CN211855084U - Electronic detonator - Google Patents

Electronic detonator Download PDF

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Publication number
CN211855084U
CN211855084U CN201922150522.0U CN201922150522U CN211855084U CN 211855084 U CN211855084 U CN 211855084U CN 201922150522 U CN201922150522 U CN 201922150522U CN 211855084 U CN211855084 U CN 211855084U
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CN
China
Prior art keywords
heat
bonding glue
electronic detonator
circuit board
utility
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Active
Application number
CN201922150522.0U
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Chinese (zh)
Inventor
李叶磊
王斐
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Hangzhou Jinqi Electronic Technology Co ltd
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Hangzhou Jinqi Electronic Technology Co ltd
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Priority to CN201922150522.0U priority Critical patent/CN211855084U/en
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Abstract

The utility model relates to an electron detonator technical field, in particular to electron detonator, including control chip, energy storage capacitor, foot line linking bridge and the ignition element of welding on PCB circuit board, PCB circuit board openly and the back all cover there is one deck stereoplasm bonding glue film, stereoplasm bonding glue film outside parcel has heat shrinkage bush. The utility model adopts the heat-shrinkable sleeve to replace the original hot melt adhesive, and has lower cost; the hard bonding glue layer is arranged, so that the insulation performance is good, and the quality is stable; the heat-shrinkable bush who uses belongs to plastics class goods, and quality control is stable in its production process, and no metallic impurity mixes wherein, and dual mode combined action makes the insulating properties of electronic detonator good, and loss strength has not improved greatly again the utility model discloses a quality, during the heat-shrinkable bush shrink, can encase ignition head and other components and parts simultaneously, form a whole, and anti-seismic performance is good, and the ignition head is difficult for taking place the breakage because of the vibration, has better protected the ignition head.

Description

Electronic detonator
Technical Field
The utility model relates to an electron detonator technical field, in particular to electron detonator.
Background
The inner diameter of the electronic detonator shell is smaller, generally 6.3mm, and the outer diameter of the electronic detonator module is generally not more than 6.0 mm. The small size results in a very compact electronic detonator module. In the detonation process of the electronic detonator, large impact can be generated, parts on the PCB can be caused to contact a tube shell, faults are caused, and the electronic detonator is prevented from being detonated, so that an insulation protection structure needs to be added outside an electronic detonator module. The former electronic detonator module generally adopts a sealing glue structure, namely a layer of insulating hot melt adhesive is wrapped on the periphery of the electronic detonator module, but the mode has great defects, such as high cost, easy module short circuit, easy chip component falling off, incapability of protecting an ignition head and the like.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide an electronic detonator with low costs, be difficult to lead to module short circuit and components and parts to break away from and protect the ignition head.
In order to solve the technical problem, the utility model discloses a scheme does:
the utility model provides an electronic detonator, includes control chip, energy storage capacitor, foot line linking bridge and the ignition element of welding on PCB circuit board, PCB circuit board openly and the back all cover has one deck stereoplasm bonding glue film, the parcel of stereoplasm bonding glue film outside has heat shrinkage bush.
Preferably, the length of the heat-shrinkable sleeve extends from the tail part of the energy storage capacitor to the head part of the ignition element, and the leg wire connecting bracket is exposed.
Preferably, the hard bonding glue layer uniformly covers all components on the PCB, and the thickness of the hard bonding glue layer is 0.2 mm.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model adopts the heat-shrinkable sleeve to replace the original hot melt adhesive, and has lower cost; meanwhile, the front surface and the back surface of the PCB are covered with a hard bonding adhesive layer, so that the PCB is good in insulating property and stable in quality; additionally the utility model discloses the heat shrinkable bush that uses belongs to plastics class goods, and quality control is stable in its production process, and no metallic impurity mixes wherein, and dual mode combined action makes the insulating properties of electron detonator good, and loss strength has not improved again greatly the utility model discloses a quality to, during the heat shrinkable bush shrink, can encase ignition head and other components and parts simultaneously, form a whole, anti-seismic performance is good, and ignition head is difficult for taking place the breakage because of the vibration, has better protected ignition head, can significantly reduce the on-the-spot probability of failing to explode.
Drawings
Fig. 1 is a bottom view of the present invention;
fig. 2 is a left side view of the present invention;
fig. 3 is a top view of the present invention;
fig. 4 is a perspective view of the present invention;
fig. 5 is a schematic structural view of the heat shrinkable sleeve wrapped in fig. 1 according to the present invention.
Detailed Description
The following describes the present invention with reference to the accompanying drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Referring to fig. 1-4, an electronic detonator comprises a control chip 2, an energy storage capacitor 3, a pin wire connecting support 4 and an ignition element 5 which are welded on a PCB circuit board 1, wherein the cost of a hot melt adhesive is high, so that the technical requirements can be met only by using imported materials, in addition, the adhesive sealing process is complex, the equipment and manpower investment is high, the cost is high, therefore, the front surface and the back surface of the PCB circuit board 1 are covered with a hard bonding adhesive layer (not shown in the figure), the impurities of the hot melt adhesive have great influence on the whole performance, the hot melt adhesive can reach a die only after passing through a long conveying pipeline, metal scraps generated by mechanical friction are easily mixed in the process, or the purity of the hot melt adhesive is insufficient, the hot melt adhesive layer has conductive impurities, so that the internal circuit of the electronic detonator is short-circuited and fails, therefore, the hard bonding adhesive layer (not shown in the figure) is adopted to, the ignition head of the electronic detonator is fragile and easy to damage under the action of the explosion shock waves of adjacent blast holes, so that the electronic detonator is prevented from being detonated, the ignition head cannot be sealed by hot melt adhesive sealed by the electronic detonator, otherwise, the detonator cannot be detonated, and the ignition head of the electronic detonator cannot be protected by the hot melt adhesive, so that the heat-shrinkable sleeve 6 (shown in figure 5) wraps the outer side of the hard bonding adhesive layer, the ignition head detonator can be simultaneously wrapped when the heat-shrinkable sleeve 6 shrinks, and the whole body with good anti-seismic performance is formed, the ignition head cannot be easily broken due to vibration, and field tests show that the on-site anti-explosion probability can be greatly reduced by the method.
In order to ensure that the insulating property of the electronic detonator is good without losing the strength, the length of the heat-shrinkable sleeve 6 extends from the tail part of the energy storage capacitor 3 to the head part of the ignition element 5, and the leg wire connecting bracket 4 is exposed.
All components and parts on PCB circuit board 1 are evenly covered in stereoplasm bonding glue film, and thickness is 0.2 mm.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and the scope of the invention is to be accorded the full scope of the claims.

Claims (3)

1. An electronic detonator, characterized in that: including welding control chip (2), energy storage capacitor (3), foot line linking bridge (4) and ignition element (5) on PCB circuit board (1), PCB circuit board (1) openly and the back has all covered one deck stereoplasm bonding glue film, the parcel of stereoplasm bonding glue film outside has heat shrinkage bush (6).
2. Electronic detonator as claimed in claim 1, wherein: the length of the heat-shrinkable sleeve (6) extends from the tail of the energy storage capacitor (3) to the head of the ignition element (5) to expose the leg wire connecting bracket (4).
3. Electronic detonator as claimed in claim 1, wherein: all components and parts on PCB circuit board (1) are evenly covered to stereoplasm bonding glue film, and thickness is 0.2 mm.
CN201922150522.0U 2019-12-04 2019-12-04 Electronic detonator Active CN211855084U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922150522.0U CN211855084U (en) 2019-12-04 2019-12-04 Electronic detonator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922150522.0U CN211855084U (en) 2019-12-04 2019-12-04 Electronic detonator

Publications (1)

Publication Number Publication Date
CN211855084U true CN211855084U (en) 2020-11-03

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ID=73214308

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922150522.0U Active CN211855084U (en) 2019-12-04 2019-12-04 Electronic detonator

Country Status (1)

Country Link
CN (1) CN211855084U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112595186A (en) * 2020-11-07 2021-04-02 杭州晋旗电子科技有限公司 Electronic detonator chip assembling equipment and method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112595186A (en) * 2020-11-07 2021-04-02 杭州晋旗电子科技有限公司 Electronic detonator chip assembling equipment and method thereof

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GR01 Patent grant
GR01 Patent grant
CP02 Change in the address of a patent holder

Address after: No. 602-129, Complex Building, No. 1099, Qingxi Second Road, Hezhuang Street, Qiantang District, Hangzhou, Zhejiang, 310000

Patentee after: Hangzhou Jinqi Electronic Technology Co.,Ltd.

Address before: Room 639-642, building 5, No.2, kekeyuan Road, Baiyang street, Hangzhou Economic and Technological Development Zone, Zhejiang 310000

Patentee before: Hangzhou Jinqi Electronic Technology Co.,Ltd.

CP02 Change in the address of a patent holder