CN112639177A - SiC单晶、SiC晶锭的制造方法和SiC晶片的制造方法 - Google Patents

SiC单晶、SiC晶锭的制造方法和SiC晶片的制造方法 Download PDF

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Publication number
CN112639177A
CN112639177A CN201980053250.2A CN201980053250A CN112639177A CN 112639177 A CN112639177 A CN 112639177A CN 201980053250 A CN201980053250 A CN 201980053250A CN 112639177 A CN112639177 A CN 112639177A
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China
Prior art keywords
plane
sic
single crystal
atomic arrangement
curvature
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CN201980053250.2A
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English (en)
Chinese (zh)
Inventor
野口骏介
藤川阳平
鹰羽秀隆
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Resonac Holdings Corp
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Showa Denko KK
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Publication of CN112639177A publication Critical patent/CN112639177A/zh
Withdrawn legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/36Carbides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/32Carbides
    • C23C16/325Silicon carbide
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00After-treatment of single crystals or homogeneous polycrystalline material with defined structure

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
CN201980053250.2A 2018-08-13 2019-08-13 SiC单晶、SiC晶锭的制造方法和SiC晶片的制造方法 Withdrawn CN112639177A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-152391 2018-08-13
JP2018152391A JP2020026376A (ja) 2018-08-13 2018-08-13 SiC単結晶、SiCインゴットの製造方法及びSiCウェハの製造方法
PCT/JP2019/031814 WO2020036170A1 (ja) 2018-08-13 2019-08-13 SiC単結晶、SiCインゴットの製造方法及びSiCウェハの製造方法

Publications (1)

Publication Number Publication Date
CN112639177A true CN112639177A (zh) 2021-04-09

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CN201980053250.2A Withdrawn CN112639177A (zh) 2018-08-13 2019-08-13 SiC单晶、SiC晶锭的制造方法和SiC晶片的制造方法

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Country Link
US (1) US20210189596A1 (https=)
JP (1) JP2020026376A (https=)
CN (1) CN112639177A (https=)
WO (1) WO2020036170A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7190841B2 (ja) 2018-08-13 2022-12-16 昭和電工株式会社 SiCインゴットの製造方法及びSiCウェハの製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6228164B1 (en) * 1998-05-28 2001-05-08 WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG Process for producing a single crystal
TW200632153A (en) * 2004-10-29 2006-09-16 Sixon Ltd Silicon carbide single crystal, silicon carbide substrate and manufacturing method for silicon carbide single crystal
JP2011111372A (ja) * 2009-11-27 2011-06-09 Showa Denko Kk 炭化珪素単結晶及びその製造方法、並びに炭化珪素単結晶ウェーハ及び炭化珪素単結晶インゴット
JP2013136494A (ja) * 2011-12-28 2013-07-11 Toyota Central R&D Labs Inc 単結晶製造装置、SiC単結晶、ウェハ、及び、半導体デバイス

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8293623B2 (en) * 2007-09-12 2012-10-23 Showa Denko K.K. Epitaxial SiC single crystal substrate and method of manufacture of epitaxial SiC single crystal substrate
JP7190841B2 (ja) * 2018-08-13 2022-12-16 昭和電工株式会社 SiCインゴットの製造方法及びSiCウェハの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6228164B1 (en) * 1998-05-28 2001-05-08 WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG Process for producing a single crystal
TW200632153A (en) * 2004-10-29 2006-09-16 Sixon Ltd Silicon carbide single crystal, silicon carbide substrate and manufacturing method for silicon carbide single crystal
JP2011111372A (ja) * 2009-11-27 2011-06-09 Showa Denko Kk 炭化珪素単結晶及びその製造方法、並びに炭化珪素単結晶ウェーハ及び炭化珪素単結晶インゴット
JP2013136494A (ja) * 2011-12-28 2013-07-11 Toyota Central R&D Labs Inc 単結晶製造装置、SiC単結晶、ウェハ、及び、半導体デバイス

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WO2020036170A1 (ja) 2020-02-20
US20210189596A1 (en) 2021-06-24
JP2020026376A (ja) 2020-02-20

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Application publication date: 20210409