CN112635636A - Process method for improving LED color point concentration - Google Patents
Process method for improving LED color point concentration Download PDFInfo
- Publication number
- CN112635636A CN112635636A CN202011553836.6A CN202011553836A CN112635636A CN 112635636 A CN112635636 A CN 112635636A CN 202011553836 A CN202011553836 A CN 202011553836A CN 112635636 A CN112635636 A CN 112635636A
- Authority
- CN
- China
- Prior art keywords
- chip
- glue
- led
- dispensing
- bracket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 230000008569 process Effects 0.000 title claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 26
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 239000000956 alloy Substances 0.000 claims abstract description 4
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 239000012945 sealing adhesive Substances 0.000 abstract description 3
- 239000000843 powder Substances 0.000 description 12
- 239000011324 bead Substances 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 230000008685 targeting Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a process method for improving the color point concentration ratio of an LED, and relates to the technical field of LED packaging. The method comprises the following steps: fixing the chip in the functional area of the bracket bowl cup by using die bond glue; after baking and curing, connecting and conducting the anode and the cathode of the chip with the anode and cathode functional regions of the bracket by using a bonding alloy wire; filling a transparent outer sealing adhesive in the functional area at the bottom of the support to cover the bottom of the support and an area with a certain height above the chip; the transparent outer sealing glue is baked at high temperature to form a cured layer; and then, dispensing the mixed fluorescent glue above the transparent external sealing glue, and baking after dispensing to obtain a finished product. The invention has simple flow, reasonable design and convenient use, and can improve the target hitting concentration and the light emitting uniformity of the existing LED dispensing color dots.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to a process method for improving the color point concentration of an LED.
Background
Due to the factors of market demand expansion and cost reduction of LED devices, the LED packaging has higher and higher requirements on the yield of LED finished products, and the requirements of LED devices are more and more obvious. Therefore, the color point concentration of the LED in the manufacturing process is improved by optimizing the existing processes, and the processes of some existing processes are optimized; the finished product LED with low cost and high yield is obtained, the shipment rate and profit rate of LED products are improved, and the technical optimization is imminent.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a process method for improving the color point concentration of an LED, which has the advantages of simple flow, reasonable design and convenient use, and can improve the target concentration and the luminous uniformity of the color point of the existing LED spot gluing.
In order to achieve the purpose, the invention is realized by the following technical scheme: a process method for improving the color point concentration of an LED comprises the following steps: fixing the chip in the functional area of the bracket bowl cup by using die bond glue; after baking and curing, connecting and conducting the anode and the cathode of the chip with the anode and cathode functional regions of the bracket by using a bonding alloy wire; filling a transparent outer sealing adhesive in the functional area at the bottom of the support to cover the bottom of the support and an area with a certain height above the chip; the transparent outer sealing glue is baked at high temperature to form a cured layer; and then, dispensing the mixed fluorescent glue above the transparent external sealing glue, and baking after dispensing to obtain a finished product.
According to the invention, the transparent outer sealing glue is firstly dripped into a certain height area above the chip, and after the transparent outer sealing glue is heated, baked and cured, the mixed fluorescent glue is dripped above the transparent outer sealing glue, so that the sedimentation path of the fluorescent powder is effectively slowed down, the uniformity of the fluorescent powder sedimentation is improved, the fluorescent powder is uniformly covered on the surface of the chip, the uniformity of the luminous color is improved, the integral LED color point concentration is improved during batch glue dispensing operation, and the LED yield is further improved.
The invention has the beneficial effects that: the LED lamp bead disclosed by the invention can uniformly distribute the fluorescent powder above the chip in the LED lamp bead, and simultaneously improves the uniformity of fluorescent powder deposition, so that the brightness and color uniformity of the lamp bead are improved, the LED color point concentration is subjected to batch dispensing, the yield of finished products is improved, and the practicability is stronger.
Drawings
The invention is described in detail below with reference to the drawings and the detailed description;
FIG. 1 is a schematic top view of a conventional LED light-emitting device;
FIG. 2 is a schematic side view of a conventional LED light-emitting device;
FIG. 3 is a top view of the structure of the present invention;
FIG. 4 is a side view of the structure of the invention;
FIG. 5 is a color point concentration targeting diagram of LEDs after batch dispensing in the prior art;
FIG. 6 is a color point concentration targeting diagram of LEDs after batch dispensing according to the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 3, 4 and 6, the following technical solutions are adopted in the present embodiment: a process method for improving the color point concentration of an LED comprises the following steps: fixing the chip 3 in the bowl-cup functional area of the bracket 1 by using the die bond adhesive 2; after baking and curing, connecting and conducting the anode and cathode of the chip 3 with the anode and cathode functional areas of the bracket by using a bonding alloy wire 4; filling a transparent external sealing adhesive 5 in the functional area at the bottom of the bracket to cover the bottom of the bracket and an area with a certain height above the chip 3; the transparent external sealing glue 5 is baked at high temperature to form a solidified layer; avoid mixing the fluorescent glue and go into support bowl cup after, the fluorescent glue flow is inhomogeneous, and the fluorescent powder distributes inhomogeneously simultaneously, and the fluorescent powder hides easily in the space gap that chip, support, wire rod three formed, goes into support bowl cup with mixing the fluorescent glue, and the transparent outer seal of gluing top is gone into to the point promptly, and later place whole product and toast completely in the oven, obtains the product that a batch of color dot concentration is higher and luminous colour is even.
The working principle of the specific embodiment is as follows: chip 3 top take the altitude to be regional, bonding gold wire 4 regional packing has transparent external seal glue 5, through heating and solidification, avoid mixing behind the fluorescent glue 6 spot income support bowl cup, the fluorescent glue flows inhomogeneously, fluorescent powder distributes inhomogeneously simultaneously, fluorescent powder hides easily at chip 3, support 1, in the space gap that 4 three of bonding gold wire formed, will mix fluorescent glue 6 spot income transparent external seal glue 5 tops simultaneously, its effectual settlement route that has slowed down fluorescent powder, the uniformity that has also promoted the fluorescent powder simultaneously and has precipitated, make the even cover of fluorescent powder at chip 3 surfaces, promote luminous colour homogeneity.
The LED color point concentration can be improved, the LED yield can be increased, the uniformity of the light source color can be improved through the process, and the practicability is higher.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (1)
1. A process method for improving the color point concentration of an LED is characterized by comprising the following steps: fixing the chip (3) in the bowl-cup functional area of the bracket (1) by using the die bond adhesive (2); after baking and curing, connecting and conducting the anode and cathode of the chip (3) with the anode and cathode functional areas of the bracket by using a bonding alloy wire (4); filling a transparent external sealing glue (5) in the functional area at the bottom of the bracket to cover the bottom of the bracket and an area with a certain height above the chip (3); the transparent external sealing glue (5) is baked at high temperature to form a solidified layer; and then, dispensing the mixed fluorescent glue (6) above the transparent external sealing glue (5), and baking after dispensing to obtain a finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011553836.6A CN112635636A (en) | 2020-12-24 | 2020-12-24 | Process method for improving LED color point concentration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011553836.6A CN112635636A (en) | 2020-12-24 | 2020-12-24 | Process method for improving LED color point concentration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112635636A true CN112635636A (en) | 2021-04-09 |
Family
ID=75324411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011553836.6A Pending CN112635636A (en) | 2020-12-24 | 2020-12-24 | Process method for improving LED color point concentration |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112635636A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115911224B (en) * | 2023-01-10 | 2023-08-01 | 深圳市平深光电子科技有限公司 | Production process of light-emitting device for sighting device, light-emitting device and sighting device |
-
2020
- 2020-12-24 CN CN202011553836.6A patent/CN112635636A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115911224B (en) * | 2023-01-10 | 2023-08-01 | 深圳市平深光电子科技有限公司 | Production process of light-emitting device for sighting device, light-emitting device and sighting device |
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