CN112645051A - Irradiation glue-dissolving equipment - Google Patents
Irradiation glue-dissolving equipment Download PDFInfo
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- CN112645051A CN112645051A CN202011422126.XA CN202011422126A CN112645051A CN 112645051 A CN112645051 A CN 112645051A CN 202011422126 A CN202011422126 A CN 202011422126A CN 112645051 A CN112645051 A CN 112645051A
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- irradiation
- driving mechanism
- bin
- workbench
- dispergation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
Abstract
The invention belongs to the technical field of wafer processing, and particularly relates to irradiation degumming equipment which comprises a workbench, a bin device and an irradiation device, wherein the bin device and the irradiation device are fixedly arranged on the workbench; the irradiation conveying device comprises an irradiation conveying driving mechanism fixedly arranged on the workbench and a carrying platform fixedly arranged on an output part of the irradiation conveying driving mechanism, the transferring device comprises a material transferring driving mechanism arranged between the bin device and the irradiation conveying device and a clamping mechanism fixedly arranged on the output part of the material transferring driving mechanism, and the irradiation device, the irradiation conveying driving mechanism, the material transferring driving mechanism and the clamping mechanism are respectively and electrically connected with the electric control device. The problems that manual glue-releasing easily causes wafer pollution and repeated glue-releasing or glue-releasing leakage of the wafer are solved.
Description
Technical Field
The invention belongs to the technical field of wafer processing, and particularly relates to irradiation glue-dissolving equipment.
Background
During wafer processing, a layer of UV adhesive tape is pasted on a wafer frame, the wafer is pasted on the UV adhesive tape and is cut after being fixed, the wafer can be taken down after the cutting is finished and the UV adhesive tape needs to be debonded, the UV adhesive tape plays a role in fixing the wafer before debonding, and the wafer bears the weight after debonding. At present, the materials in the drawer type storage structure are taken out manually by an operator and then placed in a box type UV irradiation machine for irradiation to perform dispergation, the materials are placed back in the drawer type storage structure after irradiation is finished, manual operation easily causes wafer pollution, repeated dispergation of wafers or misoperation of leaking dispergation is easily caused, the dose and the intensity of UV irradiation are manually controlled, the problem of insufficient dispergation or over dispergation is easily caused, and the dispergation effect is uncontrollable.
Disclosure of Invention
The invention aims to provide irradiation glue-stripping equipment, and aims to solve the problems that manual glue-stripping easily causes wafer pollution and repeated glue-stripping or glue-missing of wafers.
The invention discloses irradiation degumming equipment which comprises a workbench, a stock bin device and an irradiation device, wherein the stock bin device and the irradiation device are fixedly arranged on the workbench; the irradiation conveying device comprises an irradiation conveying driving mechanism fixedly installed on the workbench and a carrying platform fixedly installed on an output part of the irradiation conveying driving mechanism, the transferring device comprises a material transferring driving mechanism arranged between the bin device and the irradiation conveying device and a clamping mechanism fixedly installed on the output part of the material transferring driving mechanism, and the irradiation device, the irradiation conveying driving mechanism, the material transferring driving mechanism and the clamping mechanism are respectively and electrically connected with the electric control device.
As an improvement, the stock bin device comprises a lifting driving mechanism fixedly arranged on the workbench and a bin body fixedly arranged on an output part of the lifting driving mechanism, and the lifting driving mechanism is electrically connected with the electric control device.
As an improvement, the storehouse body includes first curb plate and the second curb plate that the interval set up, connect first curb plate with the upper junction plate between the upside of second curb plate, connect first curb plate with the lower junction plate between the downside of second curb plate first curb plate with be equipped with a plurality of draw-in grooves of arranging in proper order along upper and lower direction on the adjacent side of second curb plate respectively, a plurality of draw-in grooves on the first curb plate with a plurality of draw-in grooves one-to-one on the second curb plate.
As an improvement, the storage bin device further comprises a bin body supporting plate, the lifting driving mechanism is arranged between the workbench and the bin body supporting plate, positioning blocks detachably connected with the bin body supporting plate are respectively arranged at the four corners of the bin body supporting plate corresponding to the bin body, and the bin body is placed in the four limiting areas formed by the positioning blocks.
As an improvement, the irradiation device comprises a cover-shaped shell, the shell is fixedly installed on the workbench, a cover opening of the shell is arranged downwards, the irradiation device further comprises a UV light source arranged at the cover opening of the shell and an air inlet structure installed on the shell, and the UV light source is electrically connected with the electric control device.
