CN106431796B - Full-automatic glue injection, encapsulation and on-line system of electronic delay ignition device - Google Patents
Full-automatic glue injection, encapsulation and on-line system of electronic delay ignition device Download PDFInfo
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- CN106431796B CN106431796B CN201610785671.2A CN201610785671A CN106431796B CN 106431796 B CN106431796 B CN 106431796B CN 201610785671 A CN201610785671 A CN 201610785671A CN 106431796 B CN106431796 B CN 106431796B
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- groove
- glue injection
- glue
- electronic delay
- automatic
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- C—CHEMISTRY; METALLURGY
- C06—EXPLOSIVES; MATCHES
- C06C—DETONATING OR PRIMING DEVICES; FUSES; CHEMICAL LIGHTERS; PYROPHORIC COMPOSITIONS
- C06C7/00—Non-electric detonators; Blasting caps; Primers
- C06C7/02—Manufacture; Packing
Abstract
The invention discloses a full-automatic glue injection, encapsulation and on-line system of an electronic delay ignition device, which comprises a conveyor belt and a glue injection mold, wherein the conveyor belt is arranged on the conveyor belt; an electronic delay module is arranged in the glue injection mould; the side edge of the conveyor belt is sequentially provided with a low-pressure automatic glue injection machine, a foot line butt joint device and an automatic welding machine along the conveying direction; the glue injection mold comprises an upper mold and a lower mold; the bottom surface of the upper die and the top surface of the lower die are provided with glue guiding grooves in a mirror image manner, and the glue guiding grooves are connected with the glue guiding grooves; the glue guide groove is communicated with a glue injection groove; the side edge of the glue injection groove is communicated with the forming groove through a glue tank groove; the top end of the forming groove is connected with a medicine head groove; an electronic delay module is placed in the forming groove; a rubber inlet pipe is arranged in the upper die and is used for communicating the rubber guiding groove with the rubber injection hole; the glue injection hole is positioned on the upper end surface of the upper die; sealing the tail end of the forming groove on the upper die; the tail end of the forming groove on the lower die is communicated with a butt joint groove. The electronic detonator packaging structure can realize complete sealing and packaging of the electronic delay module, can realize moisture prevention, water prevention and dust prevention, and improves the assembly speed, the assembly quality and the service life of the electronic detonator.
Description
Technical Field
The invention belongs to the technical field of electronic detonator processing, and particularly relates to a full-automatic glue injection, packaging and on-line system of an electronic delay ignition device.
Background
The electronic detonator in China is always in the test exploration stage for more than ten years of development, and is not produced and used in a large scale. Therefore, the related production technology is relatively lagged behind, and a pure manual production mode is basically adopted. As shown in fig. 1, the electronic detonator mainly comprises an electronic delay ignition device and a basic detonator 1; the electronic delay ignition device consists of a chemical head 2, an electronic delay module 3 and a foot line 4; the electronic detonator is to adopt certain measures to wrap the electronic delay module 3 before assembly, so as to prevent the electronic components on the surface of the electronic delay module 3 from being scratched when the basic detonator 1 is inserted for assembly, and the components are prevented from losing efficacy or falling off. Due to technical limitation, most of the existing processes adopt a heat-shrinkable tube for encapsulation, workers firstly sleeve the electronic delay ignition device into the heat-shrinkable tube, and then blow the heat-shrinkable tube by a hot air blower to ensure that the heat-shrinkable tube is heated and shrunk to wrap the electronic delay ignition device. The heat-shrinkable tube encapsulation technology has high operation difficulty, difficult automatic production and low production efficiency. Because of its both ends opening, it does not possess complete sealing ability, can't dampproofing waterproof dustproof.
Disclosure of Invention
The invention aims to solve the problems, and provides a full-automatic glue injection, encapsulation and on-line system of an electronic delay ignition device, which can realize the complete sealing and wrapping of an electronic delay module in the electronic delay ignition device and the butt joint of a leg wire, can realize the moisture resistance, the water resistance and the dust resistance, effectively prevent electronic components on the electronic delay module from being damaged, greatly improve the assembly speed and the assembly quality of the electronic detonator, prolong the storage life of the electronic detonator, reduce the requirement on the storage environment of the electronic detonator, and save the storage cost.
In order to realize the purpose, the invention adopts the technical scheme that: the full-automatic glue injection, packaging and on-line system of the electronic delay ignition device comprises a glue injection mold (5) conveyed by a conveyor belt (6); an electronic delay module (3) is arranged in the glue injection mold (5); the side edge of the conveyor belt (6) is sequentially provided with a low-pressure automatic glue injection machine (7) for injecting glue into the glue injection mould (5), a foot line butt joint device (8) for butt joint of the electronic delay module (3) and the foot line, and an automatic welding machine (9) for welding the electronic delay module (3) in a wiring manner along the conveying direction; the glue injection mold (5) comprises an upper mold (51) and a lower mold (52); the bottom surface of the upper die (51) and the top surface of the lower die (52) are provided with glue guiding grooves (58) in a mirror image manner, and the glue guiding grooves (58) are connected with glue guiding grooves (60); the glue guide groove (60) is communicated with a glue injection groove (63); the glue injection groove (63) is positioned between two adjacent forming grooves (61); the side edge of the glue injection groove (63) is communicated with the forming groove (61) through a glue tank groove (64); the top end of the forming groove (61) is connected with a medicine head groove (62); an electronic delay module (3) is placed in the forming groove (61); a rubber inlet pipe (59) is arranged in the upper die (51) and is used for communicating the rubber guiding groove (58) with the rubber injection hole (57); the glue injection hole (57) is positioned on the upper end surface of the upper die (51); the tail end of a forming groove (61) on the upper die (51) is sealed; the tail end of the molding groove (61) on the lower die (52) is communicated with a butt joint groove (54).
Furthermore, the upper die (51) and the lower die (52) are fixedly connected through a clamping bolt (53); the clamping bolt (53) is positioned on the bottom surface of the upper die (51); and clamping bolt holes (65) for connecting clamping bolts (53) are formed in two sides of the lower die (52).
Furthermore, a tightening handle (56) is vertically arranged on the clamping bolt (53); handle movable grooves (55) are formed in two side edges of the upper die (51); the tightening handle (56) is positioned in the handle movable groove (55).
Furthermore, the glue guiding groove (58) and the glue guiding groove (60) are connected to form a T shape.
Further, the tank glue groove (64) is a conical cavity groove.
Furthermore, two glue injection holes (57) are formed in the upper die (51), and each glue injection hole (57) is connected with one glue guide groove (58) respectively.
Further, the diameter of the groove hole of the butt joint groove (54) is smaller than that of the forming groove (61).
Further, the molding groove (61) is a semi-cylindrical cavity; the length of the forming groove (61) is larger than that of the electronic delay module (3).
Furthermore, each molding groove (61) is communicated with a glue tank (64).
The invention has the beneficial effects that:
the automatic glue injection mold grabbing and conveying device is simple in process action, after manual arrangement, a manipulator automatically grabs a glue injection mold to a conveying line, the conveying line automatically conveys the mold to a glue injection station, the glue injection manipulator automatically grabs the glue injection mold to be conveyed into a glue injection machine, and the glue injection machine automatically injects glue after sensing that the mold is in place. And after the glue injection is finished, the glue injection manipulator automatically takes out the mold, and the encapsulated electronic delay ignition device flows to the next procedure along with the mold. The automatic control system has high automation degree, is operated on line in the whole process, and is easy for assembly line production operation.
And secondly, the glue injection encapsulation technology can achieve full sealing. The electronic component on the electronic delay module can be protected from being scratched and falling off, and the electronic component can be dustproof and waterproof. Because the glue solution has certain glue injection pressure during glue injection, the glue solution can be filled into a tiny gap between the electronic elements, and can isolate the electromagnetic influence between the electronic elements, so that the reliability and the precision of the module are better. The cylindrical inclusion formed after glue injection is solid, so that the rigidity of the electronic delay ignition device can be increased, and the rubber has better elasticity and can play roles in bending prevention, shock resistance and the like.
Drawings
Fig. 1 is a schematic diagram of an electronic detonator structure.
FIG. 2 is a schematic diagram of the system of the present invention.
Fig. 3 is a front view of the injection mold of the present invention.
Fig. 4 is a left side view of fig. 3.
Fig. 5 is a top view of fig. 3.
Fig. 6 is a schematic view of the bottom structure of the upper mold.
FIG. 7 is a schematic view of the top surface of the lower mold.
In the figure: 1. a base detonator; 2. a medicine head; 3. an electronic delay module; 4. a leg wire; 5. a glue injection mold; 6. a conveyor belt; 7. a low-pressure automatic glue injection machine; 8. a leg wire butting device; 9. automatic welding machine; 51. an upper die; 52. a lower die; 53. fastening a bolt; 54. a butt joint groove; 55. a handle movable groove; 56. screwing down the handle; 57. injecting glue holes; 58. a glue guiding groove; 59. feeding a rubber tube; 60. a glue guiding groove; 61. forming a groove; 62. a medicine head groove; 63. injecting glue groove; 64. a glue tank; 65. a clamping bolt hole.
Detailed Description
The following detailed description of the present invention is given for the purpose of better understanding technical solutions of the present invention by those skilled in the art, and the present description is only exemplary and explanatory and should not be construed as limiting the scope of the present invention in any way.
As shown in fig. 1 to 7, the specific structure of the present invention is: the full-automatic glue injection, packaging and on-line system of the electronic delay ignition device comprises a glue injection mold 5 conveyed by a conveyor belt 6; an electronic delay module 3 is arranged in the glue injection mold 5; the side edge of the conveyor belt 6 is sequentially provided with a low-pressure automatic glue injection machine 7 for injecting glue into the glue injection mold 5, a pin wire butting device 8 for butting pin wires of the electronic delay module 3 and an automatic welding machine 9 for welding the pin wires of the electronic delay module 3 along the conveying direction; the glue injection mold 5 comprises an upper mold 51 and a lower mold 52; the bottom surface of the upper die 51 and the top surface of the lower die 52 are provided with glue guiding grooves 58 in a mirror image manner, and the glue guiding grooves 58 are connected with glue guiding grooves 60; the glue guide groove 60 is communicated with a glue injection groove 63; the glue injection groove 63 is positioned between two adjacent forming grooves 61; the side edge of the glue injection groove 63 is communicated with the forming groove 61 through a glue tank 64; the top end of the forming groove 61 is connected with a medicine head groove 62; the electronic delay module 3 is placed in the forming groove 61; a rubber inlet pipe 59 is arranged in the upper die 51 to communicate the rubber guiding groove 58 with the rubber injection hole 57; the glue injection hole 57 is positioned on the upper end surface of the upper die 51; the tail end of the forming groove 61 on the upper die 51 is sealed; the tail end of the forming groove 61 on the lower die 52 is communicated with the butt joint groove 54.
Preferably, the upper die 51 and the lower die 52 are connected and fixed through a clamping bolt 53; the latch 53 is positioned on the bottom surface of the upper die 51; the lower mold 52 is provided at both sides thereof with latch holes 65 for connecting the latches 53.
Preferably, a tightening handle 56 is vertically arranged on the latch 53; handle movable grooves 55 are formed in two side edges of the upper die 51; the tightening handle 56 is located in the handle moving groove 55.
Preferably, the glue guiding groove 58 and the glue guiding groove 60 are connected to form a T-shape.
Preferably, the glue tank 64 is a conical cavity tank.
Preferably, the upper die 51 is provided with two glue injection holes 57, and each glue injection hole 57 is connected with one glue guiding groove 58.
Preferably, the diameter of the slot hole of the butt-joint slot 54 is smaller than that of the forming slot 61.
Preferably, the molding groove 61 is a semi-cylindrical cavity; the length of the forming groove 61 is larger than that of the electronic delay module 3.
Preferably, each forming groove 61 is communicated with a glue tank 64.
The invention adopts the following principle:
opening the upper die 51 and the lower die 52, placing the electronic delay module 3 into a forming groove 61 (ten times of each die) in the lower die 52, and connecting and fixing the upper die 51 and the lower die 52 by screwing the handle 56; the glue injection mold 5 is conveyed to the position of the low-pressure automatic glue injection machine 7 through the conveyor belt 6, the low-pressure automatic glue injection machine 7 injects glue through the two glue injection holes 57 on the upper mold 51, the glue injection fills the molding groove 61, and the electronic delay module 3 is wrapped; the conveyor belt 6 conveys the glue injection mold 5 subjected to glue injection to an automatic board separator, and the electronic delay module of one ten-shot board subjected to glue injection is cut into single shots; the glue injection mold 5 is conveyed to the pin line butt joint device 8 by the conveyor belt 6, the lead is connected with the electronic delay module 3 through the butt joint groove 54, then the glue injection mold 5 with the pin lines in butt joint is conveyed to the automatic welding machine 9 by the conveyor belt 6, the automatic welding machine 9 performs welding on the butt joint groove 54, and the lead is welded with the electronic delay module 3. After the glue injection mold 5 is opened by screwing the handle 56, the glue solution is cooled to form a cylindrical inclusion, and the electronic delay module 3 is firmly wrapped.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts of the present invention. The foregoing is only a preferred embodiment of the present invention, and it should be noted that there are objectively infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes may be made without departing from the principle of the present invention, and the technical features described above may be combined in a suitable manner; such modifications, variations, combinations, or adaptations of the invention using its spirit and scope, as defined by the claims, may be directed to other uses and embodiments.
Claims (6)
1. The full-automatic glue injection, packaging and feeding system of the electronic delay ignition device is characterized by comprising a glue injection mold (5) conveyed by a conveyor belt (6); an electronic delay module (3) is arranged in the glue injection mold (5); the side edge of the conveyor belt (6) is sequentially provided with a low-pressure automatic glue injection machine (7) for injecting glue into the glue injection mould (5), a foot line butt joint device (8) for butt joint of the electronic delay module (3) and foot lines, and an automatic welding machine (9) for welding the foot lines of the electronic delay module (3) along the conveying direction; the glue injection mold (5) comprises an upper mold (51) and a lower mold (52); the bottom surface of the upper die (51) and the top surface of the lower die (52) are provided with glue guiding grooves (58) in a mirror image manner, and the glue guiding grooves (58) are connected with glue guiding grooves (60); the glue guide groove (60) is communicated with a glue injection groove (63); the glue injection groove (63) is positioned between two adjacent forming grooves (61); the side edge of the glue injection groove (63) is communicated with the forming groove (61) through a glue tank groove (64); the top end of the forming groove (61) is connected with a medicine head groove (62); an electronic delay module (3) is placed in the forming groove (61); a rubber inlet pipe (59) is arranged in the upper die (51) and is used for communicating the rubber guiding groove (58) with the rubber injection hole (57); the glue injection hole (57) is positioned on the upper end surface of the upper die (51); the tail end of a forming groove (61) on the upper die (51) is sealed; the tail end of a forming groove (61) on the lower die (52) is communicated with a butt joint groove (54);
the use principle of the full-automatic glue injection, packaging and on-line system of the electronic delay ignition device is as follows:
opening the upper die (51) and the lower die (52), placing the electronic delay module (3) into a forming groove (61) in the lower die (52), screwing a handle (56) to connect and fix the upper die (51) and the lower die (52) for ten times of each die; the glue injection mold (5) is conveyed to the position of a low-pressure automatic glue injection machine (7) through a conveyor belt (6), the low-pressure automatic glue injection machine (7) injects glue through two glue injection holes (57) in an upper mold (51), the molding groove (61) is filled with the injected glue, and the electronic delay module (3) is wrapped; the conveyor belt (6) conveys the glue injection mold (5) subjected to glue injection to an automatic board separator, and the electronic delay module (3) of one ten-shot board subjected to glue injection is cut into single shots; the glue injection mold (5) is conveyed to a pin line butt joint device (8) by a conveyor belt (6), a lead is connected with the electronic delay module (3) through a butt joint groove (54), then the glue injection mold (5) with the pin lines in butt joint is conveyed to an automatic welding machine (9) by the conveyor belt (6), the automatic welding machine (9) performs welding on the butt joint groove (54), and the lead is welded with the electronic delay module (3); after the glue injection mold (5) is opened by screwing the handle (56), the glue solution is seen to be cooled to form a cylindrical inclusion, and the electronic delay module (3) is firmly wrapped;
the upper die (51) and the lower die (52) are fixedly connected through a clamping bolt (53); the clamping bolt (53) is positioned on the bottom surface of the upper die (51); the two sides of the lower die (52) are provided with clamping bolt holes (65) for connecting clamping bolts (53);
a tightening handle (56) is vertically arranged on the clamping bolt (53); handle movable grooves (55) are formed in two side edges of the upper die (51); the tightening handle (56) is positioned in the handle movable groove (55);
the glue guiding groove (58) and the glue guiding groove (60) are connected to form a T shape.
2. The full-automatic glue injection, packaging and line feeding system of the electronic delay igniter according to claim 1, wherein the glue tank (64) is a conical cavity tank.
3. The full-automatic glue injection, packaging and feeding system of the electronic delay ignition device according to claim 1, characterized in that the upper mold (51) is provided with two glue injection holes (57), and each glue injection hole (57) is connected with a glue guiding groove (58).
4. The full-automatic glue injection and packaging on-line system of the electronic delay ignition device according to claim 1, characterized in that the diameter of the slotted hole of the butt joint slot (54) is smaller than that of the forming slot (61).
5. The full-automatic glue injection and packaging online system of the electronic delay ignition device according to claim 1, wherein the molding groove (61) is a semi-cylindrical cavity; the length of the forming groove (61) is larger than that of the electronic delay module (3).
6. The full-automatic glue injection and packaging on-line system of the electronic delay ignition device according to claim 1, characterized in that each molding groove (61) is communicated with a glue tank (64).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610785671.2A CN106431796B (en) | 2016-08-31 | 2016-08-31 | Full-automatic glue injection, encapsulation and on-line system of electronic delay ignition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610785671.2A CN106431796B (en) | 2016-08-31 | 2016-08-31 | Full-automatic glue injection, encapsulation and on-line system of electronic delay ignition device |
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| Publication Number | Publication Date |
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| CN106431796A CN106431796A (en) | 2017-02-22 |
| CN106431796B true CN106431796B (en) | 2022-04-08 |
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| CN201610785671.2A Active CN106431796B (en) | 2016-08-31 | 2016-08-31 | Full-automatic glue injection, encapsulation and on-line system of electronic delay ignition device |
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| CN112595186A (en) * | 2020-11-07 | 2021-04-02 | 杭州晋旗电子科技有限公司 | Electronic detonator chip assembling equipment and method thereof |
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| EP0822385A1 (en) * | 1996-08-02 | 1998-02-04 | Rheinmetall Industrie Aktiengesellschaft | Primer for propulsive charge |
| CN103335567A (en) * | 2013-06-26 | 2013-10-02 | 北京理工大学 | Integrally gummed electronic circuit module for electronic detonator and process method thereof |
| CN203310310U (en) * | 2013-05-30 | 2013-11-27 | 北京全安密灵科技股份公司 | Glue-filling protective structure of electronic detonator inbuilt control module |
| CN103528452A (en) * | 2013-10-17 | 2014-01-22 | 北京京煤化工有限公司 | Production system of electronic ignition components |
| CN103570481A (en) * | 2013-10-11 | 2014-02-12 | 新疆雪峰科技(集团)股份有限公司 | Automatic electronic detonator assembly production device |
| CN203510600U (en) * | 2013-10-17 | 2014-04-02 | 北京京煤化工有限公司 | Electronic ignition element packaging machine |
| CN206089500U (en) * | 2016-08-31 | 2017-04-12 | 湖南神斧集团向红机械化工有限责任公司 | System of reaching standard grade is sealed to full -automatic injecting glue of electron delay igniter |
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2016
- 2016-08-31 CN CN201610785671.2A patent/CN106431796B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0822385A1 (en) * | 1996-08-02 | 1998-02-04 | Rheinmetall Industrie Aktiengesellschaft | Primer for propulsive charge |
| US5895881A (en) * | 1996-08-02 | 1999-04-20 | Rheinmetall Industrie Ag | Propellant charge igniter |
| CN203310310U (en) * | 2013-05-30 | 2013-11-27 | 北京全安密灵科技股份公司 | Glue-filling protective structure of electronic detonator inbuilt control module |
| CN103335567A (en) * | 2013-06-26 | 2013-10-02 | 北京理工大学 | Integrally gummed electronic circuit module for electronic detonator and process method thereof |
| CN103570481A (en) * | 2013-10-11 | 2014-02-12 | 新疆雪峰科技(集团)股份有限公司 | Automatic electronic detonator assembly production device |
| CN103528452A (en) * | 2013-10-17 | 2014-01-22 | 北京京煤化工有限公司 | Production system of electronic ignition components |
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| CN206089500U (en) * | 2016-08-31 | 2017-04-12 | 湖南神斧集团向红机械化工有限责任公司 | System of reaching standard grade is sealed to full -automatic injecting glue of electron delay igniter |
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