CN109765704B - Method and device for determining production equipment causing product defects - Google Patents
Method and device for determining production equipment causing product defects Download PDFInfo
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- CN109765704B CN109765704B CN201910026743.9A CN201910026743A CN109765704B CN 109765704 B CN109765704 B CN 109765704B CN 201910026743 A CN201910026743 A CN 201910026743A CN 109765704 B CN109765704 B CN 109765704B
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Abstract
The embodiment of the invention provides a method and equipment for determining production equipment causing product defects, wherein the method comprises the following steps: receiving target product information input by a user; inquiring a quality management system according to the target product information, and determining a target defect corresponding to a target product; inquiring a production management system according to the target product information, and determining production process information corresponding to the target product; and determining target equipment information causing the target defect according to the production process information. The embodiment of the invention can improve the efficiency of determining the production equipment causing the product defects.
Description
Technical Field
The embodiment of the invention relates to the field of display, in particular to a method and equipment for determining production equipment causing product defects.
Background
The production of Liquid Crystal Displays (LCDs) requires a number of process steps, during which the produced LCDs may suffer from various defects. Determining production equipment that causes LCD defects is critical to the production of LCDs.
At present, a production management system is responsible for management and control of a production line and storage of production data in an actual production process, and a quality management system is responsible for control of process quality and storage of quality data in the production process. Production equipment that is defective and causes a product defect is typically manually located by personnel based on data in the production management system and data in the quality management system.
However, since the amount of data in the production management system and the quality management system is very large, the inventors have found that such a method of manually determining the production equipment causing the product defect is inefficient.
Disclosure of Invention
The embodiment of the invention provides a method and equipment for determining production equipment causing product defects, which can determine the production equipment causing the product defects in the production process and improve the efficiency.
In a first aspect, an embodiment of the present invention provides a method for determining a production apparatus causing a product defect, including:
receiving target product information input by a user;
inquiring a quality management system according to the target product information, and determining a target defect corresponding to a target product;
inquiring a production management system according to the target product information, and determining production process information corresponding to the target product;
and determining target equipment information causing the target defect according to the production process information.
In a first possible implementation manner, the target product is a first liquid crystal panel cut by a first liquid crystal substrate; the target defect is a scratch caused by a mask plate;
the production process information comprises cutting information of the first liquid crystal substrate and a first corresponding relation between each position of the first liquid crystal substrate and a mask plate;
the determining target equipment information causing the target defect according to the production process information comprises:
determining first position information of the first liquid crystal panel in the first liquid crystal substrate before cutting according to the cutting information of the first liquid crystal substrate;
and inquiring the first corresponding relation according to the first position information, and determining a target mask plate causing scratches on the first liquid crystal panel.
In a second possible implementation manner, the production management system is queried according to the target device information, the production product information corresponding to the target device is determined, and the production product information is sent to the user terminal.
In a third possible implementation manner, the target product is a product having an N-layer film structure, where N is an integer greater than 1;
further comprising:
inquiring the quality management system according to the target product information, and respectively determining the defect position of the detection defect in the ith layer of film structure and the defect position of the detection defect in the ith-1 layer of film structure of the target product, wherein the defect position of the detection defect in the ith layer of film structure comprises the defect position of the detection defect in the ith-1 layer of film structure, and i is 2, 3, … N;
removing the defect position of the detection defect which is superposed with the i-1 layer film structure in the i layer film structure to obtain the defect position of the target defect in the i layer film structure;
and sending the defect position of the target defect to a user terminal.
With reference to the third possible implementation manner, in a fourth possible implementation manner, the method further includes:
and determining target repairing equipment matched with the ith layer of film structure, and sending the target repairing equipment to the user terminal.
In a fifth possible implementation manner, the target product is a second liquid crystal panel cut from a second liquid crystal substrate; the target product information comprises the second liquid crystal substrate information; the production process information includes cutting information of the second liquid crystal substrate;
further comprising:
inquiring the quality management system according to the second liquid crystal substrate information to determine the defect information of the second liquid crystal substrate;
determining second position information of the second liquid crystal panel in the second liquid crystal substrate before cutting according to the cutting information of the second liquid crystal substrate;
and determining the defect information of the second liquid crystal panel according to the defect information of the second liquid crystal substrate and the second position information.
