CN112735264B - 制造显示装置的方法及由该方法制造的显示装置 - Google Patents

制造显示装置的方法及由该方法制造的显示装置 Download PDF

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Publication number
CN112735264B
CN112735264B CN202011101550.4A CN202011101550A CN112735264B CN 112735264 B CN112735264 B CN 112735264B CN 202011101550 A CN202011101550 A CN 202011101550A CN 112735264 B CN112735264 B CN 112735264B
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cut
adhesive tape
substrate
acf
base film
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CN112735264A (zh
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闵眞植
罗珉贞
余尙原
李锺寅
郑昶燮
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
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    • H01L24/27—Manufacturing methods
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • G—PHYSICS
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    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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    • G02F2202/28—Adhesive materials or arrangements
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Abstract

提供了一种制造显示装置的方法及由该方法制造的显示装置。所述方法包括：设置粘合带，粘合带包括基体膜、在基体膜上的粘合导电层，其中，粘合带具有切割宽度和间隔，切割宽度与基底的粘合带附接区域的宽度对应，粘合带被设置为具有沿着基体膜彼此相邻的多个切割宽度，间隔在彼此相邻的多个切割宽度之间；在间隔内，对粘合带执行多个半切割，以形成多切割粘合带；以及在多切割粘合带的与切割宽度对应的第一部分处，将多切割粘合带按压到基底，以将多切割粘合带的第一部分与基体膜分离，并且在基底的粘合带附接区域处，将多切割粘合带的第一部分附接到基底。

Description

制造显示装置的方法及由该方法制造的显示装置
技术领域
发明的实施例涉及一种各向异性导电膜(“ACF”)附接设备、一种使用该ACF附接设备制造显示装置的方法以及由该方法制造的显示装置。更具体地，发明涉及一种制造与ACF附接设备一起使用的可以减小ACF的尺寸公差的显示装置的方法以及由此制造的显示装置。
背景技术
显示装置包括用于显示图像的多个像素以及连接到多个像素的多条栅极线和多条数据线。根据信号控制器的控制将具有栅极导通电压的栅极信号顺序地施加到多条栅极线，并且将数据电压施加到与栅极导通电压的栅极信号对应的多条数据线，从而显示图像。
