CN112556892A - High-precision resonant ball type pressure sensor - Google Patents
High-precision resonant ball type pressure sensor Download PDFInfo
- Publication number
- CN112556892A CN112556892A CN202011272096.9A CN202011272096A CN112556892A CN 112556892 A CN112556892 A CN 112556892A CN 202011272096 A CN202011272096 A CN 202011272096A CN 112556892 A CN112556892 A CN 112556892A
- Authority
- CN
- China
- Prior art keywords
- ball
- resonant
- resonance
- pressure sensor
- resonance ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/10—Measuring force or stress, in general by measuring variations of frequency of stressed vibrating elements, e.g. of stressed strings
- G01L1/106—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/005—Measuring force or stress, in general by electrical means and not provided for in G01L1/06 - G01L1/22
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention provides a high-precision resonant ball type pressure sensor which comprises a resonant ball (1) and a back cavity structure (2), wherein the resonant ball (1) is arranged on the upper surface of the back cavity structure (2), a functional area of the resonant ball (1) is embedded into a cavity of the back cavity structure (2), the resonant ball (1) and the back cavity structure (2) are provided with a cavity at the position of the back cavity structure (2), and corresponding surfaces of the resonant ball (1) and the back cavity structure (2) in the cavity are respectively provided with an electrode. The resonant sphere surface electrodes are arranged on the structure surface in pairs with the back cavity structure surface electrodes, forming the drive electrodes and the detection electrodes of the resonant sphere. The driving electrode is used for driving the resonant ball to a corresponding vibration mode (frequency), and the detection electrode is used for detecting the change of the frequency of the resonant ball under the action of different pressures so as to further realize the measurement of the pressure.
Description
Technical Field
The invention relates to the field of pressure sensors, in particular to a high-precision resonant ball type pressure sensor.
Background
With the technical development in the fields of aviation, aerospace, oceans, meteorology and the like, higher requirements are placed on the measurement accuracy and long-term stability of the pressure sensor. In order to further improve the performance of the pressure sensor, such as measurement accuracy and long-term stability, the pressure sensor adopting the resonant ball type principle is required to meet the technical requirements of various fields.
At present, the high-precision resonant pressure sensor mainly includes a vibrating cylinder type pressure sensor, a quartz resonant pressure sensor, and a silicon resonant pressure sensor. The core vibration cylinder of the vibration cylinder type pressure sensor is made of metal materials through machining, and works in a piezoelectric driving mode or an electromagnetic driving mode. The metal vibrating cylinder has large processing error and high residual stress, so that the Q value of the vibrating cylinder type pressure sensor is low and the long-term stability is poor. The core resonators of the quartz resonance type pressure sensor and the silicon resonance type pressure sensor are made of quartz materials or silicon materials, the Q value of the core resonators is generally between thousands and tens of thousands, but the pressure needs to be converted into stress acting on the resonators by utilizing a mechanical transmission structure, and the pressure is measured by detecting the frequency change of the resonators. Due to the adoption of an additional mechanical transmission structure, the resonant pressure sensor has a complex structure, poor hysteresis and repeatability, and influences the measurement precision and long-term stability.
Disclosure of Invention
The invention aims to solve the problems that in the prior art, a vibrating cylinder type pressure sensor has low Q value and poor long-term stability due to large processing error and high residual stress of a metal vibrating cylinder; the quartz resonant pressure sensor and the silicon resonant pressure sensor adopt extra mechanical transmission structures, so that the resonant pressure sensors have the problems of complex structure, poor hysteresis and repeatability and influence on the measurement precision and long-term stability.
The invention provides a high-precision resonant ball type pressure sensor which comprises a resonant ball and a back cavity structure, wherein the resonant ball is arranged on the upper surface of the back cavity structure, a functional area of the resonant ball is embedded into a cavity of the back cavity structure, a cavity is formed in the back cavity structure by the resonant ball and the back cavity structure, and electrodes are respectively arranged on the corresponding surfaces of the resonant ball and the back cavity structure in the cavity.
