CN112713013B - 一种特高压电容器制备工艺 - Google Patents
一种特高压电容器制备工艺 Download PDFInfo
- Publication number
- CN112713013B CN112713013B CN202011578633.2A CN202011578633A CN112713013B CN 112713013 B CN112713013 B CN 112713013B CN 202011578633 A CN202011578633 A CN 202011578633A CN 112713013 B CN112713013 B CN 112713013B
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- Prior art keywords
- fixedly connected
- high voltage
- extra
- rod
- voltage capacitor
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- 239000003990 capacitor Substances 0.000 title claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 77
- 239000002184 metal Substances 0.000 claims abstract description 77
- 238000002360 preparation method Methods 0.000 claims abstract description 23
- 230000006835 compression Effects 0.000 claims abstract description 14
- 238000007906 compression Methods 0.000 claims abstract description 14
- 238000005452 bending Methods 0.000 claims abstract description 4
- 230000000903 blocking effect Effects 0.000 claims description 8
- 239000011888 foil Substances 0.000 description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202011578633.2A CN112713013B (zh) | 2020-12-28 | 2020-12-28 | 一种特高压电容器制备工艺 |
Applications Claiming Priority (1)
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CN202011578633.2A CN112713013B (zh) | 2020-12-28 | 2020-12-28 | 一种特高压电容器制备工艺 |
Publications (2)
Publication Number | Publication Date |
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CN112713013A CN112713013A (zh) | 2021-04-27 |
CN112713013B true CN112713013B (zh) | 2022-11-22 |
Family
ID=75545788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202011578633.2A Active CN112713013B (zh) | 2020-12-28 | 2020-12-28 | 一种特高压电容器制备工艺 |
Country Status (1)
Country | Link |
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CN (1) | CN112713013B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06176987A (ja) * | 1992-12-08 | 1994-06-24 | Rohm Co Ltd | 面実装型電子部品におけるリード端子の曲げ加工方法 |
JPH08138971A (ja) * | 1994-11-02 | 1996-05-31 | Matsushita Electric Ind Co Ltd | セラミック基板及びそれを用いたコンデンサ |
JP2003158040A (ja) * | 2001-11-19 | 2003-05-30 | Murata Mfg Co Ltd | 積層セラミック電子部品のプレス装置 |
CN107346708A (zh) * | 2016-05-04 | 2017-11-14 | 上海库柏电力电容器有限公司 | 电容器的制造方法 |
CN110480006A (zh) * | 2019-09-17 | 2019-11-22 | 哈工大机器人(岳阳)军民融合研究院 | 基于金属基复合材料磁脉冲双向压制的装置及压制方法 |
CN111508709A (zh) * | 2020-04-29 | 2020-08-07 | 深圳市峰泳科技有限公司 | 平面电容及其制作方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN209843525U (zh) * | 2019-07-08 | 2019-12-24 | 常州联威自动化设备有限公司 | 一种金属化薄膜电容压扁装置 |
CN112122429A (zh) * | 2020-09-12 | 2020-12-25 | 尹宜林 | 一种金属壳体冲压件加工系统与加工方法 |
-
2020
- 2020-12-28 CN CN202011578633.2A patent/CN112713013B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06176987A (ja) * | 1992-12-08 | 1994-06-24 | Rohm Co Ltd | 面実装型電子部品におけるリード端子の曲げ加工方法 |
JPH08138971A (ja) * | 1994-11-02 | 1996-05-31 | Matsushita Electric Ind Co Ltd | セラミック基板及びそれを用いたコンデンサ |
JP2003158040A (ja) * | 2001-11-19 | 2003-05-30 | Murata Mfg Co Ltd | 積層セラミック電子部品のプレス装置 |
CN107346708A (zh) * | 2016-05-04 | 2017-11-14 | 上海库柏电力电容器有限公司 | 电容器的制造方法 |
CN110480006A (zh) * | 2019-09-17 | 2019-11-22 | 哈工大机器人(岳阳)军民融合研究院 | 基于金属基复合材料磁脉冲双向压制的装置及压制方法 |
CN111508709A (zh) * | 2020-04-29 | 2020-08-07 | 深圳市峰泳科技有限公司 | 平面电容及其制作方法 |
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Publication number | Publication date |
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CN112713013A (zh) | 2021-04-27 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20221025 Address after: 518000 Area A, 11th Floor, Building A, Jingang Science Park, Qiaotou Community, Fuyong Street, Shenzhen, Guangdong Applicant after: SHENZHEN RICH ELECTRONIC Co.,Ltd. Address before: 150300 group 1, Nanyao Committee, Henan Street, Yuquan Town, Acheng District, Harbin City, Heilongjiang Province Applicant before: Jin Zhaohui |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A preparation process for ultra-high voltage capacitors Effective date of registration: 20231127 Granted publication date: 20221122 Pledgee: Shenzhen Rural Commercial Bank Co.,Ltd. Futian Sub branch Pledgor: SHENZHEN RICH ELECTRONIC Co.,Ltd. Registration number: Y2023980067651 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |