CN112469758B - 固化性组合物、预浸料、树脂片、覆金属箔层叠板和印刷电路板 - Google Patents
固化性组合物、预浸料、树脂片、覆金属箔层叠板和印刷电路板Info
- Publication number
- CN112469758B CN112469758B CN201980049413.XA CN201980049413A CN112469758B CN 112469758 B CN112469758 B CN 112469758B CN 201980049413 A CN201980049413 A CN 201980049413A CN 112469758 B CN112469758 B CN 112469758B
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- Prior art keywords
- epoxy
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- curable composition
- compound
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
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- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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| CN118251458B (zh) * | 2021-08-05 | 2025-08-05 | 三菱瓦斯化学株式会社 | 固化性组合物、预浸料、树脂片、覆金属箔层叠板及印刷电路板 |
| WO2023013712A1 (ja) * | 2021-08-05 | 2023-02-09 | 三菱瓦斯化学株式会社 | 硬化性組成物、プリプレグ、金属箔張積層板、及びプリント配線板 |
| KR102688208B1 (ko) * | 2021-08-05 | 2024-07-25 | 미츠비시 가스 가가쿠 가부시키가이샤 | 경화성 조성물, 프리프레그, 레진 시트, 금속박 피복 적층판 및 프린트 배선판 |
| JP7449498B2 (ja) * | 2021-08-05 | 2024-03-14 | 三菱瓦斯化学株式会社 | 硬化性組成物、プリプレグ、金属箔張積層板及びプリント配線板 |
| KR20240040056A (ko) | 2021-08-05 | 2024-03-27 | 미츠비시 가스 가가쿠 가부시키가이샤 | 열경화성 수지 조성물, 프리프레그 및 프린트 배선판 |
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Citations (2)
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| JPH04314723A (ja) * | 1991-04-15 | 1992-11-05 | Fujitsu Ltd | エポキシ樹脂組成物 |
| US5659004A (en) * | 1990-08-27 | 1997-08-19 | Fujitsu Limited | Epoxy resin composition |
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| JPH02202910A (ja) * | 1989-02-02 | 1990-08-13 | Sumitomo Bakelite Co Ltd | 封止用樹脂組成物 |
| JPH044213A (ja) | 1990-04-23 | 1992-01-08 | Sumitomo Bakelite Co Ltd | 半導体封止用樹脂の製造方法 |
| JPH06136093A (ja) | 1992-09-08 | 1994-05-17 | Fujitsu Ltd | エポキシ樹脂組成物 |
| JP3463075B2 (ja) * | 1993-03-18 | 2003-11-05 | ナガセケムテックス株式会社 | エポキシ樹脂組成物の射出成形方法及びエポキシ樹脂組成物 |
| TW296400B (enExample) * | 1994-11-17 | 1997-01-21 | Shinetsu Chem Ind Co | |
| JP2005097448A (ja) * | 2003-09-25 | 2005-04-14 | Matsushita Electric Works Ltd | 半導体封止用液状エポキシ樹脂組成物及び半導体装置 |
| JP2009097014A (ja) * | 2007-09-27 | 2009-05-07 | Hitachi Chem Co Ltd | 封止用液状樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ |
| JP5633382B2 (ja) | 2011-01-18 | 2014-12-03 | 日立化成株式会社 | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ、積層板及び多層プリント配線板 |
| SG11201407874QA (en) * | 2012-06-12 | 2014-12-30 | Mitsubishi Gas Chemical Co | Resin composition, prepreg, metal foil-clad laminate and printed wiring board |
| CN103540101B (zh) | 2012-07-17 | 2016-01-20 | 台光电子材料(昆山)有限公司 | 无卤素树脂组合物及应用其的铜箔基板及印刷电路板 |
| SG11201503925QA (en) * | 2012-11-28 | 2015-06-29 | Mitsubishi Gas Chemical Co | Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board |
| US10815349B2 (en) * | 2015-07-06 | 2020-10-27 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board |
| JP6760281B2 (ja) * | 2015-07-06 | 2020-09-23 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板 |
| JP2018140494A (ja) | 2015-07-23 | 2018-09-13 | コニカミノルタ株式会社 | 機能性フィルム及びこれを備えた電子デバイス |
| JP6850548B2 (ja) | 2016-04-22 | 2021-03-31 | 三菱瓦斯化学株式会社 | プリント配線板用樹脂組成物、プリプレグ、レジンシート、積層板、金属箔張積層板、及びプリント配線板 |
| CN106633675B (zh) | 2016-12-01 | 2019-02-19 | 陕西生益科技有限公司 | 一种高导热树脂组合物及其应用 |
| WO2018124161A1 (ja) * | 2016-12-28 | 2018-07-05 | 三菱瓦斯化学株式会社 | プリント配線板用樹脂組成物、プリプレグ、レジンシート、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板 |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5659004A (en) * | 1990-08-27 | 1997-08-19 | Fujitsu Limited | Epoxy resin composition |
| JPH04314723A (ja) * | 1991-04-15 | 1992-11-05 | Fujitsu Ltd | エポキシ樹脂組成物 |
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| JP7488513B2 (ja) | 2024-05-22 |
| JPWO2020022084A1 (ja) | 2021-08-19 |
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| US11499005B2 (en) | 2022-11-15 |
| US20210261722A1 (en) | 2021-08-26 |
| KR102768029B1 (ko) | 2025-02-13 |
| CN112469758A (zh) | 2021-03-09 |
| EP3828221A1 (en) | 2021-06-02 |
| WO2020022084A1 (ja) | 2020-01-30 |
| TWI815923B (zh) | 2023-09-21 |
| US11718708B2 (en) | 2023-08-08 |
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