The resonance ball body and the resonance ball fixing and supporting part are integrally processed from the same material, so that the resonance ball body is fixed and supported, a sealing connection structure is formed, and a pressure sensing structure is realized. The resonant ball fixing part and the back cavity structure are sealed in vacuum in modes of filler bonding and the like to form an absolute pressure measurement vacuum cavity, and the resonant ball surface electrode and the back cavity structure surface electrode are communicated to the outside of the vacuum cavity and used for packaging an electrical lead.
The invention relates to a high-precision resonant ball type pressure sensor, which is characterized in that as a preferred mode, a resonant ball comprises a resonant ball body, a resonant ball fixed support part and a resonant ball surface electrode, wherein the resonant ball body is a hollow hemisphere, the resonant ball fixed support part is a cuboid, the shortest side length of the resonant ball fixed support part is larger than the diameter of the resonant ball body, the resonant ball body is arranged on one side of the resonant ball fixed support part, a through hole communicated with the resonant ball body in a hollow mode is formed in the resonant ball fixed support part, and the resonant ball surface electrode is arranged on the convex outer surface of the resonant ball body.
According to the high-precision resonant ball type pressure sensor, as a preferred mode, the back cavity mechanism comprises a back cavity structure body, a back cavity and a back cavity surface electrode, the back cavity structure body is a cuboid, the back cavity is a hemispherical cavity, the back cavity is arranged on the upper surface of the back cavity structure body, and the back cavity surface electrode is arranged inside the back cavity.
According to the high-precision resonant ball type pressure sensor, as a preferable mode, the diameter of the back cavity is larger than that of the resonant ball body.
According to the high-precision resonant ball type pressure sensor, as an optimal mode, the resonant ball surface electrode and the back cavity surface electrode are arranged correspondingly.
According to the high-precision resonant ball type pressure sensor, as a preferred mode, the number of the resonant ball surface electrodes and the number of the back cavity surface electrodes are even.
According to the high-precision resonant ball type pressure sensor, as a preferred mode, the resonant ball body and the resonant ball fixing and supporting part are of an integrally machined structure.
According to the high-precision resonant ball type pressure sensor, as a preferable mode, the resonant ball fixing and supporting part is an oblate cuboid with a square side face of a resonant ball body.
The resonant sphere surface electrode adopts an even number electrode distribution form of 4 electrodes, 6 electrodes, 8 electrodes and the like which are uniformly distributed. The back cavity structure surface electrode adopts an even number electrode distribution form of 4 electrodes, 6 electrodes or 8 electrodes which are uniformly distributed. The resonant sphere surface electrodes are arranged on the structure surface in pairs with the back cavity structure surface electrodes, forming the drive electrodes and the detection electrodes of the resonant sphere. The driving electrode is used for driving the resonant ball to a corresponding vibration mode (frequency), and the detection electrode is used for detecting the change of the frequency of the resonant ball under the action of different pressures so as to further realize the measurement of the pressure.
The invention has the following beneficial effects:
(1) the measurement precision and the resolution are high. The resonant ball is made of materials such as low-expansion-coefficient glass or fused quartz, and the like, has the advantages of simple structure, good consistency and the like, and the Q value of the resonant ball can reach hundreds of thousands to millions of orders of magnitude and is higher than that of the conventional resonant pressure sensor by more than one order of magnitude. And because the pressure medium directly acts on the surface of the resonant ball, an additional mechanical transmission structure is not needed, and the hysteresis and the repeatability error of the sensor can be greatly reduced. The advantages of the two aspects effectively ensure that the pressure sensor has extremely high measurement precision and resolution.
(2) Has good long-term stability. The resonant ball and the fixed supporting edge thereof are made of the same material such as low-expansion-coefficient glass or fused quartz, so that the residual stress and the thermal stress of the structure can be eliminated, and the long-term stability of the resonant ball type pressure sensor is effectively ensured.
Drawings
FIG. 1 is a schematic diagram of a high precision resonant ball pressure sensor;
FIG. 2 is a schematic diagram of a resonant ball of a high-precision resonant ball type pressure sensor;
fig. 3 is a schematic structural diagram of a back cavity of a high-precision resonant ball type pressure sensor.
Reference numerals:
1. a resonant ball; 11. a resonant ball body; 12. a resonant ball mount; 13. a resonant sphere surface electrode; 2. a back cavity structure; 21 a back cavity structure body; 22. a back cavity; 23. a back cavity surface electrode.
