CN110379746A (zh) * | 2019-08-05 | 2019-10-25 | 江苏新智达新能源设备有限公司 | 一种多工位多芯片的半导体封装设备 |
CN210223951U (zh) * | 2019-09-16 | 2020-03-31 | 深圳新益昌科技股份有限公司 | 一种全自动ic平面固晶机的固晶机构 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4684569B2 (ja) * | 2004-03-31 | 2011-05-18 | 株式会社ディスコ | テープ拡張装置 |
JP6341641B2 (ja) * | 2013-08-09 | 2018-06-13 | ファスフォードテクノロジ株式会社 | ダイボンダ |
CN109065494B (zh) * | 2018-07-27 | 2020-10-20 | 广东阿达智能装备有限公司 | 封装设备及其晶圆蓝膜的张紧和调节装置 |
CN111383968A (zh) * | 2020-03-25 | 2020-07-07 | 广东省智行机器人科技有限公司 | 一种实现晶圆盘升降的固晶机内环模组及其升降方法 |
-
2020
- 2020-12-30 CN CN202011605839.XA patent/CN112735982B9/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09283543A (ja) * | 1996-04-19 | 1997-10-31 | Sony Corp | ダイボンド装置 |
CN103311171A (zh) * | 2013-06-14 | 2013-09-18 | 邹志峰 | 一种多吸头芯片固定设备 |
CN109786311A (zh) * | 2019-01-28 | 2019-05-21 | 深圳市新益昌自动化设备有限公司 | 一种mini-LED高速固晶机及固晶方法 |
CN109979856A (zh) * | 2019-04-03 | 2019-07-05 | 深圳市联得自动化装备股份有限公司 | 倒装固晶设备及其方法 |
CN110379746A (zh) * | 2019-08-05 | 2019-10-25 | 江苏新智达新能源设备有限公司 | 一种多工位多芯片的半导体封装设备 |
CN210223951U (zh) * | 2019-09-16 | 2020-03-31 | 深圳新益昌科技股份有限公司 | 一种全自动ic平面固晶机的固晶机构 |
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Publication number | Publication date |
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CN112735982B (zh) | 2021-09-14 |
CN112735982A (zh) | 2021-04-30 |
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CI03 | Correction of invention patent |
Correction item: Denomination of Invention|Abstract|Claims|Description Correct: Wafer blue film crystal taking and fixing device|Correct False: Crystal taking and crystal fixing device for crystal blue film|error Number: 38-01 Page: full text Volume: 37 Correction item: Denomination of Invention Correct: Wafer blue film crystal taking and fixing device False: Crystal taking and crystal fixing device for crystal blue film Number: 38-01 Volume: 37 |
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CI03 | Correction of invention patent | ||
CB03 | Change of inventor or designer information |
Inventor after: Xiang Jun Inventor before: Xiang Jun Inventor before: Feng Hao Inventor before: Feng Xiaxia Inventor before: Wang Jinlei |
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CB03 | Change of inventor or designer information |