CN112595186A - Electronic detonator chip assembling equipment and method thereof - Google Patents
Electronic detonator chip assembling equipment and method thereof Download PDFInfo
- Publication number
- CN112595186A CN112595186A CN202011234406.8A CN202011234406A CN112595186A CN 112595186 A CN112595186 A CN 112595186A CN 202011234406 A CN202011234406 A CN 202011234406A CN 112595186 A CN112595186 A CN 112595186A
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- Prior art keywords
- electronic detonator
- positioning die
- automatic
- riveting
- detonator chip
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 230000002950 deficient Effects 0.000 claims abstract description 40
- 238000001514 detection method Methods 0.000 claims abstract description 40
- 238000003466 welding Methods 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000005516 engineering process Methods 0.000 description 3
- 238000005422 blasting Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 241001133184 Colletotrichum agaves Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42C—AMMUNITION FUZES; ARMING OR SAFETY MEANS THEREFOR
- F42C17/00—Fuze-setting apparatus
- F42C17/04—Fuze-setting apparatus for electric fuzes
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Automatic Assembly (AREA)
Abstract
The invention discloses an electronic detonator chip assembling device and a method thereof, wherein the electronic detonator chip assembling device comprises a conveying line, a positioning die arranged on the conveying line and moving along with the conveying line, and a lifter, a foot line riveting device, a laser welding device, an automatic sleeve pipe forming device, an automatic detection device, a defective product blanking device and a finished product blanking device which are sequentially arranged beside the conveying line from right to left, wherein the lifter, the foot line riveting device, the laser welding device, the automatic sleeve pipe forming device, the automatic detection device, the defective product blanking device and the finished product blanking device are all electrically connected with a control center The purpose of automated production liberates the labour, improves production efficiency.
Description
Technical Field
The invention relates to the technical field of civil explosives, in particular to an electronic detonator chip assembling device and method.
Background
In the electronic detonator production field, the appearance structure of present electronic detonator chip mainly is that the glue is moulded plastics, wrap up the components and parts of electronic detonator chip inside, though the outward appearance of traditional electronic detonator chip is more standard like this, most is a cylinder, be convenient for the processing assembly of station behind, but because moulding plastics alone on the electronic detonator chip, lead to with high a lot more in the cost, and electronic detonator chip and ignition head are independent two parts, the ignition head directly exposes externally, the ignition head breakage often appears in the production process of electronic detonator, thereby cause the unable problem of detonating of electronic detonator, seriously influence the safety problem of blasting job site, directly endanger blasting constructor's life and property safety, there is very big potential safety hazard.
In the assembly process of the conventional electronic detonator electronic chip, single-time processing is mainly carried out through single-station equipment, the equipment is semi-automatic equipment, the production efficiency is low, the labor intensity of operators is high, and the assembly process is not suitable for production of large-batch products.
Disclosure of Invention
The invention aims to overcome the technical problems in the prior art, provides electronic detonator chip assembling equipment and a method thereof, establishes an efficient process flow, conveys parts to be processed to each processing station through a positioning die on a conveying line, executes related processing technology in each processing station, achieves the aim of large-batch and automatic production, liberates labor force, improves production efficiency, and can effectively solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the electronic detonator chip assembling equipment comprises a conveying line, a positioning die arranged on the conveying line and moving along with the conveying line, and a lifting machine, a foot line riveting device, a laser welding device, an automatic sleeve device, a sleeve automatic forming device, an automatic detection device, a defective product blanking device and a finished product blanking device which are sequentially arranged beside the conveying line from right to left, wherein the lifting machine, the foot line riveting device, the laser welding device, the automatic sleeve device, the sleeve automatic forming device, the automatic detection device, the defective product blanking device and the finished product blanking device are all electrically connected with a control center.
As a preferable aspect of the present invention, the assembling method includes the steps of:
the method comprises the following steps that an operator puts twenty groups of electronic detonator chip components into a bin of a leg wire riveting device, equipment is started, the operator inserts exposed copper wires at the front ends of leg wire sealing races into connecting holes of a capacitor support of electronic detonator chips, steps down a riveting starting switch to finish riveting work of the leg wires of the chips, and after riveting is finished, the operator takes out a product and puts the product into a corresponding positioning seat on a positioning die as required to realize riveting and die arrangement work of the electronic detonator chips;
the method comprises the following steps that a positioning die is conveyed to an automatic sleeving device on a conveying line, after a detection switch detects that the positioning die is in place, a secondary positioning mechanism is started to accurately position the positioning die, and then the automatic sleeving device is used for sleeving heat-shrinkable tubes on twenty generator lightning tube chips at the same time;
the positioning die is continuously conveyed to the automatic sleeve forming device, a hot air heating mechanism is started, and a heat shrinkage pipe on the electronic detonator chip is heated, shrunk and tightly wrapped on the electronic detonator chip by using hot air, so that the purpose of automatically forming the chip is realized;
the method comprises the following steps that a positioning die is continuously conveyed to an automatic detection device, after a detection switch detects that the positioning die is in place, a secondary positioning mechanism is started to accurately position the positioning die, the automatic detection device is started to perform performance detection on all products, and detection results are fed back to a control system;
the method comprises the following steps that a positioning die is continuously conveyed to a defective product blanking device, after a detection switch detects that the positioning die is in place, a secondary positioning mechanism is started to accurately position the positioning die, a manipulator of the defective product blanking device is started, defective products on the positioning die are automatically taken out according to defective product information given by the detection mechanism, and the purpose of automatic blanking of the defective products is achieved;
and step (3) continuously conveying the positioning die to a finished product blanking device, finishing the blanking of the finished product in the conveying process of the positioning die, wherein the positioning die does not need to stop in the blanking process of the finished product, circulating the empty positioning die after blanking to a lower-layer conveying line through a lifting machine, automatically circulating the empty positioning die back to the foot line riveting device, and continuously producing the product of the next round.
In a preferred embodiment of the present invention, the step of connecting the chip and the leg wire is preferably performed by a laser welding device.
As a preferred technical scheme of the invention, a working chair is arranged beside the stations of the foot line riveting device and the automatic sleeving device.
As a preferable technical scheme of the invention, a defective product containing box is arranged beside a station of the defective product blanking device.
As a preferable technical solution of the present invention, the number of the leg wire riveting devices is eight, and the eight leg wire riveting devices are respectively located on both sides of the conveyor line with four as a group.
As a preferred technical scheme of the invention, the positioning die is arranged in a bilateral symmetry mode, the cross section of the positioning die is in an I shape, and ten groups of electronic detonator chip groups are respectively clamped in positioning seats at the left end face and the right end face of the positioning die.
As a preferred technical solution of the present invention, the number of the automatic casing devices is two and the automatic casing devices are arranged on both sides of the conveying line.
As a preferable technical scheme of the invention, the number of the defective product blanking devices is two, and the two defective product blanking devices are arranged on two sides of the conveying line.
As a preferable technical solution of the present invention, the number of the automatic detection devices is twenty.
Compared with the prior art, the invention has the beneficial effects that: the electronic detonator chip assembling equipment and the method thereof establish an efficient process flow, then convey the parts to be processed to each processing station through the positioning die on the conveying line, and execute the related processing technology in each processing station, thereby realizing the purpose of mass and automatic production, liberating labor force and improving production efficiency.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of the structure at A of the present invention;
FIG. 3 is an enlarged view of the structure at B of the present invention;
FIG. 4 is an enlarged view of the structure at position C of the present invention.
In the figure: the automatic production line comprises a conveying line 1, a positioning die 2, a lifting machine 3, a 4-pin line riveting device, a 5 laser welding device, a 6 automatic sleeve device, a 7 sleeve automatic forming device, an 8 automatic detection device, a 9 defective product blanking device, a 10 finished product blanking device, a 11 defective product containing box and a 12 working chair.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: an electronic detonator chip assembling device comprises a conveying line 1, a positioning die 2 which is arranged on the conveying line 1 and moves along with the conveying line, and a lifter 3, a foot line riveting device 4, a laser welding device 5, an automatic casing device 6, an automatic casing forming device 7, an automatic detection device 8, a defective product blanking device 9 and a finished product blanking device 10 which are sequentially arranged beside the conveying line 1 from right to left, wherein the positioning die 2 is symmetrically arranged from left to right, the cross section of the positioning die is I-shaped, ten groups of electronic detonator chip sets are respectively clamped in positioning seats at the left end face and the right end face of the positioning die 2, a working chair 12 is arranged beside stations of the foot line riveting device 4 and the automatic casing device 6, the elevator 3, the foot line riveting device 4, the laser welding device 5, the automatic sleeve device 6, the automatic sleeve forming device 7, the automatic detection device 8, the defective product blanking device 9 and the finished product blanking device 10 are all electrically connected with the control center so as to reduce labor consumption of workers;
the assembly method comprises the following steps:
step 1, an operator puts twenty groups of electronic detonator chip components into a bin of a foot wire riveting device 4, equipment is started, the operator inserts exposed copper wires at the front ends of foot wire sealing races into connecting holes of a capacitor support of an electronic detonator chip, a riveting starting switch is stepped down to finish riveting work of chip foot wires, after riveting is finished, the operator takes out a product and puts the product into a corresponding positioning seat on a positioning die 2 as required to realize riveting and mould arranging work of the electronic detonator chip, the number of the foot wire riveting devices 4 is eight, the eight foot wire riveting devices 4 are respectively positioned at two sides of a conveying line 1 by taking four as a group, so that riveting efficiency is improved, and the specific structure of the foot wire riveting device 4 refers to the foot wire riveting device of the electronic detonator chip and the patent of the invention of the processing flow (CN111023920A) of the foot wire riveting device;
in the step 1, the connection process of the chip and the leg wire is preferably finished through a laser welding device 5, so that the efficiency is higher;
step 3, the positioning mold 2 is continuously conveyed to the automatic sleeve forming device 7, a hot air heating mechanism is started, a heat shrinkage pipe on the electronic detonator chip is heated and shrunk by hot air to tightly wrap the electronic detonator chip, and the purpose of automatically forming the chip is achieved, and the specific structure of the automatic sleeve forming device 7 refers to the patent of the automatic sleeve forming device (CN111233595A) of the electronic detonator chip, which is applied by me before;
step 5, the positioning die 2 is continuously conveyed to a defective product blanking device 9, after a detection switch detects that the positioning die 2 is in place, a secondary positioning mechanism is started to accurately position the positioning die 2, a manipulator of the defective product blanking device 9 is started, defective products on the positioning die 2 are automatically taken out according to defective product information given by the detection mechanism, a defective product containing box 11 is arranged beside a station of the defective product blanking device 9, two sets of defective product blanking manipulators are arranged according to a defective product distribution principle to automatically take out and place the detected defective products into the defective product containing box 11, the purpose of automatic blanking of the defective products is achieved, and the specific structure of the defective product blanking device 9 refers to the patent of the electronic detonator chip defective product automatic rejection waste product device (CN111112098A) in the previous application;
and 6, continuously conveying the positioning die 2 to a finished product blanking device 10, wherein the specific structure of the blanking device 10 refers to the patent of the invention of an automatic blanking device (CN111232627A) of an electronic detonator chip, which is applied by the inventor before, and the blanking of the finished product is completed in the conveying process of the positioning die 2, wherein in the blanking process of the finished product, the positioning die 2 does not need to be stopped, and the empty positioning die 2 after blanking is circulated to the lower-layer conveying line 1 through the hoister 3 and then automatically circulated back to the foot line riveting device 4 to continue the production of the next round of products.
Claims (10)
1. The utility model provides an electronic detonator chip rigging equipment which characterized in that: the automatic detection device comprises a conveying line (1), a positioning die (2) which is arranged on the conveying line (1) and moves along with the conveying line, and a lifting machine (3) which is sequentially arranged beside the conveying line (1) from right to left, a foot line riveting device (4), a laser welding device (5), an automatic sleeve device (6), an automatic sleeve forming device (7), an automatic detection device (8), a defective product blanking device (9) and a finished product blanking device (10), wherein the lifting machine (3), the foot line riveting device (4), the laser welding device (5), the automatic sleeve device (6), the automatic sleeve forming device (7), the automatic detection device (8), the defective product blanking device (9) and the finished product blanking device (10) are all electrically connected with a control center.
2. The method for assembling an electronic detonator chip according to claim 1 wherein: the assembly method comprises the following steps:
step 1, an operator puts twenty groups of electronic detonator chip components into a bin of a foot wire riveting device (4), starts equipment, inserts exposed copper wires at the front ends of foot wire sealing races into connecting holes of a capacitor support of the electronic detonator chips, steps down a riveting starting switch to finish riveting work of the foot wires of the chips, takes out products after riveting is finished, and puts the products into corresponding positioning seats on a positioning die (2) according to requirements to realize riveting and die arrangement work of the electronic detonator chips;
step 2, the positioning die (2) is conveyed forwards to the automatic sleeving device (6) on the conveying line (1), after the detection switch detects that the positioning die (2) is in place, the secondary positioning mechanism is started to accurately position the positioning die (2), and then the automatic sleeving device (6) conducts heat shrink tube sleeving operation on the twenty-power electronic detonator chip at the same time;
step 3, continuously conveying the positioning die (2) to an automatic sleeve forming device (7), starting a hot air heating mechanism, heating and shrinking a heat shrinkage pipe on the electronic detonator chip by using hot air, and tightly wrapping the electronic detonator chip to realize the purpose of automatic chip forming;
step 4, continuously conveying the positioning die (2) to an automatic detection device (8), starting a secondary positioning mechanism to accurately position the positioning die (2) after a detection switch detects that the positioning die (2) is in place, starting the automatic detection device (8) to perform performance detection on all products, and feeding detection results back to a control system;
step 5, the positioning die (2) is continuously conveyed to a defective product blanking device (9), after the detection switch detects that the positioning die (2) is in place, a secondary positioning mechanism is started to accurately position the positioning die (2), a manipulator of the defective product blanking device (9) is started, and a defective product on the positioning die (2) is automatically taken out according to defective product information given by the detection mechanism, so that the purpose of automatic blanking of the defective product is achieved;
and 6, continuously conveying the positioning die (2) to a finished product blanking device (10), finishing finished product blanking in the conveying process of the positioning die (2), wherein the positioning die (2) does not need to stop in the finished product blanking process, circulating the empty positioning die (2) subjected to blanking to a lower-layer conveying line (1) through a lifter (3), automatically circulating the empty positioning die to a foot line riveting device (4), and continuously producing products of the next round.
3. The method of assembling an electronic detonator chip according to claim 2 wherein: in the step 1, the connection process of the chip and the leg wire is preferably completed by a laser welding device (5).
4. The electronic detonator chip assembly apparatus of claim 1 wherein: and working chairs (12) are arranged beside the stations of the foot line riveting device (4) and the automatic sleeving device (6).
5. The electronic detonator chip assembly apparatus of claim 1 wherein: and a defective product containing box (11) is arranged beside the station of the defective product blanking device (9).
6. The electronic detonator chip assembly apparatus of claim 1 wherein: the number of the foot line riveting devices (4) is eight, and the eight foot line riveting devices (4) are respectively positioned on two sides of the conveying line (1) by taking four foot line riveting devices as a group.
7. The electronic detonator chip assembly apparatus of claim 1 wherein: the positioning die (2) is arranged in a bilateral symmetry mode, the cross section of the positioning die is I-shaped, and ten groups of electronic detonator chip sets are respectively clamped in positioning seats on the left end face and the right end face of the positioning die (2).
8. The electronic detonator chip assembly apparatus of claim 1 wherein: the number of the automatic sleeve devices (6) is two and the automatic sleeve devices are arranged on two sides of the conveying line (1).
9. The electronic detonator chip assembly apparatus of claim 1 wherein: the number of the defective product blanking devices (9) is two and the two blanking devices are arranged on two sides of the conveying line (1).
10. The electronic detonator chip assembly apparatus of claim 1 wherein: the number of the automatic detection devices (8) is twenty.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011234406.8A CN112595186A (en) | 2020-11-07 | 2020-11-07 | Electronic detonator chip assembling equipment and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011234406.8A CN112595186A (en) | 2020-11-07 | 2020-11-07 | Electronic detonator chip assembling equipment and method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN112595186A true CN112595186A (en) | 2021-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011234406.8A Pending CN112595186A (en) | 2020-11-07 | 2020-11-07 | Electronic detonator chip assembling equipment and method thereof |
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| CN (1) | CN112595186A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113790643A (en) * | 2021-10-09 | 2021-12-14 | 雅化集团绵阳实业有限公司 | Automatic medicine dipping device for electronic detonator electronic chip module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3126495C2 (en) * | 1981-07-04 | 1984-06-07 | Dynamit Nobel Ag, 5210 Troisdorf | Process for the automatic manufacture of detonators |
| CN106431796A (en) * | 2016-08-31 | 2017-02-22 | 湖南神斧集团向红机械化工有限责任公司 | Fully-automatic glue injection, encapsulation and inline formation system of electronic delayed ignition device |
| CN106748603A (en) * | 2017-03-10 | 2017-05-31 | 贵州全安密灵科技有限公司 | Method and system are known in a kind of electric detonator automatic assembling, detection, mark |
| CN111174653A (en) * | 2020-03-17 | 2020-05-19 | 安徽雷鸣科化有限责任公司 | Laser welding production line for electronic detonator chip leg wire |
| CN111217653A (en) * | 2020-03-12 | 2020-06-02 | 杭州晋旗电子科技有限公司 | Automatic sleeve device of electronic detonator chip |
| CN111233595A (en) * | 2020-03-17 | 2020-06-05 | 杭州晋旗电子科技有限公司 | Automatic forming device for electronic detonator chip sleeve |
| CN211855084U (en) * | 2019-12-04 | 2020-11-03 | 杭州晋旗电子科技有限公司 | Electronic detonator |
| CN215003244U (en) * | 2020-11-07 | 2021-12-03 | 杭州晋旗电子科技有限公司 | Electronic detonator chip assembly equipment |
-
2020
- 2020-11-07 CN CN202011234406.8A patent/CN112595186A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3126495C2 (en) * | 1981-07-04 | 1984-06-07 | Dynamit Nobel Ag, 5210 Troisdorf | Process for the automatic manufacture of detonators |
| CN106431796A (en) * | 2016-08-31 | 2017-02-22 | 湖南神斧集团向红机械化工有限责任公司 | Fully-automatic glue injection, encapsulation and inline formation system of electronic delayed ignition device |
| CN106748603A (en) * | 2017-03-10 | 2017-05-31 | 贵州全安密灵科技有限公司 | Method and system are known in a kind of electric detonator automatic assembling, detection, mark |
| CN211855084U (en) * | 2019-12-04 | 2020-11-03 | 杭州晋旗电子科技有限公司 | Electronic detonator |
| CN111217653A (en) * | 2020-03-12 | 2020-06-02 | 杭州晋旗电子科技有限公司 | Automatic sleeve device of electronic detonator chip |
| CN111174653A (en) * | 2020-03-17 | 2020-05-19 | 安徽雷鸣科化有限责任公司 | Laser welding production line for electronic detonator chip leg wire |
| CN111233595A (en) * | 2020-03-17 | 2020-06-05 | 杭州晋旗电子科技有限公司 | Automatic forming device for electronic detonator chip sleeve |
| CN215003244U (en) * | 2020-11-07 | 2021-12-03 | 杭州晋旗电子科技有限公司 | Electronic detonator chip assembly equipment |
Non-Patent Citations (1)
| Title |
|---|
| 马蓉等, 电子科技大学出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113790643A (en) * | 2021-10-09 | 2021-12-14 | 雅化集团绵阳实业有限公司 | Automatic medicine dipping device for electronic detonator electronic chip module |
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Application publication date: 20210402 |