CN109065693B - LED packaging method - Google Patents
LED packaging method Download PDFInfo
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- CN109065693B CN109065693B CN201810894276.7A CN201810894276A CN109065693B CN 109065693 B CN109065693 B CN 109065693B CN 201810894276 A CN201810894276 A CN 201810894276A CN 109065693 B CN109065693 B CN 109065693B
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- packaging
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The invention provides an LED packaging method, which comprises the following steps: a1, providing a packaging support with a dam structure and a blue light LED chip, wherein the blue light LED chip is fixed on the packaging support and is electrically connected with the packaging support; a2, providing fluorescent glue, coating the fluorescent glue on a packaging support, and covering the blue light LED chip to form a packaging body; a3, rotating the package body with a central axis of a package holder as a rotation axis, and making the package body rotate; the fluorescent powder of fluorescent glue produces centrifugal motion to shift to fluorescent glue peripheral direction, form an annular fluorescence circle, the blue light LED chip is located this annular fluorescence circle. The problem of light spots can be well solved, the fluorescent powder is far away from the chip, and the heat of the chip cannot directly influence the luminous efficiency of the fluorescent powder; compared with a bottom deposition structure, the excited emission degree is high, and the using amount of fluorescent powder can be reduced; the front surface of the chip is not blocked by fluorescent powder, a heat radiation channel of blue light is not blocked, and the heat radiation effect is good.
Description
Technical Field
The invention relates to the field of LED illumination, in particular to an LED packaging method.
Background
LED lamp beads are packaged in various ways, and the prior art has the following three ways in a more conventional way, wherein the first way is that fluorescent powder and glue are uniformly mixed and coated on the lamp beads; the second is to deposit the fluorescent powder on the bottom of the lamp bead by adopting a centrifuge, as described in the manufacturing method of the COB light source disclosed in the Chinese patent application No. 201710903465.1; the third is to adopt the form of remote excitation phosphor, namely a remote phosphor structure.
For the packaging, different defects exist, for example, obvious light spots exist in the first structure in a uniform dispensing mode, namely, the optical paths from the blue light at the central position to the fluorescent glue at different positions are different, so that different color temperatures are generated, and the light spots are formed. In the second structure, as the PN junction emitting blue light is arranged in the middle of the chip, the fluorescent powder deposited at the bottom cannot be completely excited, namely the excitation efficiency of the fluorescent powder on the bottom layer is lower, so that the excitation efficiency of the fluorescent powder is low, the area of the bottom layer is large, and the material waste is large; the fluorescent powder is close to the heating position of the chip, and the luminous efficiency of the fluorescent powder is low after the fluorescent powder is heated; and the remote excitation mode in the third structure, the gas tightness requirement to lamp pearl inside is high, and the technology is not well controlled to phosphor powder is located chip upper portion, blocks the heat radiation passageway of blue light, influences the heat dissipation.
Disclosure of Invention
Therefore, the invention provides a brand new packaging method, the using amount of the fluorescent powder is small, the excited emission efficiency of the fluorescent powder is high, a heat radiation channel of blue light is not blocked, and the problem of facula is avoided.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
an LED packaging method comprises the following steps:
a1, providing a packaging support with a dam structure and a blue light LED chip, wherein the blue light LED chip is fixed on the packaging support and is electrically connected with the packaging support;
a2, providing fluorescent glue, coating the fluorescent glue on a packaging support, and covering the blue light LED chip to form a packaging body;
a3, rotating the package body with a central axis of a package holder as a rotation axis, and making the package body rotate; the fluorescent powder of fluorescent glue produces centrifugal motion to shift to fluorescent glue peripheral direction, form an annular fluorescence circle, the blue light LED chip is located this annular fluorescence circle.
Furthermore, the annular fluorescent ring props against the inner wall of the dam.
Furthermore, the cross section of the annular fluorescent ring is in a structure with a narrow top and a wide bottom.
Furthermore, the blue light LED chip and the annular fluorescent ring are arranged at intervals.
Furthermore, the distance between the blue light LED chip and the annular fluorescent ring is 0.5mm-1 mm.
Further, the rotation speed of the packaging body is 700r/min-900 r/min.
Still further, the rotation speed of the packaging body for rotation is 800 r/min.