为了驱动这样的显示装置，信号线从诸如栅极驱动电路、数据驱动电路等的驱动器接收各种电信号。将驱动电路安装或连接到显示装置内的其它组件的方法包括带式自动接合(“TAB”)方法、玻璃上芯片(“COG”)方法、膜上芯片(“COF”)方法等。
发明内容
发明的实施例提供了一种制造显示装置的方法，所述方法包括：设置粘合带，粘合带包括基体膜、在基体膜上的粘合导电层，其中，粘合带具有切割宽度和间隔，切割宽度与基底的粘合带附接区域的宽度对应，粘合带被设置为具有沿着基体膜彼此相邻的多个切割宽度，间隔在彼此相邻的多个切割宽度之间；在间隔内，对粘合带执行多个半切割，以形成多切割粘合带；以及在多切割粘合带的与切割宽度对应的第一部分处，将多切割粘合带按压到基底，以将多切割粘合带的第一部分与基体膜分离，并且在基底的粘合带附接区域处，将多切割粘合带的第一部分附接到基底。
每个半切割可以仅穿透基体膜和粘合导电层之中的粘合导电层。
基底可以是包括显示像素的显示面板或可电连接到显示面板的印刷电路板。
将多切割粘合带的第一部分与基体膜分离的按压多切割粘合带的步骤可以将多切割粘合带的与间隔对应的第二部分保留在基体膜上。
两个间隔可以分别包括第一半切割和第二半切割，第一半切割和第二半切割限定第一半切割与第二半切割之间的切割宽度，并且多切割粘合带的在基底的粘合带附接区域处附接到基底的第一部分的侧表面可以分别与第一半切割和第二半切割对应。
两个间隔可以分别包括第一半切割和第二半切割，第一半切割和第二半切割限定第一半切割与第二半切割之间的切割宽度，将多切割粘合带按压到基底的按压器可以包括与第一半切割对应的边缘，并且多切割粘合带的在基底的粘合带附接区域处附接到基底的第一部分的第一侧表面可以与按压器的边缘对应。
多切割粘合带的在基底的粘合带附接区域处附接到基底的第一部分的第二侧表面可以与第二半切割对应。
对粘合带执行多个半切割的步骤可以形成沿着基体膜彼此间隔开切割间隔的多个半切割，并且切割间隔可以在约10微米(μm)至约100μm之间。
对粘合带执行多个半切割的步骤可以在间隔内形成多个半切割，并且多个半切割的数量可以为约2至约20。
发明的实施例提供了一种显示装置，所述显示装置包括：基底，包括粘合带附接区域；各向异性导电膜，在粘合带附接区域处电连接到基底，各向异性导电膜是多切割粘合带的一部分；以及集成电路，通过各向异性导电膜电连接到基底。多切割粘合带具有：切割宽度，与粘合带附接区域的宽度对应；以及两个间隔，沿着基体膜彼此面对且切割宽度在两个间隔之间，其中，两个间隔之中的每个间隔包括多个半切割，多个半切割均在垂直于基底的方向上延伸，以限定多切割粘合带，并且多切割粘合带的作为各向异性导电膜的所述一部分包括与多个半切割之中的半切割对应的侧表面。
基底可以是包括显示像素的显示面板。
基底可以是可电连接到包括显示像素的显示面板的印刷电路板。
基底可以是电连接到包括显示像素的显示面板的柔性印刷电路板。
显示装置还可以包括通过各向异性导电膜电连接到基底的柔性印刷电路板。
多切割粘合带还可以包括沿着基体膜彼此间隔开切割间隔的多个半切割，并且切割间隔可以为约10μm至约100μm。
多切割粘合带还可以包括仅穿透基体膜和粘合导电层之中的粘合导电层的每个半切割。
发明的实施例提供了一种用于在显示装置中附接粘合导电层的设备，所述设备包括：粘合带供应器，供应粘合带，粘合带包括基体膜、在基体膜上的粘合导电层，其中，粘合带具有切割宽度和间隔，切割宽度与显示装置的基底的粘合带附接区域的宽度对应，粘合带被设置为具有沿着基体膜彼此相邻的多个切割宽度，间隔沿着基体膜在彼此相邻的多个切割宽度之间；切割器，在间隔处对粘合带执行多个半切割，以限定多切割粘合带；以及按压器，在多切割粘合带的与切割宽度对应的第一部分处，将多切割粘合带按压到基底，以将多切割粘合带的第一部分与基体膜分离，并且在基底的粘合带附接区域处，将多切割粘合带的第一部分附接到基底。
