CN106431796A - Fully-automatic glue injection, encapsulation and inline formation system of electronic delayed ignition device - Google Patents

Fully-automatic glue injection, encapsulation and inline formation system of electronic delayed ignition device Download PDF

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Publication number
CN106431796A
CN106431796A CN201610785671.2A CN201610785671A CN106431796A CN 106431796 A CN106431796 A CN 106431796A CN 201610785671 A CN201610785671 A CN 201610785671A CN 106431796 A CN106431796 A CN 106431796A
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CN
China
Prior art keywords
glue
mould
electronic delay
groove
grooves
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Application number
CN201610785671.2A
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Chinese (zh)
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CN106431796B (en
Inventor
张勤
吕忠
罗卫国
李�远
肖辉
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HUNAN SHENFU GROUP XIANGHONG MACHINERY CHEMICAL CO Ltd
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HUNAN SHENFU GROUP XIANGHONG MACHINERY CHEMICAL CO Ltd
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Priority to CN201610785671.2A priority Critical patent/CN106431796B/en
Publication of CN106431796A publication Critical patent/CN106431796A/en
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Classifications

    • CCHEMISTRY; METALLURGY
    • C06EXPLOSIVES; MATCHES
    • C06CDETONATING OR PRIMING DEVICES; FUSES; CHEMICAL LIGHTERS; PYROPHORIC COMPOSITIONS
    • C06C7/00Non-electric detonators; Blasting caps; Primers
    • C06C7/02Manufacture; Packing

Abstract

The invention discloses a fully-automatic glue injection, encapsulation and inline formation system of an electronic delayed ignition device. The system comprises a conveyor belt and a glue injection die; a low-pressure automatic glue injection machine, a leg wire butting device and an automatic welding machine are sequentially arranged at the side edge of the conveyor belt along a conveying direction; the glue injection die comprises an upper die and a lower die; glue leading grooves are arranged on the bottom surface of the upper die and the top surface of the lower die in a mutual mirror image manner, and the glue leading grooves are connected with glue guiding grooves; the glue guiding grooves communicate with glue injecting grooves; the side edges of the glue injecting grooves communicate through glue pouring grooves to form profiled grooves; the top end of each profiled groove is connected with a gunpowder groove; an electronic time delay module is placed in each profiled groove; glue inlet tubes are arranged in the upper die, and communicate the glue leading grooves with glue injecting holes; the glue injecting holes are positioned in the upper end surface of the upper die; the tail ends of the profiled grooves of the upper die are sealed; and the tail ends of the profiled grooves of the lower die communicate with butting grooves. The system realizes complete sealed wrapping of the electronic delay module, realizes moisture, water and dust prevention, improves the assembling speed and the assembling quality of electronic detonators, and prolongs the service life of the electronic detonators.

Description

Electronic delay igniter Full-automatic rubber injection encapsulates system of reaching the standard grade
Technical field
The invention belongs to electric detonator processing technique field, specially a kind of electronic delay igniter Full-automatic rubber injection bag Seal up linear system system.
Background technology
Since China's electric detonator development more than ten years, it has been constantly in the experimental exploration stage, do not mass produce and use. Therefore associated production technology is more backward, substantially by the way of pure manual production.As shown in figure 1, electric detonator is mainly by electricity Sub- delay igniter and basal detonator 1 form;Electronic delay igniter is by medicine head 2, electronic delay module 3,4 groups of payment to a porter Become;Electronic delay module 3 portion envelops are got up electric detonator by certain measure to be taken before assembly, prevent thunder basic in insertion Scratch the electronic devices and components on electronic delay module 3 surface when pipe 1 is assembled, lead to component failure or come off.Due to technology Limit, existing process is encapsulated using heat-shrink tube mostly, and electronic delay igniter is first inserted in heat-shrink tube, Ran Houyong by workman Air-heater blows heat-shrink tube so as to heat shrinkable wraps up electronic delay igniter.Heat-shrink tube wrapper technology operation easier big it is difficult to Using automated production, low production efficiency.Because of its both ends open, it does not possess the ability of fully sealing it is impossible to moistureproof and waterproof is dust-proof.
Content of the invention
The purpose of the present invention is for problem above, provides a kind of electronic delay igniter Full-automatic rubber injection encapsulating to reach the standard grade System, it enables the docking fully sealing parcel and payment to a porter of the electronic delay module in electronic delay igniter, energy Realize that moistureproof and waterproof is dust-proof, effectively prevent electronic devices and components to be thereon destroyed, greatly improve electric detonator assembling speed and Assembling quality, the storage life that improve electric detonator and the requirement reducing electric detonator storage environment, can save storage Cost.
For realizing object above, the technical solution used in the present invention is:Electronic delay igniter Full-automatic rubber injection is encapsulated Reach the standard grade system, it includes the gel-injection mould (5) transmitting by conveyer belt (6);It is provided with electronic delay in described gel-injection mould (5) Module (3);Described conveyer belt (6) side is disposed with the low pressure for gel-injection mould (5) is carried out with injecting glue along direction of transfer Automatic glue injection machine (7), for electronic delay module (3) is docked with payment to a porter payment to a porter docking facilities (8), be used for electronic delay Module (3) carries out the automatic welding machine (9) of wiring welding;Mould (51) and lower mould (52) in the inclusion of described gel-injection mould (5);Described Mutually it is provided with mirror image on upper and lower mould (52) top surface of upper mould (51) bottom surface and draws glue groove (58), described draw glue groove (58) connection and lead Glue groove (60);Described glue groove (60) of leading is communicated with injecting glue groove (63);Described injecting glue groove (63) is located at two adjacent forming tank (61) Between;Described injecting glue groove (63) side connects forming tank (61) by tank glue groove (64);Described forming tank (61) top is connected with Medicine head groove (62);It is placed with electronic delay module (3) in described forming tank (61);It is provided with glue inlet tube in described upper mould (51) (59) glue groove (58) will be drawn connect with hole for injecting glue (57);Described hole for injecting glue (57) is located on the upper surface of upper mould (51);On described Forming tank (61) tail end sealing on mould (51);Forming tank (61) tail end on described lower mould (52) is communicated with docking groove (54).
Further, described upper mould (51) and lower mould (52) are connected by snib (53);Described snib (53) is located at On upper mould (51) bottom surface;Described lower mould (52) both sides are provided with the snib hole (65) for connecting snib (53).
Further, described snib (53) is vertically installed with and tightens handle (56);Described upper mould (51) two side setting There is handle loose slot (55);Described handle (56) of tightening is located in handle loose slot (55).
Further, described draw glue groove (58) and lead glue groove (60) and connect and compose T-shaped shape.
Further, described tank glue groove (64) is conical cavity groove.
Further, described upper mould (51) is provided with two hole for injecting glue (57), each hole for injecting glue (57) connects respectively One is drawn glue groove (58).
Further, the slotted eye diameter of described docking groove (54) is less than forming tank (61).
Further, described forming tank (61) is semi-cylindrical cavity;Described forming tank (61) length is more than electronic delay The length of module (3).
Further, each forming tank (61) is communicated with a tank glue groove (64).
Beneficial effects of the present invention:
First, technological action is simple, and after artificial identity, automatically by upper for gel-injection mould crawl transmission line, transmission line is certainly for manipulator Move and mould is delivered to injecting glue station, injecting glue manipulator automatically captures gel-injection mould and delivers in glue-injection machine, and glue-injection machine senses mould Tool automatic injecting glue after putting in place.Injecting glue manipulator automatic delivery again, encapsulated good electronic delay igniter after the completion of injecting glue Circulate subsequent processing with mould.Its high degree of automation, whole on-line operation is it is easy to production line balance operation.
2nd, injecting glue wrapper technology can accomplish hermetically sealed.The electronic component in electronic delay module can not only be protected to scratch Come off, can be with dustproof and waterproof.Because during injecting glue, glue has certain injection pressure, therefore can be filled between electronic component Minim gap, insulating electron element electromagnetic effect each other can be played so that Module Reliability and precision more preferably.Due to The cylinder inclusion enclave being formed after injecting glue is solid, can increase the rigidity of electronic delay igniter, rubber possesses preferably Elasticity, can play the effect such as anti-bending, antidetonation.
Brief description
Fig. 1 is electric detonator structural representation.
Fig. 2 is present system schematic diagram.
Fig. 3 is gel-injection mould front schematic view in the present invention.
Fig. 4 is Fig. 3 left view.
Fig. 5 is Fig. 3 top view.
Fig. 6 is upper mould bottom surface structure schematic diagram.
Fig. 7 is lower mould top surface structure schematic diagram.
In figure:1st, basal detonator;2nd, medicine head;3rd, electronic delay module;4th, payment to a porter;5th, gel-injection mould;6th, conveyer belt;7th, low Pressure automatic glue injection machine;8th, payment to a porter docking facilities;9th, automatic welding machine;51st, upper mould;52nd, lower mould;53rd, snib;54th, docking groove; 55th, handle loose slot;56th, tighten handle;57th, hole for injecting glue;58th, draw glue groove;59th, glue inlet tube;60th, lead glue groove;61st, forming tank; 62nd, medicine head groove;63rd, injecting glue groove;64th, tank glue groove;65th, snib hole.
Specific embodiment
In order that those skilled in the art more fully understand technical scheme, below in conjunction with the accompanying drawings the present invention is entered Row describes in detail, and the description of this part is only exemplary and explanatory, should not have any restriction to protection scope of the present invention Effect.
As shown in Fig. 1-Fig. 7, the concrete structure of the present invention is:The upper linear system of electronic delay igniter Full-automatic rubber injection encapsulating System, it includes the gel-injection mould 5 transmitting by conveyer belt 6;It is provided with electronic delay module 3 in described gel-injection mould 5;Described biography Send with 6 sides along direction of transfer be disposed with for gel-injection mould 5 is carried out with injecting glue low pressure automatic glue injection machine 7, for right Electronic delay module 3 carries out the payment to a porter docking facilities 8 of payment to a porter docking, is used for electronic delay module 3 is carried out with oneself of payment to a porter welding Dynamic bonding machine 9;Described gel-injection mould 5 includes mould 51 and lower mould 52;On upper and lower mould 52 top surface of described upper mould 51 bottom surface mutually Be provided with mirror image and draw glue groove 58, described draw glue groove 58 connect lead glue groove 60;Described glue groove 60 of leading is communicated with injecting glue groove 63;Described Injecting glue groove 63 is located between two adjacent forming tank 61;Described injecting glue groove 63 side connects forming tank 61 by tank glue groove 64;Institute State forming tank 61 top and be connected with medicine head groove 62;It is placed with electronic delay module 3 in described forming tank 61;Set in described upper mould 51 It is equipped with glue inlet tube 59 and will draw glue groove 58 and connect with hole for injecting glue 57;Described hole for injecting glue 57 is located on the upper surface of upper mould 51;On described Forming tank 61 tail end sealing on mould 51;Forming tank 61 tail end on described lower mould 52 is communicated with docking groove 54.
Preferably, described upper mould 51 and lower mould 52 are connected by snib 53;Described snib 53 is located at upper mould 51 bottom surface On;Described lower mould 52 both sides are provided with the snib hole 65 for connecting snib 53.
Preferably, described snib 53 is vertically installed with and tightens handle 56;Described 51 liang of sides of upper mould are provided with handle and live Dynamic groove 55;Described handle 56 of tightening is located in handle loose slot 55.
Preferably, described draw glue groove 58 and lead glue groove and 60 connect and compose T-shaped shape.
Preferably, described tank glue groove 64 is conical cavity groove.
Preferably, described upper mould 51 is provided with two hole for injecting glue 57, each hole for injecting glue 57 connects one respectively and draws glue Groove 58.
Preferably, the slotted eye diameter of described docking groove 54 is less than forming tank 61.
Preferably, described forming tank 61 is semi-cylindrical cavity;Described forming tank 61 length is more than electronic delay module 3 Length.
Preferably, each forming tank 61 is communicated with a tank glue groove 64.
Use principle of the present invention:
Open mould 51 and lower mould 52, electronic delay module 3 put in the forming tank 61 in lower mould 52 (ten every moulds), Using tightening handle 56, upper mould 51 and lower mould 52 are connected;By conveyer belt 6, gel-injection mould 5 is sent to low pressure automatically to note Glue machine 7 position, low pressure automatic glue injection machine 7 carries out injecting glue, the full forming tank of injecting glue filling by two hole for injecting glue 57 on upper mould 51 61, electronic delay module 3 is wrapped;The gel-injection mould 5 that injecting glue completes is sent at automatic board separator by conveyer belt 6, will note The electronic delay module of ten plates that glue completes is cut into single-shot;Gel-injection mould 5 is sent to payment to a porter docking facilities by conveyer belt 6 At 8, by docking groove 54, wire is coupled together with electronic delay module 3, be then transported on to the injecting glue mould connecting payment to a porter with 6 Tool 5 is sent at automatic welding machine 9, and automatic welding machine 9 is welded on docking groove 54, by wire and electronic delay module 3 Weld.Gel-injection mould 5 is opened rear it can be seen that forming cylindrical inclusion enclave after glue cooling using tightening handle 56, Firmly wrap electronic delay module 3.
It should be noted that herein, term " inclusion ", "comprising" or its any other variant are intended to non-row The comprising of his property, so that including a series of process of key elements, method, article or equipment not only include those key elements, and And also include other key elements of being not expressly set out, or also include intrinsic for this process, method, article or equipment institute Key element.
Specific case used herein is set forth to the principle of the present invention and embodiment, the explanation of above example It is only intended to help and understand the method for the present invention and its core concept.The above is only the preferred embodiment of the present invention, should When pointing out due to the finiteness of literal expression, and objectively there is unlimited concrete structure, for the common skill of the art For art personnel, under the premise without departing from the principles of the invention, some improvement, retouching or change can also be made it is also possible to incite somebody to action Above-mentioned technical characteristic is combined by rights;These improve retouching, change or combine, or the not improved structure by invention Think and technical scheme directly applies to other occasions, be regarded as protection scope of the present invention.

Claims (9)

1. the encapsulating of electronic delay igniter Full-automatic rubber injection reaches the standard grade system it is characterised in that it includes passing by conveyer belt (6) The gel-injection mould (5) sending;It is provided with electronic delay module (3) in described gel-injection mould (5);Described conveyer belt (6) side is along biography Send direction be disposed with for gel-injection mould (5) is carried out with injecting glue low pressure automatic glue injection machine (7), for by electronic delay mould Block (3) and payment to a porter docking payment to a porter docking facilities (8), the automatic welding for electronic delay module (3) carried out with payment to a porter welding Pick (9);Mould (51) and lower mould (52) in the inclusion of described gel-injection mould (5);Described upper mould (51) bottom surface upper and lower mould (52) top Mutually it is provided with mirror image on face and draws glue groove (58), described draw glue groove (58) connection and lead glue groove (60);Described glue groove (60) of leading connects It is connected with injecting glue groove (63);Described injecting glue groove (63) is located between two adjacent forming tank (61);Described injecting glue groove (63) side leads to Cross tank glue groove (64) connection forming tank (61);Described forming tank (61) top is connected with medicine head groove (62);Described forming tank (61) Inside it is placed with electronic delay module (3);It is provided with glue inlet tube (59) in described upper mould (51) and glue groove (58) and hole for injecting glue will be drawn (57) connect;Described hole for injecting glue (57) is located on the upper surface of upper mould (51);Forming tank (61) tail end on described upper mould (51) Sealing;Forming tank (61) tail end on described lower mould (52) is communicated with docking groove (54).
2. electronic delay igniter Full-automatic rubber injection according to claim 1 encapsulating reaches the standard grade system it is characterised in that institute State mould (51) and lower mould (52) is connected by snib (53);Described snib (53) is located on upper mould (51) bottom surface;Described Lower mould (52) both sides are provided with the snib hole (65) for connecting snib (53).
3. electronic delay igniter Full-automatic rubber injection according to claim 2 encapsulating reaches the standard grade system it is characterised in that institute State to be vertically installed with snib (53) and tighten handle (56);Described upper mould (51) two side is provided with handle loose slot (55);Institute State and tighten handle (56) in handle loose slot (55).
4. electronic delay igniter Full-automatic rubber injection according to claim 1 encapsulating reaches the standard grade system it is characterised in that institute State and draw glue groove (58) and lead glue groove (60) and connect and compose T-shaped shape.
5. electronic delay igniter Full-automatic rubber injection according to claim 1 encapsulating reaches the standard grade system it is characterised in that institute Stating tank glue groove (64) is conical cavity groove.
6. electronic delay igniter Full-automatic rubber injection according to claim 1 encapsulating reaches the standard grade system it is characterised in that institute State and two hole for injecting glue (57) are provided with mould (51), each hole for injecting glue (57) connects one respectively and draws glue groove (58).
7. electronic delay igniter Full-automatic rubber injection according to claim 1 encapsulating reaches the standard grade system it is characterised in that institute The slotted eye diameter stating docking groove (54) is less than forming tank (61).
8. electronic delay igniter Full-automatic rubber injection according to claim 1 encapsulating reaches the standard grade system it is characterised in that institute Stating forming tank (61) is semi-cylindrical cavity;Described forming tank (61) length is more than the length of electronic delay module (3).
9. electronic delay igniter Full-automatic rubber injection according to claim 1 encapsulating reaches the standard grade system it is characterised in that every One forming tank (61) is communicated with a tank glue groove (64).
CN201610785671.2A 2016-08-31 2016-08-31 Full-automatic glue injection, encapsulation and on-line system of electronic delay ignition device Active CN106431796B (en)

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CN201610785671.2A CN106431796B (en) 2016-08-31 2016-08-31 Full-automatic glue injection, encapsulation and on-line system of electronic delay ignition device

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Application Number Priority Date Filing Date Title
CN201610785671.2A CN106431796B (en) 2016-08-31 2016-08-31 Full-automatic glue injection, encapsulation and on-line system of electronic delay ignition device

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CN106431796B CN106431796B (en) 2022-04-08

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112595186A (en) * 2020-11-07 2021-04-02 杭州晋旗电子科技有限公司 Electronic detonator chip assembling equipment and method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0822385A1 (en) * 1996-08-02 1998-02-04 Rheinmetall Industrie Aktiengesellschaft Primer for propulsive charge
CN103335567A (en) * 2013-06-26 2013-10-02 北京理工大学 Integrally gummed electronic circuit module for electronic detonator and process method thereof
CN203310310U (en) * 2013-05-30 2013-11-27 北京全安密灵科技股份公司 Glue-filling protective structure of electronic detonator inbuilt control module
CN103528452A (en) * 2013-10-17 2014-01-22 北京京煤化工有限公司 Production system of electronic ignition components
CN103570481A (en) * 2013-10-11 2014-02-12 新疆雪峰科技(集团)股份有限公司 Automatic electronic detonator assembly production device
CN203510600U (en) * 2013-10-17 2014-04-02 北京京煤化工有限公司 Electronic ignition element packaging machine
CN206089500U (en) * 2016-08-31 2017-04-12 湖南神斧集团向红机械化工有限责任公司 System of reaching standard grade is sealed to full -automatic injecting glue of electron delay igniter

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0822385A1 (en) * 1996-08-02 1998-02-04 Rheinmetall Industrie Aktiengesellschaft Primer for propulsive charge
US5895881A (en) * 1996-08-02 1999-04-20 Rheinmetall Industrie Ag Propellant charge igniter
CN203310310U (en) * 2013-05-30 2013-11-27 北京全安密灵科技股份公司 Glue-filling protective structure of electronic detonator inbuilt control module
CN103335567A (en) * 2013-06-26 2013-10-02 北京理工大学 Integrally gummed electronic circuit module for electronic detonator and process method thereof
CN103570481A (en) * 2013-10-11 2014-02-12 新疆雪峰科技(集团)股份有限公司 Automatic electronic detonator assembly production device
CN103528452A (en) * 2013-10-17 2014-01-22 北京京煤化工有限公司 Production system of electronic ignition components
CN203510600U (en) * 2013-10-17 2014-04-02 北京京煤化工有限公司 Electronic ignition element packaging machine
CN206089500U (en) * 2016-08-31 2017-04-12 湖南神斧集团向红机械化工有限责任公司 System of reaching standard grade is sealed to full -automatic injecting glue of electron delay igniter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112595186A (en) * 2020-11-07 2021-04-02 杭州晋旗电子科技有限公司 Electronic detonator chip assembling equipment and method thereof

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