CN112505957A - Substrate edge washing method, edge washing device and substrate - Google Patents
Substrate edge washing method, edge washing device and substrate Download PDFInfo
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- CN112505957A CN112505957A CN202011453163.7A CN202011453163A CN112505957A CN 112505957 A CN112505957 A CN 112505957A CN 202011453163 A CN202011453163 A CN 202011453163A CN 112505957 A CN112505957 A CN 112505957A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Abstract
The embodiment of the application provides a substrate edge washing method, an edge washing device and a substrate. The method and the device determine the edge washing amount of the substrate according to the distance between the mark position and the mark. Thereby avoid artifical definite limit volume of washing, the limit volume of washing of definite base plate that like this can be more accurate for can be more accurate when wasing the base plate, promote cleaning efficiency.
Description
Technical Field
The application relates to the technical field of display, in particular to a substrate edge washing method, an edge washing device and a substrate.
Background
Liquid Crystal Displays (LCDs) are the most widely used Display products in the market at present, and have the advantages of mature production process technology, high product yield, relatively low production cost and high market acceptance. The TFT-LCD (Thin Film Transistor-Liquid Crystal Display) panel manufacturing industry has been developed for many years, and the production process of the TFT-LCD has been very refined and mature.
In recent years, large-sized liquid crystal displays have been developed rapidly. In the manufacturing process, the substrate needs to be edge-washed by an edge-washing exposure machine in addition to a necessary precise optical instrument exposure machine. In the prior art, the edge washing amount of the substrate is judged by human eyes, so that the problem of inaccurate judgment of the edge washing amount is caused.
Disclosure of Invention
The embodiment of the application provides an edge washing method and device for a substrate and the substrate, which can accurately determine the edge washing amount of the substrate.
The application provides a substrate edge washing method, which comprises the following steps:
arranging corresponding marks on the edges of the corresponding film layers of the substrate;
detecting the identification position of the edge washing machine in the edge washing process;
and determining the edge washing amount of the substrate according to the distance between the mark position and the mark.
In some embodiments, the providing the corresponding mark on the edge of the corresponding film layer of the substrate includes:
correspondingly attaching a first mark to the edge of the metal film layer of the substrate, wherein the first mark is a strip metal;
and arranging a second mark at the end part of the nonmetal layer of the substrate, wherein the second mark is a through hole.
In some embodiments, the determining the edge-wash quantity of the substrate according to the mark position and the distance between the marks comprises:
and determining the edge washing amount of the metal film layer of the substrate based on the distance between the mark position and the end part of the first mark.
In some embodiments, the determining the edge-wash quantity of the substrate according to the mark position and the distance between the marks comprises:
and determining the edge washing amount of the non-metal film layer of the substrate based on the distance between the mark position and the second mark.
In some embodiments, after determining the edge-washing amount of the substrate according to the position of the mark and the distance between the marks, the method comprises:
and uploading the edge washing amount to a control host.
In some embodiments, the detecting the identification position in the edge washing process of the edge washing machine includes:
the position of a rotary brush head of the edge washing machine is determined, and the position of the mark is determined based on the position of the rotary brush head.
In some embodiments, said determining an identification position based on the position of the rotating brushhead comprises:
an identification position is determined based on the distance moved by the rotating brushhead.
The embodiment of the present application further provides an edge washing device for a substrate, including:
the identification unit is used for setting corresponding identifications on the edges of the corresponding film layers of the substrate;
the detection unit is used for detecting the identification position of the edge washing machine in the edge washing process;
and the determining unit is used for determining the edge washing amount of the substrate according to the position of the mark and the distance between the marks.
In some embodiments, the system further comprises an uploading unit, and the uploading unit uploads the edge washing amount to a control host.
The embodiment of the application also provides a substrate and the substrate manufactured by using the substrate edge washing method.
The substrate edge washing method provided by the embodiment of the application comprises the steps of firstly setting corresponding marks at the edges of corresponding film layers of a substrate, detecting mark positions in the edge washing process of an edge washing machine, and determining the edge washing amount of the substrate according to the distance between the mark positions and the marks. The method and the device determine the edge washing amount of the substrate according to the distance between the mark position and the mark. Thereby avoid artifical definite limit volume of washing, the limit volume of washing of definite base plate that like this can be more accurate for can be more accurate when wasing the base plate, promote cleaning efficiency.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart of a substrate cleaning method according to an embodiment of the present disclosure.
Fig. 2 is a schematic view of a scene of a substrate cleaning method according to an embodiment of the present disclosure.
Fig. 3 is a schematic structural diagram of a substrate cleaning apparatus according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the embodiments of the present invention, it is to be understood that terms such as "including" or "having", etc., are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof disclosed in the present specification, and are not intended to exclude the possibility that one or more other features, numbers, steps, actions, components, parts, or combinations thereof may be present or added.
The embodiments of the present application provide an edge-washing method, an edge-washing device and a substrate, and the edge-washing method is described in detail below.
Referring to fig. 1, fig. 1 is a schematic flow chart of a substrate cleaning method according to an embodiment of the present disclosure. The embodiment of the application provides a substrate edge washing method, which comprises the following steps:
101. and arranging corresponding marks on the edges of the corresponding film layers of the substrate.
It should be noted that the substrate may include a plurality of film layers, for example, the substrate may include a metal layer and a non-metal layer. In some embodiments, the substrate may be formed from a single non-metallic layer, two metallic layers in a stacked arrangement. Wherein, the non-metal layer can be a plastic layer. Specifically, the non-metallic layer may be a PFA layer. Of course, other materials may be used for the non-metallic layer. Redundant description is not provided in the embodiments of the present application. In addition, the material of the metal layer may be copper. Of course, the metal layer may be other materials.
The substrate is generally cuboid, and corresponding marks are respectively arranged on corresponding film layers of the substrate. For example, the substrate includes a non-metal layer and a metal layer, which are stacked, and then a corresponding first mark is disposed at an edge of the metal layer, and a corresponding second mark is disposed at an edge of the non-metal layer.
In some embodiments, the step of providing the corresponding mark on the edge of the corresponding film layer of the substrate includes:
(11) and correspondingly pasting a first mark on the edge of the metal film layer of the substrate, wherein the first mark is strip metal.
It should be noted that the first mark is arranged corresponding to the metal film layer, and the first mark is a strip metal with a length corresponding to the edge of the substrate and a regular shape. The length of the metal film layer of the corresponding substrate can be obtained by measuring the length of the first mark.
(12) And arranging a second mark at the end part of the nonmetal layer of the substrate, wherein the second mark is a through hole.
It should be noted that the second mark is arranged corresponding to the non-metal film layer, the second mark is a via hole, the via hole is located at the end of the non-metal layer, and the via hole can be used as a positioning target.
102. And detecting the identification position of the edge washing machine in the edge washing process.
It should be noted that the identification position of the edge washing process of the edge washing machine can be determined through the camera. For example, in the edge washing process of the edge washing machine, the moving distance of the brush head of the edge washing machine is determined according to the running time of the edge washing machine, so that the mark position is determined. Of course, the identification position in the edge washing process of the edge washing machine can also be determined in other ways. Redundant description is not provided in the embodiments of the present application.
In some embodiments, detecting the identification position in the edge washing process of the edge washing machine comprises the following steps:
(21) the position of a rotary brush head of the edge washing machine is determined, and the position of the mark is determined based on the position of the rotary brush head.
It should be noted that the rotary brush head of the edge washing machine is determined as a mark, and the position of the rotary brush head is the mark position. Specifically, the marker position is determined based on the moving distance of the rotating brush head. That is, the sign position is determined based on the distance the rotating brush head moves along the first sign edge.
103. And determining the edge washing amount of the substrate according to the distance between the mark position and the mark.
It should be noted that the edge-washing amount of the substrate is determined by determining the position of the mark and the distance between the marks.
In some embodiments, determining the edge-wash quantity of the substrate based on the location of the mark and the distance between the marks comprises:
(31) and determining the edge washing amount of the metal film layer of the substrate based on the distance between the mark position and the end part of the first mark.
It should be noted that, after the mark position is determined, the edge-washing amount of the metal film layer can be calculated based on the distance between the mark position and the end of the first mark.
(32) And determining the edge washing amount of the non-metal film layer of the substrate based on the distance between the mark position and the second mark.
It should be noted that, after the identification position is determined, the edge-washing amount of the metal film layer can be calculated based on the distance between the identification position and the second identification.
In some embodiments, after determining the edge-washing amount of the substrate according to the position of the mark and the distance between the marks, the method comprises:
and uploading the edge washing amount to a control host.
It should be noted that the control host may be a server or an intelligent terminal. The producer can acquire the edge washing amount of the substrate in real time through the server. By adopting the means, the edge washing amount of the substrate can be obtained in real time, so that the working efficiency of the edge washing process of the substrate is improved.
The substrate edge washing method provided by the embodiment of the application comprises the steps of firstly setting corresponding marks at the edges of corresponding film layers of a substrate, detecting mark positions in the edge washing process of an edge washing machine, and determining the edge washing amount of the substrate according to the distance between the mark positions and the marks. The method and the device determine the edge washing amount of the substrate according to the distance between the mark position and the mark. Thereby avoid artifical definite limit volume of washing, the limit volume of washing of definite base plate that like this can be more accurate for can be more accurate when wasing the base plate, promote cleaning efficiency.
The embodiment of the present application further describes a method for edge washing of a substrate with reference to the schematic view of the scene 2, wherein when the distance that the tag position 40 moves from the edge of the first mark 10 is L1, the amount of edge washing of the first metal film layer of the substrate is L1, and when the distance that the tag position 40 moves from the second mark 20 is L2, the amount of edge washing of the second metal layer of the substrate is L2, a non-metal layer via hole 30 is disposed at one side edge of the substrate, and a rotary brush head can perform edge washing from the non-metal via hole 30.
The method described in the above examples is further illustrated in detail below by way of example.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an edge washing device according to an embodiment of the present disclosure, where the edge washing device 200 includes an identification unit 201, a detection unit 202, and a determination unit 203, the identification unit 201 is configured to set a corresponding identifier on a corresponding film edge of a substrate, the detection unit 202 is configured to detect an identifier position in an edge washing process of an edge washing machine, and the determination unit 203 is configured to determine an edge washing amount of the substrate according to a distance between the identifier position and the identifier.
In some embodiments, the identifying unit 201 is specifically configured to:
correspondingly attaching a first mark to the edge of the metal film layer of the substrate, wherein the first mark is a strip metal;
and arranging a second mark at the end part of the nonmetal layer of the substrate, wherein the second mark is a through hole.
In some embodiments, the determining unit 203 is specifically configured to:
and determining the edge washing amount of the metal film layer of the substrate based on the distance between the mark position and the end part of the first mark.
And determining the edge washing amount of the non-metal film layer of the substrate based on the distance between the mark position and the second mark.
In some embodiments, the system further comprises an uploading unit 204, and the uploading unit 204 is configured to upload the edge washing amount to the control host.
In some embodiments, the detection unit 202 is specifically configured to determine a position of a rotating brush head of the edge washing machine, the identification position being determined based on the position of the rotating brush head.
In some embodiments, the detection unit 202 is specifically configured to determine the identification position based on the moving distance of the rotating brush head.
The edge washing device 200 comprises an identification unit 201, a detection unit 202 and a determination unit 203, wherein the identification unit is used for setting corresponding identifications at the edges of corresponding film layers of a substrate, the detection unit is used for detecting identification positions of an edge washing machine in the edge washing process, and the determination unit is used for determining the edge washing amount of the substrate according to the distance between the identification positions and the identifications. The method and the device determine the edge washing amount of the substrate according to the distance between the mark position and the mark. Thereby avoid artifical definite limit volume of washing, the limit volume of washing of definite base plate that like this can be more accurate for can be more accurate when wasing the base plate, promote cleaning efficiency.
The embodiment of the application also provides a substrate and the substrate manufactured by using the substrate edge washing method. Since the substrate edge washing method is described in detail in the above embodiments, the substrate edge washing method according to the embodiments of the present application is not described in detail.
The substrate edge washing method, the edge washing device and the substrate provided by the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are explained herein by applying specific examples, and the description of the above embodiments is only used to help understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A method of edge bead processing a substrate, comprising:
arranging corresponding marks on the edges of the corresponding film layers of the substrate;
detecting the identification position of the edge washing machine in the edge washing process;
and determining the edge washing amount of the substrate according to the distance between the mark position and the mark.
2. The method of claim 1, wherein the step of providing the corresponding mark on the edge of the corresponding film layer of the substrate comprises:
correspondingly attaching a first mark to the edge of the metal film layer of the substrate, wherein the first mark is a strip metal;
and arranging a second mark at the end part of the nonmetal layer of the substrate, wherein the second mark is a through hole.
3. The method of claim 2, wherein determining the edge-washing amount of the substrate according to the mark position and the distance between the marks comprises:
and determining the edge washing amount of the metal film layer of the substrate based on the distance between the mark position and the end part of the first mark.
4. The method of claim 2, wherein determining the edge-washing amount of the substrate according to the mark position and the distance between the marks comprises:
and determining the edge washing amount of the non-metal film layer of the substrate based on the distance between the mark position and the second mark.
5. The method of claim 1, wherein determining the edge-washing amount of the substrate according to the distance between the mark position and the mark comprises:
and uploading the edge washing amount to a control host.
6. The method of claim 1, wherein the detecting the mark position in the edge-washing process of the edge-washing machine comprises:
the position of a rotary brush head of the edge washing machine is determined, and the position of the mark is determined based on the position of the rotary brush head.
7. The substrate edge washing method of claim 6, wherein determining the identification position based on the position of the rotating brush head comprises:
an identification position is determined based on the distance moved by the rotating brushhead.
8. A substrate edge washing apparatus, comprising:
the identification unit is used for setting corresponding identifications on the edges of the corresponding film layers of the substrate;
the detection unit is used for detecting the identification position of the edge washing machine in the edge washing process;
and the determining unit is used for determining the edge washing amount of the substrate according to the position of the mark and the distance between the marks.
9. The apparatus of claim 8, further comprising an upload unit that uploads the edge-washing amount to a control host.
10. A substrate produced by the edge-washing method for a substrate according to any one of claims 1 to 7.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011453163.7A CN112505957A (en) | 2020-12-11 | 2020-12-11 | Substrate edge washing method, edge washing device and substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011453163.7A CN112505957A (en) | 2020-12-11 | 2020-12-11 | Substrate edge washing method, edge washing device and substrate |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06196401A (en) * | 1992-12-24 | 1994-07-15 | Dainippon Screen Mfg Co Ltd | Cleaning apparatus for edge of substrate |
| CN1558294A (en) * | 2004-02-05 | 2004-12-29 | 友达光电股份有限公司 | Developing machine bench with edge scrubbing device |
| CN101894827A (en) * | 2009-05-19 | 2010-11-24 | 中芯国际集成电路制造(上海)有限公司 | Test wafer for gluing and edge cleaning detection |
| CN106556976A (en) * | 2016-11-30 | 2017-04-05 | 武汉新芯集成电路制造有限公司 | A kind of method and system based on measurement photoresistance film thickness monitoring photoresistance side washing precision |
| CN108319057A (en) * | 2018-03-29 | 2018-07-24 | 武汉华星光电技术有限公司 | Substrate edges processing method, mask plate |
| CN109669321A (en) * | 2017-10-16 | 2019-04-23 | 中芯国际集成电路制造(上海)有限公司 | A kind of wafer side washing system and wafer side washing method |
| CN110989217A (en) * | 2019-11-19 | 2020-04-10 | Tcl华星光电技术有限公司 | Substrate and method for monitoring boundary position of film layer on substrate |
-
2020
- 2020-12-11 CN CN202011453163.7A patent/CN112505957A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06196401A (en) * | 1992-12-24 | 1994-07-15 | Dainippon Screen Mfg Co Ltd | Cleaning apparatus for edge of substrate |
| CN1558294A (en) * | 2004-02-05 | 2004-12-29 | 友达光电股份有限公司 | Developing machine bench with edge scrubbing device |
| CN101894827A (en) * | 2009-05-19 | 2010-11-24 | 中芯国际集成电路制造(上海)有限公司 | Test wafer for gluing and edge cleaning detection |
| CN106556976A (en) * | 2016-11-30 | 2017-04-05 | 武汉新芯集成电路制造有限公司 | A kind of method and system based on measurement photoresistance film thickness monitoring photoresistance side washing precision |
| CN109669321A (en) * | 2017-10-16 | 2019-04-23 | 中芯国际集成电路制造(上海)有限公司 | A kind of wafer side washing system and wafer side washing method |
| CN108319057A (en) * | 2018-03-29 | 2018-07-24 | 武汉华星光电技术有限公司 | Substrate edges processing method, mask plate |
| CN110989217A (en) * | 2019-11-19 | 2020-04-10 | Tcl华星光电技术有限公司 | Substrate and method for monitoring boundary position of film layer on substrate |
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