As an improvement, a light detection device electrically connected with the electric control device is arranged in the shell.
As an improvement, a space is reserved between the cover opening of the shell and the workbench; the UV light source is arranged below the workbench, and an irradiation notch is formed in the position, corresponding to the UV light source, of the workbench.
As an improvement, the stage comprises a stage support plate fixedly mounted on the output part of the irradiation conveying driving mechanism, and two guide rails arranged on the stage support plate at intervals, the arrangement direction of the two guide rails is the same as that of the clamping groove, a positioning structure fixedly mounted on the stage support plate is arranged between the two guide rails, and an irradiation hole is arranged at a position of the stage support plate close to the positioning structure.
As an improvement, position limiting plates are respectively arranged on the two guide rails at positions close to the positioning structures, and a clamping groove is formed between each position limiting plate and the corresponding guide rail; two the guide rail is close to the one end punishment of feed bin device do not fixed mounting have the deflector, the deflector with correspond form the guide way between the guide rail.
As an improvement, a light screen detachably connected with the carrier support plate is arranged between the two guide rails, a light screen through hole coaxial with the irradiation hole is arranged on the light screen, and the diameter of the light screen through hole is smaller than that of the irradiation hole.
As an improvement, a code scanning device electrically connected with the electric control device is fixedly arranged on the workbench.
By adopting the technical scheme, the irradiation dispergation equipment comprises a workbench, a bin device and an irradiation device which are fixedly arranged on the workbench, an irradiation conveying device which is fixedly arranged on the workbench and is arranged corresponding to the irradiation device, a transfer device which is arranged between the bin device and the irradiation conveying device and used for transferring materials, and an electric control device; the irradiation conveying device comprises an irradiation conveying driving mechanism fixedly arranged on the workbench and a carrying platform fixedly arranged on an output part of the irradiation conveying driving mechanism, the transferring device comprises a material transferring driving mechanism arranged between the bin device and the irradiation conveying device and a clamping mechanism fixedly arranged on the output part of the material transferring driving mechanism, and the irradiation device, the irradiation conveying driving mechanism, the material transferring driving mechanism and the clamping mechanism are respectively and electrically connected with the electric control device. The material is placed in the stock bin device, the material transfer driving mechanism drives the clamping mechanism to move to the stock bin device, the clamping mechanism clamps the material, the material transfer driving mechanism drives the clamping mechanism to transfer the material to the carrying platform of the irradiation conveying device, the irradiation conveying driving mechanism of the irradiation conveying device conveys the material to the irradiation device for irradiation dispergation, the irradiation conveying driving mechanism drives the carrying platform to convey the dispergated material to a position close to the transfer device after the dispergation is finished, and the material transfer driving mechanism drives the clamping mechanism to move the dispergated material back to the stock bin device The repeated glue-stripping or the leaked glue-stripping of the wafer.
Drawings
FIG. 1 is a schematic top view of an irradiation dispergation apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic perspective view of a bin device of an irradiation dispergation apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic perspective view of an irradiation conveying mechanism of the irradiation dispergation apparatus according to the embodiment of the present invention;
11, a workbench, 20, a bin device, 21, a bin body, 211, a first side plate, 212, a second side plate, 213, an upper connecting plate, 214, a lower connecting plate, 215, a clamping groove, 22, a lifting driving mechanism, 23, a guiding mechanism, 24, a bin body supporting plate, 25, a positioning block, 30, an irradiation device, 31, a shell, 32, a UV light source, 33, an air inlet structure, 40, an irradiation conveying driving mechanism, 50, a carrying platform, 51, a carrying platform supporting plate, 52, a guide rail, 53, a wafer frame positioning column, 54, a limiting plate, 55, a guiding plate, 56, a shading plate, 60, a material transfer driving mechanism, 70, a clamping mechanism, 71, a clamping jaw cylinder, 72, a clamping plate, 73, a mounting seat, 80, a code scanning device, 81, a code scanning support, 82 and a code scanning gun.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Fig. 1 to 3 are schematic structural diagrams of an irradiation dispergation apparatus according to an embodiment of the present invention, where fig. 1 shows a schematic structural diagram of a top view of the irradiation dispergation apparatus according to the embodiment of the present invention, fig. 2 shows a schematic structural diagram of a bin device of the irradiation dispergation apparatus according to the embodiment of the present invention, and fig. 3 shows a schematic structural diagram of an irradiation conveying mechanism of the irradiation dispergation apparatus according to the embodiment of the present invention. For the sake of convenience, only the parts relevant to the present invention are shown in the drawings.
As can be seen from fig. 1, 2 and 3, the irradiation dispergation apparatus includes a worktable 11, a bin device 20 and an irradiation device 30 fixedly mounted on the worktable 11, and further includes an irradiation conveying device fixedly mounted on the worktable 11 for conveying the material to the irradiation device 30, a transfer device for transferring the material between the bin device 20 and the irradiation conveying device, and an electric control device; the irradiation conveying device comprises an irradiation conveying driving mechanism 40 fixedly arranged on the workbench 11 and a carrying platform 50 fixedly arranged on an output part of the irradiation conveying driving mechanism 40, the transferring device comprises a material transferring driving mechanism 60 arranged between the bin device 20 and the irradiation conveying device and a clamping mechanism 70 fixedly arranged on the output part of the material transferring driving mechanism 60, and the irradiation device 30, the irradiation conveying driving mechanism 40, the material transferring driving mechanism 60 and the clamping mechanism 70 are respectively and electrically connected with an electric control device.
Materials (the materials comprise a wafer frame, a UV adhesive tape layer adhered on the wafer frame and a wafer adhered on the UV adhesive tape layer) are placed in the bin device 20, the material transfer driving mechanism 60 drives the clamping mechanism 70 to move to the bin device 20, the clamping mechanism 70 clamps the materials, the material transfer driving mechanism 60 drives the clamping mechanism 70 to transfer the materials to the carrying platform 50 of the irradiation conveying device, the irradiation conveying driving mechanism 40 of the irradiation conveying device conveys the materials to the irradiation device 30 for irradiation degumming, the carrying platform 50 is driven by the irradiation conveying driving mechanism 40 to convey the materials which are subjected to degumming to a position close to the transfer device after the degumming is finished, the material transfer driving mechanism 60 drives the clamping mechanism 70 to move the materials which are subjected to degumming back to the bin device 20, and the material taking and discharging in the whole degumming process are finished by the equipment, the irradiation dispergation equipment provided by the embodiment of the invention solves the problems that manual dispergation is easy to cause wafer pollution and repeated dispergation or glue leakage of the wafer.
In the embodiment of the present invention, the stock bin device 20 includes a lifting driving mechanism 22 fixedly installed on the working table 11, and a bin body 21 fixedly installed on an output portion of the lifting driving mechanism 22, wherein the lifting driving mechanism 22 is electrically connected to an electric control device, and typically, the lifting driving mechanism 22 is an electric cylinder. In order to ensure the precision, a guiding mechanism 23 is further arranged between the workbench 11 and the bin body 21, the guiding mechanism 23 comprises a sliding sleeve fixedly installed on the workbench 11 and a guiding rod slidably installed in the sliding sleeve, and one end of the guiding rod close to the bin body 21 is fixedly connected with the bin body 21.
Specifically, the silo body 21 includes a first side plate 211 and a second side plate 212 which are arranged at intervals, an upper connecting plate 213 which is connected between upper sides of the first side plate 211 and the second side plate 212, and a lower connecting plate 214 which is connected between lower sides of the first side plate 211 and the second side plate 212, a plurality of slots 215 which are sequentially arranged along the vertical direction are respectively arranged on adjacent sides of the first side plate 211 and the second side plate 212, the slots 215 on the first side plate 211 correspond to the slots 215 on the second side plate 212 one by one, a material is placed between two corresponding slots 215, and the materials placed in the silo body 21 form a layered structure.
Because the size of wafer is different, for example 8 cun, 12 cun etc. for the convenience of shining the wafer that the equipment of debonding is applicable to not unidimensional, this feed bin device 20 still includes storehouse body backup pad 24, and lifting drive mechanism 22, guiding mechanism 23 set up between workstation 11 and storehouse body backup pad 24, and storehouse body 21 is installed on storehouse body backup pad 24, when needing to debond the wafer of not unidimensional, can change storehouse body 21. Generally, positioning blocks 25 detachably connected with the bin body supporting plate 24 are respectively arranged on the bin body supporting plate 24 corresponding to the four corners of the bin body 21, and the bin body 21 is placed in a limiting area formed by the four positioning blocks 25; different positioning positions are arranged on the bin body supporting plate 24 corresponding to wafers with different sizes, and different bin bodies 21 can be replaced only by detaching four positioning blocks 25 from the bin body supporting plate 24 and then installing the four positioning blocks to the corresponding positions.
In the embodiment of the present invention, the irradiation device 30 includes a housing 31 in a shape of a cover, the housing 31 is fixedly installed on the worktable 11, a cover opening of the housing 31 is disposed downward, the irradiation device further includes a UV light source 32 disposed at a position corresponding to the cover opening of the housing 31, an air intake structure 33 installed on the housing 31, and an electromagnetic valve and the UV light source 32 connected in series with the air intake structure 33 are respectively electrically connected to the electric control device. Normally, nitrogen gas is filled into the housing 31 through the gas inlet structure 33, the irradiation and conveyance drive mechanism 40 drives the stage 50 to convey the material into the housing 31, and the material on the stage 50 is immersed in the nitrogen gas, so that the degumming effect can be enhanced.
Specifically, the UV light source 32 includes a lamp base, a lamp tube mounted on the lamp base, and the lamp base is electrically connected to the electronic control device.
In order to control the dose and the intensity of the light emitted by the UV light source 32 conveniently, the dose is the intensity of the light multiplied by the irradiation time, and generally, the dose can be adjusted by controlling the intensity of the light and the irradiation time, but the intensity of the light cannot be too large when the irradiation is required to be ensured.
In general, a distance is left between the cover opening of the housing 31 and the table 11, the UV light source 32 is arranged below the table 11, and an illumination cutout adapted to the shape of the UV light source 32 is provided at the table 11 corresponding to the UV light source 32.
In the embodiment of the present invention, the stage 50 includes a stage support plate 51 fixedly attached to the output portion of the irradiation transport driving mechanism 40, and two guide rails 52 provided on the stage support plate 51 at an interval, the direction in which the two guide rails 52 are provided is the same as the direction in which the card slot 215 is provided, a positioning structure fixedly attached to the stage support plate 51 is provided between the two guide rails 52, an irradiation hole that fits into the inner hole of the wafer frame is provided at a position of the stage support plate 51 near the positioning structure, and usually, the positioning structure is a wafer frame positioning post 53. The elevating driving mechanism 22 drives the bin body 21 to move up and down to align a layer of material with the plane of the two guide rails 52, the material transfer driving mechanism 60 drives the clamping mechanism 70 to clamp the layer of material, and the material transfer driving mechanism 60 pulls the material onto the two guide rails 52 until the wafer frame positioning columns 53 stop.
In order to avoid the movement of the material when the material is conveyed to the irradiation device 30, the two guide rails 52 are respectively provided with a limiting plate 54, and a clamping groove is formed between each limiting plate 54 and the corresponding guide rail 52; the material moves along the two guide rails 52, and two sides of the final material are respectively limited in two clamping grooves formed between the two material limiting plates 54 and the two guide rails 52.
Specifically, in order to facilitate the transfer of the material between the bin device 20 and the carrier 50, guide plates 55 are fixedly mounted on the ends of the two guide rails 52 close to the bin device 20, and guide grooves are formed between the guide plates 55 and the corresponding guide rails 52.
Typically, the irradiation transport drive mechanism 40 and the material transfer drive mechanism 60 are electric cylinders.
When changing a material (a wafer having a different size), it is necessary to detach the two guide rails 52 from the stage support plate 51, and adjust the distance between the two guide rails 52 so that the distance between the two guide rails 52 is adapted to the size of the changed material.
In order to facilitate the sliding of the carrier 50 along the workbench 11 to the irradiation device 30, two sets of sliding rail slider assemblies are arranged between the carrier 50 and the workbench 11 at intervals, the sliding rails of the two sets of sliding rail slider assemblies are fixedly installed on the workbench 11, and the carrier 50 is fixedly connected between the sliding blocks of the two sets of sliding rail slider assemblies.
In order to conveniently irradiate different materials, a light screen 56 detachably connected with the carrier support plate 51 is arranged between the two guide rails 52, a light screen through hole coaxially arranged with the irradiation hole is arranged on the light screen 56, the diameter of the light screen through hole is smaller than that of the irradiation hole, and in order to conveniently ensure that the light screen through hole and the irradiation hole are coaxially arranged, a light screen positioning column is arranged on the carrier support plate 51; the light blocking plate 56 is typically fixedly mounted on the stage support plate 51 by bolts. Specifically, if the material corresponds to a 12-inch wafer, the light shielding plate 56 needs to be removed, and the range of the irradiated holes is the area through which the light passes; if the material corresponds 8 cun wafers, just need install light screen 56, the scope of light screen through-hole is exactly the region that light passes through, because the diameter of light screen through-hole is less than the diameter of irradiation hole, can guarantee that light only shines 8 cun wafers on, avoids the too big UV sticky tape that leads to of irradiation scope to drop from the wafer frame.
In the embodiment of the present invention, in order to further avoid repeated or missed wafer debonding, a code scanning device 80 electrically connected to the electronic control device is generally fixedly mounted on the worktable 11. Each wafer frame is attached with a marked bar code, such as a two-dimensional code, a bar code, etc., and the marked bar code is scanned by the bar code scanner 80 to determine whether the material has undergone a disperging operation.
Specifically, the code scanning device 80 comprises a code scanning support 81 and a code scanning gun 82 fixedly mounted on the code scanning support 81.
In the embodiment of the present invention, the gripping mechanism 70 includes a clamping jaw cylinder 71 fixedly mounted on the output portion of the material transfer driving mechanism 60, and two clamping plates 72 fixedly connected to two output ends of the clamping jaw cylinder 71, respectively, in order to facilitate the fixed mounting of the clamping jaw cylinder 71, a mounting seat 73 is fixedly mounted on the output portion of the material transfer driving mechanism 60, and the clamping jaw cylinder 71 is fixed on the mounting seat 73.
In the embodiment of the present invention, the electric control device is a PLC controller or an EMS (manufacturing enterprise manufacturing process execution management system) system.
The above description is only exemplary of the present invention and should not be taken as limiting the invention, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (11)
1. The irradiation degumming equipment is characterized by comprising a workbench, a bin device and an irradiation device which are fixedly arranged on the workbench, an irradiation conveying device which is fixedly arranged on the workbench and is arranged corresponding to the irradiation device, a transfer device which is arranged between the bin device and the irradiation conveying device and used for transferring materials, and an electric control device; the irradiation conveying device comprises an irradiation conveying driving mechanism fixedly installed on the workbench and a carrying platform fixedly installed on an output part of the irradiation conveying driving mechanism, the transferring device comprises a material transferring driving mechanism arranged between the bin device and the irradiation conveying device and a clamping mechanism fixedly installed on the output part of the material transferring driving mechanism, and the irradiation device, the irradiation conveying driving mechanism, the material transferring driving mechanism and the clamping mechanism are respectively and electrically connected with the electric control device.
2. The irradiation dispergation apparatus according to claim 1, wherein said stock bin device comprises a lifting driving mechanism fixedly mounted on said worktable, and a stock bin body fixedly mounted on an output portion of said lifting driving mechanism, said lifting driving mechanism being electrically connected to said electric control device.
3. The irradiation dispergation apparatus according to claim 2, wherein said bin body comprises a first side plate and a second side plate arranged at intervals, an upper connecting plate connected between the upper sides of said first side plate and said second side plate, and a lower connecting plate connected between the lower sides of said first side plate and said second side plate, wherein a plurality of slots arranged in sequence along the up-down direction are respectively arranged on the adjacent sides of said first side plate and said second side plate, and a plurality of slots on said first side plate correspond to a plurality of slots on said second side plate one to one.
4. The irradiation glue dissolving equipment according to claim 2, wherein the stock bin device further comprises a bin body supporting plate, the lifting driving mechanism is arranged between the workbench and the bin body supporting plate, positioning blocks detachably connected with the bin body supporting plate are respectively arranged on the bin body supporting plate corresponding to four corners of the bin body, and the bin body is placed in a limiting area formed by the four positioning blocks.
5. The irradiation dispergation apparatus according to claim 1, wherein said irradiation device comprises a housing in a shape of a hood, said housing is fixedly mounted on said worktable and a hood opening of said housing is disposed facing downward, and further comprises a UV light source disposed corresponding to the hood opening of said housing and an air intake structure mounted on said housing, said UV light source is electrically connected to said electric control device.
6. The irradiation dispergation apparatus according to claim 5, wherein a light detection device is provided in said housing and electrically connected to said electrical control device.
7. The irradiation dispergation apparatus according to claim 5, wherein a space is left between the cover opening of said housing and said table; the UV light source is arranged below the workbench, and an irradiation notch is formed in the position, corresponding to the UV light source, of the workbench.
8. The irradiation dispergation apparatus according to claim 3, wherein said stage comprises a stage support plate fixedly mounted on the output portion of said irradiation conveying driving mechanism, and two guide rails spaced apart from each other on said stage support plate, the arrangement direction of said two guide rails is the same as the arrangement direction of said card slot, a positioning structure fixedly mounted on said stage support plate is provided between said two guide rails, and an irradiation hole is provided at a position of said stage support plate close to said positioning structure.
9. The irradiation dispergation equipment according to claim 8, wherein a position limiting plate is respectively arranged on the two guide rails near the positioning structure, and a clamping groove is formed between each limiting plate and the corresponding guide rail; two the guide rail is close to the one end punishment of feed bin device do not fixed mounting have the deflector, the deflector with correspond form the guide way between the guide rail.
10. The irradiation degumming apparatus according to claim 8, wherein a light screen detachably connected to said carrier support plate is provided between said two guide rails, said light screen is provided with a light screen through hole coaxial with said irradiation hole, and the diameter of said light screen through hole is smaller than the diameter of said irradiation hole.
11. The irradiation dispergation apparatus according to any one of claims 1 to 10, wherein a code scanning device electrically connected to said electric control device is fixedly mounted on said table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011422126.XA CN112645051B (en) | 2020-12-08 | 2020-12-08 | Irradiation glue-dissolving equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011422126.XA CN112645051B (en) | 2020-12-08 | 2020-12-08 | Irradiation glue-dissolving equipment |
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| Publication Number | Publication Date |
|---|---|
| CN112645051A true CN112645051A (en) | 2021-04-13 |
| CN112645051B CN112645051B (en) | 2022-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011422126.XA Active CN112645051B (en) | 2020-12-08 | 2020-12-08 | Irradiation glue-dissolving equipment |
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| JP2007201179A (en) * | 2006-01-26 | 2007-08-09 | Tokyo Seimitsu Co Ltd | Device and method for mounting wafer |
| CN101261306A (en) * | 2008-04-14 | 2008-09-10 | 无锡市易控系统工程有限公司 | Full-automatic wafer test method and equipment accomplishing the method |
| CN102468120A (en) * | 2010-11-03 | 2012-05-23 | Qmc株式会社 | Laser processing device and laser processing method using the same |
| CN206650059U (en) * | 2017-04-19 | 2017-11-17 | 中电智能卡有限责任公司 | A kind of UV dispergation machine |
| CN208525667U (en) * | 2018-02-08 | 2019-02-22 | 盐城市第三人民医院 | A kind of restriction ultraviolet light range auxiliary device |
| CN209478651U (en) * | 2018-12-26 | 2019-10-11 | 苏州镭明激光科技有限公司 | Equipment above and below automatic-positioning type |
| CN110911311A (en) * | 2019-11-18 | 2020-03-24 | 深圳格兰达智能装备股份有限公司 | Visual inspection machine to wafer after cutting |
-
2020
- 2020-12-08 CN CN202011422126.XA patent/CN112645051B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007201179A (en) * | 2006-01-26 | 2007-08-09 | Tokyo Seimitsu Co Ltd | Device and method for mounting wafer |
| CN101261306A (en) * | 2008-04-14 | 2008-09-10 | 无锡市易控系统工程有限公司 | Full-automatic wafer test method and equipment accomplishing the method |
| CN102468120A (en) * | 2010-11-03 | 2012-05-23 | Qmc株式会社 | Laser processing device and laser processing method using the same |
| CN206650059U (en) * | 2017-04-19 | 2017-11-17 | 中电智能卡有限责任公司 | A kind of UV dispergation machine |
| CN208525667U (en) * | 2018-02-08 | 2019-02-22 | 盐城市第三人民医院 | A kind of restriction ultraviolet light range auxiliary device |
| CN209478651U (en) * | 2018-12-26 | 2019-10-11 | 苏州镭明激光科技有限公司 | Equipment above and below automatic-positioning type |
| CN110911311A (en) * | 2019-11-18 | 2020-03-24 | 深圳格兰达智能装备股份有限公司 | Visual inspection machine to wafer after cutting |
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| CN112645051B (en) | 2022-11-11 |
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