CN112589807A

CN112589807A - Substrate transfer apparatus and substrate transfer method

Info

Publication number: CN112589807A
Application number: CN202011049143.3A
Authority: CN
Inventors: 武者和博; 南展史; 铃木杰之
Original assignee: Ulvac Inc
Current assignee: Ulvac Inc
Priority date: 2019-10-02
Filing date: 2020-09-29
Publication date: 2021-04-02
Anticipated expiration: 2040-09-29
Also published as: CN112589807B; US11628565B2; TW202115820A; JP7045353B2; US20210101281A1; JP2021057548A; TWI791166B; KR20210039967A

Abstract

The invention provides a substrate conveying device and a substrate conveying method capable of enlarging the degree of freedom of design. The substrate conveying device comprises: an arm; an end effector coupled to the arm; a drive unit that raises the arm to cause the end effector to receive a substrate; and a control unit configured to control an output of the drive unit to change a speed of raising the arm, wherein the control unit is configured to raise the end effector toward the substrate by raising the arm at a1 st speed, and to change the speed of raising to a2 nd speed lower than the 1 st speed when the end effector starts to raise the height position of the substrate.

Description

Substrate transfer apparatus and substrate transfer method

Technical Field

The present invention relates to a substrate transfer apparatus and a substrate transfer method.

Background

An apparatus for manufacturing various devices such as a semiconductor device and a light emitting device is equipped with a substrate transfer apparatus for transferring a substrate for forming a device. The substrate conveying device is provided with an end effector supported by an arm. The end effector is raised together with the raising of the arm, and receives a substrate placed on a placing table or the like from the placing table. The end effector is lowered together with the lowering of the arm, and the substrate placed on the end effector is sent out to the placing table. The substrate transport device includes a detection unit that optically detects a mounting state of a substrate. The control unit that controls the driving of the arm executes subsequent processing based on the detection result of the detection unit (see, for example, patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2015-119070

Disclosure of Invention

Problems to be solved by the invention

In view of shortening the time required for conveyance, it is preferable to increase the moving speed of the end effector. In contrast, from the viewpoint of improving the positional accuracy of the substrate at the conveyance destination and from the viewpoint of suppressing the generation of particles by reducing the aftershock of the substrate, it is preferable to reduce the moving speed of the end effector. As described above, the transport efficiency of the substrate and the positional accuracy of the substrate have a so-called trade-off relationship in which if one is increased, the other is decreased. In a substrate transfer apparatus which requires both reduction of transfer time and improvement of positional accuracy, it is required to increase the degree of freedom in design so as to reduce the incompatibility relationship between them.

The invention aims to provide a substrate conveying device and a substrate conveying method which can enlarge the design freedom degree.

Means for solving the problems

A substrate transfer device according to an embodiment includes: an arm; an end effector coupled to the arm; a drive unit that raises the arm and causes the end effector to receive a substrate; and a control unit configured to control an output of the drive unit to change a speed of raising the arm, wherein the control unit is configured to change the speed of raising to a2 nd speed lower than the 1 st speed when the end effector starts to raise the height position of the substrate while raising the arm at the 1 st speed to raise the end effector toward the substrate.

A substrate transfer method according to an embodiment includes: raising an end effector toward a substrate by raising an arm coupled to the end effector at a1 st speed; and changing a rising speed of the arm to a2 nd speed lower than the 1 st speed when the end effector starts to rise the height position of the substrate.

When the raised end effector abuts against the substrate, the weight of the substrate acts on the end effector, and the end effector and the arm warp according to the rigidity of the end effector and the rigidity of the arm. Then, after the end effector and the arm start to warp and recover, the height position of the substrate starts to rise. That is, the substrate transfer is started. In this regard, according to the above-described respective configurations, when the end effector starts to raise the height position of the substrate, the end effector decelerates. Therefore, the raising speed of the end effector can be increased until the substrate delivery is started, and the time required for conveyance can be shortened. Further, when the substrate transfer is started, the speed of the end effector to be raised can be reduced to improve the positional accuracy of the substrate. As a result, the degree of freedom in design can be expanded to reduce the incompatibility between the reduction in transportation time and the improvement in positional accuracy.

In the substrate transport apparatus described above, the control unit may increase the rising speed from the 2 nd speed when the vibration at the end effector changes after the rising speed is changed to the 2 nd speed.

The above substrate conveying method may further include increasing the rising speed from the 2 nd speed when the vibration at the end effector changes after changing the rising speed to the 2 nd speed.

The end effector is slightly vibrated in the up-down direction based on the rise of the end effector of the arm. When the substrate is stationary with respect to the vibrating end effector, the vibration is changed from the vibration in which only the end effector is a vibrator to the vibration in which the end effector and the substrate are vibrators. With respect to this point, according to the above-described respective structures, when the vibration at the end effector changes, the end effector accelerates. Therefore, the speed of raising the end effector can be reduced to improve the positional accuracy of the substrate until the substrate transfer is completed. Further, at the end of substrate transfer, the raising speed of the end effector can be increased, so that the time required for conveyance can be shortened. As a result, the degree of freedom in design can be increased to further weaken the incompatible relationship between the reduction in the conveying time and the improvement in the positional accuracy. In addition, as an additional effect, the vibration of the vibrator formed by the end effector and the substrate is suppressed by using the present transfer method. This also suppresses generation of particles due to aftershocks.

The substrate transport apparatus may include a position detection unit that detects a height position of the substrate. The control unit may determine that the end effector starts to raise the height position of the substrate when the detection result of the position detecting unit changes while the end effector is raised toward the substrate.

The above-described substrate conveying method may further include performing a1 st teaching process in which the position of the arm when the end effector starts to raise the height position of the substrate is taught as a1 st target position. In the teaching process 1, a position detecting unit that detects a height position of the substrate is used. The teaching of claim 1 may include: teaching a position of the arm when a detection result of the position detecting unit changes while the end effector is raised toward the substrate as the 1 st object position. The step of changing the ascent speed of the arm to the 2 nd speed may include: changing the rising speed of the arm from the 1 st speed to the 2 nd speed when the position of the arm reaches the 1 st object position.

According to each of the above configurations, since the end effector is decelerated based on the detection result of the position detection unit, the effectiveness can be further improved with respect to the improvement of the position accuracy caused by changing the rising speed to the 2 nd speed.

The substrate transport apparatus may include a vibration detection unit that detects vibration of the end effector. The control portion may determine that the vibration at the end effector changes when the detection result of the vibration detecting portion changes after the rising speed is changed to the 2 nd speed.

The substrate conveying method may further include performing a2 nd teaching process of teaching a position of the arm when the raising speed is raised from the 2 nd speed as a2 nd target position. In the teaching of claim 2, a vibration detection unit that detects vibration of the end effector is used. The 2 nd teaching process may include: teaching a position of the arm when a detection result of the vibration detection section changes after the rising speed is changed to the 2 nd speed as the 2 nd object position. Increasing the rising speed from the 2 nd speed may include: when the position of the arm reaches the 2 nd object position, the rising speed is increased from the 2 nd speed.

According to the above-described configurations, since the end effector is accelerated according to the detection result of the vibration detection unit, the effectiveness of the improvement of the transport efficiency caused by changing the rising speed from the 2 nd speed can be further improved.

Drawings

Fig. 1 is a block diagram showing an apparatus configuration of one embodiment of a substrate transport apparatus.

Fig. 2 is a graph showing the rising speed and the transition of the height position.

Fig. 3 is a graph showing a transition of the height position of the arm and the base plate in the teaching process.

Fig. 4 is a detailed graph showing the transition of the height position of the end effector in the teaching process.

Fig. 5 (a) is a graph showing transition of the rising position in the teaching process, fig. 5 (b) is a graph showing transition of the velocity in the teaching process, and fig. 5 (c) is a graph showing transition of the acceleration in the teaching process.

Fig. 6 is a graph showing the results of frequency analysis of the acceleration before and after the handover of the teaching process.

Fig. 7 is a graph showing transition of the average frequency in the teaching process together with the binarization process result.