Detailed Description
The technical solutions in the embodiments of the present invention will be made clear below with reference to the accompanying drawings in the embodiments of the present invention.
Example 1
As shown in fig. 1, a high-precision resonant ball pressure sensor, 1. a high-precision resonant ball pressure sensor, characterized in that: including resonant ball 1 and back of the body cavity structure 2, resonant ball 1 sets up in back of the body cavity structure 2 upper surface, and in resonant ball 1 functional area embedding back of the body cavity structure 2 cavity, resonant ball 1 and back of the body cavity structure 2 position were provided with the cavity, are provided with the electrode on resonant ball 1 in the cavity and the corresponding face of back of the body cavity structure 2 respectively.
As shown in fig. 2, the resonance ball 1 includes a resonance ball body 11, a resonance ball fixed support part 12 and a resonance ball surface electrode 13, the resonance ball body 11 is a hollow hemisphere, the resonance ball fixed support part 12 is a cuboid, the shortest side length of the resonance ball fixed support part 12 is greater than the diameter of the resonance ball body 11, the resonance ball body 11 is arranged on one side of the resonance ball fixed support part 12, a through hole communicated with the resonance ball body 11 in a hollow mode is arranged on the resonance ball fixed support part 12, and the resonance ball surface electrode 13 is arranged on the convex outer surface of the resonance ball body 11.
As shown in fig. 3, the back cavity structure 2 includes a back cavity structure body 21, a back cavity 22 and a back cavity surface electrode 23, the back cavity structure body 21 is a cuboid, the back cavity 22 is a hemispherical cavity, the back cavity 22 is disposed on the upper surface of the back cavity structure body 21, and the back cavity surface electrode 23 is disposed inside the back cavity 22.
The back cavity 22 has a diameter larger than the diameter of the resonant sphere body 11. The resonant sphere surface electrode 13 and the back cavity surface electrode 23 are arranged correspondingly. The number of resonant sphere surface electrodes 13 and the number of back cavity surface electrodes 23 are both an even number. The resonant ball body 11 and the resonant ball fixing and supporting part 12 are integrally processed. The resonant sphere fixed support part 12 is an oblong body with a square side surface of the resonant sphere body 11.
The resonant ball body 11 and the resonant ball fixing part 12 are integrally processed by glass or fused quartz material, wherein the resonant ball body 11 is processed by adopting a blow molding process. The material adopted by the back cavity structure 2 is the same as that adopted by the resonance ball 1, wherein the spherical groove is processed by a wet etching process or a spherical grinding and polishing process. And a vacuum filler bonding process is adopted to bond the resonant ball fixing and supporting part 12 and the back cavity structure body 21 to form a structure rigid connection and a vacuum absolute pressure reference cavity, and an internal electrode is led to the outside, so that the packaging is facilitated. One side of the resonant ball body 11 senses zero standard pressure, and the other side senses the measured environmental pressure, so that absolute pressure measurement is realized.
According to the requirements of different pressure ranges, the resonance ball body 11 is blown on the glass or quartz resonance ball fixed branch part 12 by adopting a blow molding process. And obtaining the resonant sphere surface electrode 13 by combining a hard mask and a side electrode deposition process technology.
The back cavity structure 2 is prepared into a spherical groove structure by adopting a wet etching process or a spherical grinding and polishing process. And obtaining the back cavity surface electrode 23 by combining a hard mask and a side electrode deposition process technology.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. A high accuracy resonance ball formula pressure sensor which characterized in that: including resonance ball (1) and back of the body cavity structure (2), resonance ball (1) set up in back of the body cavity structure (2) upper surface, embedding of resonance ball (1) functional area in back of the body cavity structure (2) cavity, resonance ball (1) with back of the body cavity structure (2) are in back of the body cavity structure (2) position is provided with the cavity, in the cavity resonance ball (1) with be provided with the electrode on the corresponding face of back of the body cavity structure (2) respectively.