执行多个半切割的切割器可以在基体膜和粘合导电层之中限定包括仅穿透粘合导电层的每个半切割的多切割粘合带。
执行多个半切割的切割器可以限定包括多个半切割的多切割粘合带，所述多个半切割沿着基体膜彼此间隔开切割间隔，切割间隔为约10μm至约100μm。
执行多个半切割的切割器可以限定在间隔内包括多个半切割的多切割粘合带，并且多个半切割的数量可以为约2至约20。
根据发明的一个或更多个实施例，可以均匀地形成附接到显示装置的基底的各向异性导电膜(“ACF”)的侧表面，从而减小在制造显示装置时使用的ACF的尺寸公差。
附图说明
通过参照附图进一步详细描述本公开的实施例，本公开的上面和其它优点及特征将变得更加明显，在附图中：
图1示出了各向异性导电膜(“ACF”)附接设备的实施例的示意图；
图2示出了制造包括多切割ACF带的显示装置的方法中的工艺的实施例；
图3示出了将从多切割ACF带获得的ACF附接到基底的工艺的实施例；
图4示出了按压部件相对于多切割ACF带的位置误差；
图5示出了基于位置误差附接到基底的从多切割ACF带获得的ACF的实施例；
图6和图7示出了将从单切割ACF带获得的ACF附接到基底的对比示例；以及
图8和图9分别示出了使用多切割ACF带制造的显示装置的实施例。
具体实施方式
在下文中将参照附图更充分地描述发明的实施例，在附图中，示出了发明的实施例。如本领域技术人员将认识到的，在所有不脱离本公开的精神或范围的情况下，可以以各种不同的方式修改所描述的实施例。
此外，利用发明的实施例，通过对于相同的构成元件使用相同的附图标记，参照相关附图对第一实施例中的构成元件进行详细描述，而在其它实施例中仅描述与第一实施例相关的构成元件不同的构成元件。
与描述无关的部分将被省略以清楚地描述本公开，并且在整个说明书中，同样的附图标记表示同样的元件。
此外，在附图中，为了易于描述，任意地示出了每个元件的尺寸和厚度，并且本公开不必限于附图中所示出的尺寸和厚度。在附图中，为了清楚起见，夸大了层、膜、面板、区域、区等的厚度。在附图中，为了易于描述，夸大了一些层和区域的厚度。
将理解的是，当元件、层、膜、区或基底被称为与另一元件相关(诸如“在”另一元件“上”)时，该元件、层、膜、区或基底可以直接在所述另一元件上，或者也可以存在中间元件。相反，当元件被称为与另一元件相关(诸如“直接在”另一元件“上”)时，不存在中间元件。
此外，在说明书中，词语“在……上”或“在……上方”意味着定位在对象部分上或下方，并且不必意味着基于重力方向定位在对象部分的上侧上。此外，相对术语(诸如“下”或“底部”和“上”或“顶部”)可以在此用于描述如附图中所示出的一个元件与另一元件的关系。将理解的是，相对术语旨在包含装置的除了附图中所描绘的方位之外的不同方位。例如，如果附图中的一个附图中的装置被翻转，则被描述为在其它元件的“下”侧上的元件将随后被定位在其它元件的“上”侧上。因此，示例性术语“下”可以根据附图的具体方位包含“下”和“上”两种方位。类似地，如果附图中的一个附图中的装置被翻转，则被描述为“在”其它元件“下方”或“之下”的元件将随后被定位“在”其它元件“上方”。因此，示例性术语“在……下方”或“在……之下”可以包含上方和下方两种方位。
将理解的是，尽管在此可以使用术语“第一”、“第二”、“第三”等来描述各种元件、组件、区、层和/或部分，但是这些元件、组件、区、层和/或部分不应该被这些术语所限制。这些术语仅用于将一个元件、组件、区、层或部分与另一元件、组件、区、层或部分区分开。因此，在不脱离在此教导的情况下，下面讨论的第一元件、第一组件、第一区、第一层或第一部分可以被称为第二元件、第二组件、第二区、第二层或第二部分。
在此使用的术语仅用于描述具体实施例的目的，并且不旨在成为限制。如在此所使用的，除非上下文另外清楚地指示，否则“一个(种/者)”、“所述(该)”和“至少一个(种/者)”不表示数量的限制，并且旨在包括单数和复数两者。例如，除非上下文另外清楚地指示，否则“元件”具有与“至少一个元件”的含义相同的含义。“至少一个(种/者)”不被解释为限制“一个(种/者)”。“或”意味着“和/或”。如在此所使用的，术语“和/或”包括一个或更多个相关所列项的任何组合和所有组合。在本说明书中，除非明确地相反描述，否则词语“包括”及诸如“包括”的变型将被理解为指包括所陈述的元件但不排除任何其它元件。
如在此所使用的“约”或“近似地”包括所陈述的值，并且意味着考虑到所讨论的测量和与具体量的测量相关的误差(即，测量系统的限制)，对于具体值在如由本领域普通技术人员所确定的可接受的偏差的范围内。例如，“约”可以意味着在一个或更多个标准偏差内，或在所陈述值的±30％、±20％、±10％或±5％内。
除非另外定义，否则在此所使用的所有术语(包括技术术语和科学术语)具有与本公开所属领域的普通技术人员通常理解的含义相同的含义。还将理解的是，术语(诸如在常用词典中定义的术语)应该被解释为具有与它们在相关领域和本公开的上下文中的含义一致的含义，并且将不以理想化或过于形式化的含义来解释，除非在此明确地如此定义。
在此参照作为理想化实施例的示意性图示的剖面图示来描述实施例。如此，预期由例如制造技术和/或公差导致的图示的形状的变化。因此，在此所描述的实施例不应该被解释为限于如在此所示出的区的具体形状，而是包括例如由制造导致的形状上的偏差。例如，示出或描述为平坦的区通常可以具有粗糙的和/或非线性的特征。此外，所示出的锐角可以是圆形的。因此，附图中所示出的区本质上是示意性的，并且它们的形状不旨在示出区的精确形状，并且不旨在限制本权利要求的范围。
在显示装置50(见图8)内，驱动电路可以通过诸如带式自动接合(“TAB”)方法、玻璃上芯片(“COG”)方法、膜上芯片(“COF”)方法等的各种方法可安装或可连接到显示装置50内的其它组件。根据TAB方法、COG方法、COF方法等，各向异性导电膜(“ACF”)用于在驱动电路与显示面板之间或驱动电路与印刷电路板之间的电连接。
ACF 22'包括分散在粘合树脂(例如，粘合膜或粘合导电层)中的精细的导电颗粒。当ACF 22'被热压时，驱动电路通过导电颗粒电连接到显示面板和/或印刷电路板。此外，ACF 22'的树脂可以被固化以将驱动电路固定到显示面板和/或印刷电路板。
由于ACF 22'是粘合材料，所以ACF 22'可以作为ACF层22(例如，粘合导电层)设置在基体膜21上，以形成ACF带20(例如，粘合带或粘合导电带)。在制造显示装置50的实施例中，ACF带20中的ACF层22被预切割以适合将被附接到显示面板和/或印刷电路板的基底30的部分的尺寸。在这种情况下，ACF带20内的基体膜21不被切割。基体膜21在ACF带20被按压到基底30上的同时与ACF 22'剥离，使得ACF层22的形成ACF 22'的按压部分附接到基底30。
当发生用于将ACF带20按压到基底30的按压部件140的位置误差时，除了将附接到基底30的部分之外，按压部件140还按压ACF层22的相邻的部分，导致粘合到基底30的ACF22'的边界表面将不规则地撕裂。因此，ACF22'的尺寸公差增加以适应撕裂，这可能增加用于制造显示装置50的成本和/或时间。
在下文中，将参照图1至图5描述ACF附接设备10及使用该ACF附接设备10的ACF附接方法。
图1示出了ACF附接设备10的实施例的示意图。图2示出了制造显示装置50的方法中的工艺的实施例。图3示出了在制造显示装置50的方法中将从被多半切割的ACF带20获得的ACF 22'附接到基底30的工艺的实施例。
参照图1至图3，ACF附接设备10包括带供应部件110(例如，带供应器)、带回收部件120(例如，带收集器)、切割部件130(例如，切割器或切割工具)和按压部件140(例如，按压器或施力器)。
带供应部件110将ACF带20供应到ACF 22'可附接到其的基底30。带供应部件110可以包括ACF带20缠绕在其上的辊。ACF带20可以包括可移除地附接到基体膜21的表面的ACF层22。可以通过将导电颗粒分散在热固性树脂或热塑性树脂中来设置或形成ACF层22。
带回收部件120在ACF附接工艺完成之后对ACF带20的部分进行回收。在ACF附接工艺之前ACF带20的形式可以被称为初始ACF带。带回收部件120可以包括辊，在ACF附接工艺完成之后，ACF带20绕着该辊可缠绕以被收集。带回收部件120可以连接到用于在带回收部件120处收集ACF带20的诸如马达的驱动部件(例如，驱动器)。
切割部件130和按压部件140在处理方向(即，下文中的第一方向X)上都设置在带供应部件110与带回收部件120之间。参照图1至图3，例如，处理方向可以是从左到右。ACF带20的长度可以沿着处理方向限定，而不限于此。
ACF附接设备10的组件、基底30、显示装置50等可以设置在由彼此交叉的第一方向X和第二方向Y限定的平面中。在图1至图3中，例如，水平方向和进入视图或页面的方向可以分别表示第一方向X和第二方向Y。ACF附接设备10的组件、基底30、显示装置50等的厚度可以沿着与第一方向X和第二方向Y中的每个交叉的第三方向Z限定。在图1至图3中，例如，垂直方向可以表示第三方向Z。
切割部件130执行从带供应部件110传送的ACF带20(例如，初始ACF带)的多半切割(“MHC”)，以将切割形式的ACF带20(例如，多切割粘合带)供应到按压部件140。
ACF附接设备10和/或ACF带20具有切割宽度W，所述切割宽度W设置为多个(例如，多个切割宽度W)且布置为沿着处理方向彼此间隔开。切割宽度W与基底30的ACF层22可附接到其的ACF附接区域AP对应。也就是说，切割宽度W是ACF带20的与ACF附接区域AP对应的部分。ACF附接设备10和/或ACF带20还包括沿着处理方向限定在彼此相邻的切割宽度W之间的间隔部分(也被称为间隔)D。
如图2中所示出的，多半切割(“MHC”)意味着执行半切割的工艺以沿着彼此相邻的切割宽度W之间的间隔部分D设置或形成多个半切割。半切割意味着仅切割ACF带20的ACF层22，而不切割ACF带20的基体膜21。图2中标记“MHC”的部分内的实竖直线指示上面描述的多个半切割。
在多半切割MHC的部分内，ACF层22中的半切割之间的切割间隔Cd可以是约10微米(μm)至约100μm。在多半切割MHC的部分内，ACF层22中的半切割的数量可以是约2至约20。然而，在多半切割MHC的部分中，ACF层22中的切割间隔Cd和半切割的数量可以根据ACF 22'的公差而进行各种改变。
切割部件130可以包括诸如刀片的切割工具。切割部件130可以通过使用一个刀片或通过使用沿着处理方向并排布置的多个刀片来执行多个半切割。
按压部件140向已经被多半切割的ACF带20施加力，以将ACF带20按压到基底30上。参照图2，ACF带20按压到基底30可以包括按压面对基底30的ACF附接区域AP的按压部件140，使得ACF层22的切割宽度W在按压部件140与ACF附接区域AP之间。
按压部件140可以包括头部141和缓冲部件142(例如，缓冲器)。缓冲部件142设置在头部141的面对基底30的表面上，以减少在将ACF带20按压到基底30的工艺中可能发生的损坏。缓冲部件142可以包括具有弹性的材料(诸如橡胶或硅树脂)或由具有弹性的材料(诸如橡胶或硅树脂)制成。在沿着处理方向的方向上，按压部件140可以具有与基底30的ACF附接区域AP的宽度对应的宽度。在沿着处理方向的方向上，按压部件140可以具有与切割宽度W的宽度对应的宽度。