Detailed Description

Hereinafter, an embodiment of a substrate transfer apparatus and a substrate transfer method will be described with reference to fig. 1 to 7.

As shown in fig. 1, the substrate transport apparatus includes an arm 11, an end effector (end effector)12, a substrate sensor 13S, an effector sensor 13E, an arm sensor 13A, a drive unit 20, and a control device 30.

The arm 11 is supported by a main body on which the arm 11 is mounted so as to be vertically movable, and freely rotatable and extendable and retractable in the horizontal direction. The end effector 12 is configured to be able to mount a substrate S as a conveyance target. The substrate S is placed on a placing portion such as a stage or a ring. The substrate transport apparatus lowers the arm 11 to send out the substrate S from the end effector 12 to the placement portion. In addition, the substrate transport apparatus causes the end effector 12 to receive the substrate S from the placement portion by raising the arm 11.

The substrate sensor 13S optically detects the height position of the substrate S mounted on the end effector 12. The substrate sensor 13S inputs the detected height position of the substrate S to the control device 30. The actuator sensor 13E optically detects the height position of the end effector 12. The actuator sensor 13E inputs the detected height position of the end effector 12 to the control device 30. The arm sensor 13A optically detects the height position of the arm 11. The arm sensor 13A inputs the detected height position of the arm to the control device 30.

The controller 30 controls the raising, lowering, rotation, and extension and contraction of the arm 11 by output control of the driving unit 20. The control device 30 controls the movement of the arm 11 according to teaching data stored in advance. The drive unit 20 moves up and down, rotates, and extends and contracts the arm 11 in accordance with an instruction from the control device 30, and receives the substrate S placed on the placement unit by the end effector 12 or delivers the substrate S placed on the end effector 12 to the placement unit.

The control device 30 includes a control unit 31, a storage unit 32, a conveyance processing unit 33, and a teaching processing unit 34. The control unit 31 is configured by hardware elements and software used in a computer, such as a CPU, a RAM, and a ROM. The control unit 31 is not limited to processing all of the various processes by software. For example, the control unit 31 may include an Application Specific Integrated Circuit (ASIC) as dedicated hardware that executes at least a part of various processes. The control unit 31 may be configured as one or more dedicated hardware circuits such as an ASIC, one or more microcomputers functioning as processors based on software as a computer program, or a circuit including a combination of these circuits.

The storage unit 32 stores a transport program and various data including teaching data. The control unit 31 reads the conveyance program and data stored in the storage unit 32 and executes the conveyance program, thereby causing the conveyance processing unit 33 and the teaching processing unit 34 to execute various processes such as conveyance processing and teaching processing.

The conveyance processing unit 33 generates a drive signal for causing the arm 11 to perform the up-down movement, the rotation, and the expansion and contraction movement based on the teaching data, and outputs the generated drive signal to the driving unit 20. The teaching data used for the raising and lowering operation is obtained by associating the height position of the arm 11 with the raising speed of the arm 11.

As shown in fig. 2, the teaching data includes data for increasing the ascending speed to the 1 st speed VD1 at a predetermined acceleration from the time when the height position of the arm 11 is the reference position before the ascending. In addition, the teaching data includes data for decreasing the ascending speed to the 2 nd speed VD2 when the height position of the arm 11 reaches the 1 st object position H1. In addition, the teaching data includes data for increasing the rising speed from the 2 nd speed VD2 to the 1 st speed VD1 when the height position of the arm 11 reaches the 2 nd object position H2.

The 1 st object position H1 is the height position of the arm 11 when the end effector 12 starts to raise the height position of the substrate S. The 2 nd object position H2 is a position higher than the 1 st object position H1, and is a height position of the arm 11 when the vibration at the end effector 12 changes.

The conveyance processing unit 33 lowers the raising speed of the arm 11 from the 1 st speed VD1 to the 2 nd speed VD2 when the position of the arm 11 reaches the 1 st object position H1 based on the teaching data. That is, the conveyance processing unit 33 raises the end effector 12 toward the substrate S by raising the arm 11 at the 1 st speed VD1, and changes the raising speed to the 2 nd speed VD2 lower than the 1 st speed VD1 when the end effector 12 starts to raise the height position of the substrate S.

The conveyance processing unit 33 increases the ascending speed from the 2 nd speed VD2 to the 1 st speed VD1 when the position of the arm 11 reaches the 2 nd object position H2 based on the teaching data. That is, the conveyance processing section 33 increases the rising speed from the 2 nd speed VD2 to the 1 st speed VD1 when the vibration at the end effector 12 changes after changing the rising speed to the 2 nd speed VD 2.

The teaching processing section 34 performs the 1 st teaching processing and the 2 nd teaching processing. The 1 st teaching process is a process of teaching the position of the arm 11 when the ascent speed of the arm 11 is reduced from the 1 st speed VD1 to the 2 nd speed VD2 as the 1 st object position H1. The 2 nd teaching processing is processing of teaching the position of the arm 11 when the ascending speed of the arm 11 is increased from the 2 nd speed VD2 to the 1 st speed VD1 as the 2 nd object position H2.

The teaching processing unit 34 uses the substrate sensor 13S for detecting the height position of the substrate S and the arm sensor 13A for detecting the height position of the arm 11 in the teaching process 1. In the teaching process of the 1 st teaching, the teaching processing unit 34 teaches the position of the arm 11 as the 1 st object position H1 when the detection result of the substrate sensor 13S changes while the end effector 12 is being raised toward the substrate S (when the substrate changes from the rest state to the raised state). The substrate sensor 13S is an example of a position detection unit.

As shown in fig. 3, in the teaching process of fig. 1, when the teaching process unit 34 raises the arm 11, the arm 11 starts to be raised at a time TA 1. On the other hand, the height position of the substrate S is kept constant until the end effector 12 abuts on the substrate S. When the teaching processing unit 34 continues to raise the arm 11, the detection result of the substrate sensor 13S changes at time TS1, and the substrate S starts to be raised. Then, the arm 11 and the substrate S continue to be raised until a time TA2 at which the teaching processing unit 34 stops the raising of the arm 11.

The teaching processing unit 34 uses the actuator sensor 13E for detecting the height position of the end effector 12 in the teaching processing of the 2 nd stage. In the teaching process of claim 2, the teaching processing unit 34 causes the end effector 12 to receive the substrate S while causing the end effector 12 to ascend toward the substrate S. At this time, the teaching processing unit 34 detects a change in acceleration of the end effector 12 obtained from the detection result of the effector sensor 13E. The teaching processing unit 34 teaches the height position of the arm 11 when the acceleration of the end effector 12 changes to the 2 nd object position H2 of the vibration change at the end effector 12.

As shown in fig. 4, in the teaching process of fig. 2, when the teaching processing unit 34 raises the arm 11 from time TS1 (regardless of the reference numeral in fig. 3), the end effector 12 is slightly vibrated in the vertical direction (the natural vibration of the substrate S is excited at the telescopic position) by the raising of the end effector 12 of the arm 11. Then, when the end effector 12 abuts against the substrate S at time TS2, the weight of the substrate S is applied to the end effector 12, and the end effector 12 warps in accordance with the rigidity of the end effector 12 or the like.

Next, after the end effector 12 starts the warp recovery, at time TS3, the substrate S is stationary with respect to the end effector 12. When the substrate S is stationary with respect to the vibrating end effector 12, the slight vibration of the end effector 12 changes from the vibration that causes only the end effector 12 to be a vibrator until time TS2 to the vibration that causes only the end effector 12 and the substrate S to be a vibrator (the natural vibration of the substrate S changes to the telescopic position). The vibration of the vibrator, which is the end effector 12 and the substrate S, continues until a time TS4 when the arm 11 stops rising.

Fig. 5 (a), (b), and (c) show the transition of the height position of the end effector 12, the transition of the velocity of the end effector 12, and the transition of the acceleration of the end effector 12 in the 2 nd teaching process in this order.

As shown in fig. 5 (b), the speed of the end effector 12 is checked for a change between before and after the time TS1, the time TS2, the time TS3, and the time TS 4. That is, it can be said that the amplitude of the velocity fluctuation of the end effector 12 is greatly influenced by not only the vibration in which only the end effector 12 is used as a vibrator and the vibration in which the end effector 12 and the substrate S are used as vibrators, but also other factors.

As shown in fig. 5 (c), it is difficult to confirm a large change before and after the acceleration of the end effector 12 at each of the time TS1, the time TS2, the time TS3, and the time TS4 (a large change is not confirmed with respect to the amplitude). That is, the acceleration of the end effector 12 is influenced by the vibration of the end effector 12 alone and the vibration of the end effector 12 and the substrate S alone, but it is difficult to determine the acceleration only from the amplitude.

Fig. 6 is an analysis result around time TS3 of the frequency component of the acceleration of the end effector 12. As shown in fig. 6, the acceleration of the end effector 12 has a large difference in frequency components between before the time TS3 and after the time TS 3. That is, it can be said that the frequency component before the end of delivery of the substrate S is greatly different from the frequency component after the end of delivery of the substrate S.

Fig. 7 shows the transition of the average frequency per unit time of the acceleration included in the end effector 12 and the result of the binarization processing of the average frequency. As shown in fig. 7, it can be said that by extracting the frequency components included in the acceleration of the end effector 12, the switching time MD2 (time TS3) before the end of delivery of the substrate S and after the end of delivery of the substrate S can be clearly specified (this can be said to be a method with high time resolution). The teaching processing unit 34 performs binarization processing of the average frequency in the teaching processing of the 2 nd, and teaches the height position of the arm 11 when the average frequency of the acceleration of the end effector 12 changes to the object position H2 of the 2 nd.

[ Effect ]

When the raised end effector 12 abuts on the substrate S, the weight of the substrate S is applied to the end effector 12, and the end effector 12 and the arm 11 are warped due to the rigidity of the end effector 12 and the rigidity of the arm 11. Then, after the warp of the end effector 12 and the arm 11 starts to recover, the height position of the substrate S starts to rise. At this time, the end effector 12 decelerates to the 2 nd speed VD2 lower than the 1 st speed VD 1. That is, when the substrate S starts to be raised in the height position and the transfer of the substrate S starts, the raising speed of the end effector 12 is reduced to the 2 nd speed VD 2.

Next, when the vibration at the end effector 12 changes after the rising speed is changed to the 2 nd speed VD2, the end effector 12 accelerates to the 1 st speed VD1 higher than the 2 nd speed VD 2. The end effector 12 is slightly vibrated in the up-down direction by the raising of the end effector 12 of the arm 11. When the substrate S is stationary with respect to the vibrating end effector 12, the vibration with only the end effector 12 as a vibrator is changed to the vibration with the end effector 12 and the substrate S as vibrators. That is, when the substrate S is stationary with respect to the end effector 12 and the transfer of the substrate S is completed, the raising speed of the end effector 12 is increased to the 1 st speed VD 1.

As described above, according to the above embodiment, the following effects can be obtained.

(1) The raising speed of the end effector 12 can be increased to the 1 st speed VD1 until the transfer of the substrate S is started, so that the time required for conveyance can be shortened. When the transfer of the substrate S is started, the raising speed of the end effector 12 can be reduced to the 2 nd speed VD2, so that the positional accuracy of the substrate S can be improved. As a result, the degree of freedom in design can be expanded to reduce the incompatibility between the reduction in transportation time and the improvement in positional accuracy. Further, since the vibration is suppressed in which the end effector 12 and the substrate S are vibrators, the generation of particles caused by the vibration can be suppressed.

(2) As the vibration of the end effector 12 changes, the end effector 12 accelerates. Therefore, the raising speed of the end effector 12 can be maintained at the 2 nd speed VD2 until the transfer of the substrate S is completed, so that the positional accuracy of the substrate S can be improved. Further, when the delivery of the substrate S is completed, the raising speed of the end effector 12 can be increased to the 1 st speed VD1, so that the time required for conveyance can be shortened. As a result, the degree of freedom in design can be increased to further weaken the incompatible relationship between the reduction in the conveying time and the improvement in the positional accuracy.

(3) Since the 1 st object position H1 is taught based on the detection result of the substrate sensor 13S and the end effector 12 is decelerated based on the teaching data, the effectiveness can be further improved with respect to the improvement of the position accuracy caused by changing the rising speed to the 2 nd speed VD 2.

(4) Since the 2 nd object position H2 is taught based on the detection result of the actuator sensor 13E and the end effector 12 is accelerated based on the teaching data, the effectiveness can be further improved with respect to the improvement of the transport efficiency caused by changing the rising speed from the 2 nd speed VD 2.

The above embodiment can be modified as described below.

One of the substrate sensor 13S and the actuator sensor 13E detects the vicinity of the other. Therefore, the functions of the substrate sensor 13S and the actuator sensor 13E can be switched so that one functions the other. That is, the 1 st teaching process can be performed using the detection result of the actuator sensor 13E, and the 2 nd teaching process can be performed using the detection result of the substrate sensor 13S. Among them, the configuration described in the above embodiment is preferable from the viewpoint of detection accuracy.

That is, before and after the arm 11 reaches the 1 st target position H1, the state of the substrate S changes from the stationary state to the raised state. Therefore, the S/N ratio in the substrate sensor 13S is large. In contrast, before and after the arm 11 reaches the 2 nd target position H2, the state of the substrate S does not change in this manner, and it is difficult to obtain the S/N ratio in the substrate sensor 13S as compared with the actuator sensor 13E. The state change before and after the arm 11 reaches the 2 nd object position H2 is a change in the natural vibration value. It can be said that the value of the natural vibration is changed from the value of the natural vibration having the arm 11 and the end effector 12 as the constituent elements to the value of the natural vibration having the arm 11, the end effector 12, and the substrate S as the constituent elements. Since the substrate S is fixed to the end effector 12, a noise component is mixed in the signal detected by the substrate sensor 13S. On the other hand, since the arm 11 and the end effector 12 are strongly coupled to each other in the signal detected by the effector sensor 13E, the mixing of noise components is small, and the position of the 2 nd object position H2 can be detected more accurately.

It can also be said that, from a microscopic perspective, the time when the end effector 12 starts to raise the height position of the substrate S is the time when the change in the tilt angle from the state where the substrate S is placed is detected. That is, even if the substrate S and the end effector 12 are adjusted to be horizontal, the substrate S and the end effector 12 cannot be kept horizontal from a microscopic viewpoint due to their own weight. It is assumed that, even if the substrate S and the end effector 12 are ideally horizontal, the weight of the substrate S is increased on the side of the end effector 12 when the substrate S comes into contact with the end effector 12. Further, from a microscopic perspective, the substrate S and the end effector 12 cannot maintain the initial posture, and the end effector 12 and the arm 11 are flexed and inclined in one direction due to the mechanical compliance combining the end effector 12 and the arm 11.

That is, it can be said that the time when the elevation position of the substrate S starts to be raised, in other words, the time when the inclination angle of the substrate S starts to change from the initial state of the substrate S. Therefore, instead of performing the teaching process 1 using the detection result of the substrate sensor 13S, the teaching process 1 may be performed using the measurement result of the physical quantity that tracks the tilt of the substrate S. Instead of switching from the 1 st speed VD1 to the 2 nd speed VD2 using the detection result of the substrate sensor 13S, the physical quantity that tracks the tilt of the substrate S may be measured, and the 1 st speed VD1 may be switched to the 2 nd speed VD2 using the measurement result.

Further, it is assumed that the substrate S is not a rigid body but has a state of being deflected by its own weight, that is, a uniform load, under mechanical compliance based on physical properties of the substrate S. Therefore, when the substrate S is brought into contact with the end effector 12, since the fulcrum is increased, it can be said that the inclination angle on the surface of the substrate S varies. Further, since there is a positioning error or the like in the sense that the start of contact between the substrate S and the end effector 12 is detected, it is preferable to use information obtained from the substrate S or a portion near the substrate S, rather than information on the robot side, as in the above-described embodiment.

In addition, it can be said that when the vibration at the end effector 12 changes after the rising speed is changed to the 2 nd speed VD2, the entire weight of the substrate S is applied to the end effector 12. Therefore, instead of performing the teaching process 2 using the detection result of the actuator sensor 13E, the teaching process 2 may be performed using the measurement result of a physical quantity such as a load that tracks the entire weight of the substrate S applied to the end effector 12. Instead of switching from the 2 nd speed VD2 to the 1 st speed VD1 using the detection result of the actuator sensor 13E, the physical quantity such as the load that is applied to the end effector 12 following the entire weight of the substrate S may be measured, and the 2 nd speed VD2 may be switched to the 1 st speed VD1 using the measurement result.

Description of the reference numerals

H1 … 1 st object position, H2 … 2 nd object position, VD1 … 1 st speed, VD2 … nd speed, 11 … arm, 12 … end effector, 13S … substrate sensor, 13E … effector sensor, 13a … arm sensor, 20 … drive section, 30 … control device, 31 … control section, 32 … storage section, 33 … transport processing section, 34 … teaching processing section.

Claims

1. A substrate conveying device is provided with:

an arm;

an end effector coupled to the arm;

a drive unit that raises the arm and causes the end effector to receive a substrate; and

a control unit for controlling the output of the drive unit to change the rising speed of the arm,

the control unit is configured to change the raising speed to a2 nd speed lower than the 1 st speed when the end effector starts raising the height position of the substrate while raising the arm at the 1 st speed to raise the end effector toward the substrate.

2. The substrate transport apparatus according to claim 1,

the control portion increases the rising speed from the 2 nd speed when the vibration at the end effector changes after changing the rising speed to the 2 nd speed.

3. The substrate transport apparatus according to claim 1 or 2,

the substrate conveying device is provided with a position detection part for detecting the height position of the substrate,

the control unit is configured to determine that the end effector starts to raise the height position of the substrate when a detection result of the position detection unit changes while the end effector is raised toward the substrate.

4. The substrate transport apparatus according to claim 2,

the substrate transport apparatus includes a vibration detection unit that detects vibration of the end effector,

the control unit is configured to determine that the vibration at the end effector has changed when the detection result of the vibration detection unit has changed after the rising speed is changed to the 2 nd speed.

5. A method of substrate transfer, comprising:

raising an end effector toward a substrate by raising an arm coupled to the end effector at a1 st speed; and

when the end effector starts to raise the height position of the substrate, the raising speed of the arm is changed to the 2 nd speed lower than the 1 st speed.

6. The substrate conveying method according to claim 5,

increasing the rising speed from the 2 nd speed when the vibration at the end effector changes after changing the rising speed to the 2 nd speed.

7. The substrate conveying method according to claim 5 or 6,

further comprising: performing a1 st teaching process in which the position teaching of the arm when the end effector starts to raise the height position of the substrate is a1 st object position,

in the teaching process of claim 1, a position detecting unit for detecting a height position of the substrate is used,

the 1 st teaching process includes: teaching a position of the arm when a detection result of the position detecting section changes while the end effector is raised toward the substrate as the 1 st object position,

the step of changing the rising speed of the arm to the 2 nd speed includes: changing the rising speed of the arm from the 1 st speed to the 2 nd speed when the position of the arm reaches the 1 st object position.

8. The substrate conveying method according to claim 6,

further comprising: performing 2 nd teaching processing of teaching a position of the arm when the ascent speed is increased from the 2 nd speed as a2 nd object position,

in the teaching processing of claim 2, a vibration detecting section for detecting vibration of the end effector is used,

the 2 nd teaching process includes: teaching a position of the arm when a detection result of the vibration detection section changes after the rising speed is changed to the 2 nd speed as the 2 nd object position,

the step of increasing the rising speed from the 2 nd speed includes: when the position of the arm reaches the 2 nd object position, the rising speed is increased from the 2 nd speed.