CN112622366A - 一种有机基板复合材料及其制备方法 - Google Patents
一种有机基板复合材料及其制备方法 Download PDFInfo
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- CN112622366A CN112622366A CN202011416520.2A CN202011416520A CN112622366A CN 112622366 A CN112622366 A CN 112622366A CN 202011416520 A CN202011416520 A CN 202011416520A CN 112622366 A CN112622366 A CN 112622366A
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Abstract
本发明公开一种有机基板复合材料的制备方法,包括如下步骤:在铜箔上覆盖增强纤维,并涂覆黏附剂后低温固化,形成半固化结构;对纤维填料进行预处理后通过静电植绒方法植入上述半固化结构中;制备填料溶液然后倒入植入纤维填料的半固化结构中,冷冻干燥,得到稳定薄膜结构;最后将稳定薄膜结构真空固化,剥离铜箔,得到有机基板复合材料。本发明还公开了上述制备方法制得的有机基板复合材料。本发明采用静电植绒技术,大大增强了有机基板的导热性能,同时和增强纤维配合,提高力学性能。本发明公开的有机基板,其同时具备优异的强度和导热性能,制备工艺简单,适用于各种场合。
Description
技术领域
本发明涉及封装基板技术领域,具体涉及一种有机基板复合材料及其制备方法。
背景技术
有机基板由于其较低的介电常数,低密度,易加工,易实现微细图形的电路技工,易于实现大批量生产,在BGA和CSP领域被广泛使用,如携带型电脑、手机、DVD等领域都有普遍应用。成为目前主流的封装基板种类之一。
然而,随着封装体积的减小和功率的急剧增加,基板散热问题成为制约有机基板发展的重要因素。目前增强有机基板的导热能力,主要还是靠添加高导热无机填料的方式,但由于有机基板体内增强材料的存在,填料在复合材料体内只能形成平行于树脂基体的导热网络,无法有效增加垂直基体方向的基板复合材料的导热性能。为了提高基板复合材料的导热能力,主要采用增加高导热无机填料添加量,会显著降低基板复合材料的力学性能。由于有机基板常用的增强材料,如玻璃纤维或芳香族聚酰胺纤维无纺布,具有较差的导热能力,所以常采用高导热基板复合材料不添加增强材料的方式,但这将显著降低材料的力学性能和支撑封装体的能力,无法支撑单元体积较大的封装体。
发明内容
因此,本发明要解决的技术问题在于克服现有有机基板使用的增强材料导热性能差的缺陷,从而提供一种有机基板复合材料及其制备方法。
为此,本发明采用了如下技术方案:
本发明提供一种有机基板复合材料的制备方法,包括如下步骤:
S1:在铜箔上覆盖增强纤维,并涂覆黏附剂后低温固化,形成半固化结构;
S2:对纤维填料进行预处理;
S3:将纤维填料通过静电植绒方法植入S1中的半固化结构中;
S4:制备填料溶液:
S5:将制备好的填料溶液倒入S3中植入纤维填料的半固化结构中,然后冷冻干燥,得到稳定薄膜结构;
S6:将S5得到的稳定薄膜结构真空固化,剥离铜箔,得到有机基板复合材料。
进一步地,S4中制备填料溶液的方法为将树脂基体溶于溶剂中,然后添加固化剂、固化促进剂、无机填料和其他加工助剂,然后经搅拌、超声等机械混合手段得到均匀溶液。
进一步地,所述填料溶液包括如下份数的各组分:
优选地,
所述树脂基体包括酚醛树脂,环氧树脂,聚酰亚胺树脂,聚酯树脂,聚四氟乙烯树脂和双马来酰亚胺树脂;
所述溶剂包括丁酮、丙酮及其同系物;
所述固化剂为常见的胺类固化剂或酸酐类固化剂,包括乙烯基三胺、四乙烯五胺、二甲胺基丙胺、邻苯二甲酸酐、四氢邻苯二甲酸酐、六氢邻苯二甲酸酐、戊二酸酐及其同系物变化;
所述固化促进剂为脂肪胺促进剂、聚醚胺促进剂或乙酰丙酮类促进剂,包括咪唑、三-(二甲胺基甲基)苯酚、三乙醇胺、乙酰丙酮盐类及其同系物变化;
所述无机填料为球状或片状,包括氮化铝、氮化硼、氮化硅、氧化镁、氧化铝、氧化锌及二氧化硅;
所述其他加工助剂为根据具体使用要求而改善材料制备过程中的加工参数所添加的辅助成份,包括表面活性剂和偶联剂。
进一步地,S2中纤维填料为直径5-50μm,长50-1000μm碳纤维、石墨烯纤维或金属纳米线,其预处理方法为,在氮气气氛下,在300-500℃下灼烧1小时。
S1中所述增强纤维为玻璃纤维或芳香族聚酰胺纤维无纺布,所述黏附剂为环氧类黏附剂。
进一步地,S1中,所述增强纤维厚度不超过200μm,所述黏附剂涂覆后透过增强纤维覆盖在铜箔上的厚度不超过200μm,所述低温固化的温度为110-140℃。
进一步地,所述S5中冷冻干燥的温度为-50至-10℃,所述S6中真空固化的温度为100-200℃。
本发明还提供一种有机基板复合材料,由上述的制备方法制得。
本发明技术方案,具有如下优点:
(1)本发明采用静电植绒技术,将纤维填料垂直于基板表面,均匀分布于有机基板复合材料间隙内,打破了传统有机基板中因为增强纤维的存在,只能形成水平方向的导热网络的问题,大大增强了有机基板的导热性能。
(2)本发明采用水平方向的增强纤维和垂直方向的纤维填料,两者和基板中的树脂填料互相配合,将原本增强纤维平面型的网络结构转变为立体网络结构,从而增强了有机基板的力学性能。
(3)本发明先铺设增强纤维,然后再涂覆黏附剂,黏附剂通过增强纤维的孔隙渗透至铜箔上,可以在使得纤维材料插入增强材料空隙,在不改变传统基板材料体系和工艺的同时,增加其导热性能。
(4)本发明制得的有机基板,其同时具备优异的强度和导热性能,且制备工艺简单,适用于各种场合。
附图说明
为了更清楚地说明本发明具体实施方式或现有技术中的技术方案,下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是本发明具体实施方式中实施例1中形成的半固化结构示意图;
图2是本发明具体实施方式中实施例1中在半固化结构中植入纤维填料后的结构示意图;
图3是本发明具体实施方式中实施例1中倒入填料溶液,冷却干燥后得到的稳定薄膜结构示意图;
图4是本发明具体实施方式中实施例1中制得的有机基板复合材料结构示意图。
附图标记:
1-增强纤维;2-黏附剂;3-铜箔;4-纤维填料;5-填料溶液。
具体实施方式
提供下述实施例是为了更好地进一步理解本发明,并不局限于所述最佳实施方式,不对本发明的内容和保护范围构成限制,任何人在本发明的启示下或是将本发明与其他现有技术的特征进行组合而得出的任何与本发明相同或相近似的产品,均落在本发明的保护范围之内。
在本发明的描述中,需要说明的是,术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”、“第三”仅用于描述目的,而不能理解为指示或暗示相对重要性。
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。
本申请各实施例使用的铜箔为三井120μm铜箔;
使用的增强材料为mtg75玻纤布;
使用的固化剂为二甲胺基丙胺;
使用的固化促进剂为三(二甲胺基甲基)苯酚,即DMP-30。
使用的静电植绒设备为深圳市鼓楼电控器材厂MG270。
实施例中未注明具体实验步骤或条件者,按照本领域内的文献所描述的常规实验步骤的操作或条件即可进行。所用试剂或仪器未注明生产厂商者,均为可以通过市购获得的常规试剂产品。
实施例1
本实施例提供一种有机基板复合材料的制备方法,具体步骤如下:
(1)将三井120μm铜箔3干燥后,覆盖厚度不超过200μm的mtg75玻纤布作为增强纤维1,采用辊式涂布机在上面涂覆双酚A液体环氧作为黏附剂2,所述黏附剂2涂覆后透过增强纤维覆盖1在铜箔3上的厚度为100μm的,之后在130℃固化,形成半固化结构,其结构如图1所示;
(2)取直径5-50μm,长50-1000μm的东丽碳纤维作为纤维填料4,在氮气气氛下,在400℃下灼烧1小时,去除表面杂质;
(3)将步骤(1)得到半固化结构和步骤(2)预处理过的纤维填料4分别置于静电植绒设备的上下极板内,设定静电高压10kV、电流10mA,30min后,纤维填料4在电场作用下竖直植入上极板的半固化结构内,其结构如图2所示;
(4)将100份BT树脂,10份二甲胺基丙胺、10份DMP-30、40份二氧化硅和1份十二烷基苯磺酸钠于100份丁酮中,经搅拌、超声10min后得到填料溶液5;
(5)将填料溶液5缓慢倒入已经植入纤维填料4的半固化结构上,在-30℃冷冻干燥后,去除溶剂形成稳定薄膜结构,其结构如图3所示;
(6)将步骤(5)得到的稳定薄膜结构在100℃真空固化,去除铜箔,得到有机基板复合材料,其结构如图4所示。
实施例2
本实施例提供一种有机基板复合材料的制备方法,具体步骤如下:
(1)将三井120μm铜箔干燥后,覆盖厚度不超过200μm的mtg75玻纤布作为增强纤维,采用辊式涂布机在上面涂覆双酚A液体环氧作为黏附剂,所述黏附剂涂覆后透过增强纤维覆盖在铜箔上的厚度不超过200μm,之后在110℃固化,形成半固化结构;
(2)取5-20μm,长50-500μm的石墨烯纤维作为纤维填料,在氮气气氛下,在400℃下灼烧1小时,去除表面杂质;
(3)将步骤(1)得到半固化结构和步骤(2)预处理过的纤维填料分别置于静电植绒设备的上下极板内,设定静电高压10kV、电流10mA,30min后,纤维填料在电场作用下竖直植入上极板的半固化结构内;
(4)将100份酚醛环氧树脂,8份二甲胺基丙胺、1份DMP-30、20份氮化铝和5份月桂酸溶于300份丁酮中,经搅拌、超声10min后得到填料溶液;
(5)将填料溶液缓慢倒入已经植入纤维填料的半固化结构上,在-10℃冷冻干燥后,去除溶剂形成稳定薄膜结构;
(6)将步骤(5)得到的稳定薄膜结构在150℃真空固化,去除铜箔,得到有机基板复合材料。
实施例3
本实施例提供一种有机基板复合材料的制备方法,具体步骤如下:
(1)将三井120μm铜箔干燥后,覆盖厚度不超过200μm的mtg75玻纤布作为增强纤维,采用辊式涂布机在上面涂覆双酚A液体环氧作为黏附剂,所述黏附剂涂覆后透过增强纤维覆盖在铜箔上的厚度不超过200μm,之后在120℃固化,形成半固化结构;
(2)取5-30μm,长50-1000μm的银纳米线作为纤维填料,在氮气气氛下,在300℃下灼烧1小时,去除表面杂质;
(3)将步骤(1)得到半固化结构和步骤(2)预处理过的纤维填料分别置于静电植绒设备的上下极板内,设定静电高压10kV、电流10mA,30min后,纤维填料在电场作用下竖直植入上极板的半固化结构内;
(4)将100份脂环族环氧树脂,1份二甲胺基丙胺、6份DMP-30、30份氮化铝和5份月桂酸溶于500份丁酮中,经搅拌、超声10min后得到填料溶液;
(5)将填料溶液缓慢倒入已经植入纤维填料的半固化结构上,在-20℃冷冻干燥后,去除溶剂形成稳定薄膜结构;
(6)将步骤(5)得到的稳定薄膜结构在200℃真空固化,去除铜箔,得到有机基板复合材料。
实施例4
本实施例提供一种有机基板复合材料的制备方法,具体步骤如下:
(1)将三井120μm铜箔干燥后,覆盖厚度不超过200μm的mtg75玻纤布作为增强纤维,采用辊式涂布机在上面涂覆双酚A液体环氧作为黏附剂,所述黏附剂涂覆后透过增强纤维覆盖在铜箔上的厚度不超过200μm,之后在140℃固化,形成半固化结构;
(2)取直径45-50μm,长500-1000μm的东丽碳纤维作为纤维填料,在氮气气氛下,在300℃下灼烧1小时,去除表面杂质;
(3)将步骤(1)得到半固化结构和步骤(2)预处理过的纤维填料分别置于静电植绒设备的上下极板内,设定静电高压10kV、电流10mA,30min后,纤维填料在电场作用下竖直植入上极板的半固化结构内;
(4)将100份脂环族环氧树脂,3份二甲胺基丙胺、5份DMP-30、20份二氧化硅和2份月桂酸溶于1000份丁酮中,经搅拌、超声10min后得到填料溶液;
(5)将填料溶液缓慢倒入已经植入纤维填料的半固化结构上,在-20℃冷冻干燥后,去除溶剂形成稳定薄膜结构;
(6)将步骤(5)得到的稳定薄膜结构在150℃真空固化,去除铜箔,得到有机基板复合材料。
实施例5
本实施例提供一种有机基板复合材料的制备方法,具体步骤如下:
(1)将三井120μm铜箔干燥后,覆盖厚度不超过200μm的mtg75玻纤布作为增强纤维,采用辊式涂布机在上面涂覆双酚A液体环氧作为黏附剂,所述黏附剂涂覆后透过增强纤维覆盖在铜箔上的厚度不超过200μm,之后在120℃固化,形成半固化结构;
(2)取直径40-50μm,长50-500μm的石墨烯纤维作为纤维填料,在氮气气氛下,在500℃下灼烧1小时,去除表面杂质;
(3)将步骤(1)得到半固化结构和步骤(2)预处理过的纤维填料分别置于静电植绒设备的上下极板内,设定静电高压10kV、电流10mA,30min后,纤维填料在电场作用下竖直植入上极板的半固化结构内;
(4)将100份BT树脂,8份二甲胺基丙胺、1份DMP-30、20份氮化硅和2份十二烷基苯磺酸钠溶于100份丁酮中,经搅拌、超声10min后得到填料溶液;
(5)将填料溶液缓慢倒入已经植入纤维填料的半固化结构上,在-50℃冷冻干燥后,去除溶剂形成稳定薄膜结构;
(6)将步骤(5)得到的稳定薄膜结构在150℃真空固化,去除铜箔,得到有机基板复合材料。
对比例1
本对比例提供一种有机基板复合材料的制备方法,和实施例1的区别在于,没有添加增强材料且没有使用静电植绒方法来植入纤维填料,具体步骤如下:
(1)将100份BT树脂,10份二甲胺基丙胺、10份DMP-30、4份二氧化硅和1份十二烷基苯磺酸钠溶于100份丁酮中,经搅拌、超声10min后得到均匀;
(2)取直径5-50μm,长50-1000μm的东丽碳纤维作为纤维填料,在氮气气氛下,在400℃下灼烧1小时,去除表面杂质;
(3)将碳纤维直接倒入步骤(1)得到的均匀溶液中,之后搅拌、超声得到填料溶液;
(4)将三井120μm铜箔干燥后,采用辊式涂布机将填料溶液均匀涂于铜箔上,在-30℃冷冻干燥后,去除溶剂形成稳定薄膜结构;
(5)将步骤(4)得到的稳定薄膜结构在100℃真空固化,去除铜箔,得到有机基板复合材料。
对比例2
本对比例提供一种有机基板复合材料的制备方法,和实施例1的区别在于,没有添加增强材料,具体步骤如下:
(1)将三井120μm铜箔干燥后,采用辊式涂布机在上面涂覆双酚A液体环氧作为黏附剂,所述黏附剂厚度不超过200μm的,之后在130℃固化,形成半固化结构;
(2)取直径5-50μm,长50-1000μm的东丽碳纤维作为纤维填料,在氮气气氛下,在400℃下灼烧1小时,去除表面杂质;
(3)将步骤(1)得到半固化结构和步骤(2)预处理过的纤维填料分别置于静电植绒设备的上下极板内,设定静电高压10kV、电流10mA,30min后,纤维填料在电场作用下竖直植入上极板的半固化结构内;
(4)将100份BT树脂,10份二甲胺基丙胺、10份DMP-30、40份二氧化硅和1份十二烷基苯磺酸钠溶于100份丁酮中,经搅拌、超声10min后得到填料溶液;
(5)将填料溶液缓慢倒入已经植入纤维填料的半固化结构上,在-30℃冷冻干燥后,去除溶剂形成稳定薄膜结构;
(6)将步骤(5)得到的稳定薄膜结构在100℃真空固化,去除铜箔,得到有机基板复合材料。
对比例3
本对比例提供一种有机基板复合材料的制备方法,和实施例1的区别在于,没有使用静电植绒方法来植入纤维填料,具体步骤如下:
(1)将100份BT树脂,10份二甲胺基丙胺、10份DMP-30、40份二氧化硅和1份十二烷基苯磺酸钠溶于100份丁酮中,经搅拌、超声10min后得到均匀;
(2)取直径5-50μm,长50-1000μm的东丽碳纤维作为纤维填料,在氮气气氛下,在400℃下灼烧1小时,去除表面杂质;
(3)将碳纤维直接倒入步骤(1)得到的均匀溶液中,之后搅拌、超声得到填料溶液;
(4)将三井120μm铜箔干燥后,覆盖厚度不超过200μm的mtg75玻纤布作为增强纤维,采用辊式涂布机将填料溶液均匀涂于其上,在-30℃冷冻干燥后,去除溶剂形成稳定薄膜结构;
(5)将步骤(4)得到的稳定薄膜结构在100℃真空固化,去除铜箔,得到有机基板复合材料。
试验例1
将实施例1-5和对比例1-3得到的有机基板复合材料进行导热性能的测试,其测试方法依照导热系数测试标准ASTM-D-5470,其测试结果如下表所示:
表1实施例1-5和对比例1-3得到的有机基板复合材料的导热性能
导热能力W/m.k | |
实施例1 | 6.2 |
实施例2 | 5.4 |
实施例3 | 5.9 |
实施例4 | 4.6 |
实施例5 | 3.2 |
对比例1 | 2.8 |
对比例2 | 7.2 |
对比例3 | 2.1 |
由上表可以看出,实施例1-5由于其中使用材料和条件不同,导热能力略有区别,均在3W/m.k以上,而在对比例1、3和实施例1相比,由于没有使用静电植绒方法来植入纤维填料,其导热性能明显降低,还不到实施例1的一半。
试验例2
将实施例1-5和对比例1-3得到的有机基板复合材料进行热稳定性和力学性能的测试,其测试方法为IPC-TM-650,其测试结果如下表所示:
表2实施例1-5和对比例1-3得到的有机基板复合材料的力学性能
杨氏模量(GPa) | 拉伸强度(MPa) | CTE1(ppm/℃) | |
实施例1 | 35 | 360 | 7.8 |
实施例2 | 32 | 342 | 8.2 |
实施例3 | 33 | 345 | 9 |
实施例4 | 31.9 | 353 | 10.3 |
实施例5 | 31.4 | 350 | 9.8 |
对比例1 | 9.5 | 120 | 26 |
对比例2 | 12 | 130 | 22 |
对比例3 | 30 | 300 | 12 |
由上表可以看出实施例1-5中,其力学性能类似。对比例1和2中由于没有添加增强材料,其力学性能远低于实施例1,而热膨胀系数也远远高于实施例1,而在对比例3中,其力学性能也明显比实施例1差,说明了增强纤维和使用静电植绒方法来植入纤维填料相配合可以明显提高有机基板复合材料的力学性能,同时降低热膨胀系数。
显然,上述实施例仅仅是为清楚地说明所作的举例,而并非对实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本发明创造的保护范围之中。
Claims (9)
1.一种有机基板复合材料的制备方法,其特征在于,包括如下步骤:
S1:在铜箔上覆盖增强纤维,并涂覆黏附剂后低温固化,形成半固化结构;
S2:对纤维填料进行预处理;
S3:将纤维填料通过静电植绒方法植入S1中的半固化结构中;
S4:制备填料溶液;
S5:将制备好的填料溶液倒入S3中植入纤维填料的半固化结构中,然后冷冻干燥,得到稳定薄膜结构;
S6:将S5得到的稳定薄膜结构真空固化,剥离铜箔,得到有机基板复合材料。
2.根据权利要求1所述的制备方法,其特征在于,S4中制备填料溶液的方法为将树脂基体溶于溶剂中,然后添加固化剂、固化促进剂、无机填料和其他加工助剂,然后经搅拌、超声等机械混合手段得到均匀溶液。
4.根据权利要求2或3所述的制备方法,其特征在于,
所述树脂基体包括酚醛树脂,环氧树脂,聚酰亚胺树脂,聚酯树脂,聚四氟乙烯树脂和双马来酰亚胺树脂;
所述溶剂包括丁酮、丙酮及其同系物;
所述固化剂为常见的胺类固化剂或酸酐类固化剂,包括乙烯基三胺、四乙烯五胺、二甲胺基丙胺、邻苯二甲酸酐、四氢邻苯二甲酸酐、六氢邻苯二甲酸酐、戊二酸酐及其同系物变化;
所述固化促进剂为脂肪胺促进剂、聚醚胺促进剂或乙酰丙酮类促进剂,包括咪唑、三-(二甲胺基甲基)苯酚、三乙醇胺、乙酰丙酮盐类及其同系物变化;
所述无机填料为球状或片状,包括氮化铝、氮化硼、氮化硅、氧化镁、氧化铝、氧化锌及二氧化硅;
所述其他加工助剂为根据具体使用要求而改善材料制备过程中的加工参数所添加的辅助成份,包括表面活性剂和偶联剂。
5.根据权利要求1所述的制备方法,其特征在于,S2中纤维填料为直径5-50μm,长50-1000μm碳纤维、石墨烯纤维或金属纳米线,其预处理方法为,在氮气气氛下,在300-500℃下灼烧1小时。
6.根据权利要求1所述的制备方法,其特征在于,S1中所述增强纤维为玻璃纤维或芳香族聚酰胺纤维无纺布,所述黏附剂为环氧类黏附剂。
7.根据权利要求6所述的制备方法,其特征在于,S1中,所述增强纤维厚度不超过200μm,所述黏附剂涂覆后透过增强纤维覆盖在铜箔上的厚度不超过200μm,所述低温固化的温度为110-140℃。
8.根据权利要求1-7任一权利要求所述的制备方法,其特征在于,所述S6中冷冻干燥的温度为-50至-10℃,所述真空固化的温度为100-200℃。
9.一种有机基板复合材料,其特征在于,由权利要求1-8任一权利要求所述的制备方法制得。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114833043A (zh) * | 2022-04-24 | 2022-08-02 | 浙江大学 | 一种高密度高取向碳纤维短纤阵列的制备方法及导热垫 |
CN114932058A (zh) * | 2022-04-24 | 2022-08-23 | 浙江大学 | 一种高密度高取向短纤阵列的制备方法及导热垫 |
CN115057432A (zh) * | 2022-06-17 | 2022-09-16 | 常州富烯科技股份有限公司 | 石墨烯泡沫块体、导热片、垫片、排布装置及制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104025290A (zh) * | 2011-12-28 | 2014-09-03 | 东洋纺株式会社 | 绝缘导热片 |
CN105308105A (zh) * | 2013-06-19 | 2016-02-03 | 东洋纺株式会社 | 绝缘导热片 |
CN107323025A (zh) * | 2017-08-02 | 2017-11-07 | 北京航空航天大学 | 一种层间高导热绒毛垂直取向的复合材料及其制备方法 |
CN111410546A (zh) * | 2020-04-21 | 2020-07-14 | 福建永安市永清石墨烯研究院有限公司 | 一种多维度高导热石墨烯复合板的制备方法 |
-
2020
- 2020-12-04 CN CN202011416520.2A patent/CN112622366A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104025290A (zh) * | 2011-12-28 | 2014-09-03 | 东洋纺株式会社 | 绝缘导热片 |
CN105308105A (zh) * | 2013-06-19 | 2016-02-03 | 东洋纺株式会社 | 绝缘导热片 |
CN107323025A (zh) * | 2017-08-02 | 2017-11-07 | 北京航空航天大学 | 一种层间高导热绒毛垂直取向的复合材料及其制备方法 |
CN111410546A (zh) * | 2020-04-21 | 2020-07-14 | 福建永安市永清石墨烯研究院有限公司 | 一种多维度高导热石墨烯复合板的制备方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114833043A (zh) * | 2022-04-24 | 2022-08-02 | 浙江大学 | 一种高密度高取向碳纤维短纤阵列的制备方法及导热垫 |
CN114932058A (zh) * | 2022-04-24 | 2022-08-23 | 浙江大学 | 一种高密度高取向短纤阵列的制备方法及导热垫 |
CN114932058B (zh) * | 2022-04-24 | 2023-08-25 | 浙江大学 | 一种高密度高取向短纤阵列的制备方法及导热垫 |
CN114833043B (zh) * | 2022-04-24 | 2023-09-19 | 浙江大学 | 一种高密度高取向碳纤维短纤阵列的制备方法及导热垫 |
CN115057432A (zh) * | 2022-06-17 | 2022-09-16 | 常州富烯科技股份有限公司 | 石墨烯泡沫块体、导热片、垫片、排布装置及制备方法 |
CN115057432B (zh) * | 2022-06-17 | 2023-09-05 | 常州富烯科技股份有限公司 | 石墨烯泡沫块体、导热片、垫片、排布装置及制备方法 |
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