Further, the steps between the step a2 and the step A3 further include a step a 2-3: and performing pre-curing treatment on the packaging body to enable the fluorescent glue to be in a semi-cured state.
Through the technical scheme provided by the invention, the method has the following beneficial effects:
according to the light source manufactured by the method, the fluorescent powder is transferred to the peripheral direction of the fluorescent glue to form an annular fluorescent ring, the transparent glue is arranged in the middle of the annular fluorescent ring, the blue light LED chip is positioned in the annular fluorescent ring, and light rays emitted from the side direction of the blue light LED chip are excited by the fluorescent powder of the annular fluorescent ring to form red light and green light to be emitted and are mixed with the blue light emitted from the front side of the blue light LED chip to form white light; meanwhile, the front surface of the blue LED chip is not blocked by fluorescent powder, a heat radiation channel of the blue light is not blocked, and the heat radiation effect is good.
Drawings
FIG. 1 is a block diagram of a flow chart of a method for packaging an LED according to an embodiment;
FIG. 2 is a schematic structural diagram of a package support according to an embodiment;
FIG. 3 is a schematic flow chart of an LED package according to an embodiment;
fig. 4 is a schematic structural diagram of the light source after the LED package is completed in the embodiment.
Detailed Description
To further illustrate the various embodiments, the invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. Those skilled in the art will appreciate still other possible embodiments and advantages of the present invention with reference to these figures. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.
The invention will now be further described with reference to the accompanying drawings and detailed description.
Example one
Referring to fig. 1 to 4, the LED packaging method provided in this embodiment includes the following steps:
a1, providing a package support 10 with an 11-dam structure and a blue LED chip 20, wherein the blue LED chip 20 is die-bonded on the package support 10 and electrically connected with the package support 10.
Specifically, in this step, the blue LED chip 20 is flip-chip packaged directly on the electrode of the package support 10, and the specific flip-chip packaging method is known to those skilled in the art, for example, first, the solder paste 40 is applied to the positive electrode 101 and the negative electrode 102 of the package support 10, and then the die is clamped and die-bonded by the die bonder, so that the P electrode and the N electrode of the blue LED chip 20 are respectively fixed and electrically connected to the positive electrode 101 and the negative electrode 102 of the package support 10 through the solder paste 40. Of course, in other embodiments, the front-mounted chip may be used for packaging, and will not be described in detail herein.
And A2, providing fluorescent glue 30, wherein the fluorescent glue 30 is coated on the packaging support 10 and covers the blue LED chip 20 to form a packaging body.
Specifically, the fluorescent glue in the step is a glue body in the prior art, for example, the fluorescent glue is formed by mixing and stirring a certain proportion of green powder and red powder with a transparent glue (such as silica gel), which is known by persons skilled in the art for a long time and is not described in detail herein.
A3, rotating the package about the central axis a of the package holder 10 as a rotation axis, so that the package rotates on its own axis, as shown in fig. 3; the phosphor powder of the phosphor glue 30 generates centrifugal motion and transfers to the peripheral direction of the phosphor glue 30 to form an annular phosphor ring 32, the central position of which is transformed into a transparent area 31 of transparent glue due to the transfer of the phosphor powder, and the blue light LED chip 20 is located in the annular phosphor ring 31, as shown in fig. 4.
By the rotation, the phosphor powder in the phosphor paste 30 generates a centrifugal motion and transfers outward, and then collides with the inner wall of the dam 11 of the package support 10 to start to gather, thereby forming the annular phosphor ring 32.
After the packaging is completed, after the light source is electrified to emit light, light emitted laterally by the blue light LED chip 20 is excited by the fluorescent powder of the annular fluorescent ring 32 to form red light and green light to be emitted, and the red light and the green light are mixed with the blue light emitted from the front surface of the blue light LED chip 20 to form white light; meanwhile, the light-transmitting area 31 on the front surface of the blue-light LED chip 20 is transparent adhesive (such as silica gel), no fluorescent powder blocks, a heat radiation channel of blue light is not hindered, and the heat dissipation effect is good.
Furthermore, in this embodiment, the cross-section of the annular fluorescent ring 32 is a structure with a narrow top and a wide bottom, so as to form a distribution with a small top and a large bottom, and like a cone, the light is less concentrated at a position away from the chip, and the excitation efficiency is lower. And the structure is formed, and in the rotating process, the fluorescent powder can be realized under the action of gravity without additional conditions.
