TWI791166B - Substrate transport device and substrate transporting method - Google Patents

Abstract

The invention provides a substrate conveying device and a substrate conveying method capable of expanding the design freedom. The substrate transfer device includes: an arm; an end effector connected to the arm; a drive unit that raises the arm to allow the end effector to receive the substrate; and a control unit that controls the output of the drive unit and changes the rising speed of the arm, wherein The control unit raises the end effector toward the substrate by raising the arm at a first speed, and when the end effector starts raising the height position of the substrate, the raising speed is changed to a lower speed than the first speed. second speed.

Description

Substrate transfer device and substrate transfer method

The invention relates to a substrate conveying device and a substrate conveying method.

Equipment for manufacturing various devices such as semiconductor elements and light-emitting elements is equipped with a substrate transfer device that transfers substrates on which elements are formed. The substrate transfer device includes: an end effector supported by an arm. The end effector rises together with the raising of the arm, and receives the substrate placed on the mounting table or the like from the mounting table. The end effector is lowered together with the lowering of the arm, and the substrate placed on the end effector is transferred to the mounting table. The substrate transfer device includes a detection unit that optically detects the mounting state of the substrate. The control unit that controls the drive of the arm executes subsequent processing based on the detection result of the detection unit (for example, refer to Patent Document 1).

[Prior Art Literature]

[Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2015-119070

Increasing the moving speed of the end effector is preferable from the viewpoint of shortening the time required for transfer. Conversely, reducing the moving speed of the end effector is preferable from the viewpoint of improving the positional accuracy of the substrate at the transfer destination and suppressing generation of particles by reducing residual vibration of the substrate. In this way, if one of the substrate transfer efficiency and the substrate position accuracy is increased, the other will be reduced, so it can be said that there is a trade-off relationship. In order to shorten the transfer time and improve the positional accuracy of the substrate transfer device, it is necessary to expand the degree of design freedom to Weaken the incompatible correlations between these.

The object of the present invention is to provide a substrate transfer device and a substrate transfer method that can expand the design freedom.

A substrate transfer device according to one embodiment includes: an arm; an end effector connected to the arm; a driving unit that raises the arm so that the end effector receives the substrate; and a control unit that controls the output of the driving unit to change the The raising speed of the arm, wherein the control unit raises the end effector toward the substrate by raising the arm at a first speed, and when the end effector starts to raise the height position of the substrate, the raising speed is changed to be higher than the A second speed lower than the first speed.

A substrate transfer method according to one embodiment, comprising: raising the end effector toward the substrate by raising an arm connected to the end effector at a first speed; and raising the height position of the substrate when the end effector starts to raise , changing the raising speed of the aforementioned arm to a second speed lower than the aforementioned first speed.

When the rising end effector touches the substrate, the weight of the substrate acts on the end effector, corresponding to the rigidity of the end effector and the rigidity of the arm, the end effector and the arm bend. Then, after the bending of the end effector and the arm starts to end, the height position of the substrate starts to rise. That is, substrate transfer starts. In this regard, according to each of the structures described above, when the end effector starts to raise the height position of the substrate, the end effector decelerates. Therefore, the lifting speed of the end effector can be increased until the start of substrate transfer to shorten the time required for transfer. Then, when substrate transfer begins, the ascent speed of the end effectors can be reduced to increase the positional accuracy of the substrate. As a result, the degrees of freedom in design can be expanded to lessen the incompatible relationship between shortening of transfer time and improvement of positional accuracy.

In the substrate transfer apparatus described above, the control unit changes the lifting speed to the previous After the above-mentioned second speed, when the vibration of the above-mentioned end effector changes, the above-mentioned rising speed can also be increased from the above-mentioned second speed.

In the substrate transfer method described above, it may further include: after changing the raising speed to the second speed, increasing the raising speed from the second speed when the vibration of the end effector changes.

Lifting the end effector with the arm makes the end effector vibrate slightly in the up and down direction. Then, when the vibrating end effector is stationary relative to the substrate, the vibration changes from using only the end effector as a vibrator to vibrating using the end effector and the substrate as a vibrator. In this regard, according to each of the structures described above, when the vibration of the end effector changes, the end effector accelerates. Therefore, until the transfer of the substrate is completed, the rising speed of the end effector can be reduced to improve the positional accuracy of the substrate. Then, when the transfer of the substrate is completed, the lifting speed of the end effector can be increased so that the time required for transfer can be shortened. As a result, the degree of freedom in design can be expanded to further weaken the incompatible relationship between the shortening of the transfer time and the improvement of positional accuracy. Furthermore, as a side effect, vibration using the end effector and the substrate as a vibrator is also suppressed by using this transfer method. Thereby, generation of particles due to residual vibration is also suppressed.

The above substrate transfer device may include a position detection unit configured to detect a height position of the substrate. When the control unit raises the end effector toward the substrate and the detection result of the position detection unit changes, it can be determined that the end effector starts raising the height position of the substrate.

The above substrate transfer method may further include: performing a first teaching process of teaching the position of the arm when the end effector starts raising the height position of the substrate as a first target position. In the first teaching process, the height position of the substrate may be detected using a position detection unit. The first teaching process may include teaching, as the first target position, the position of the arm when the end effector is raised toward the substrate and the detection result of the position detector changes. Will Changing the raising speed of the arm to the second speed may include changing the raising speed of the arm from the first speed to the second speed when the position of the arm reaches the first target position.

According to each of the above configurations, since the end effector is decelerated based on the detection result of the position detection unit, the effectiveness of improving the position accuracy by changing the ascent speed to the second speed can be further improved.

The substrate transfer device may include a vibration detection unit configured to detect vibration of the end effector. After the control unit changes the rising speed to the second speed, when the detection result of the vibration detection unit changes, it can be determined that the vibration of the end effector has changed.

The substrate transfer method described above may further include: a second teaching process of teaching the position of the arm when the raising speed is increased from the second speed as a second target position. In the aforementioned second teaching process, the vibration of the aforementioned end effector may be detected using a vibration detection unit. The second teaching process may include teaching, as the second object position, a position of the arm when the detection result of the vibration detection unit changes after the ascent speed is changed to the second speed. Changing the raising speed of the arm to the second speed may include increasing the raising speed from the second speed when the position of the arm reaches the second target position.

According to each of the above configurations, since the end effector is accelerated based on the detection result of the vibration detection unit, it is possible to further improve the effectiveness of changing the lifting speed to the second speed to improve the transfer efficiency.

11: arm

12: End effector

13A: Arm sensor

13E: Effector sensor

13S: Substrate sensor

20: Drive Department

30: Control device

31: Control Department

32: memory department

33: Transport processing department

34: Teaching and processing department

H1: first object position

H2: second object position

VD1: first speed

VD2: second speed

S: Substrate

TA1, TA2, TS1, TS2, TS3, TS4: timing

Fig. 1: A configuration diagram showing an apparatus configuration of an embodiment of a substrate transfer apparatus.

The second picture: the change chart showing the ascent speed and height position.

Figure 3: Transition diagram showing the height position of the arm and the substrate in the teaching process

Figure 4: A detailed view showing the transition of the height position of the end effector in the teaching process.

The fifth figure: (a) shows the transition diagram of the rising position in the teaching process; (b) shows the transition diagram of the speed in the teaching process; (c) shows the transition diagram of the acceleration in the teaching process.

Sixth figure: A frequency analysis result figure showing the acceleration before and after the transmission of the teaching process.

Fig.7: A diagram showing the transition of the average frequency in the teaching process together with the result of the binarization process.

Hereinafter, an embodiment of a substrate transfer device and a substrate transfer method will be described with reference to FIGS. 1 to 7 .

As shown in FIG. 1 , the substrate transfer device includes an arm 11 , an end effector 12 , a substrate sensor 13S, an effector sensor 13E, an arm sensor 13A, a drive unit 20 , and a control device 30 .

The arm 11 is supported so as to be able to move up and down freely with respect to the main body of the carrying arm 11 , and to be able to freely rotate and expand and contract in the horizontal direction. The end effector 12 is configured as a substrate S on which an object to be conveyed can be placed. The board|substrate S is mounted on the mounting part, such as a stage or a hoop, for example. The substrate transfer device transfers the substrate S from the end effector 12 to the mounting section by lowering the arm 11 . In addition, the substrate transfer device receives the substrate S from the mounting section to the end effector 12 by raising the arm 11 .

The substrate sensor 13S optically detects the height position of the substrate S placed on the end effector 12 . The substrate sensor 13S inputs the detected height position of the substrate S to the control device 30 . The effector sensor 13E optically detects the height position of the end effector 12 . The effector sensor 13E inputs the detected height position of the end effector 12 into the control device 30 . The arm sensor 13A optically detects the height position of the arm 11 . The arm sensor 13A inputs the detected height position of the arm to the control device 30 .

The control device 30 controls the raising/lowering, rotating, or expanding and contracting of the arm 11 by controlling the output of the driving unit 20 . The control device 30 controls the movement of the arm 11 based on pre-stored teaching data. The driving part 20 makes the arm 11 lift, rotate or stretch according to the instructions of the control device 30, and receives the substrate S placed on the mounting part at the end effector 12, and transfers the substrate S placed on the end effector 12 to the carrier. home department.

The control device 30 includes a control unit 31 , a memory unit 32 , a transport processing unit 33 , and a teaching processing unit 34 . The control unit 31 is constituted by, for example, hardware elements and software used in a computer such as CPU, RAM, and ROM. The control unit 31 is not limited to all processing by software. For example, the control unit 31 may include an application-specific integrated circuit (ASIC) or dedicated hardware that executes at least a part of various processes. The control unit 31 may also be configured as a microcomputer including one or more dedicated hardware circuits such as an ASIC, one or more processors operating according to software of a computer program, or a circuit combining these.

The storage unit 32 stores transfer programs and various data including teaching data. The control unit 31 executes the transfer program by reading the transfer program and data stored in the storage unit 32 , and causes the transfer processing unit 33 or the teaching processing unit 34 to execute various processes such as transfer processing and teaching processing.

The conveyance processing unit 33 generates a drive signal for making the arm 11 perform lifting, rotating, and telescopic actions based on the teaching data, and outputs the generated driving signal to the driving unit 20 . In the teaching material for the lifting operation, the height position of the arm 11 is associated with the raising speed of the arm 11 .

As shown in FIG. 2 , the teaching data includes data for increasing the ascending speed to the first speed VD1 with a specific acceleration from the reference position of the height position of the arm 11 before ascending. In addition, the teaching data includes data for reducing the ascending speed to the second speed VD2 when the height position of the arm 11 reaches the first target position H1. Also, the teaching materials include the method for reaching the second arm at the height position of the arm 11. At the object position H2, the ascending speed is increased from the second speed VD2 to the first speed VD1.

The first target position H1 is the height position of the arm 11 when the end effector 12 starts raising the height position of the substrate S. FIG. The second object position H2 is a position higher than the first object position H1, the height position of the arm 11 when the vibration of the end effector 12 changes.

The transport processing unit 33 lowers the raising speed of the arm 11 from the first speed VD1 to the second speed VD2 when the position of the arm 11 reaches the first target position H1 based on the teaching data. That is, the transfer processing unit 33 raises the end effector 12 toward the substrate S by raising the arm 11 at the first speed VD1, and when the end effector 12 starts raising the height position of the substrate S, the raising speed changes. It is the second speed VD2 lower than the first speed VD1.

The transport processing unit 33 increases the rising speed from the second speed VD2 to the first speed VD1 when the position of the arm 11 reaches the second target position H2 based on the teaching data. That is, after the transfer processing unit 33 changes the lifting speed to the second speed VD2, when the vibration of the end effector 12 changes, the rising speed increases from the second speed VD2 to the first speed VD1.

The teaching processing unit 34 executes the first teaching process and the second teaching process. The first teaching process is a process of teaching the position of the arm 11 when the raising speed of the arm 11 is decreased from the first speed VD1 to the second speed VD2 as the first target position H1 . The second teaching process is a process of teaching the position of the arm 11 when the raising speed of the arm 11 is increased from the second speed VD2 to the first speed VD1 as the second target position H2 .

The teaching processing unit 34 uses the substrate sensor 13S for detecting the height position of the substrate S and the arm sensor 13A for detecting the height position of the arm 11 in the first teaching process. The teaching processing unit 34 takes the position of the arm 11 when the end effector 12 is raised toward the substrate S and the detection result of the substrate sensor 13S changes (when the substrate changes from the stationary state to the raised state) in the first teaching processing as first object bit Set H1 to teach. The substrate sensor 13S is an example of a position detection unit.

As shown in FIG. 3 , in the first teaching process, when the teaching processing unit 34 raises the arm 11 , the arm 11 starts raising at timing TA1 . On the other hand, until the end effector 12 abuts on the substrate S, the height position of the substrate S is maintained. When the teaching processing unit 34 continues to raise the arm 11 , the detection result of the substrate sensor 13S changes at timing TS1 , and the substrate S starts to rise. Then, the arm 11 and the substrate S continue to rise until the timing TA2 when the teaching processing unit 34 stops the raising of the arm 11 .

The teaching processing unit 34 uses the effector sensor 13E that detects the height position of the end effector 12 in the second teaching processing. The teaching processing part 34 raises the end effector 12 toward the board|substrate S, and makes the end effector 12 receive the board|substrate S in the 2nd teaching process. At this time, the teaching processing section 34 detects the acceleration change of the end effector 12 obtained from the detection result of the effector sensor 13E. The teaching processing unit 34 teaches the height position of the arm 11 when the acceleration of the end effector 12 changes as the second target position H2 where the vibration of the end effector 12 changes.

As shown in the fourth figure, in the second teaching process, when the teaching processing unit 34 raises the arm 11 from the timing TS1 (regardless of the symbol in the third figure), the end effector 12 is lifted by the arm 11, and the end effector 12 is raised. The effector 12 vibrates slightly in the up-and-down direction (the natural vibration of the non-substrate S in the telescopic position is excited). Then, when the end effector 12 abuts against the substrate S at timing TS2 , the weight of the substrate S acts on the end effector 12 , and the end effector 12 is bent according to the rigidity of the end effector 12 .

Next, after the bending of the end effector 12 starts and ends, the substrate S is stationary with respect to the end effector 12 at timing TS3 . Then, when the substrate S is stationary with respect to the vibrating end effector 12, the microvibration of the end effector 12 is from the vibration using only the end effector 12 as a vibrator until the timing TS2, to the vibration of the end effector 12. 12 and the substrate S as the vibration of the vibrator (changed into the natural vibration of the substrate S in the telescopic position). The end effector 12 and the substrate S are used as the vibrator of the vibrator The movement continues until timing TS4 when the raising of the arm 11 stops.

The fifth (a), (b) and (c) diagrams sequentially show the change of the height position of the end effector 12 , the speed change of the end effector 12 and the acceleration change of the end effector 12 in the second teaching process.

As shown in the fifth (b) figure, the speed of the end effector 12 is recognized at each timing TS1, timing TS2, timing TS3, and timing TS4. In other words, the amplitude of the speed change of the end effector 12 is not only the vibration of the end effector 12 alone as a vibrator and the vibration of the end effector 12 and the substrate S as a vibrator, but can be said to be caused by factors other than these Impact makes bigger impact.

As shown in FIG. 5 (c), the acceleration of the end effector 12 is recognized at each timing TS1, timing TS2, timing TS3, and timing TS4 (large changes in amplitude are not recognized). That is, the acceleration of the end effector 12 is affected by the vibration of the end effector 12 alone as a vibrator and the vibration of the end effector 12 and the substrate S as a vibrator, but it can be said that only from these amplitudes It is difficult to judge.

The sixth figure shows the analysis results before and after the timing TS3 of the frequency component of the acceleration of the end effector 12 . As shown in FIG. 6 , in the acceleration of the end effector 12 , there is a large difference in frequency components between before timing TS3 and after timing TS3 . That is, it can be said that the frequency components before the completion of the transfer of the substrate S are greatly different from the frequency components after the completion of the transfer of the substrate S.

The seventh diagram shows the average frequency change per unit time included in the acceleration of the end effector 12 and the result of binarization processing of the average frequency. As shown in the seventh figure, it can be said that by extracting the frequency component contained in the acceleration of the end effector 12, the switching time MD2 (timing TS3) that can distinguish between before the end of the transfer of the substrate S and after the end of the transfer of the substrate S can be clearly determined (can be It is said that the time resolution is high method). Then, in the second teaching process, the teaching processing unit 34 performs average frequency binarization processing to teach the height position of the arm 11 when the average frequency of the acceleration of the end effector 12 changes as the second target position H2.

〔effect〕

When the rising end effector 12 abuts against the substrate S, the weight of the substrate S acts on the end effector 12, and the end effector 12 or the arm 11 bends corresponding to the rigidity of the end effector 12 or the rigidity of the arm 11. Next, after the bending of the end effector 12 or the arm 11 starts and ends, the height position of the substrate S starts to rise. At this time, the end effector 12 is decelerated to a second speed VD2 lower than the first speed VD1. That is, when the height position of the substrate S starts to rise and the transfer of the substrate S starts, the rising speed of the end effector 12 decreases to the second speed VD2.

Next, after the rising speed is changed to the second speed VD2, when the vibration of the end effector 12 changes, the end effector 12 accelerates to the first speed VD1 higher than the second speed VD2. The end effector 12 is raised by the arm 11, and the end effector 12 is slightly vibrated in the up and down direction. Then, when the substrate S is stationary relative to the vibrating end effector 12, the vibration using only the end effector 12 as a vibrator is changed to the vibration using the end effector 12 and the substrate S as a vibrator. That is to say, the substrate S is stationary relative to the end effector 12, and when the transfer of the substrate S ends, the rising speed of the end effector 12 increases toward the first speed VD1.

As mentioned above, according to the said embodiment, the following effects can be acquired.

(1) In order to shorten the time required for conveyance until the transfer of the substrate S starts, the rising speed of the end effector 12 may be increased to the first speed VD1. Then, when the transfer of the substrate S starts, in order to improve the position accuracy of the substrate S, the rising speed of the end effector 12 may be reduced to the second speed VD2. As a result, the degree of freedom in design can be expanded to reduce the trade-off between the reduction of transfer time and the improvement of positional accuracy. incompatible relationship. Furthermore, since the vibration using the end effector 12 and the substrate S as a vibrator is suppressed, generation of particles caused by this is also suppressed.

(2) When the vibration of the end effector 12 changes, the end effector 12 accelerates. Therefore, until the transfer of the substrate S is completed, the rising speed of the end effector 12 can be maintained at the second speed VD2, so as to improve the position accuracy of the substrate S. Then, when the transfer of the substrate S is completed, the rising speed of the end effector 12 can be increased to the first speed VD1, and the time required for the transfer can be shortened. As a result, the degree of freedom in design can be expanded to further weaken the incompatible relationship between shortening of transfer time and positional accuracy.

(3) Since the first object position H1 is taught based on the detection result of the substrate sensor 13S, and the end effector 12 is decelerated according to the teaching material, it is possible to improve the position accuracy by changing the rising speed to the second speed VD2. Improve effectiveness.

(4) Because the second object position H2 is taught according to the detection result of the effector sensor 13E, and the end effector 12 is accelerated according to the teaching material, so the transfer efficiency can be improved by changing the rising speed to the second speed VD2. effectiveness.

In addition, the above-mentioned embodiment can also be implemented with the following modifications.

• Substrate sensor 13S and effector sensor 13E, one of which detects the proximity of the other. Therefore, the functions of the substrate sensor 13S and the effector sensor 13E can be replaced, and one can realize the function of the other. That is, the first teaching process may be performed using the detection result of the effector sensor 13E, and the second teaching process may be performed using the detection result of the substrate sensor 13S. However, from the viewpoint of detection accuracy, the configuration described in the above-mentioned embodiments is preferable.

That is, before and after the arm 11 reaches the first target position H1, the state of the substrate S changes from the stationary state to the rising state. Therefore, the S/N ratio of the substrate sensor 13S is large. In this regard, before and after the arm 11 reaches the second object position H2, the state of the substrate S does not change in this way, and the substrate sensor 13S The S/N ratio is difficult to compare with the effector sensor 13E. The state change before and after the arm 11 reaches the second target position H2 is a change in the natural vibration value. It can be said that the natural vibration value is changed from the natural vibration value having the arm 11 and the end effector 12 as constituent elements to the natural vibration value having the arm 11 , the end effector 12 and the substrate S as constituent elements. Then, since the substrate S is not fixed on the end effector 12, the signal detected by the substrate sensor 13S will be mixed with noise components. On the other hand, since the arm 11 and the end effector 12 are rigidly combined in the signal detected by the effector sensor 13E, less noise components are mixed in, and the position of the second object H2 can be detected more accurately.

‧When the end effector 12 starts to raise the height position of the substrate S, it can also be said that the change of the inclination angle is detected from the seating state of the substrate S from a microscopic point of view. That is to say, even if the substrate S or the end effector 12 is adjusted to be horizontal, the substrate S or the end effector 12 cannot remain horizontal due to its own weight. Even if the substrate S and the end effector 12 are ideally horizontal, when the substrate S and the end effector 12 are in contact, the weight of the substrate S is added to the end effector 12 side. Then, microscopically, the substrate S and the end-effector 12 do not maintain the original posture, and the end-effector 12 and the arm 11 bend and tilt in any direction due to the mechanical compliance combining the end-effector 12 and the arm 11 .

That is, when the height position of the substrate S starts to rise, in other words, the inclination angle of the substrate S starts to change from the initial state of the substrate S. Therefore, instead of performing the first teaching process using the detection result of the substrate sensor 13S, a physical quantity measurement following the inclination of the substrate S may be performed and the measurement result may be used to perform the first teaching process. In addition, instead of switching from the first speed VD1 to the second speed VD2 using the detection result of the substrate sensor 13S, it is also possible to perform physical quantity measurement following the inclination of the substrate S, and use the measurement result to switch from the first speed VD1 to the second speed VD2. Speed VD2.

In addition, the substrate S is not a rigid body, and the mechanical sequence according to the physical properties of the substrate S From the properties, it is estimated that the substrate S has a bent state by its own weight, that is, a uniformly distributed load. Therefore, when the substrate S is in contact with the end effector 12, the inclination angle of the surface of the substrate S changes because of the addition of a fulcrum. In addition, the significance of detecting the start of contact between the substrate S and the end effector 12 is not information on the motor side because of positioning errors, etc.

‧Also, when the vibration of the end effector 12 changes after the lifting speed is changed to the second speed VD2, it can be said that the entire body weight of the substrate S is applied to the end effector 12. Therefore, it is also possible to measure a physical quantity such as a load applied to the end effector 12 following the entire body weight of the substrate S, and use the measurement result to switch from the second speed VD2 to the first speed VD1 instead of using the effector to sense The detection result of the device 13E switches from the second speed VD2 to the first speed VD1.

11: arm

12: End effector

13A: Arm sensor

13E: Effector sensor

13S: Substrate sensor

20: Drive Department

30: Control device

31: Control Department

32: memory department

33: Transport processing department

34: Teaching and processing department

S: Substrate

Claims (6)

A substrate transfer device, comprising: an arm; an end effector connected to the arm; a drive unit that raises the arm to allow the end effector to receive a substrate; and a control unit that controls the output of the drive unit and changes the rising speed of the arm wherein the control unit raises the end effector toward the substrate by raising the arm at a first speed, and when the end effector starts to raise the height position of the substrate, the rising speed is changed to be faster than the first speed. Low second speed, after the aforementioned control unit changes the aforementioned rising speed to the aforementioned second speed, the vibration of the aforementioned end-effector that generates micro-vibrations by rising is changed from the vibration of only the aforementioned end-effector as a vibrator to the vibration of the aforementioned end-effector. When the end effector and the substrate vibrate as a vibrator, the rising speed is increased from the second speed. The substrate conveying device according to claim 1, comprising: a position detection unit that detects the height position of the substrate; and when the control unit raises the end effector toward the substrate and the detection result of the position detection unit changes, judges that the end effector is The effector starts to raise the height position of the aforementioned substrate. The substrate transfer device according to claim 1 or 2, comprising: a vibration detection unit that detects the vibration of the end effector; after the control unit changes the lifting speed to the second speed, the detection result of the vibration detection unit changes , it is judged that the vibration of the aforementioned end effector changes. A substrate transfer method, comprising: The end-effector is raised toward the substrate by raising an arm connected to the end-effector at a first speed; when the end-effector begins to raise the height position of the substrate, the speed of raising the arm is changed to a speed higher than that of the The second speed lower than the first speed; and after changing the aforementioned rising speed to the aforementioned second speed, the vibration of the aforementioned end-effector that generates micro-vibrations by rising is changed from the vibration that only uses the aforementioned end-effector as a vibrator In order to vibrate the end effector and the substrate as a vibrator, the raising speed is increased from the second speed. The substrate transfer method according to claim 4, further comprising: performing a first teaching process, which is to teach the position of the arm when the end effector starts to raise the height position of the substrate as the first target position; The first teaching process is to use the position detector to detect the height position of the substrate; the first teaching process includes: changing the position of the arm when the end effector is raised toward the substrate and the detection result of the position detector is changed. Teaching as the aforementioned first object position; changing the raising speed of the aforementioned arm to the aforementioned second speed includes: changing the raising speed of the aforementioned arm from the aforementioned first speed to the aforementioned first object position when the position of the aforementioned arm reaches the aforementioned first object position The aforementioned second speed. The substrate transfer method according to claim 4, further comprising: a second teaching process, which is to teach the position of the arm when the lifting speed is increased from the second speed as the second object position; in the second teaching The processing is to use the vibration detection part to detect the vibration of the aforementioned end effector; the aforementioned second teaching process includes: after the aforementioned rising speed is changed to the aforementioned second speed, the position of the aforementioned arm when the detection result of the aforementioned vibration detecting part changes is used as The aforementioned second object position is taught; changing the raising speed of the aforementioned arm to the aforementioned second speed includes: when the position of the aforementioned arm reaches the aforementioned second target position, increasing the aforementioned raising speed from the aforementioned second speed.

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