CN209478651U - Equipment above and below automatic-positioning type - Google Patents
Equipment above and below automatic-positioning type Download PDFInfo
- Publication number
- CN209478651U CN209478651U CN201822206087.4U CN201822206087U CN209478651U CN 209478651 U CN209478651 U CN 209478651U CN 201822206087 U CN201822206087 U CN 201822206087U CN 209478651 U CN209478651 U CN 209478651U
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- wafer
- positioning
- automatic
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- equipment
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Abstract
The utility model relates to equipment above and below a kind of automatic-positioning type, include pedestal, wafer clamp device is installed on pedestal, wafer positioning device is connected on wafer clamp device, the side of wafer clamp device is equipped with magazine lifting device, is also connected with wafer transfer device in wafer positioning device.Automatic positioning equipment is had as a result, the wafer in transport can be accurately positioned and is placed into machining position and magazine.Overall construction is simple, and integraty is good, without occupying the biggish device space.Use can be matched with current conventional wafer processing, wide usage is preferable.
Description
Technical field
The utility model relates to equipment above and below a kind of equipment up and down more particularly to a kind of automatic-positioning type.
Background technique
At present in wafer processing industry, the universal complicated and space of wafer fetching device is larger, and the device space is caused to become larger, and makes
Cause this raising, it is therefore necessary to design that a kind of space is small, price is low and full-automatic handling equipment with automatic positioning.
In view of the above shortcomings, the designer, is actively subject to research and innovation, to found a kind of automatic-positioning type or more
Equipment makes it with more the utility value in industry.
Utility model content
In order to solve the above technical problems, the purpose of the utility model is to provide equipment above and below a kind of automatic-positioning type.
Equipment above and below the automatic-positioning type of the utility model, includes pedestal, in which: be equipped with wafer clamp on the pedestal
Device is taken, wafer positioning device is connected on the wafer clamp device, the side of the wafer clamp device is equipped with magazine
Lifting device is also connected with wafer transfer device in the wafer positioning device.
Further, equipment above and below above-mentioned automatic-positioning type, wherein the wafer clamp device includes support leg,
The support leg is connected with pedestal, and the first guide rail is equipped in the support leg, and the both ends of first guide rail are provided with axis
Mounting base is held, the first screw rod is connected between the bearing mounting base, one end of first screw rod is connected with driving motor, institute
It states and clamp assemblies is installed on the first guide rail.
Further, equipment above and below above-mentioned automatic-positioning type, wherein the clamp assemblies clamp assemblies include folder
Sub- connecting plate is connected with cylinder on the clip connecting plate, is provided with intermediate plate on the cylinder.
Further, equipment above and below above-mentioned automatic-positioning type, wherein the wafer positioning device includes installation
Foot, the installation foot are connected with pedestal, and mounting plate is connected on the installation foot, and the mounting plate two sides are respectively connected with subband
Wheel, and control motor is connected at least one secondary pulley, it is arranged with secondary belt in the secondary pulley, is installed on the pair belt
There is locating piece.
Further, equipment above and below above-mentioned automatic-positioning type, wherein the magazine lifting device includes installation bottom
Plate, the two sides of the mounting base are equipped with the second guide rail, are also connected with the second screw rod on the mounting base, and described second
The both ends of bar are provided with bearing mounting base, and magazine support plate is equipped on second guide rail and magazine support plate is located at second
The upper end of bar is equipped with lifting motor on the mounting base, is provided on second screw rod and lifting motor independent
Main pulley is arranged with main belt on the main pulley.
Further, above-mentioned automatic-positioning type equipment up and down, wherein the wafer transfer device includes and wafer
Positioning device connected pinboard is equipped with telescopic rod on the pinboard, transfer motor is connected on the telescopic rod.
Still further, equipment above and below above-mentioned automatic-positioning type, wherein the installation site of the telescopic rod is located at described
The top of wafer positioning device.
According to the above aspect of the present invention, the utility model at least has the following advantages:
1, automatic positioning equipment is had, the wafer in transport can be accurately positioned and be placed into machining position and magazine.
2, overall construction is simple, and integraty is good, without occupying the biggish device space.
3, use can be matched with current conventional wafer processing, wide usage is preferable.
The above description is merely an outline of the technical solution of the present invention, in order to better understand the skill of the utility model
Art means, and can be implemented in accordance with the contents of the specification, below on the preferred embodiment of the present invention and the accompanying drawings in detail
It describes in detail bright as after.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of equipment above and below automatic-positioning type.
The meaning of each appended drawing reference is as follows in figure.
1 pedestal, 2 wafer clamp device
3 wafer positioning device, 4 magazine lifting device
5 wafer transfer device, 6 support leg
7 first guide rail, 8 first screw rod
9 driving motor, 10 clip connecting plate
11 cylinder, 12 intermediate plate
13 mounting base, 14 second guide rail
15 magazine support plate, 16 pinboard
17 telescopic rods 18 shift motor
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is described in further detail.Below
Embodiment is not intended to limit the scope of the present invention for illustrating the utility model.
As Fig. 1 automatic-positioning type above and below equipment, include pedestal 1, unusual place is: in order to can be automatic
Positioning clamping is carried out to wafer, wafer clamp device 2 is installed on pedestal 1.Meanwhile in order to be fitted during clamping
When unit, be not in it is multiple crawl or crawl offset mistake, be connected on wafer clamp device 2 wafer positioning dress
Set 3.Also, from the point of view of actual implementation, the side of wafer clamp device 2 is equipped with magazine lifting device 4.In such manner, it is possible to real
The pickup of existing different feed height is adjusted, and is able to achieve the tracking crawl of automation.Simultaneously, it is contemplated that smooth between each station
It is connected, is also connected with wafer transfer device 5 in wafer positioning device 3.
From the point of view of the preferable embodiment of the utility model one, the wafer clamp device 2 of use includes support leg 6,
Support leg 6 is connected with pedestal 1.Meanwhile the first guide rail 7 being installed in support leg 6, the both ends of the first guide rail 7 are provided with bearing
Mounting base.In view of moving smooth guidance, it is connected with the first screw rod 8 between bearing mounting base, one end of the first screw rod 8 is connected with
Driving motor 9 is equipped with clamp assemblies on first guide rail 7.Meanwhile quick, the stable clamping in order to smoothly realize wafer, clamping
Component clamp assemblies include clip connecting plate 10, and cylinder 11 is connected on clip connecting plate 10, is provided with intermediate plate on cylinder 11
12.In this way, implement when, driving motor 9 drive clip wafer is taken out from magazine, at the end of driving motor 9 drive
Wafer is pushed back magazine by clip.
Furthermore, the wafer positioning device 3 of use includes installation foot, installation foot is connected with pedestal 1.Meanwhile pacifying
It is connected with mounting plate on dress foot, mounting plate two sides are respectively connected with secondary pulley, and control motor is connected at least one secondary pulley.
In order to realize driving transmission, it is arranged with secondary belt in secondary pulley, locating piece is installed on secondary belt.In this way, control motor rotation
Secondary belt is driven to turn, secondary belt rotation drives locating piece stretching motion, positions wafer.
Furthermore, magazine lifting device 4 includes mounting base 13, the two sides of mounting base 13 are equipped with second
Guide rail 14 is also connected with the second screw rod on mounting base 13, and the both ends of the second screw rod are provided with bearing mounting base.Meanwhile considering
To the convenience controlled is driven, magazine support plate 15 is installed on the second guide rail 14 and magazine support plate 15 is located at the upper of the second screw rod
It holds, lifting motor is installed on mounting base 13.Also, it is provided with independent main pulley on the second screw rod and lifting motor,
Main belt is arranged on main pulley.When actual use, magazine is transported up and down under lifting motor driving effect.
From the point of view of actual use, wafer transfer device 5 includes the pinboard 16 being connected with wafer positioning device 3, is turned
Telescopic rod 17 is installed on fishplate bar 16, transfer motor 18 is connected on telescopic rod 17.In this way, transfer motor 18 is transported during use
It is dynamic that telescopic rod 17 is driven to go up and down, the wafer having good positioning in wafer positioning device 3 is drawn and is placed into adding under wafer positioning device 3
On work platform, the wafer completed the process on processing platform absorption is put into wafer positioning dress by wafer transfer device 5 when completing the process
It sets and is positioned on 3.Also, it preferably adjusts and uses for the ease of telescopic rod 17, the installation position set of telescopic rod 17 can be enabled
In the top of wafer positioning device 3.
It can be seen from the above written description and the attached drawings that gathering around and having the following advantages after using the utility model:
1, automatic positioning equipment is had, the wafer in transport can be accurately positioned and be placed into machining position and magazine.
2, overall construction is simple, and integraty is good, without occupying the biggish device space.
3, use can be matched with current conventional wafer processing, wide usage is preferable.
The above is only the preferred embodiment of the utility model, is not intended to limit the utility model, it is noted that
For those skilled in the art, without deviating from the technical principle of the utility model, it can also do
Several improvements and modifications out, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (7)
1. equipment above and below automatic-positioning type, includes pedestal, it is characterised in that: wafer clamp device is installed on the pedestal,
Wafer positioning device is connected on the wafer clamp device, the side of the wafer clamp device is equipped with magazine lifting dress
It sets, is also connected with wafer transfer device in the wafer positioning device.
2. automatic-positioning type according to claim 1 equipment up and down, it is characterised in that: the wafer clamp device includes
Support leg, the support leg are connected with pedestal, and the first guide rail is equipped in the support leg, and the both ends of first guide rail are all provided with
It is equipped with bearing mounting base, the first screw rod is connected between the bearing mounting base, one end of first screw rod is connected with driving
Motor is equipped with clamp assemblies on first guide rail.
3. equipment above and below automatic-positioning type according to claim 2, it is characterised in that: the clamp assemblies clamp assemblies packet
Clip connecting plate has been included, cylinder is connected on the clip connecting plate, is provided with intermediate plate on the cylinder.
4. automatic-positioning type according to claim 1 equipment up and down, it is characterised in that: the wafer positioning device includes
Installation foot, the installation foot are connected with pedestal, and mounting plate is connected on the installation foot, and the mounting plate two sides are respectively connected with pair
Belt wheel, and control motor is connected at least one secondary pulley, it is arranged with secondary belt in the secondary pulley, pacifies on the pair belt
Equipped with locating piece.
5. automatic-positioning type according to claim 1 equipment up and down, it is characterised in that: the magazine lifting device includes
Mounting base, the two sides of the mounting base are equipped with the second guide rail, and the second screw rod is also connected on the mounting base, described
The both ends of second screw rod are provided with bearing mounting base, and magazine support plate is equipped on second guide rail and magazine support plate is located at
The upper end of second screw rod is equipped with lifting motor on the mounting base, is provided on second screw rod and lifting motor
Independent main pulley is arranged with main belt on the main pulley.
6. automatic-positioning type according to claim 1 equipment up and down, it is characterised in that: the wafer transfer device includes
The pinboard being connected with wafer positioning device is equipped with telescopic rod on the pinboard, and transfer electricity is connected on the telescopic rod
Machine.
7. equipment above and below automatic-positioning type according to claim 6, it is characterised in that: the installation position set of the telescopic rod
In the top of the wafer positioning device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201822206087.4U CN209478651U (en) | 2018-12-26 | 2018-12-26 | Equipment above and below automatic-positioning type |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201822206087.4U CN209478651U (en) | 2018-12-26 | 2018-12-26 | Equipment above and below automatic-positioning type |
Publications (1)
Publication Number | Publication Date |
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CN209478651U true CN209478651U (en) | 2019-10-11 |
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ID=68128256
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CN201822206087.4U Active CN209478651U (en) | 2018-12-26 | 2018-12-26 | Equipment above and below automatic-positioning type |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112645051A (en) * | 2020-12-08 | 2021-04-13 | 歌尔光学科技有限公司 | Irradiation glue-dissolving equipment |
CN112864082A (en) * | 2020-12-23 | 2021-05-28 | 苏州镭明激光科技有限公司 | Wafer grabbing structure, wafer slotting equipment and wafer slotting method |
-
2018
- 2018-12-26 CN CN201822206087.4U patent/CN209478651U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112645051A (en) * | 2020-12-08 | 2021-04-13 | 歌尔光学科技有限公司 | Irradiation glue-dissolving equipment |
CN112864082A (en) * | 2020-12-23 | 2021-05-28 | 苏州镭明激光科技有限公司 | Wafer grabbing structure, wafer slotting equipment and wafer slotting method |
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