Further, in this embodiment, the blue light LED chip 20 and the annular fluorescent ring 32 are spaced apart from each other, and preferably, the blue light LED chip 20 and the annular fluorescent ring 32 are spaced apart from each other by 0.5mm, so that the excitation efficiency can be ensured well while keeping away from the heat source.
Further, in this embodiment, the rotation speed of the package body is 800r/min, which can ensure that the phosphor generates centrifugal motion and the colloid is not spilled, and of course, in other embodiments, the rotation speed of the package body is 700r/min to 900r/min, which can meet the above requirements.
The experimental comparison data of the packaging method provided by this embodiment and the method of depositing the second phosphor on the bottom of the bead in the background art are as follows:
in the background art, the LED lamp beads manufactured by the method of depositing the second phosphor on the bottom of the lamp beads are a control group, and the LED lamp beads manufactured by the packaging method of this embodiment are an improved group. The fluorescent powder is used in the comparison group and the improved group under the condition of the same weight of the fluorescent glue and the same luminous efficiency (namely the same color temperature and the same color rendering index). Table 1 shows cold data of the control group; table 2 shows the thermal state data of the control group; table 3 shows the cold data for the modified set; table 4 shows the thermal state data of the improved set. The cold state data is a value of an instant test after the lamp beads are lightened, and the temperature of the lamp beads can be approximate to a normal temperature test result at the moment; the thermal state data is obtained after the lamp beads are stably lightened.
Control group data were as follows:
TABLE 1 Cold State data of control group
TABLE 2 thermal state data of control group
Wherein, the percentage data of the green powder, the red powder 1 and the red powder 2 refers to the percentage of the total weight of the green powder, the red powder 1 and the red powder 2 respectively mixed with the fluorescent powder.
From the data in tables 1 and 2, it can be found that the cold/hot luminous flux maintenance ratio of the control group was 96.17/119.67 ═ 100% — 80.36%; the color temperature shift (cold color temperature-hot color temperature)/cold color temperature (2907-.
The fluorescent powder amount is 53.23% + 4.51% + 1.43% + 59.17%.
The improved group data is as follows:
TABLE 3 improved set of Cold State data
TABLE 2 improved set of thermal state data
Wherein, the percentage data of the green powder, the red powder 1 and the red powder 2 refers to the percentage of the total weight of the green powder, the red powder 1 and the red powder 2 respectively mixed with the fluorescent powder.
From the data in tables 3 and 4, it can be found that the improved cold/hot state luminous flux maintenance ratio is 102.02/121.26 ═ 100% ═ 84.13%; the color temperature shift (cold color temperature-hot color temperature)/cold color temperature (2903 + 3018)/2903 + 100% is 3.96%.
The fluorescent powder content is 40.56% + 4.10% + 0.75% + 45.41%.
From the above data, it can be seen that under the same weight of the phosphor paste and the same luminous efficacy (i.e., the same color temperature and color rendering index), the amount of the phosphor used in the improved group of 45.41% is less than the amount of the phosphor used in the control group of 59.17%. And the luminous flux maintenance rate in the cold and hot states is better than that in the control group.
Example two
The LED packaging method provided in this embodiment is substantially the same as the packaging method in the first embodiment, except that: in this embodiment, the step a2-3 is further included between the step a2 and the step A3: and performing pre-curing treatment on the packaging body to enable the fluorescent glue 30 to be in a semi-cured state.
The fluorescent glue 30 is subjected to pre-curing treatment to be in a semi-cured state, so that the structure of the fluorescent glue is more stable, the fluorescent glue cannot be spilled out during rotation, and the applicable rotating speed range is wider; meanwhile, the phosphor in the semi-cured phosphor paste 30 has certain fluidity, and the same effect can be achieved by selecting a proper rotation speed and time.
Meanwhile, the distance between the blue LED chip 20 and the annular fluorescent ring 32 is set to be 0.8mm, and the excitation efficiency can be well guaranteed while the blue LED chip is far away from a heat source.
EXAMPLE III
The LED packaging method provided in this embodiment is substantially the same as the packaging method in the first or second embodiment, except that: in this embodiment, the interval between the blue LED chip 20 and the annular fluorescent ring 32 is set to 1mm, which can ensure the excitation efficiency while keeping away from the heat source.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (7)
1. An LED packaging method, characterized in that: the method comprises the following steps:
a1, providing a packaging support with a dam structure and a blue light LED chip, wherein the blue light LED chip is fixed on the packaging support and is electrically connected with the packaging support;
a2, providing fluorescent glue, coating the fluorescent glue on a packaging support, and covering the blue light LED chip to form a packaging body;
a3, rotating the package body with a central axis of a package holder as a rotation axis, and making the package body rotate; the fluorescent powder of the fluorescent glue generates centrifugal motion and transfers to the peripheral direction of the fluorescent glue to form an annular fluorescent ring, and the blue light LED chip is positioned in the annular fluorescent ring; the cross section of the annular fluorescent ring is in a structure with a narrow top and a wide bottom.
2. The LED packaging method of claim 1, wherein: the annular fluorescent ring is abutted against the inner wall of the dam.
3. The LED packaging method of claim 1, wherein: the blue light LED chip and the annular fluorescent ring are arranged at intervals.
4. The LED packaging method of claim 3, wherein: the distance between the blue light LED chip and the annular fluorescent ring is 0.5mm-1 mm.
5. The LED packaging method of claim 1, wherein: the rotation speed of the packaging body is 700r/min-900 r/min.
6. The LED packaging method according to claim 5, wherein: the rotation speed of the packaging body is 800 r/min.
7. The LED packaging method of claim 1, wherein: the step A2-3 is also included between the step A2 and the step A3: and performing pre-curing treatment on the packaging body to enable the fluorescent glue to be in a semi-cured state.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810894276.7A CN109065693B (en) | 2018-08-08 | 2018-08-08 | LED packaging method |
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| CN201810894276.7A CN109065693B (en) | 2018-08-08 | 2018-08-08 | LED packaging method |
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| CN109065693A CN109065693A (en) | 2018-12-21 |
| CN109065693B true CN109065693B (en) | 2020-09-11 |
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| CN110931625A (en) * | 2019-12-24 | 2020-03-27 | 厦门多彩光电子科技有限公司 | LED packaging method |
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| CN2593369Y (en) * | 2002-12-12 | 2003-12-17 | 东贝光电科技股份有限公司 | Light-emitting dipolar body |
| CN102130233A (en) * | 2010-12-30 | 2011-07-20 | 东莞高埗佰鸿电子厂 | Method for spraying fluorescent powder on LED (light-emitting diode) reflection cup |
| CN102244179A (en) * | 2010-05-13 | 2011-11-16 | 展晶科技(深圳)有限公司 | Encapsulation structure for light-emitting diode and manufacturing method thereof |
| CN202678408U (en) * | 2012-06-01 | 2013-01-16 | 深圳市华高光电科技有限公司 | LED dam structure of COB |
| CN103094459A (en) * | 2012-11-06 | 2013-05-08 | 罗维鸿 | Green light-emitting diode (LED) and fluorescent powder used for LED |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102683542B (en) * | 2011-03-15 | 2014-12-10 | 展晶科技(深圳)有限公司 | Led packaging structure |
| JP6191453B2 (en) * | 2013-12-27 | 2017-09-06 | 日亜化学工業株式会社 | Light emitting device |
| DE102017106776A1 (en) * | 2017-01-30 | 2018-08-02 | Osram Opto Semiconductors Gmbh | Semiconductor device with semiconductor chip |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2593369Y (en) * | 2002-12-12 | 2003-12-17 | 东贝光电科技股份有限公司 | Light-emitting dipolar body |
| CN102244179A (en) * | 2010-05-13 | 2011-11-16 | 展晶科技(深圳)有限公司 | Encapsulation structure for light-emitting diode and manufacturing method thereof |
| CN102130233A (en) * | 2010-12-30 | 2011-07-20 | 东莞高埗佰鸿电子厂 | Method for spraying fluorescent powder on LED (light-emitting diode) reflection cup |
| CN202678408U (en) * | 2012-06-01 | 2013-01-16 | 深圳市华高光电科技有限公司 | LED dam structure of COB |
| CN103094459A (en) * | 2012-11-06 | 2013-05-08 | 罗维鸿 | Green light-emitting diode (LED) and fluorescent powder used for LED |
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