为了将ACF带20按压到基底30，按压部件140可以朝向ACF带20和基底30移动(例如，由图2中的箭头所示的向下方向移动)。当按压部件140在对ACF带20按压之后移动远离ACF带20和基底30(例如，由图3中的箭头所示的向上方向移动)时，ACF层22的被按压部分与基体膜21分离并且附接到基底30。ACF层22的被按压部分的宽度与切割宽度W和/或基底30的ACF附接区域AP的宽度对应。
如图2和图3中所示出的，当按压部件140对应于切割宽度W对准以按压ACF带20时，对应于切割宽度W的ACF 22'附接到基底30上，ACF层22的多半切割(“MHC”)部分可以保留在基体膜21上。也就是说，ACF 22'是ACF带20内的ACF层22的第一部分或第一图案。ACF带20内的ACF层22的第二部分或第二图案可以在其对应于多半切割MHC的部分处保留在基体膜21上。ACF层22的第二部分可以是ACF层22的剩余部分，并且可以沿着处理方向与基体膜21一起被传送。
附接到基底30的ACF 22'的侧表面可以沿着处理方向彼此相对地限定。ACF 22'的侧表面与多半切割MHC的部分内的多条半切割线之中的切割线对应。沿着处理方向彼此面对的两个多半切割MHC的部分的切割线可以限定位于其之间的切割宽度W。也就是说，ACF带20包括沿着基体膜21设置为多个的间隔部分D，并且包括设置在彼此相对的两个间隔部分D之间的切割宽度W。两个间隔部分D分别包括限定在其之间的切割宽度W的第一半切割和第二半切割。在基底30的ACF附接区域AP处附接到基底30的ACF 22'包括沿着基体膜21彼此相对的侧表面(即，在第一方向X上彼此相对的侧表面)，并且侧表面分别与第一半切割和第二半切割对应。
在实施例中，ACF附接设备10还可以包括引导部件(例如，引导件)，该引导部件防止ACF带20在由切割部件130和按压部件140执行的工艺期间与传送路径(例如，处理方向)分离或沿着传送路径(例如，处理方向)晃动，并且将ACF带20沿着处理方向引导到正确位置。引导部件可以包括第一引导辊113和第二引导辊115，第一引导辊113用于将从带供应部件110供应的ACF带20引导到切割部件130，第二引导辊115用于将从按压部件140回收的ACF带20引导到带回收部件120。第一引导辊113和第二引导辊115中的至少一个可以用于在由切割部件130或按压部件140执行的工艺中支撑ACF带20。
在下文中，将参照图4和图5描述ACF附接设备10，该ACF附接设备10包括由于工艺误差而与ACF带20的切割宽度W不对准且按压ACF带20的按压部件140。
图4示出了按压部件140相对于被多半切割的ACF带20的位置误差。图5示出了基于针对图4所描述的位置误差附接到基底30的从被多半切割的ACF带20获得的ACF 22'。
参照图4和图5，由于工艺误差，按压部件140的宽度与ACF带20的切割宽度W不匹配，或者按压部件140可能相对于基底30的ACF附接区域AP未对准。可选择地，由于工艺误差，ACF带20的切割宽度W可能与基底30的ACF附接区域AP的宽度不匹配，使得按压部件140可能与ACF带20的切割宽度W不对准。
与ACF带20的切割宽度W或基底30的ACF附接区域AP不对准的按压部件140可以将ACF带20的在切割宽度W处的部分与ACF带20的在多半切割MHC的部分处的一部分一起按压到基底30上。然后，与ACF带20的在切割宽度W处和在多半切割MHC的部分处的部分都对应的ACF 22'附接到基底30。附接到基底30的ACF 22'的第一侧表面可以与多半切割MHC的第一部分的多条半切割线之中的切割线对应并且与按压部件140的第一边缘(例如，图5中的ACF22'的左侧)对应。附接到基底30的ACF 22'的第二侧表面可以与形成切割宽度W的侧表面(例如，图5中的ACF 22'的右侧)的切割线对应。
在图5中在附接到基底30的ACF 22'的左侧处，ACF 22'包括ACF层22的比基底30的ACF附接区域AP宽的部分，所述部分是在多半切割MHC的部分处与ACF层22的被按压部分对应的附加区域Ta。附加区域Ta可以限定ACF 22'的尺寸公差，这增加了制造工艺的额外材料和/或成本。
在下文中，将参照图6和图7描述当从用单次切割穿过ACF层22而不是多次切割穿过ACF层22来半切割的ACF带20获得的ACF 22'附接到基底30时ACF 22'的尺寸公差。
图6和图7示出了将从包括单半切割SHC的ACF带20获得的ACF 22'附接到基底30的对比示例。
参照图6和图7，单半切割SHC意味着在相邻的切割宽度W之间的间隔处执行一次半切割，其中半切割包括相对于与基底30的ACF附接区域AP对应的切割宽度W仅切割ACF层22。
由于工艺误差，当按压部件140与ACF带20的切割宽度W不匹配和/或与基底30上的ACF附接区域AP未对准，然后在单半切割SHC处按压ACF带20时，ACF带20的与单半切割SHC相邻的部分(除了ACF带20的在切割宽度W处将附接到基底30的部分之外)也被按压到基底30上。在这种情况下，ACF层22不沿着单半切割SHC与基体膜21分离，而是被不均匀地撕裂(图7)以限定与基体膜21分离的ACF 22'的不均匀侧表面，并且附接到基底30上。也就是说，附接到基底30的ACF 22'的侧表面(例如，图7中的左侧表面)被设置或形成为非均匀的。ACF22'相对于基底30的附接区域由ACF附接区域AP的平面区域增加了ACF层22在其处被撕裂的非均匀附加区域Tb。非均匀附加区域Tb可以限定ACF 22'的公差，这增加了制造工艺的额外材料和/或成本。
由于ACF层22被撕裂，非均匀附加区域Tb的尺寸会大于图5中所示出的附加区域Ta。也就是说，通过切割包括多半切割MHC的部分的ACF带20而不是通过单半切割SHC切割ACF带20，可以减小ACF 22'的尺寸公差。
图8和图9分别示出了通过使用经受多半切割MHC的ACF带20制造的显示装置50的实施例。
参照图8和图9，显示装置50包括：包含多个像素(例如，设置为多个的显示像素)的显示面板、用于驱动显示面板的驱动集成电路(“IC”)510、电连接到显示面板的柔性印刷电路板520以及通过柔性印刷电路板520电连接到显示面板的印刷电路板。
上面参照图1至图5描述的基底30可以是显示装置50的组件。图8和图9中的基底30可以不同地表示印刷电路板、柔性电路板和其中设置或形成有多个像素的显示面板。
如图8中所示出的，ACF 22'可以设置在基底30上，驱动IC 510可以设置在ACF 22'上，并且驱动IC 510可以通过ACF 22'电连接到作为显示面板、印刷电路板、柔性电路板等的基底30。
如图9中所示出的，ACF 22'可以设置在基底30上，柔性印刷电路板520可以设置在ACF 22'上，并且柔性印刷电路板520可以通过ACF 22'电连接到作为显示面板、印刷电路板、柔性电路板等的基底30。
图8和图9的ACF 22'是通过上面参照图1至图5描述的多半切割MHC方法的一个或更多个实施例设置或形成的ACF层22的图案。ACF 22'可以包括剩余的多半切割MHC'的部分作为图1至图5中的多半切割MHC的部分的一部分。剩余的多半切割MHC'的部分包括在其处沿垂直于基底30的表面的方向切割ACF 22'的至少一条切割线(例如，半切割)。
图8的实施例和图9的实施例可以同时被包括在单个显示装置50中。
尽管已经结合目前被认为是实用的实施例描述了本发明，但是将理解的是，发明不限于所公开的实施例，而是相反，发明旨在覆盖包括在权利要求的精神和范围内的各种修改和等同布置。因此，本领域技术人员将理解的是，发明的各种修改和其它等同实施例是可能的。因此，发明的真正技术保护范围必须基于权利要求的技术精神来确定。

Claims (10)

1.一种制造显示装置的方法，所述方法包括以下步骤：
设置粘合带，所述粘合带包括：基体膜；粘合导电层，在所述基体膜上，其中，所述粘合带具有切割宽度和间隔，所述切割宽度与所述显示装置的基底的粘合带附接区域的宽度对应，所述粘合带被设置为具有沿着所述基体膜彼此相邻的多个切割宽度，所述间隔沿着所述基体膜在彼此相邻的所述多个切割宽度之间；
在所述间隔内，沿着所述基体膜对所述粘合带执行彼此相邻的多个半切割，以形成多切割粘合带；以及
在所述多切割粘合带的与所述切割宽度对应的第一部分处，将所述多切割粘合带按压到所述基底，以将所述多切割粘合带的所述第一部分与所述基体膜分离，并且在所述基底的所述粘合带附接区域处，将所述多切割粘合带的所述第一部分附接到所述基底。
2.根据权利要求1所述的制造显示装置的方法，其中，每个半切割仅穿透所述基体膜与所述粘合导电层之中的所述粘合导电层。
3.根据权利要求1所述的制造显示装置的方法，其中，所述基底是包含显示像素的显示面板或可电连接到所述显示面板的印刷电路板。
4.根据权利要求1所述的制造显示装置的方法，其中，将所述多切割粘合带的所述第一部分与所述基体膜分离的按压所述多切割粘合带的所述步骤将所述多切割粘合带的与所述间隔对应的第二部分保留在所述基体膜上。
5.根据权利要求4所述的制造显示装置的方法，其中，
所述粘合带还具有沿着所述基体膜设置为多个的所述间隔和设置在彼此相对的两个间隔之间的所述切割宽度，所述两个间隔分别包括第一半切割和第二半切割，所述第一半切割和所述第二半切割限定所述第一半切割与所述第二半切割之间的所述切割宽度，
所述多切割粘合带的在所述基底的所述粘合带附接区域处附接到所述基底的所述第一部分包括沿着所述基体膜彼此相对的侧表面，并且
所述侧表面分别与所述第一半切割和所述第二半切割对应。
6.根据权利要求1所述的制造显示装置的方法，其中，
所述粘合带还具有沿着所述基体膜设置为多个的所述间隔和设置在彼此相对的两个间隔之间的所述切割宽度，所述两个间隔分别包括第一半切割和第二半切割，所述第一半切割和所述第二半切割限定所述第一半切割与所述第二半切割之间的所述切割宽度，
按压所述多切割粘合带的所述步骤包括按压器将所述多切割粘合带按压到所述基底，所述按压器包括与所述第一半切割对应的边缘，
所述多切割粘合带的在所述基底的所述粘合带附接区域处附接到所述基底的所述第一部分包括沿着所述基体膜彼此相对的第一侧表面和第二侧表面，并且
所述第一侧表面与所述按压器的所述边缘对应。
7.根据权利要求6所述的制造显示装置的方法，其中，所述第二侧表面与所述第二半切割对应。
8.根据权利要求1所述的制造显示装置的方法，其中，
对所述粘合带执行所述多个半切割的所述步骤形成了沿着所述基体膜彼此间隔开切割间隔的所述多个半切割，并且
所述切割间隔为10微米至100微米。
9.根据权利要求1所述的制造显示装置的方法，其中，
对所述粘合带执行所述多个半切割的所述步骤形成了在所述间隔内的所述多个半切割，并且
所述多个半切割的数量为2至20。
10.一种显示装置，所述显示装置包括：
基底，包括粘合带附接区域；
各向异性导电膜，在所述粘合带附接区域处电连接到所述基底，所述各向异性导电膜是多切割粘合带的一部分；以及
集成电路，通过所述各向异性导电膜电连接到所述基底，
其中，
所述多切割粘合带具有：切割宽度，与所述粘合带附接区域的宽度对应；以及两个间隔，彼此面对且使所述切割宽度在所述两个间隔之间，其中，所述两个间隔之中的每个间隔包括多个半切割，所述多个半切割均在垂直于所述基底的方向上延伸，以限定所述多切割粘合带，并且
所述多切割粘合带的作为所述各向异性导电膜的所述一部分包括与所述多个半切割之中的一个半切割对应的侧表面。
CN202011101550.4A 2019-10-28 2020-10-15 制造显示装置的方法及由该方法制造的显示装置 Active CN112735264B (zh)

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