2. A high precision resonant ball pressure sensor as claimed in claim 1, wherein: resonance ball (1) is including resonance ball body (11), resonance ball solid branch portion (12) and resonance ball surface electrode (13), resonance ball body (11) are the hollow hemisphere, resonance ball solid branch portion (12) are the cuboid, resonance ball solid branch portion (12) shortest length of side is greater than resonance ball body (11) diameter, resonance ball body (11) set up resonance ball solid branch portion (12) one side, be provided with on resonance ball solid branch portion (12) with the through-hole of resonance ball body (11) hollow intercommunication, resonance ball surface electrode (13) set up the convex surface of resonance ball body (11).
3. A high precision resonant ball pressure sensor as claimed in claim 2, wherein: back of the body chamber structure (2) is including carrying out chamber structure body (21), carrying on the back chamber (22) and carrying on the back chamber surface electrode (23), carry on the back chamber structure body (21) and be the cuboid, carry on the back chamber (22) and be the hemisphere cavity, carry on the back chamber (22) and set up carry on the back chamber structure body (21) upper surface, carry on the back chamber surface electrode (23) and set up inside carrying on the back chamber (22).
4. A high accuracy resonant ball pressure sensor as claimed in claim 3, wherein: the diameter of the back cavity (22) is larger than that of the resonant ball body (11).
5. A high accuracy resonant ball pressure sensor as claimed in claim 4, wherein: the resonant sphere surface electrode (13) and the back cavity surface electrode (23) are correspondingly arranged.
6. A high accuracy resonant ball pressure sensor as claimed in claim 5, wherein: the number of the resonant sphere surface electrodes (13) and the number of the back cavity surface electrodes (23) are both even numbers.
7. A high precision resonant ball pressure sensor as claimed in claim 1, wherein: the resonance ball body (11) and the resonance ball fixing and supporting part (12) are of an integrated processing structure.
8. A high precision resonant ball pressure sensor as claimed in claim 2, wherein: the resonance ball supporting part (12) is an oblate cuboid provided with a square side face on the side face of the resonance ball body (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011272096.9A CN112556892B (en) | 2020-11-13 | 2020-11-13 | High-precision resonant ball type pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011272096.9A CN112556892B (en) | 2020-11-13 | 2020-11-13 | High-precision resonant ball type pressure sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112556892A true CN112556892A (en) | 2021-03-26 |
| CN112556892B CN112556892B (en) | 2022-10-18 |
Family
ID=75042314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011272096.9A Active CN112556892B (en) | 2020-11-13 | 2020-11-13 | High-precision resonant ball type pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112556892B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101093667A (en) * | 2006-06-23 | 2007-12-26 | 北京大学 | Dish type transmitting transducer |
| US20090009036A1 (en) * | 2007-07-02 | 2009-01-08 | Schlumberger Technology Corporation | Pressure transducer |
| US20120181900A1 (en) * | 2011-01-13 | 2012-07-19 | Delaware Capital Formation, Inc. | Sensors for measuring at least one of pressure and temperature, sensor arrays and related methods |
| CN104197914A (en) * | 2014-08-08 | 2014-12-10 | 上海交通大学 | Miniature blow-molding semispherical resonator gyroscope and preparation method thereof |
| CN105387852A (en) * | 2015-10-19 | 2016-03-09 | 中北大学 | Preparing method for micro hemisphere gyro harmonic oscillators through self-alignment technology |
| CN107055457A (en) * | 2016-12-12 | 2017-08-18 | 北京自动化控制设备研究所 | A kind of micro- half spherical top sensitive structure of vitreous silica |
| CN107389229A (en) * | 2017-07-17 | 2017-11-24 | 合肥皖科智能技术有限公司 | A kind of ceramic capacitive pressure sensors |
| CN107677261A (en) * | 2017-08-12 | 2018-02-09 | 北方电子研究院安徽有限公司 | Micro- hemisphere gyroscope of interior outer hyperboloid stereo electrod |