With reference to any implementation manner of the first aspect, in a sixth possible implementation manner, the target product information carries an identifier of a target product;
the inquiring the quality management system according to the target product information to determine the target defects corresponding to the target product comprises the following steps:
acquiring a second corresponding relation between the product identification and the defect in the quality management system;
inquiring the second corresponding relation according to the identification of the target product, and determining the target defect corresponding to the target product;
the inquiring of the production management system according to the target product information to determine the production process information corresponding to the target product comprises the following steps:
acquiring a third corresponding relation between the product in the production management system and the production process;
and inquiring the third corresponding relation according to the identification of the target product, and determining the production process information corresponding to the target product.
In a second aspect, an embodiment of the present invention provides an apparatus for determining a production device causing a product defect, including:
the receiving module is used for receiving target product information input by a user;
the first determining module is used for inquiring the quality management system according to the target product information and determining the target defects corresponding to the target product;
the second determining module is used for inquiring a production management system according to the target product information and determining production process information corresponding to the target product;
and the third determining module is used for determining target equipment information causing the target defects according to the production process information.
In a third aspect, an embodiment of the present invention provides a device for determining a production device causing a product defect, including: at least one processor and memory;
the memory stores computer-executable instructions;
the at least one processor executing the computer-executable instructions stored by the memory causes the at least one processor to perform the method of determining a production facility that is causing a product defect according to any of the first aspects.
In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, where a computer executes instructions, and when a processor executes the computer to execute the instructions, the method for determining a production equipment causing a product defect according to any one of the first aspect is implemented.
According to the method and the equipment for determining the production equipment causing the product defects, provided by the embodiment of the invention, the target product information input by a user is received, the quality management system is inquired according to the target product information, the target defects corresponding to the target products are determined, the production management system is inquired according to the target product information, the production process information corresponding to the target products is determined, and the target equipment information causing the target defects is determined according to the production process information, so that the efficiency of determining the production equipment causing the product defects can be improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is an architecture diagram of a determination system for a production facility that provides a defect to a product according to an embodiment of the present invention;
FIG. 2 is a first flowchart of an implementation of a method for determining a manufacturing device causing a product defect according to an embodiment of the present invention;
FIG. 3 is a flowchart II of an implementation of the method for determining a production facility causing a product defect according to an embodiment of the present invention;
FIG. 4 is a flowchart illustrating a second implementation of the method for determining a manufacturing apparatus causing a product defect according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a device for determining a production facility causing a product defect according to an embodiment of the present invention;
fig. 6 is a schematic hardware structure diagram of a determining device of a production device causing a product defect according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims, as well as in the drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Fig. 1 is an architecture diagram of a system for determining a production facility causing a product defect according to an embodiment of the present invention, and as shown in fig. 1, a system 100 for determining a production facility causing a product defect includes a server 101, a quality management system 102, and a production management system 103. The server 101 communicates with the quality management system 102 and the production management system 103, respectively, via the network 104.
The server 101 may be an independent server, a cluster of multiple servers, or a cloud server.
The quality management system 102 is responsible for controlling the quality of the process and storing quality data during the production process. Quality data includes, but is not limited to, defect type, defect characteristics, number of defects, defect location, etc. of the product. The quality data is input into the quality management system 102 by a user, or the quality management system 102 is connected to a detection device, and the quality management system 102 acquires the quality data through the detection device.
The production management system 103 is responsible for management and control of the production line, and stores production data in the actual production process. Production data includes, but is not limited to, product type, product quantity, production time, product production process, and the like. The quality data is input into the quality management system 103 by a user, or the production management system 103 is connected to a production facility, and the production management system 103 acquires the production data through the production facility.
Fig. 2 is a flowchart of a first implementation of a method for determining a production device causing a product defect according to an embodiment of the present invention, where the method is applied to the server 101 shown in fig. 1. As shown in fig. 2, the method may include the steps of:
step S201, receiving target product information input by a user.
In the embodiment of the invention, the server comprises a man-machine interaction module, and the user inputs the target product information through the man-machine interaction module. The target product information includes, but is not limited to, the name, identification number, model, production time, production lot, etc. of the target product. The target product information input by the user is displayed on the man-machine interaction module, so that the user can confirm whether the input target product information is correct or not.
As an embodiment of the present invention, one possible implementation manner of step S101 is: receiving a loading instruction input by a user, loading a product selection list according to the loading instruction, and receiving target product information selected by the user according to the product selection list.
Step S202, inquiring a quality management system according to the target product information, and determining a target defect corresponding to the target product.
In the embodiment of the invention, the quality management system stores the quality data of each product, and the server inquires the target defects corresponding to the target products from the quality management system.
Step S203, inquiring a production management system according to the target product information, and determining production process information corresponding to the target product.
In the embodiment of the present invention, the production management system stores production process information of each product, where the production process information includes, but is not limited to, a production process flow and production equipment corresponding to each production step in the production process flow. And the server inquires the production process information corresponding to the target product from the production management system.
And step S204, determining target equipment information causing the target defect according to the production process information.
In the embodiment of the invention, the target defect of the target product is caused by a certain production step in the production process, each production step is completed by corresponding production equipment, the target production process step causing the target defect can be determined according to the production process information, and the target equipment information is determined according to the target production process step.
According to the embodiment of the invention, the target defect corresponding to the target product is determined by receiving the target product information input by a user, inquiring the quality management system according to the target product information, inquiring the production management system according to the target product information, determining the production process information corresponding to the target product, and determining the target equipment information causing the target defect according to the production process information, so that the efficiency of determining the production equipment causing the product defect can be improved.
As an embodiment of the present invention, the target product is a first liquid crystal panel cut from a first liquid crystal substrate; the target defect is a scratch caused by a mask plate;
the production process information comprises cutting information of the first liquid crystal substrate and a first corresponding relation between each position of the first liquid crystal substrate and a mask plate;
one possible implementation manner of step S204 includes:
determining first position information of the first liquid crystal panel in the first liquid crystal substrate before cutting according to the cutting information of the first liquid crystal substrate;
and inquiring the first corresponding relation according to the first position information, and determining a target mask plate causing scratches on the first liquid crystal panel.
In the embodiment of the invention, the liquid crystal panels are all formed by cutting large liquid crystal substrates. In the LCD process segment, a large liquid crystal substrate needs a plurality of mask plates, and the defective mask plates can scratch the liquid crystal substrate. For example, the mask has holes, and the holes in the mask may scratch the liquid crystal substrate during the production process. After the liquid crystal substrate is cut into the liquid crystal panel, the integrity of the liquid crystal substrate is damaged, so that a mask plate causing scratches is difficult to find.
In the embodiment of the invention, the cutting information of the first liquid crystal substrate carries the coordinate position and the corresponding mark of the cut liquid crystal panel on the first liquid crystal substrate. The target product information carries an identifier of the first liquid crystal panel. The coordinate position of the first liquid crystal panel on the first liquid crystal substrate can be determined according to the mark of the first liquid crystal panel, and the target mask plate corresponding to the coordinate position can be determined by inquiring the first relation list, wherein the target mask plate is equipment for scratching the first liquid crystal panel.
As an embodiment of the present invention, an embodiment of the present invention may further include:
and inquiring the production management system according to the target equipment information, determining the production product information corresponding to the target equipment, and sending the production product information to the user terminal.
In the embodiment of the invention, the target equipment can produce other products besides the target product, all the production product information related to the target equipment is determined by inquiring the production management system, and the production product information is sent to the user terminal, so that the range of bad batches is prevented from being expanded.
Fig. 3 is a flowchart illustrating a second implementation of the method for determining a manufacturing apparatus causing product defects according to an embodiment of the present invention, where in the embodiment of the present invention, the target product is a product having an N-layer film structure, where N is an integer greater than 1. On the basis of the embodiment shown in fig. 2, as shown in fig. 3, the embodiment of the present invention may further include:
step S301, querying the quality management system according to the target product information, and determining a defect position of a detection defect in an i-th layer film structure of the target product and a defect position of a detection defect in an i-1-th layer film structure respectively, where the defect position of the detection defect in the i-th layer film structure includes the defect position of the detection defect in the i-1-th layer film structure, where i is 2, 3, and … N.
Step S302, removing the defect position of the detection defect which is superposed with the i-1 layer film structure in the i-th layer film structure to obtain the defect position of the target defect in the i-th layer film structure.
Step S303, the defect position of the target defect is sent to a user terminal.
In the embodiment of the present invention, detecting a defect refers to actually detecting a defect by a detection device when detecting a defect of each layer of the film structure. The target defect refers to a defect actually present in each layer of the film structure.
For a product with a multilayer film structure, defect detection is carried out after each layer of film structure is prepared, defect positions and defect quantity are obtained through detection, and the corresponding defect positions and defect quantity are uploaded to a quality management system. Because the ith layer of film structure is prepared on the ith-1 layer of film structure, the defect position and the defect number of the ith layer of film structure comprise the defect position and the defect number of the ith-1 layer of film structure.
For example, a first layer of film structure is first prepared, after the preparation, defect detection is performed, the number of detected defects is 20, and after a second layer of film structure is prepared, the number of detected defects is 50, wherein the 20 defects in the second layer of film structure coincide with the defect positions of the 20 defects in the second layer of film structure, and the number of target defects in the first layer of film structure is 30.
The multilayer film structure product can be an intermediate product formed in a TFT process section during the preparation of the liquid crystal substrate, 5-6 mask layers are needed in the TFT process section, defect detection is carried out after each mask layer is carried out to obtain the defect position of the detection defect of each mask layer, and the defect position of the detection defect is uploaded to a quality management system.
And removing the superposed defect positions of the detection defects according to the defect positions of the detection defects in the ith film structure and the defect positions of the detection defects in the ith-1 film structure to obtain the defect positions of the target defects in the ith film structure.
For example, the defect position is a defect coordinate, the number of detected defects in the first layer of film structure is 2, the defect coordinate is (1,1) (1, 2), the number of detected defects in the second layer of film structure is 3, the defect coordinate is (1,1) (1, 2), (1, 3), and the coordinates of the overlapping coordinates are removed, so that the coordinates (1, 3) are the defect coordinates of the target defect in the second layer of film structure.
And sending the target defect position to a user terminal, so that the user can repair the ith layer of film structure conveniently according to the defect position of the target defect.
As an embodiment of the present invention, the method of this embodiment may further include:
and determining target repairing equipment matched with the ith layer of film structure, and sending the target repairing equipment to the user terminal.
In embodiments of the present invention, defects in different membrane structures need to be repaired using corresponding repair equipment. In a possible implementation manner, the production management system stores a correspondence list between each layer of film structure and the repair device, loads the correspondence list between each layer of film structure and the repair device, and determines the repair device information matched with the ith layer of film structure by querying the correspondence list. After the information of the repairing equipment is inquired, the information of the repairing equipment is packaged and sent to the user terminal, so that a user can conveniently and quickly find the repairing equipment to repair the ith layer film structure, and the repairing efficiency is improved.
Fig. 4 is a third implementation flowchart of the method for determining the production equipment causing the product defect according to the embodiment of the present invention, in the embodiment of the present invention, the target product is a second liquid crystal panel cut from a second liquid crystal substrate; the target product information comprises the second liquid crystal substrate information; the production process information includes cutting information of the second liquid crystal substrate. On the basis of the embodiment shown in fig. 2, as shown in fig. 4, the method of this embodiment may further include the following steps:
step S401, querying the quality management system according to the second liquid crystal substrate information, and determining defect information of the second liquid crystal substrate.
Step S402, determining second position information of the second liquid crystal panel in the second liquid crystal substrate before cutting according to the cutting information of the second liquid crystal substrate.
Step S403, determining the defect information of the second liquid crystal panel according to the defect information of the second liquid crystal substrate and the second position information.
In the embodiment of the invention, the thin film transistor and the color film are separately prepared and then are attached to the LCD to form the liquid crystal substrate, and the liquid crystal substrate is cut into the liquid crystal panel. The defect of the cut liquid crystal panel is difficult to detect in defect detection, and the defect of the liquid crystal substrate before cutting is easy to detect.
In the embodiment of the present invention, the defect information of the second liquid crystal substrate carries the position and the number of the defects of the second liquid crystal substrate. The cutting information of the second liquid crystal substrate carries the coordinate position and the corresponding mark of the cut liquid crystal panel on the second liquid crystal substrate. The target product information carries an identifier of the second liquid crystal panel. And the coordinate position of the second liquid crystal panel on the second liquid crystal substrate can be determined according to the mark of the second liquid crystal panel, and the defect information corresponding to the second liquid crystal substrate can be determined according to the defect information of the second liquid crystal substrate.
According to the embodiment of the invention, the defect of the cut liquid crystal panel can be obtained according to the defect of the liquid crystal substrate before cutting without detecting the defect of the cut liquid crystal panel, so that the repairing efficiency is improved.
As an embodiment of the present invention, the target product information carries an identifier of a target product;
one possible implementation manner of step S202 is:
acquiring a second corresponding relation between the product identification and the defect in the quality management system;
inquiring the second corresponding relation according to the identification of the target product, and determining the target defect corresponding to the target product;
one possible implementation manner of step S203 is:
acquiring a third corresponding relation between the product in the production management system and the production process;
and inquiring the third corresponding relation according to the identification of the target product, and determining the production process information corresponding to the target product.
In the embodiment of the invention, the target defect of the target product can be determined by inquiring the identifier of the target product in the second corresponding relation between the product identifier and the defect. And inquiring the second identifier of the target product in the third corresponding relation between the product and the production process in the production management system to determine the production process information corresponding to the target product.
Fig. 5 is a schematic structural diagram of a determining apparatus of a production device causing a product defect according to an embodiment of the present invention, in which the determining apparatus 500 of the production device causing a product defect may include:
a receiving module 501, configured to receive target product information input by a user;
a first determining module 502, configured to query a quality management system according to the target product information, and determine a target defect corresponding to a target product;
a second determining module 503, configured to query a production management system according to the target product information, and determine production process information corresponding to the target product;
a third determining module 504, configured to determine target device information that causes the target defect according to the production process information.
As an embodiment of the present invention, the target product is a first liquid crystal panel cut from a first liquid crystal substrate; the target defect is a scratch caused by a mask plate;
the production process information comprises cutting information of the first liquid crystal substrate and a first corresponding relation between each position of the first liquid crystal substrate and a mask plate;
a third determining module 504, specifically configured to determine, according to the cutting information of the first liquid crystal substrate, first position information of the first liquid crystal panel in the first liquid crystal substrate before cutting;
and inquiring the first corresponding relation according to the first position information, and determining a target mask plate causing scratches on the first liquid crystal panel.
As an embodiment of the present invention, the method further includes: and the first sending module is used for inquiring the production management system according to the target equipment information, determining the production product information corresponding to the target equipment and sending the production product information to the user terminal.
As an embodiment of the present invention, the target product is a product having an N-layer film structure, where N is an integer greater than 1;
further comprising: a fourth determining module, configured to query the quality management system according to the target product information, and respectively determine a defect position of a detection defect in an ith layer of film structure of the target product and a defect position of a detection defect in an ith-1 layer of film structure, where the defect position of the detection defect in the ith layer of film structure includes the defect position of the detection defect in the ith-1 layer of film structure, where i is 2, 3, … N;
the removing module is used for removing the defect position of the detection defect which is superposed with the i-1 layer film structure in the i-th layer film structure to obtain the defect position of the target defect in the i-th layer film structure;
and the second sending module is used for sending the defect position of the target defect to the user terminal.
As an embodiment of the present invention, the second sending module is further configured to determine a target repair device matching the ith layer of film structure, and send the target repair device to the user terminal.
As an embodiment of the present invention, the target product is a second liquid crystal panel cut from a second liquid crystal substrate; the target product information comprises the second liquid crystal substrate information; the production process information includes cutting information of the second liquid crystal substrate;
further comprising: a fifth determining module, configured to query the quality management system according to the second liquid crystal substrate information, and determine defect information of the second liquid crystal substrate;
a sixth determining module, configured to determine, according to the cutting information of the second liquid crystal substrate, second position information of the second liquid crystal panel in the second liquid crystal substrate before cutting;
and the seventh determining module is used for determining the defect information of the second liquid crystal panel according to the defect information of the second liquid crystal substrate and the second position information.
As an embodiment of the present invention, the target product information carries an identifier of a target product;
the first determining module 502 is specifically configured to obtain a second correspondence between a product identifier and a defect in the quality management system;
inquiring the second corresponding relation according to the identification of the target product, and determining the target defect corresponding to the target product;
the second determining module 503 is specifically configured to obtain a third corresponding relationship between the product in the production management system and the production process;
and inquiring the third corresponding relation according to the identification of the target product, and determining the production process information corresponding to the target product.
The apparatus of the present embodiment may be used to implement the method embodiments shown in fig. 2 to fig. 3, and the implementation principle and technical effect are similar, which are not described herein again.
Fig. 6 is a schematic hardware structure diagram of a determining device of a production device causing a product defect according to an embodiment of the present invention. As shown in fig. 6, the determining apparatus 600 of the production apparatus causing the product defect provided by the present embodiment includes: at least one processor 601 and memory 602. The determining device 600 of the production device causing the product defect further includes a communication section 603. The processor 601, the memory 602, and the communication section 603 are connected by a bus 604.
In a specific implementation process, the at least one processor 601 executes the computer-executable instructions stored in the memory 602, so that the at least one processor 601 performs the method for determining the production equipment causing the product defect in any one of the method embodiments. The communication part 603 is used for communication with the terminal device and/or the server.
For a specific implementation process of the processor 601, reference may be made to the above method embodiments, which implement the principle and the technical effect similarly, and details of this embodiment are not described herein again.
In the embodiment shown in fig. 6, it should be understood that the Processor may be a Central Processing Unit (CPU), other general purpose processors, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of a method disclosed in connection with the present invention may be embodied directly in a hardware processor, or in a combination of the hardware and software modules within the processor.
The memory may comprise high speed RAM memory and may also include non-volatile storage NVM, such as at least one disk memory.
The bus may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, an Extended ISA (EISA) bus, or the like. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, the buses in the figures of the present application are not limited to only one bus or one type of bus.
The embodiment of the present invention further provides a computer-readable storage medium, where the computer-readable storage medium stores computer-executable instructions, and when a processor executes the computer-executable instructions, the method for determining a production device that causes a product defect in any of the above method embodiments is implemented.
The computer-readable storage medium described above may be implemented by any type of volatile or non-volatile memory device or combination thereof, such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disk. Readable storage media can be any available media that can be accessed by a general purpose or special purpose computer.
An exemplary readable storage medium is coupled to the processor such the processor can read information from, and write information to, the readable storage medium. Of course, the readable storage medium may also be an integral part of the processor. The processor and the readable storage medium may reside in an Application Specific Integrated Circuits (ASIC). Of course, the processor and the readable storage medium may also reside as discrete components in the apparatus.
Those of ordinary skill in the art will understand that: all or a portion of the steps of implementing the above-described method embodiments may be performed by hardware associated with program instructions. The program may be stored in a computer-readable storage medium. When executed, the program performs steps comprising the method embodiments described above; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. A method of determining production equipment that causes product defects, comprising:
receiving target product information input by a user;
inquiring a quality management system according to the target product information, and determining a target defect corresponding to a target product;
inquiring a production management system according to the target product information, and determining production process information corresponding to the target product;
determining target equipment information causing the target defect according to the production process information;
the target product is a first liquid crystal panel formed by cutting a first liquid crystal substrate; the target defect is a scratch caused by a mask plate;
the production process information comprises cutting information of the first liquid crystal substrate and a first corresponding relation between each position of the first liquid crystal substrate and a mask plate;
the determining target equipment information causing the target defect according to the production process information comprises:
determining first position information of the first liquid crystal panel in the first liquid crystal substrate before cutting according to the cutting information of the first liquid crystal substrate;
and inquiring the first corresponding relation according to the first position information, and determining a target mask plate causing scratches on the first liquid crystal panel.
2. The method of claim 1, further comprising:
and inquiring the production management system according to the target equipment information, determining the production product information corresponding to the target equipment, and sending the production product information to the user terminal.
3. The method according to claim 1, wherein the target product is a product having an N-layer film structure, wherein N is an integer greater than 1;
further comprising:
inquiring the quality management system according to the target product information, and respectively determining the defect position of the detection defect in the ith layer of film structure and the defect position of the detection defect in the ith-1 layer of film structure of the target product, wherein the defect position of the detection defect in the ith layer of film structure comprises the defect position of the detection defect in the ith-1 layer of film structure, and i is 2, 3, … N;
removing the defect position of the detection defect which is superposed with the i-1 layer film structure in the i layer film structure to obtain the defect position of the target defect in the i layer film structure;
and sending the defect position of the target defect to a user terminal.
4. The method of claim 3, further comprising:
and determining target repairing equipment matched with the ith layer of film structure, and sending the target repairing equipment to the user terminal.
5. The method according to claim 1, wherein the target product is a second liquid crystal panel cut from a second liquid crystal substrate; the target product information comprises the second liquid crystal substrate information; the production process information includes cutting information of the second liquid crystal substrate;
further comprising:
inquiring the quality management system according to the second liquid crystal substrate information to determine the defect information of the second liquid crystal substrate;
determining second position information of the second liquid crystal panel in the second liquid crystal substrate before cutting according to the cutting information of the second liquid crystal substrate;
and determining the defect information of the second liquid crystal panel according to the defect information of the second liquid crystal substrate and the second position information.
6. The method of any one of claims 1 to 5, wherein the target product information carries an identification of a target product;
the inquiring the quality management system according to the target product information to determine the target defects corresponding to the target product comprises the following steps:
acquiring a second corresponding relation between the product identification and the defect in the quality management system;
inquiring the second corresponding relation according to the identification of the target product, and determining the target defect corresponding to the target product;
the inquiring of the production management system according to the target product information to determine the production process information corresponding to the target product comprises the following steps:
acquiring a third corresponding relation between the product in the production management system and the production process;
and inquiring the third corresponding relation according to the identification of the target product, and determining the production process information corresponding to the target product.
7. A device for determining a production facility causing a product defect, comprising:
the receiving module is used for receiving target product information input by a user;
the first determining module is used for inquiring the quality management system according to the target product information and determining a target defect corresponding to a target product, wherein the target product is a first liquid crystal panel formed by cutting a first liquid crystal substrate, and the target defect is a scratch caused by a mask plate;
the second determining module is used for inquiring a production management system according to the target product information and determining production process information corresponding to the target product, wherein the production process information comprises cutting information of the first liquid crystal substrate and a first corresponding relation between each position of the first liquid crystal substrate and a mask plate;
the third determining module is used for determining target equipment information causing the target defects according to the production process information;
a third determining module, configured to determine, according to the cutting information of the first liquid crystal substrate, first position information of the first liquid crystal panel in the first liquid crystal substrate before cutting; and inquiring the first corresponding relation according to the first position information, and determining a target mask plate causing scratches on the first liquid crystal panel.
8. A determining apparatus of a production apparatus causing a defect of a product, comprising: at least one processor and memory;
the memory stores computer-executable instructions;
the at least one processor executing the computer-executable instructions stored by the memory causes the at least one processor to perform the method of determining a production facility that is causing a product defect of any of claims 1 to 6.
9. A computer-readable storage medium, wherein the computer-readable storage medium has stored therein computer-executable instructions that, when executed by a processor, implement the method for determining a production facility that causes a product defect according to any one of claims 1 to 6.
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| CN116779937A (en) * | 2023-08-17 | 2023-09-19 | 宁德时代新能源科技股份有限公司 | Cold pressing station determining method, device, equipment and storage medium |
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| JP2004192190A (en) * | 2002-12-10 | 2004-07-08 | Matsushita Electric Ind Co Ltd | Database production management system |
| CN103679359A (en) * | 2013-12-09 | 2014-03-26 | 华南理工大学 | SMT central intelligent optimal management and monitoring system |
| CN108037739A (en) * | 2017-11-09 | 2018-05-15 | 广州兴森快捷电路科技有限公司 | The process management and control method and system of PCB product |
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| JP2004192190A (en) * | 2002-12-10 | 2004-07-08 | Matsushita Electric Ind Co Ltd | Database production management system |
| CN103679359A (en) * | 2013-12-09 | 2014-03-26 | 华南理工大学 | SMT central intelligent optimal management and monitoring system |
| CN108037739A (en) * | 2017-11-09 | 2018-05-15 | 广州兴森快捷电路科技有限公司 | The process management and control method and system of PCB product |
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