CN112640152B - 蒸镀用掩模及其制备方法 - Google Patents
蒸镀用掩模及其制备方法 Download PDFInfo
- Publication number
- CN112640152B CN112640152B CN201980057661.9A CN201980057661A CN112640152B CN 112640152 B CN112640152 B CN 112640152B CN 201980057661 A CN201980057661 A CN 201980057661A CN 112640152 B CN112640152 B CN 112640152B
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- vapor deposition
- deposition mask
- holes
- groove
- mask
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- 238000007740 vapor deposition Methods 0.000 title claims abstract description 406
- 238000004519 manufacturing process Methods 0.000 title description 11
- 238000004891 communication Methods 0.000 claims abstract description 28
- 230000008020 evaporation Effects 0.000 claims description 58
- 238000001704 evaporation Methods 0.000 claims description 58
- 239000007769 metal material Substances 0.000 claims description 4
- 239000010953 base metal Substances 0.000 description 62
- 238000005530 etching Methods 0.000 description 51
- 239000010410 layer Substances 0.000 description 43
- 229920002120 photoresistant polymer Polymers 0.000 description 35
- 239000000758 substrate Substances 0.000 description 27
- 239000002335 surface treatment layer Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 19
- 239000000126 substance Substances 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 230000000694 effects Effects 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 230000007547 defect Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 229910001374 Invar Inorganic materials 0.000 description 7
- 239000011368 organic material Substances 0.000 description 7
- 238000000926 separation method Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 239000011148 porous material Substances 0.000 description 6
- 229910000990 Ni alloy Inorganic materials 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000011572 manganese Substances 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000005416 organic matter Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- JAWMENYCRQKKJY-UHFFFAOYSA-N [3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-ylmethyl)-1-oxa-2,8-diazaspiro[4.5]dec-2-en-8-yl]-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]methanone Chemical compound N1N=NC=2CN(CCC=21)CC1=NOC2(C1)CCN(CC2)C(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F JAWMENYCRQKKJY-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
- C23F1/04—Chemical milling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410185675.1A CN117966101A (zh) | 2018-09-04 | 2019-08-30 | 蒸镀用掩模及其制备方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180105328A KR102642138B1 (ko) | 2018-09-04 | 2018-09-04 | 증착용 마스크 및 이의 제조 방법 |
| KR10-2018-0105328 | 2018-09-04 | ||
| PCT/KR2019/011201 WO2020050558A1 (ko) | 2018-09-04 | 2019-08-30 | 증착용 마스크 및 이의 제조 방법 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410185675.1A Division CN117966101A (zh) | 2018-09-04 | 2019-08-30 | 蒸镀用掩模及其制备方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112640152A CN112640152A (zh) | 2021-04-09 |
| CN112640152B true CN112640152B (zh) | 2024-03-08 |
Family
ID=69722654
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410185675.1A Pending CN117966101A (zh) | 2018-09-04 | 2019-08-30 | 蒸镀用掩模及其制备方法 |
| CN201980057661.9A Active CN112640152B (zh) | 2018-09-04 | 2019-08-30 | 蒸镀用掩模及其制备方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410185675.1A Pending CN117966101A (zh) | 2018-09-04 | 2019-08-30 | 蒸镀用掩模及其制备方法 |
Country Status (4)
| Country | Link |
|---|---|
| KR (2) | KR102642138B1 (ko) |
| CN (2) | CN117966101A (ko) |
| TW (1) | TWI829753B (ko) |
| WO (1) | WO2020050558A1 (ko) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118102829A (zh) * | 2018-11-19 | 2024-05-28 | Lg伊诺特有限公司 | 合金板和包括合金板的沉积掩模 |
| CN111411323B (zh) * | 2020-03-31 | 2023-01-20 | 云谷（固安）科技有限公司 | 一种掩膜板 |
| US20230142411A1 (en) * | 2020-04-23 | 2023-05-11 | Lg Innotek Co., Ltd. | Deposition mask made of metal for oled pixel deposition and method for manufacturing deposition mask |
| WO2022092848A1 (ko) * | 2020-10-30 | 2022-05-05 | 에이피에스홀딩스 주식회사 | 증착 마스크 |
| TWI832113B (zh) * | 2020-11-24 | 2024-02-11 | 南韓商奧魯姆材料股份有限公司 | Ｏｌｅｄ像素形成用掩模及框架一體型掩模 |
| TWI757041B (zh) * | 2021-01-08 | 2022-03-01 | 達運精密工業股份有限公司 | 遮罩 |
| KR20240035264A (ko) * | 2022-09-08 | 2024-03-15 | 엘지이노텍 주식회사 | Oled 화소 증착을 위한 증착용 마스크 |
| KR20240044957A (ko) * | 2022-09-29 | 2024-04-05 | 엘지이노텍 주식회사 | Oled 화소 증착을 위한 증착용 마스크 |
| KR20240045693A (ko) * | 2022-09-30 | 2024-04-08 | 엘지이노텍 주식회사 | Oled 화소 증착을 위한 증착용 마스크 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004063375A (ja) * | 2002-07-31 | 2004-02-26 | Toppan Printing Co Ltd | 架張型の色識別マスク微小変形評価方法 |
| JP4072422B2 (ja) * | 2002-11-22 | 2008-04-09 | 三星エスディアイ株式会社 | 蒸着用マスク構造体とその製造方法、及びこれを用いた有機ｅｌ素子の製造方法 |
| JP2011195960A (ja) * | 2010-03-17 | 2011-10-06 | Samsung Mobile Display Co Ltd | マスク及びこれを含むマスク組立体 |
| KR20160076008A (ko) * | 2014-12-19 | 2016-06-30 | 삼성디스플레이 주식회사 | 마스크 프레임 조립체, 이를 포함하는 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법 |
| JP2017210657A (ja) * | 2016-05-26 | 2017-11-30 | 大日本印刷株式会社 | 蒸着マスク、フレーム付き蒸着マスク、有機半導体素子の製造方法、及びに有機ｅｌディスプレイの製造方法 |
| WO2018052197A1 (ko) * | 2016-09-13 | 2018-03-22 | 엘지이노텍 주식회사 | 증착 마스크용 금속판, 증착 마스크 및 이의 제조방법 |
| WO2018051443A1 (ja) * | 2016-09-14 | 2018-03-22 | シャープ株式会社 | マスクシート、蒸着マスク、表示パネルの製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102524534B1 (ko) * | 2016-02-29 | 2023-04-24 | 삼성디스플레이 주식회사 | 증착용 마스크, 표시 장치의 제조 장치 및 표시 장치의 제조 방법 |
| KR20180089827A (ko) * | 2017-02-01 | 2018-08-09 | 엘지이노텍 주식회사 | 증착 마스크용 기판, 증착 마스크 및 이의 제조방법 |
| KR20180089925A (ko) * | 2017-02-01 | 2018-08-10 | 삼성디스플레이 주식회사 | 마스크 어셈블리 |
-
2018
- 2018-09-04 KR KR1020180105328A patent/KR102642138B1/ko active IP Right Grant
-
2019
- 2019-08-30 CN CN202410185675.1A patent/CN117966101A/zh active Pending
- 2019-08-30 WO PCT/KR2019/011201 patent/WO2020050558A1/ko active Application Filing
- 2019-08-30 CN CN201980057661.9A patent/CN112640152B/zh active Active
- 2019-09-03 TW TW108131724A patent/TWI829753B/zh active
-
2024
- 2024-02-22 KR KR1020240025880A patent/KR20240031275A/ko not_active Application Discontinuation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004063375A (ja) * | 2002-07-31 | 2004-02-26 | Toppan Printing Co Ltd | 架張型の色識別マスク微小変形評価方法 |
| JP4072422B2 (ja) * | 2002-11-22 | 2008-04-09 | 三星エスディアイ株式会社 | 蒸着用マスク構造体とその製造方法、及びこれを用いた有機ｅｌ素子の製造方法 |
| JP2011195960A (ja) * | 2010-03-17 | 2011-10-06 | Samsung Mobile Display Co Ltd | マスク及びこれを含むマスク組立体 |
| KR20160076008A (ko) * | 2014-12-19 | 2016-06-30 | 삼성디스플레이 주식회사 | 마스크 프레임 조립체, 이를 포함하는 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법 |
| JP2017210657A (ja) * | 2016-05-26 | 2017-11-30 | 大日本印刷株式会社 | 蒸着マスク、フレーム付き蒸着マスク、有機半導体素子の製造方法、及びに有機ｅｌディスプレイの製造方法 |
| WO2018052197A1 (ko) * | 2016-09-13 | 2018-03-22 | 엘지이노텍 주식회사 | 증착 마스크용 금속판, 증착 마스크 및 이의 제조방법 |
| WO2018051443A1 (ja) * | 2016-09-14 | 2018-03-22 | シャープ株式会社 | マスクシート、蒸着マスク、表示パネルの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202016331A (zh) | 2020-05-01 |
| TWI829753B (zh) | 2024-01-21 |
| KR20200027253A (ko) | 2020-03-12 |
| KR20240031275A (ko) | 2024-03-07 |
| CN112640152A (zh) | 2021-04-09 |
| KR102642138B1 (ko) | 2024-03-04 |
| WO2020050558A1 (ko) | 2020-03-12 |
| CN117966101A (zh) | 2024-05-03 |
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