| CN209579177U (en) * | 2018-09-13 | 2019-11-05 | 西安航晨机电科技股份有限公司 | Hemispherical resonator ultraprecise device for machining spherical surface |
-
2020
- 2020-11-13 CN CN202011272096.9A patent/CN112556892B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101093667A (en) * | 2006-06-23 | 2007-12-26 | 北京大学 | Dish type transmitting transducer |
| US20090009036A1 (en) * | 2007-07-02 | 2009-01-08 | Schlumberger Technology Corporation | Pressure transducer |
| US20120181900A1 (en) * | 2011-01-13 | 2012-07-19 | Delaware Capital Formation, Inc. | Sensors for measuring at least one of pressure and temperature, sensor arrays and related methods |
| CN104197914A (en) * | 2014-08-08 | 2014-12-10 | 上海交通大学 | Miniature blow-molding semispherical resonator gyroscope and preparation method thereof |
| CN105387852A (en) * | 2015-10-19 | 2016-03-09 | 中北大学 | Preparing method for micro hemisphere gyro harmonic oscillators through self-alignment technology |
| CN107055457A (en) * | 2016-12-12 | 2017-08-18 | 北京自动化控制设备研究所 | A kind of micro- half spherical top sensitive structure of vitreous silica |
| CN107389229A (en) * | 2017-07-17 | 2017-11-24 | 合肥皖科智能技术有限公司 | A kind of ceramic capacitive pressure sensors |
| CN107677261A (en) * | 2017-08-12 | 2018-02-09 | 北方电子研究院安徽有限公司 | Micro- hemisphere gyroscope of interior outer hyperboloid stereo electrod |
| CN209579177U (en) * | 2018-09-13 | 2019-11-05 | 西安航晨机电科技股份有限公司 | Hemispherical resonator ultraprecise device for machining spherical surface |
Non-Patent Citations (1)
| Title |
|---|
| 何敏: "基频和高阶谐振频率下球形谐振腔声场、声致发光及生物学效应的研究", 《中国优秀博硕士学位论文全文数据库(博士)基础科学辑》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112556892B (en) | 2022-10-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108507709B (en) | Preparation method of resonant pressure sensor | |
| CN103105248B (en) | Silicon substrate double-paddle structure quartz beam resonant micro pressure sensor | |
| WO2017028465A1 (en) | Mems pressure gauge chip and manufacturing method thereof | |
| CN107478862B (en) | Quartz vibrating beam accelerometer sensitive chip based on gold bonding | |
| CN103941041B (en) | A kind of single mass three-shaft mems accelerometer of three-frame structure | |
| CN109160484B (en) | Piezoelectric type MEMS acceleration sensor and preparation method thereof | |
| CN105021846A (en) | Six-axis integrated miniature acceleration sensor and manufacturing method therefor | |
| CN106323511A (en) | One-chip type quartz resonance pressure/temperature sensor and technological method therefor | |
| CN109883581B (en) | Cantilever beam type differential resonance pressure sensor chip | |
| CN112034204A (en) | Linked contact capacitance type acceleration sensitive chip and manufacturing method thereof | |
| CN111796119A (en) | Resonant acceleration sensor based on nano piezoelectric beam and preparation method thereof | |
| CN203191141U (en) | Silicon piezoresistive MEMS pressure transducer for gas and liquid pressure measurement | |
| CN112556892B (en) | High-precision resonant ball type pressure sensor | |
| CN103217228B (en) | Temperature sensor based on capacitive micromachined ultrasonic transducer (CMUT) and preparation and application method of temperature sensor | |
| CN107976274A (en) | A kind of pressure-detecting device and detection method based on synchro-resonance | |
| CN117268600A (en) | MEMS pressure sensor chip and preparation method thereof | |
| CN116067530A (en) | Large-range resonant pressure sensor based on volume compression principle | |
| Cheng et al. | A resonant differential pressure microsensor with temperature and static pressure compensations | |
| CN113405946B (en) | Micro-electromechanical resonance type viscosity sensor | |
| CN109813490B (en) | MEMS capacitive vacuum gauge and manufacturing method thereof | |
| JPWO2005003711A1 (en) | Quartz pressure sensor and manufacturing method thereof | |
| Han et al. | A novel resonant accelerometer based on quartz on silicon (QoS) | |
| CN109231157B (en) | Pressure and displacement integrated MEMS sensor combining four-beam circular membrane and coaxial cylinder | |
| CN207675357U (en) | A kind of pressure-detecting device based on synchro-resonance | |
| CN203534757U (en) | Absolute pressure sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |