CN112864082A - Wafer grabbing structure, wafer slotting equipment and wafer slotting method - Google Patents

Wafer grabbing structure, wafer slotting equipment and wafer slotting method Download PDF

Info

Publication number
CN112864082A
CN112864082A CN202011542154.5A CN202011542154A CN112864082A CN 112864082 A CN112864082 A CN 112864082A CN 202011542154 A CN202011542154 A CN 202011542154A CN 112864082 A CN112864082 A CN 112864082A
Authority
CN
China
Prior art keywords
wafer
grabbing
driving
group
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202011542154.5A
Other languages
Chinese (zh)
Other versions
CN112864082B (en
Inventor
施心星
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Lumi Laser Technology Co ltd
Original Assignee
Suzhou Lumi Laser Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Lumi Laser Technology Co ltd filed Critical Suzhou Lumi Laser Technology Co ltd
Priority to CN202011542154.5A priority Critical patent/CN112864082B/en
Publication of CN112864082A publication Critical patent/CN112864082A/en
Application granted granted Critical
Publication of CN112864082B publication Critical patent/CN112864082B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The application discloses a wafer grabbing structure, wafer slotting equipment and a wafer slotting method, wherein a grabbing device of the wafer slotting equipment drives two groups of wafer grabbing structures for grabbing wafers to move step by step, so that the wafers are firstly driven to be glued in a gluing device, then the wafers are driven to be placed on a material carrying device, the material carrying device drives the wafers with glued surfaces to move to be in butt joint with a laser slotting device, the laser slotting device emits laser to the wafers with glued surfaces, so that the wafers are slotted on the surfaces under the condition of no contact with the wafers, the processing effect of slotting on the surfaces of the wafers is effectively ensured, and the yield of products is improved. The wafer grabbing structure finishes grabbing work of the wafer in two steps, wafers of various sizes can be flexibly clamped, and the applicability of the wafer grabbing structure is improved. The wafer grabbing structure is arranged in the process of slotting the surface of the wafer by the wafer slotting equipment, and the stability of the wafer in the transferring process can be ensured.

Description

Wafer grabbing structure, wafer slotting equipment and wafer slotting method
Technical Field
The application relates to the technical field of semiconductor processing systems, in particular to a wafer grabbing structure, wafer slotting equipment and a wafer slotting method.
Background
The wafer refers to a circular chip made of semiconductor integrated circuits, and the surface of the semiconductor wafer needs to be grooved in the production process. In the related art, the grooving cutter is adopted for processing the surface of the wafer, so that the process difficulty is high, the grooving cutter head directly acts on the surface of the wafer, the surface of the wafer is easy to be damaged due to improper force application and other factors, and the yield of products is reduced.
Disclosure of Invention
The application provides a wafer grabbing structure, a wafer slotting device and a wafer slotting method, which can solve the problem of high difficulty of the slotting process on the surface of a wafer in the background technology and improve the yield of products for slotting on the surface of the wafer.
In a first aspect, an embodiment of the present application provides a wafer grabbing structure, which includes a mounting plate, and a plurality of grabbing mechanisms and a plurality of positioning mechanisms mounted on the mounting plate. A placing area for containing the wafers is arranged among the plurality of groups of grabbing mechanisms, and each grabbing mechanism comprises a clamping jaw and a clamping driving assembly which is connected with the clamping jaw and used for driving the clamping jaw to grab the wafers. The positioning mechanism comprises a positioning claw and a positioning driving assembly which is connected with the positioning claw and used for driving the positioning claw to abut against a wafer borne on the clamping jaw. Wherein, multiunit centre gripping drive assembly and multiunit location drive assembly all install on the mounting panel and encircle and place the regional setting, and the clamping jaw is located to the clamping jaw towards one side of placing the region.
In some exemplary embodiments, the clamping jaw comprises a first clamping plate and a second clamping plate which are connected with each other, the first clamping plate is arranged along the direction perpendicular to the plate surface of the mounting plate, and the second clamping plate is arranged along the direction parallel to the plate surface of the mounting plate;
the clamping driving assembly comprises a clamping driving cylinder arranged on the mounting plate, and the driving end of the clamping driving cylinder is connected with the first clamping plate to drive the first clamping plate to move along the direction parallel to the surface of the mounting plate.
In some exemplary embodiments, the positioning driving assembly comprises a positioning driving motor and a bar-shaped sliding rail which are arranged on the mounting plate, a screw rod arranged at the end part of the positioning driving motor, and a sliding block arranged on the screw rod, wherein the sliding block is slidably arranged on the bar-shaped sliding rail which is arranged along a direction parallel to the plate surface of the mounting plate and parallel to the screw rod;
the positioning claws are arranged on the sliding blocks, are plate-shaped and are arranged along the direction vertical to the surface of the mounting plate, and the end parts of the positioning claws are provided with clamping grooves for bearing wafers.
In some exemplary embodiments, the mounting plate includes a plurality of mounting arms, and the plurality of sets of gripping mechanisms and the plurality of sets of positioning mechanisms are mounted on the plurality of mounting arms in a one-to-one correspondence.
In a second aspect, an embodiment of the present application provides a wafer slotting device, including:
the first group of wafer grabbing structures and the second group of wafer grabbing structures are the wafer grabbing structures respectively; the wafer slotting equipment further comprises a material grabbing device connected with the first group of wafer grabbing structures and the second group of wafer grabbing structures, a glue coating device used for coating a glue layer on the surface of the wafer, a material carrying device used for carrying the wafer, and a laser slotting device used for emitting laser to slot the surface of the wafer.
The material grabbing device is used for transferring the wafers grabbed on the first group of wafer grabbing structures into the gluing device, driving the second group of wafer grabbing structures to take out the wafers coated with the glue layer on the inner surface of the gluing device and placing the wafers coated with the glue layer on the surface on the material carrying device; the material loading device is used for driving the wafer with the surface coated with the glue layer to move to be in butt joint with the laser grooving device.
In some exemplary embodiments, the wafer slotting equipment further includes a cleaning device, and the material grabbing device is further configured to drive the second group of wafer grabbing structures to grab the wafer on which the groove is machined on the upper surface of the material loading device and transfer the wafer on which the groove is machined into the cleaning device for cleaning.
In some exemplary embodiments, the material grabbing device further comprises a first grabbing driving mechanism, a first transfer driving mechanism, a second grabbing driving mechanism and a second transfer driving mechanism;
the first transfer driving mechanism is connected with the first grabbing driving mechanism and used for driving the first grabbing driving mechanism to move towards the gluing device, the first grabbing driving mechanism is connected with the first group of wafer grabbing structures, and the first grabbing driving mechanism is used for driving the first group of wafer grabbing structures to place wafers into the gluing device;
the second grabbing driving mechanism is connected with the second group of wafer grabbing structures and used for driving the second group of wafer grabbing structures to take out the wafers coated with the glue layers on the inner surface of the gluing device, and the second transfer driving mechanism is connected with the second grabbing driving mechanism and used for driving the second grabbing driving mechanism to move from the gluing device to the material loading device;
the second grabbing driving mechanism is further used for driving the second group of wafer grabbing structures to grab the wafers with the grooves on the upper surface of the material loading device, and the second transfer driving mechanism is further used for driving the second group of wafer grabbing structures to place the wafers with the grooves on the surfaces in the cleaning device.
In some exemplary embodiments, the moving direction of the first group of wafer grabbing structures driven by the first grabbing driving mechanism and the moving direction of the second group of wafer grabbing structures driven by the second grabbing driving mechanism are both perpendicular to the surface of the mounting plate;
the first transfer driving mechanism drives the first grabbing driving mechanism to move in a direction, and the second transfer driving mechanism drives the second grabbing driving mechanism to move in a direction which is staggered and parallel to the surface of the mounting plate.
In some exemplary embodiments, the material loading device includes a material loading table for loading the wafer, and a material loading driving mechanism for driving the material loading table to move between the glue coating device and the laser grooving device, the material loading driving mechanism is further used for driving the wafer to move to be in butt joint with the laser grooving device, and the laser grooving device is used for acting on the surface of the wafer along a direction perpendicular to the plate surface of the mounting plate.
In a third aspect, an embodiment of the present application provides a wafer grooving method, where a wafer surface is grooved by using the wafer grooving apparatus described above, including the following steps:
controlling the material grabbing device to drive the first group of wafer grabbing structures to move, enabling the first group of wafer grabbing structures to be in butt joint with the gluing device, and controlling the first group of wafer grabbing structures to place the wafers in the gluing device;
controlling a gluing device to coat a glue layer on the surface of the wafer;
controlling the material grabbing device to drive the second group of wafer grabbing structures to take out the wafers with the surface coated with the adhesive layer, and continuously driving the second group of wafer grabbing structures to move to place the wafers with the surface coated with the adhesive layer on the material loading device;
controlling the material loading device to drive the wafer with the surface coated with the adhesive layer to move to be in butt joint with the laser grooving device;
and starting the laser grooving device to emit laser to act on one surface of the wafer with the surface coated with the glue layer, and engraving a groove on the surface of the wafer.
The application provides a wafer grabbing structure, wafer slotting equipment and a wafer slotting method, a grabbing device of the wafer slotting equipment drives two groups of wafer grabbing structures for grabbing wafers to move step by step, so that the wafers are firstly driven to be glued in a gluing device, then the wafers are driven to be placed on a material carrying device, the material carrying device drives the wafers with glued surfaces to move to be in butt joint with a laser slotting device, the laser slotting device emits laser to the wafers with glued surfaces, slotting is realized on the surfaces of the wafers under the condition of no contact with the wafers, the processing effect of slotting on the surfaces of the wafers is effectively ensured, and the product yield is improved. The wafer grabbing structure finishes grabbing work of the wafer in two steps, wafers of various sizes can be flexibly clamped, and the applicability of the wafer grabbing structure is improved. The wafer grabbing structure is arranged in the process of slotting the surface of the wafer by the wafer slotting equipment, and the stability of the wafer in the transferring process can be ensured.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic perspective view illustrating a wafer capture structure according to an embodiment of the present disclosure;
FIG. 2 is a schematic perspective view of another embodiment of a wafer capture structure according to the present application;
FIG. 3 is a schematic partial structure diagram of a wafer capture structure according to an embodiment of the present disclosure;
FIG. 4 is a schematic perspective view illustrating an embodiment of a wafer notching apparatus;
FIG. 5 is a top view of an embodiment of a wafer notching apparatus of the present application;
fig. 6 is a schematic perspective view illustrating a loading device mounted on a workbench according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The conventional wafer has various specifications such as four inches, six inches, eight inches and twelve inches, and the material claws of the related art device for slotting on the surface of the wafer have fixed sizes and can only be specially used for the wafer with a specific size or have unsatisfactory stability in the process of clamping the wafer. Therefore, the wafer grabbing structure capable of grabbing wafers of various sizes is provided, the applicability of the wafer grabbing structure in devices for wafer processing and the like is improved, and the processing cost is reduced.
As shown in fig. 1, which is a schematic perspective view of a wafer grabbing structure 200 provided in an embodiment of the present application, the wafer grabbing structure 200 includes a mounting plate 210, and a plurality of grabbing mechanisms 220 and a plurality of positioning mechanisms 230 mounted on the mounting plate 210.
A placing area 240 for accommodating the wafer 100 is disposed between the plurality of sets of gripping mechanisms 220, and each gripping mechanism 220 includes a clamping jaw 221 and a clamping driving assembly 222 connected to the clamping jaw 221 for driving the clamping jaw 221 to grip the wafer 100. The placing region 240 may be configured as a circular region, and the plurality of sets of clamping driving assemblies 222 may be configured to respectively drive the clamping jaws 221 to move in a direction away from the center of the placing region 240 at a time to adjust the area of the circular placing region 240, so as to grasp wafers 100 with different sizes.
As shown in fig. 2, the positioning mechanism 230 includes a positioning pawl 231 and a positioning driving assembly 232 connected to the positioning pawl 231 for driving the positioning pawl 231 to abut against the wafer 100 carried on the clamping jaw 221. The positioning driving assemblies 232 are each operable to drive the positioning claws 231 to move from a plurality of different directions to abut against the wafer 100.
The plurality of clamping driving assemblies 222 and the plurality of positioning driving assemblies 232 are mounted on the mounting plate 210 and are disposed around the placing region 240, and the positioning pawl 231 is disposed on one side of the clamping jaw 221 facing the placing region 240, so that the positioning driving assemblies 232 can drive the positioning pawl 231 to move in the placing region 240 inside the clamping jaw 221, and the positioning pawl 231 can abut against the wafers 100 with different sizes.
The wafer grabbing structure 200 provided in the embodiment of the present application grabs the wafer 100 placed on the external carrying device through the wafer grabbing structure 200, so that the wafer 100 is carried on the clamping jaw 221, and then the positioning driving component 232 of the positioning mechanism 230 drives the positioning jaw 231 located inside the clamping jaw 221 to push the wafer 100 carried on the clamping jaw 221, and the positioning jaw 231 abuts against the wafer 100 to fix the wafer 100, thereby completing grabbing of the wafer 100 in two steps, and also ensuring stability of the wafer 100 in the transferring process. The positioning driving assembly 232 can adjust the position of the positioning pawl 231 according to the size of the wafer 100, so as to conveniently and flexibly clamp the wafers 100 with various sizes, and improve the applicability of the wafer grabbing structure 200.
The number of the grabbing mechanisms 220 and the positioning mechanisms 230 may include three, four, five or six groups, etc. which are correspondingly arranged one by one, and the plurality of groups of grabbing mechanisms 220 and the plurality of groups of positioning mechanisms 230 are uniformly installed on the installation plate 210. Taking four groups of gripping mechanisms 220 as an example, the gripping mechanisms 220 are uniformly installed on the mounting plate 210, and the four groups of gripping mechanisms 220 can respectively approach the wafer 100 from four different directions, so as to stably claw the wafer 100 carried on the external carrying device; four sets of positioning mechanisms 230 are respectively abutted against the wafer 100 from four different directions to fix the position of the wafer 100, thereby ensuring the stability of the wafer 100 during the transfer process.
The mounting plate 210 may be mounted to an external device to complete the mounting of the wafer capture structure 200. The mounting plate 210 may be configured as a flat plate, and the plurality of sets of grabbing mechanisms 220 and the plurality of sets of positioning mechanisms 230 may be installed around the connection portion of the mounting plate 210 and the external structure, and are uniformly installed on the flat plate-shaped mounting plate 210, so that the wafer grabbing structure 200 is compact, and the space occupied by the whole wafer grabbing structure 200 is saved.
In some exemplary embodiments, the clamping jaw 221 includes a first clamping plate 2211 and a second clamping plate 2212 connected to each other, the first clamping plate 2211 being disposed in a direction perpendicular to the plate surface of the mounting plate 210, and the second clamping plate 2212 being disposed in a direction parallel to the plate surface of the mounting plate 210. The clamping driving assembly 222 includes a clamping driving cylinder installed on the mounting plate 210, and a driving end of the clamping driving cylinder is connected to the first clamping plate 2211 to drive the first clamping plate 2211 to move along a direction parallel to the surface of the mounting plate 210, and drive the first clamping plate 2211 to move along a center far away from or close to the placement area 240. Specifically, when clamping the material, the clamping driving cylinder is first controlled to drive the first clamping plate 2211 to move along the center of the placement area 240, so as to enlarge the space between the plurality of clamping jaws 221. And then the wafer grabbing structure 200 is controlled to move towards the wafer 100 loaded on the external loading device along the direction perpendicular to the plate surface of the mounting plate 210 until the mounting plate 210 and the second clamping plate 2212 are respectively located at two opposite sides of the wafer 100. Then, the clamping driving cylinder is controlled to drive the first clamping plate 2211 to move towards the center of the placing area 240 until the second clamping plate 2212 is partially overlapped with the wafer 100 in the direction perpendicular to the plate surface of the mounting plate 210, and finally, the wafer grabbing structure 200 is driven to move towards the direction perpendicular to the plate surface of the mounting plate 210, so that the wafer 100 is borne on the second clamping plate 2212 and the wafer 100 is taken away from an external bearing device, and the grabbing of the wafer 100 is completed.
After the wafer 100 is picked up and carried on the second clamping plate 2212, the second clamping plate 2212 can carry wafers 100 of different sizes by adjusting the width of the second clamping plate 2212 in a plane parallel to the mounting plate 210. The surface of the second clamping plate 2212 that contacts the wafer 100 may be disposed in a plane parallel to the surface of the mounting plate 210 to ensure the stability of the wafer 100 carried on the second clamping plate 2212.
As shown in fig. 2, in some exemplary embodiments, the positioning driving assembly 232 includes a positioning driving motor 2321 and a bar-shaped sliding rail 2322 installed on the mounting plate 210, a screw 2323 installed at an end of the positioning driving motor 2321, and a slider 2324 installed on the screw 2323, where the slider 2324 is slidably installed on the bar-shaped sliding rail 2322, and the bar-shaped sliding rail 2322 is arranged parallel to the plate surface of the mounting plate 210 and parallel to the screw 2323. The positioning claws 231 are mounted on the sliders 2324, the positioning claws 231 are plate-shaped and are disposed in a direction perpendicular to the plate surface of the mounting plate 210, and the end portions of the positioning claws 231 are provided with retaining grooves 2311 for receiving the wafers 100. The positioning driving motor 2321 can be controlled to operate to drive the lead screw 2323 to operate and further drive the slider 2324 to slide on the slide rail, and the slider 2324 further drives the positioning pawl 231 to move along the plane parallel to the mounting plate 210 and towards the center of the far away or close to the placement area 240, so as to control the connection state of the positioning pawl 231 and the wafer 100.
In the process that the clamping driving cylinder drives the clamping jaw 221 to grab the wafer 100, the positioning driving motor 2321 needs to be controlled to drive the positioning pawl 231 to move towards the center away from the placement area 240, the positioning pawl 231 is adjusted to be located between the wafer 100 and the first clamping plate 2211, meanwhile, the end of the positioning pawl 231 is not in contact with the wafer 100, a gap exists between the positioning pawl 231 and the first clamping plate 2211 in a plane parallel to the surface of the mounting plate 210, and the distance between the positioning pawl 231 and the first clamping plate 2211 is greater than the distance that the first clamping plate 2211 moves towards the center of the placement area 240 to grab the wafer 100, so as to ensure that the clamping driving cylinder can smoothly drive the first clamping plate 2211 to move.
After the grasping mechanism 220 grasps the wafer 100 and the wafer 100 is received on the first clamping plate 2211, the one or more positioning driving motors 2321 are controlled to operate to drive the corresponding positioning claws 231 to move toward the direction close to the center of the placing region 240, and the positioning claws 231 move to be connected with the wafer 100 and then continue to push the wafer 100 toward the center of the placing region 240 from multiple directions until all the positioning claws 231 are connected with the wafer 100. After the wafer 100 abuts against the positioning claws 231, the center of the wafer 100 may overlap the center of the placing area 240, and the wafer 100 may be limited in the center area 240 of the placing area to protect the wafer 100.
The positioning claw 231 is plate-shaped, and the clamping groove 2311 is formed in the end of the positioning claw 231, so that the space occupied by the positioning claw 231 can be effectively saved, the stroke of the clamping driving cylinder driving the first clamping plate 2211 to move is conveniently reduced, and the space occupied by the whole wafer grabbing structure 200 is reduced. The locking groove 2311 at the end of the positioning claw 231 is disposed adjacent to the second clamping plate 2212, so that the wafer 100 can enter the locking groove 2311.
In some exemplary embodiments, the mounting plate 210 includes a plurality of mounting arms 211, and the plurality of sets of gripping mechanisms 220 and the plurality of sets of positioning mechanisms 230 are mounted on the plurality of mounting arms 211 in a one-to-one correspondence. Specifically, a clamping driving cylinder may be installed on a side of the mounting arm 211 away from the placement area 240, and the first clamping plate 2211 is connected to a driving end of the clamping driving cylinder and bypasses an end of the mounting arm 211, so that the second clamping plate 2212 is located on a side of the mounting arm 211 facing the placement area 240. A bar-shaped sliding rail 2322 may be installed on one side of the mounting arm 211 facing the placement area 240, the positioning driving motor 2321 and the lead screw 2323 are installed on a side wall of the mounting arm 211, and two ends of the slider 2324 are respectively connected with the lead screw 2323 and the bar-shaped sliding rail 2322, so that the clamping jaw 221 moves on one side of the mounting arm 211 facing the placement area 240 under the action of the positioning driving motor 2321. By arranging the mounting plate 210 to include a plurality of mounting arms 211, the grasping mechanism 220 and the positioning mechanism 230 are installed in different regions, so that the wafer grasping structure 200 is compact, and the installation space of the wafer 100 mounting structure is saved.
The grasping mechanism 220 is mounted on the same mounting arm 211 as the positioning mechanism 230 such that the positioning claws 231 of the positioning mechanism 230 are disposed adjacent to the gripping claws 221 of the grasping mechanism 220. Preferably, as shown in fig. 3, the end of the positioning claw 231 facing the first surface of the second clamping plate 2212 is disposed as a plane parallel to the plate surface of the mounting plate 210, the first surface is attached to the surface of the second clamping plate 2212, and the end of the positioning groove 2311 is disposed with a guiding inclined surface 2312 connected to the first surface, so that a smooth transition structure is formed between the surface of the second clamping plate 2212 and the positioning groove 2311 on the positioning claw 231, and the wafer 100 can be smoothly slid into the positioning groove 2311. The wall surface of the clamping groove 2311 connected with the guide inclined surface 2312 is parallel to the surface of the mounting plate 210, the edge of the wafer 100 enters the clamping groove 2311 and then is received on the wall surface connected with the guide inclined surface 2312, and meanwhile, the surface of the wafer 100 is attached to or abutted against the bottom surface of the clamping groove 2311, so that the stability of the wafer 100 in the clamping groove 2311 is ensured.
The wafer grabbing structure 200 provided by the embodiment of the application can effectively ensure the grabbing stability of the wafer 100 after the positioning claw 231 grabs the wafer 100, can drive the wafer 100 to carry out multi-angle transfer, and can apply the wafer grabbing structure 200 to various wafer 100 processing devices with different processing requirements.
As shown in fig. 4, the embodiment of the present application further provides a wafer slotting apparatus 300, where the wafer slotting apparatus 300 includes a first group of wafer grabbing structures 311 and a second group of wafer grabbing structures 312, where the first group of wafer grabbing structures 311 and the second group of wafer grabbing structures 312 are the wafer grabbing structures 200 as described above, respectively. The wafer grooving apparatus 300 further includes a material grabbing device 320 connected to the first group of wafer grabbing structures 311 and the second group of wafer grabbing structures 312, a glue coating device 330 for coating a glue layer on the surface of the wafer 100, a material loading device 340 for receiving the wafer 100, and a laser grooving device 350 for emitting laser to groove the surface of the wafer 100. The material grabbing device 320 is used for transferring the wafer 100 grabbed on the first group of wafer grabbing structures 311 into the gluing device 330, driving the second group of wafer grabbing structures 312 to take out the wafer 100 coated with the glue layer on the inner surface of the gluing device 330, and placing the wafer 100 coated with the glue layer on the surface on the material loading device 340; the loading device 340 is used to drive the wafer 100 with the glue layer coated on the surface to move to be in butt joint with the laser grooving device 350.
The wafer slotting device 300 provided by the embodiment of the application grabs the wafer 100 by arranging the two groups of wafer grabbing structures 200, and drives the two groups of wafer grabbing structures 200 grabbing the wafer 100 to move by the grabbing device 320, so as to drive the wafer 100 to glue in the gluing device 330, then drive the wafer 100 to be placed on the material carrying device 340, drive the wafer 100 with the glued surface to move to be butted with the laser slotting device 350 by the material carrying device 340, and the laser slotting device 350 emits laser to the wafer 100 with the glued surface to realize slotting on the surface of the wafer 100 under the condition of no contact with the wafer 100, thereby effectively ensuring the slotting processing effect on the surface of the wafer 100 and improving the product yield.
Impurities such as debris or melt are generated during the process of applying laser to the surface of the wafer 100 to open the groove, and the wafer 100 after opening the groove needs to be cleaned to remove the impurities on the surface, so as to ensure the subsequent use effect of the wafer 100. In some exemplary embodiments, the wafer slotting device 300 further includes a cleaning device, and the material grabbing device 320 is further configured to drive the second group of wafer grabbing structures 312 to grab the wafer 100 with the groove machined on the upper surface of the material loading device 340 and transfer the wafer 100 with the groove machined into the cleaning device for cleaning.
In some embodiments, the cleaning device may be disposed adjacent to the glue applicator 330. Specifically, the cleaning device and the glue spreading device 330 may be installed in the same installation barrel in a centralized manner, and the cleaning device is located below the glue spreading device 330 in the vertical direction, the glue spreading device 330 may apply a glue layer on the surface of the wafer 100 by spraying on the upper layer, the cleaning device cleans the wafer 100 with a groove on the surface on the lower layer, and the glue spreading device 330 and the cleaning device do not affect each other in each independent operation. The cleaning device and the gluing device 330 are installed in a centralized manner, so that the installation space occupied by the whole wafer slotting equipment 300 is saved, and the installation and the transfer of the wafer slotting equipment 300 are facilitated.
The wafer grooving apparatus 300 may further include a workbench 361 and a back-end control system, the material grabbing device 320, the glue applying device 330, the material loading device 340, the laser grooving device 350 and the cleaning device may all be mounted on the workbench 361, and the first group of wafer grabbing structures 311, the second group of wafer grabbing structures 312, the material grabbing device 320, the glue applying device 330, the material loading device 340, the laser grooving device 350 and the cleaning device are all connected to the back-end control system, and the back-end control system may control the devices to alternatively operate to complete the grooving operation on the surface of the wafer 100.
In some exemplary embodiments, the gripper 320 further comprises a first gripper drive 321, a first transfer drive 322, a second gripper drive 323, and a second transfer drive 324.
Specifically, the first transfer driving mechanism 322 is connected to the first grabbing driving mechanism 321 and is configured to drive the first grabbing driving mechanism 321 to move toward the gluing device 330, the first grabbing driving mechanism 321 is connected to the first group of wafer grabbing structures 311, and the first grabbing driving mechanism 321 is configured to drive the first group of wafer grabbing structures 311 to place the wafer 100 in the gluing device 330. The second grabbing driving mechanism 323 is connected to the second group of wafer grabbing structures 312, the second grabbing driving mechanism 323 is used for driving the second group of wafer grabbing structures 312 to take out the wafer 100 with the glue layer coated on the inner surface of the gluing device 330, and the second transferring driving mechanism 324 is connected to the second grabbing driving mechanism 323 and used for driving the second grabbing driving mechanism 323 to move from the gluing device 330 to the material loading device 340. The second grabbing driving mechanism 323 is further configured to drive the second group of wafer grabbing structures 312 to grab the wafer 100 with the grooved upper surface of the loading device 340, and the second transferring driving mechanism 324 is further configured to drive the second group of wafer grabbing structures 312 to place the wafer 100 with the grooved upper surface in the cleaning device.
Specifically, in some embodiments, the first grip drive mechanism 321, the first transfer drive mechanism 322, the second grip drive mechanism 323, and the second transfer drive mechanism 324 may all be lead screw 2323 drive mechanisms. A mounting frame (not shown) may be disposed on the working platform 361, the first transfer driving mechanism 322 and the second transfer driving mechanism 324 may be mounted on the mounting frame, the first grabbing driving mechanism 321 is mounted at a driving end of the first transfer driving mechanism 322, the first group of wafer grabbing structures 311 is mounted at a driving end of the first grabbing driving mechanism 321, the second grabbing driving mechanism 323 is mounted at a driving end of the second transfer driving mechanism 324, and the second group of wafer grabbing structures 312 is mounted at a driving end of the second grabbing driving mechanism 323. The back end control system controls the first grabbing driving mechanism 321 and the first transferring driving mechanism 322 to drive the first group of wafer grabbing structures 311, and controls the second grabbing driving mechanism 323 and the second transferring driving mechanism 324 to drive the second group of wafer grabbing structures 312 to move alternately to transfer the wafers 100 in different states.
In some exemplary embodiments, the first grabbing driving mechanism 321 drives the first group of wafer grabbing structures 311 to move in a direction perpendicular to the surface of the mounting plate 210, and the second group of grabbing driving mechanisms drives the second group of wafer grabbing structures 312 to move in a direction perpendicular to the surface of the mounting plate 210. The first transfer driving mechanism 322 drives the first grabbing driving mechanism 321 to move in a direction, and the second transfer driving mechanism 324 drives the second grabbing driving mechanism 323 to move in a direction staggered and parallel to the surface of the mounting plate 210. For example, the mounting plate 210 is arranged along the horizontal direction, the wafer 100 grabbed on the wafer grabbing structure 200 can be placed along the horizontal direction, the first grabbing driving mechanism 321 can drive the first group of wafer grabbing structures 311 and the wafer 100 thereon to move along the vertical direction, grab the wafer 100 pushed out of the magazine 370 or place the wafer 100 in the gluing device 330, and the first transferring driving mechanism 322 can drive the first group of wafer grabbing structures 311 and the wafer 100 thereon to move along the horizontal direction from the outlet of the magazine 370 to the upper side of the gluing device 330; the second transfer driving mechanism 324 can drive the second group of wafer grabbing structures 312 and the wafers 100 thereon to move from the upper part of the gluing device 330 to the upper part of the loading device 340 or from the upper part of the loading device 340 to the upper part of the cleaning device along the horizontal direction; the second grabbing driving mechanism 323 can drive the second group of wafer grabbing structures 312 and the wafers 100 thereon to move in the vertical direction, so as to take out the wafers 100 from the gluing device 330, place the wafers 100 on the material loading device 340, grab the wafers 100 with grooves on the upper surface of the material loading device 340, and place the wafers 100 with grooves on the surface in the cleaning device, thereby completing various transfer operations of the wafers 100 in different states.
The moving direction of the first transferring driving mechanism 321 driven by the first transferring driving mechanism 322 and the moving direction of the second transferring driving mechanism 323 driven by the second transferring driving mechanism 324 are staggered, so that the first transferring driving mechanism 322 and the second transferring driving mechanism 324 can respectively drive the first grabbing driving mechanism 321 and the second grabbing driving mechanism 323 to move above the gluing device 330 and the cleaning device alternately.
In some exemplary embodiments, the loading device 340 includes a loading platform 341 for holding the wafer 100, and a loading driving mechanism 342 for driving the loading platform 341 to move between the glue coating device 330 and the laser grooving device 350, wherein the loading driving mechanism 342 is further configured to drive the wafer 100 to move to interface with the laser grooving device 350, and the laser grooving device 350 is configured to act on the surface of the wafer 100 in a direction perpendicular to the plate surface of the mounting plate 210. Specifically, the material loading driving mechanism 342 may include a first material loading driving mechanism for driving the wafer 100 to move along a first predetermined direction, and a second material loading driving mechanism for driving the wafer 100 to move along a second predetermined direction, as indicated by arrows in fig. 5, the first predetermined direction is the direction of the arrow, the second predetermined direction is perpendicular to the first predetermined direction, the glue coating device 330 and the magazine 370 may be arranged side by side along a direction parallel to the first predetermined direction, and the laser grooving device 350 is arranged opposite to one of the glue coating device 330 and the magazine 370 along the second predetermined direction, so that the material loading device 340 may move flexibly along two directions to be in butt joint with the first group of wafer grabbing structures 311 and the second group of wafer grabbing structures 312.
As shown in fig. 6, the first loading driving mechanism may include a first driving motor installed on the workbench 361 and a first rail slider structure connected to the first driving motor, the first rail 3421 of the first rail slider structure is installed on the workbench 361, the second loading driving mechanism may include a carrier plate 3423 installed on the first slider 3422 of the first rail slider structure, a second rail slider structure installed on the carrier plate 3423 and a second driving motor connected to the second rail slider structure, the loading table 341 is installed on the carrier plate 3423 of the second loading driving mechanism, the wafer 100 to be grooved is placed on the loading table 341 such that the first rail 3421 moves along a first preset direction or the second rail moves along a second preset direction, so as to drive the wafer 100 on the loading platform 341 to move between the first group of wafer grabbing structures 311, the second group of wafer grabbing structures 312 and the laser grooving apparatus 350.
The embodiment of the present application further provides a method for slotting a wafer 100, where the above wafer slotting device 300 is used to slot a surface of the wafer 100, and the method specifically includes the following steps:
s101, controlling the material grabbing device 320 to drive the first group of wafer grabbing structures 311 to move, enabling the first group of wafer grabbing structures 311 to be in butt joint with the gluing device 330, and controlling the first group of wafer grabbing structures 311 to place the wafer 100 in the gluing device 330.
Specifically, the first grabbing driving mechanism 321 may be controlled to drive the first group of wafer grabbing structures 311 to move towards the workbench 361, and control the first group of wafer grabbing structures 311 to grab the wafer pushed out from the magazine 370, and then control the first grabbing driving mechanism 321 to drive the first group of wafer grabbing structures 311 to move towards a direction away from the workbench 361 to grab the wafer 100. Then, the first transfer driving mechanism 322 is controlled to drive the first grabbing driving mechanism 321 to move towards the gluing device 330, and the first group of wafer grabbing structures 311 are moved to be in butt joint with the gluing device 330, the first grabbing driving mechanism 321 is controlled to drive the first group of wafer grabbing structures 311 to move towards the gluing device 330, and the first group of wafer grabbing structures 311 are controlled to place the wafer 100 in the gluing device 330.
S102, controlling the glue coating device 330 to coat the glue layer on the surface of the wafer 100, so that the glue layer is completely distributed on the surface of the wafer 100.
And S103, controlling the material grabbing device 320 to drive the second group of wafer grabbing structures 312 to take out the wafer 100 with the surface coated with the adhesive layer, and continuously driving the second group of wafer grabbing structures 312 to move to place the wafer 100 with the surface coated with the adhesive layer on the material loading device 340.
Specifically, the first transfer driving mechanism 322 is controlled to take the first grabbing driving mechanism 321 and the first group of wafer grabbing structures 311 away from the gluing device 330, and the second transfer driving mechanism 324 is continuously controlled to drive the second grabbing driving mechanism 323 to move, so that the second group of wafer grabbing structures 312 are butted with the gluing device 330. The second grabbing driving mechanism 323 is controlled to drive the second group of wafer grabbing structures 312 to move towards the gluing device 330 and grab the wafer 100 with the glue layer coated on the surface, the second grabbing driving mechanism 323 is controlled to drive the second group of wafer grabbing structures 312 with the grabbed wafer 100 to move out of the gluing device 330, the second transfer driving mechanism 324 and the second grabbing driving mechanism 323 are continuously controlled to drive the second group of wafer grabbing structures 312 to move towards the material loading table 341, and the second group of wafer grabbing structures 312 are controlled to place the wafer with the glue layer coated on the surface on the material loading table 341.
S104, controlling the material loading device 340 to drive the wafer 100 with the surface coated with the glue layer to move to be in butt joint with the laser grooving device 350.
According to the installation position of the laser grooving device 350 on the workbench, the first loading driving mechanism and the second loading driving mechanism of the loading device can be controlled to drive the loading platform 341 to move step by step along one direction or multiple directions to be in butt joint with the laser grooving device 350.
And S105, starting the laser grooving device 350 to emit laser to act on one surface of the wafer 100 with the glue layer coated on the surface, and grooving the surface of the wafer 100.
According to the method for slotting the wafer 100 provided by the embodiment of the application, after the adhesive layer is coated on the surface of the wafer 100, the wafer 100 is moved to be in butt joint with the laser slotting device 350, the laser slotting device 350 emits laser to slot the surface of the wafer 100 in a non-contact manner, and the slotting efficiency and the product yield of the surface of the wafer 100 are effectively improved. By coating the glue on the surface of the wafer 100 in advance and then grooving, the glue layer on the surface of the wafer 100 can isolate external impurities or impurities generated in the grooving process, so that the surface of the wafer 100 can be cleaned conveniently, and the processing efficiency of the wafer 100 is improved.
After step S105 is completed, the embodiment of the present application may further include the following steps:
s106, controlling the material loading device 340 to drive the wafer 100 with the groove carved on the surface to move out of the end of the laser grooving device 350, controlling the material grabbing device 320 to drive the second group of wafer grabbing structures 312 to be in butt joint with the material loading device 340 again, controlling the second group of wafer grabbing structures 312 to grab the wafer 100 with the groove carved on the surface, controlling the material grabbing device 320 to continuously drive the second group of wafer grabbing structures 312 to move to be in butt joint with the cleaning device, controlling the second group of wafer grabbing structures 312 to place the wafer 100 in the cleaning device, cleaning impurities such as glue layers and scraps on the surface of the wafer 100 through the cleaning device, taking out the cleaned wafer 100 from the cleaning device, and completing the process of grooving on the surface of the wafer 100.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A wafer grasping structure, comprising:
mounting a plate;
the wafer picking mechanism comprises a plurality of groups of picking mechanisms, wherein a placing area for containing wafers is arranged between the plurality of groups of picking mechanisms, and each picking mechanism comprises a clamping jaw and a clamping driving assembly which is connected with the clamping jaw and is used for driving the clamping jaw to pick the wafers; and
the positioning mechanism comprises a positioning claw and a positioning driving assembly which is connected with the positioning claw and is used for driving the positioning claw to abut against the wafer loaded on the clamping jaw;
wherein, the multiunit centre gripping drive assembly and multiunit location drive assembly all install in on the mounting panel and encircle place regional setting, just the locating pawl is located the clamping jaw orientation place regional one side.
2. The wafer grabbing structure of claim 1, wherein the clamping jaw comprises a first clamping plate and a second clamping plate which are connected with each other, the first clamping plate is arranged along a direction perpendicular to the surface of the mounting plate, and the second clamping plate is arranged along a direction parallel to the surface of the mounting plate;
the clamping driving assembly comprises a clamping driving cylinder arranged on the mounting plate, and the driving end of the clamping driving cylinder is connected with the first clamping plate to drive the first clamping plate to move along the direction parallel to the surface of the mounting plate.
3. The wafer grabbing structure of claim 1, wherein the positioning driving assembly comprises a positioning driving motor and a bar-shaped sliding rail which are mounted on the mounting plate, a screw rod which is mounted at the end part of the positioning driving motor, and a sliding block which is mounted on the screw rod, wherein the sliding block is slidably mounted on the bar-shaped sliding rail, and the bar-shaped sliding rail is arranged in parallel with the surface of the mounting plate and the screw rod;
the positioning claws are arranged on the sliding blocks, are plate-shaped and are arranged in the direction vertical to the surface of the mounting plate, and clamping grooves for bearing the wafers are formed in the end parts of the positioning claws.
4. The wafer grabbing structure of claim 1, wherein the mounting plate comprises a plurality of mounting arms, and a plurality of groups of grabbing mechanisms and a plurality of groups of positioning mechanisms are mounted on the plurality of mounting arms in a one-to-one correspondence.
5. A wafer notching apparatus, comprising:
a first group of wafer grabbing structures and a second group of wafer grabbing structures, wherein the first group of wafer grabbing structures and the second group of wafer grabbing structures are respectively the wafer grabbing structures according to any one of the claims 1 to 4;
the material grabbing device is connected with the first group of wafer grabbing structures and the second group of wafer grabbing structures;
the glue coating device is used for coating a glue layer on the surface of the wafer;
the material loading device is used for receiving the wafer;
the laser grooving device is used for emitting laser to groove the surface of the wafer;
the material grabbing device is used for transferring the wafers grabbed on the first group of wafer grabbing structures into the gluing device, driving the second group of wafer grabbing structures to take out the wafers coated with the glue layer on the inner surface of the gluing device and placing the wafers coated with the glue layer on the surface on the material loading device; the material loading device is used for driving the wafer with the surface coated with the glue layer to move to be in butt joint with the laser grooving device.
6. The wafer slotting device according to claim 5, wherein the wafer slotting device further comprises a cleaning device, and the grabbing device is further used for driving the second group of wafer grabbing structures to grab the wafer with the groove machined on the upper surface of the loading device and transfer the wafer with the groove machined into the cleaning device for cleaning.
7. The wafer notching apparatus of claim 6, wherein the material grasping device further comprises a first grasping drive mechanism, a first transfer drive mechanism, a second grasping drive mechanism, and a second transfer drive mechanism;
the first transfer driving mechanism is connected with the first grabbing driving mechanism and used for driving the first grabbing driving mechanism to move towards the gluing device, the first grabbing driving mechanism is connected with the first group of wafer grabbing structures, and the first grabbing driving mechanism is used for driving the first group of wafer grabbing structures to place the wafers in the gluing device;
the second grabbing driving mechanism is connected with the second group of wafer grabbing structures, and is used for driving the second group of wafer grabbing structures to take out the wafers coated with the glue layers on the inner surface of the gluing device;
the second grabbing driving mechanism is further used for driving the second group of wafer grabbing structures to grab the wafers with the grooves on the upper surface of the loading device, and the second transfer driving mechanism is further used for driving the second group of wafer grabbing structures to place the wafers with the grooves on the surfaces in the cleaning device.
8. The wafer slotting apparatus as claimed in claim 7, wherein the first group of wafer grabbing structures are driven by the first grabbing driving mechanism to move in a direction perpendicular to the plate surface of the mounting plate;
the first transfer driving mechanism drives the first moving direction of the grabbing driving mechanism, the second transfer driving mechanism drives the second moving direction of the grabbing driving mechanism is arranged in a staggered mode and is parallel to the surface of the mounting plate.
9. The wafer slotting device as claimed in claim 6, wherein the material loading device comprises a material loading table for loading the wafer, and a material loading driving mechanism for driving the material loading table to move between the gluing device and the laser slotting device, the material loading driving mechanism is further used for driving the wafer to move to be in butt joint with the laser slotting device, and the laser slotting device is used for acting on the surface of the wafer along a direction perpendicular to the plate surface of the mounting plate.
10. A method of notching a wafer with the wafer notching apparatus of any one of claims 6 through 9, comprising the steps of:
controlling a material grabbing device to drive the first group of wafer grabbing structures to move, enabling the first group of wafer grabbing structures to be in butt joint with the gluing device, and controlling the first group of wafer grabbing structures to place the wafers in the gluing device;
controlling the glue coating device to coat a glue layer on the surface of the wafer;
controlling the material grabbing device to drive the second group of wafer grabbing structures to take out the wafers with the surfaces coated with the adhesive layers, and continuously driving the second group of wafer grabbing structures to move to place the wafers with the surfaces coated with the adhesive layers on the material loading device;
controlling the material loading device to drive the wafer with the surface coated with the adhesive layer to move to be in butt joint with the laser grooving device;
and starting the laser grooving device to emit laser to act on one surface of the wafer with the surface coated with the glue layer, and engraving a groove on the surface of the wafer.
CN202011542154.5A 2020-12-23 2020-12-23 Wafer grabbing structure, wafer slotting equipment and wafer slotting method Active CN112864082B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011542154.5A CN112864082B (en) 2020-12-23 2020-12-23 Wafer grabbing structure, wafer slotting equipment and wafer slotting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011542154.5A CN112864082B (en) 2020-12-23 2020-12-23 Wafer grabbing structure, wafer slotting equipment and wafer slotting method

Publications (2)

Publication Number Publication Date
CN112864082A true CN112864082A (en) 2021-05-28
CN112864082B CN112864082B (en) 2022-11-04

Family

ID=75996450

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011542154.5A Active CN112864082B (en) 2020-12-23 2020-12-23 Wafer grabbing structure, wafer slotting equipment and wafer slotting method

Country Status (1)

Country Link
CN (1) CN112864082B (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218183A (en) * 2002-01-24 2003-07-31 Kondo Seisakusho:Kk Wafer carrying device
CN101465309A (en) * 2009-01-09 2009-06-24 富创得科技（沈阳）有限公司 Translational overturn type automatic conveying device for silicon wafer
CN205702861U (en) * 2016-04-26 2016-11-23 深圳市中兴新通讯设备有限公司 A kind of can the laser cutting device of automatic loading/unloading
CN106944755A (en) * 2017-05-19 2017-07-14 苏州镭明激光科技有限公司 A kind of fully-automatic laser processing unit (plant) slotted for LOW K
JP2019125756A (en) * 2018-01-19 2019-07-25 株式会社東京精密 Workpiece transfer device and workpiece transfer method
CN209478651U (en) * 2018-12-26 2019-10-11 苏州镭明激光科技有限公司 Equipment above and below automatic-positioning type
CN210585533U (en) * 2019-08-05 2020-05-22 深圳泰研半导体装备有限公司 Automatic wafer cleaning and gluing device
JP2020088072A (en) * 2018-11-20 2020-06-04 株式会社東京精密 Wafer delivery device
CN211507602U (en) * 2020-07-30 2020-09-15 华海清科(北京)科技有限公司 Wafer supporting device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218183A (en) * 2002-01-24 2003-07-31 Kondo Seisakusho:Kk Wafer carrying device
CN101465309A (en) * 2009-01-09 2009-06-24 富创得科技（沈阳）有限公司 Translational overturn type automatic conveying device for silicon wafer
CN205702861U (en) * 2016-04-26 2016-11-23 深圳市中兴新通讯设备有限公司 A kind of can the laser cutting device of automatic loading/unloading
CN106944755A (en) * 2017-05-19 2017-07-14 苏州镭明激光科技有限公司 A kind of fully-automatic laser processing unit (plant) slotted for LOW K
JP2019125756A (en) * 2018-01-19 2019-07-25 株式会社東京精密 Workpiece transfer device and workpiece transfer method
JP2020088072A (en) * 2018-11-20 2020-06-04 株式会社東京精密 Wafer delivery device
CN209478651U (en) * 2018-12-26 2019-10-11 苏州镭明激光科技有限公司 Equipment above and below automatic-positioning type
CN210585533U (en) * 2019-08-05 2020-05-22 深圳泰研半导体装备有限公司 Automatic wafer cleaning and gluing device
CN211507602U (en) * 2020-07-30 2020-09-15 华海清科(北京)科技有限公司 Wafer supporting device

Also Published As

Publication number Publication date
CN112864082B (en) 2022-11-04

Similar Documents

Publication Publication Date Title
CN110126107B (en) Silicon rod conversion device, silicon rod squaring equipment and silicon rod squaring method
CN110126108B (en) Silicon rod squaring equipment, silicon rod squaring method and edge skin unloading device
KR101444815B1 (en) Apparatus for machining material automatically
US7156602B2 (en) Mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machine
KR20100066741A (en) Over head jig and apparatus for manufacturing of solar cell string
WO2005081611A1 (en) Support pin holding device and substrate supporting device
TWI823623B (en) A wafer polishing system, loading method and application method thereof
JP4598058B2 (en) Work handling device
CN112864082B (en) Wafer grabbing structure, wafer slotting equipment and wafer slotting method
CN216638060U (en) Clamping device
JPH05285766A (en) Automatic tool replacing device of machine tool
US6412622B1 (en) Apparatus for the automated processing of workpieces
CN209829442U (en) Dispensing system
JP2017170551A (en) Full automatic drill device
CN116475820A (en) Double-procedure overturning processing equipment and working method thereof
US20050020420A1 (en) Machine tool with gripper and/or tool magazine system
CN115448014A (en) Feeding and discharging device and feeding and discharging system
CN209793759U (en) Lens coupling clamping device
CN219404310U (en) Manipulator and automation equipment
CN217322313U (en) Clamping mechanism and clamping equipment
CN218193116U (en) Laser processing apparatus
JP2001036291A (en) Plate-like work feeder
CN216443949U (en) Device for automatically identifying and grabbing unsealed cartons
CN115473389B (en) Circuit board assembling equipment
CN220740806U (en) Average compression frock structure

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant