CN112466809B - Semiconductor process equipment and bearing device - Google Patents
Semiconductor process equipment and bearing device Download PDFInfo
- Publication number
- CN112466809B CN112466809B CN202110139550.1A CN202110139550A CN112466809B CN 112466809 B CN112466809 B CN 112466809B CN 202110139550 A CN202110139550 A CN 202110139550A CN 112466809 B CN112466809 B CN 112466809B
- Authority
- CN
- China
- Prior art keywords
- cooling
- heater
- plate
- assembly
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides semiconductor process equipment and a bearing device. This load-bearing device includes: the chuck assembly, the heater and the cooling assembly; the chuck assembly is arranged on the heater and used for bearing and fixing a workpiece to be machined; the heater is used for heating a workpiece to be processed, and the bottom of the heater is provided with a cooling space; the cooling assembly is arranged in the cooling space, and cooling gas is blown to the bottom of the heater through the cooling assembly to carry out cooling, so that the bearing device can carry out cooling without naturally cooling a workpiece to be processed to a preset temperature, and the process rate is greatly improved; in addition, because the flow guide structure arranged on the cooling assembly can guide the cooling gas to the edge area of the chuck assembly, the cooling speed of the edge area and the cooling speed of the middle area of the workpiece to be processed are the same, the temperature uniformity of the workpiece to be processed is greatly improved, and the process yield and the economic benefit are greatly improved.
Description
Technical Field
The application relates to the technical field of semiconductor processing, in particular to semiconductor process equipment and a bearing device.
Background
At present, the physical vapor deposition technology for preparing the aluminum film is widely applied to the field of semiconductor preparation. The aluminum film can be used as a lead terminal for testing electrical connections and packaging to achieve metal interconnection and provide functions such as electronic signals, micro-wiring and the like for each device in the chip. With the increasing process, the thickness of the aluminum film is higher and higher, and the requirement for the cooling capacity and temperature uniformity of the bearing device is higher and higher.
In the prior art, as shown in fig. 3, when an aluminum thin film process is performed in a typical pvd process, plasma and metal atoms sputtered from a target 201 carry high energy and deposit on a wafer 202 to cause heat accumulation, the heat is transferred from the wafer 202 to a carrying device 203, and water in a cooling water pipe 204 of the carrying device 203 takes away the heat to speed up cooling of the wafer 202, so as to control the temperature of the wafer 202. However, since the temperature of the cooling water pipe 204 is low, the temperature of the wafer 202 may drop suddenly to generate fragments, and thus the cooling water pipe 204 needs to be used to cool the wafer 202 after the wafer 202 is naturally cooled to a certain temperature, which may greatly reduce the process rate and the process yield. In addition, since the existing cooling water pipe 204 cannot extend to the edge of the carrying device 203, the edge area of the wafer cannot be well cooled, and the overall temperature uniformity of the wafer during the process is not good.
Disclosure of Invention
The present application provides a semiconductor process apparatus and a carrier device for solving the technical problems of low process rate and yield and poor temperature uniformity caused by the structure of the carrier device in the prior art.
In a first aspect, an embodiment of the present application provides a carrying device disposed in a process chamber of a semiconductor processing apparatus, for carrying a workpiece to be processed, including: the chuck assembly, the heater and the cooling assembly; the chuck assembly is arranged on the heater and is used for bearing and fixing the workpiece to be machined; the heater is used for heating the workpiece to be processed, and the bottom of the heater is provided with a cooling space; the cooling assembly is arranged in the cooling space, a gas flow channel is arranged in the cooling assembly, a vent communicated with the gas flow channel is formed in the top surface of the cooling assembly, and the gas flow channel is used for introducing cooling gas and blowing the cooling gas to the bottom of the heater through the vent so that the heater cools a workpiece to be machined borne on the chuck assembly; still be provided with the water conservancy diversion structure on cooling module's the top surface, the water conservancy diversion structure be used for with the part cooling gas water conservancy diversion that the blow vent blew off extremely the heater bottom with the corresponding within range in chuck subassembly edge region.
In an embodiment of the present application, the flow guiding structure includes a partition cylinder and a flow guiding ring, the partition cylinder is disposed on the top surface of the cooling module, and a peripheral wall of the partition cylinder is close to an edge of the top surface of the cooling module, and the inside and the outside of the partition cylinder are provided with the air vents; the inner edge of the guide ring is connected with the top end of the separating cylinder, the bottom surface of the guide ring and the outer peripheral surface of the separating cylinder form a preset included angle, and the preset included angle is larger than 90 degrees and smaller than 180 degrees.
In an embodiment of the present application, the cooling assembly includes a uniform flow plate and an air channel plate stacked in sequence, and the vent holes are penetrated in a thickness direction of the uniform flow plate; the air flow channel comprises a first air flow channel and a second air flow channel, the top surface of the air channel plate is provided with a groove, and the bottom surface of the uniform flow plate is matched with the groove to form the first air flow channel and the second air flow channel; the first gas flow channel is arranged corresponding to the middle area of the chuck assembly, and the second gas flow channel is arranged around the first gas flow channel and is arranged corresponding to the edge area of the chuck assembly.
In an embodiment of the present application, the air vent includes a plurality of first through holes and a plurality of second through holes, the plurality of first through holes are located in a projection range of the first air flow channel, and the plurality of second through holes are located in a projection range of the second air flow channel.
In an embodiment of the application, the cooling module further includes a cooling plate stacked at the bottom of the air channel plate, a plurality of cooling channels are arranged in the cooling plate, the plurality of cooling channels are arranged in parallel along the radial direction of the cooling plate, the arrangement density of the cooling channels at the bottom of the first air channel is smaller than the arrangement density of the cooling channels at the bottom of the second air channel, and the cooling channels are used for introducing a cooling medium to cool the cooling module.
In an embodiment of the present application, a plurality of heat dissipation fins are further disposed on the top surface of the uniform flow plate, and the plurality of heat dissipation fins are concentrically nested on the uniform flow plate.
In an embodiment of the present application, the cooling assembly further includes a supporting structure disposed at a bottom of the cooling plate for supporting the cooling plate.
In an embodiment of the application, the carrying device further includes a base, a sleeve is disposed on a bottom surface of the heater, the sleeve is disposed on a top of the base, the sleeve and the base cooperate to form the cooling space, and the base is further configured to carry the supporting structure.
In an embodiment of the present application, the cooling element is disposed at a bottom of the cooling space and spaced apart from the heater in an axial direction of the cooling space.
In a second aspect, an embodiment of the present application provides a semiconductor processing apparatus, comprising a process chamber and the carrying device as provided in the first aspect, the carrying device being disposed in the process chamber.
The technical scheme provided by the embodiment of the application has the following beneficial technical effects:
the embodiment of the application provides a load bearing device, set up in the process chamber of semiconductor process equipment for bear and treat the machined part, this load bearing device includes: the chuck assembly, the heater and the cooling assembly; the chuck assembly is arranged on the heater and used for bearing and fixing a workpiece to be machined; the heater is used for heating a workpiece to be processed, and the bottom of the heater is provided with a cooling space; the cooling assembly is arranged in the cooling space. According to the embodiment of the application, the cooling assembly blows the cooling gas to the bottom of the heater to cool, so that the workpiece to be machined can be cooled without being naturally cooled to a preset temperature, and the process speed is greatly improved; and the condition that the workpiece to be machined is broken due to the fact that the temperature of the cooling water pipe is low is avoided, and therefore the process yield is greatly improved. In addition, because the flow guide structure arranged on the cooling assembly can guide the cooling gas to the edge area of the chuck assembly, the cooling speed of the edge area and the cooling speed of the middle area of the workpiece to be processed are the same, the temperature uniformity of the workpiece to be processed is greatly improved, and the process yield and the economic benefit are greatly improved.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic cross-sectional structural diagram of a carrying device according to an embodiment of the present disclosure;
fig. 2 is a schematic cross-sectional structural diagram of a semiconductor processing apparatus according to an embodiment of the present disclosure;
fig. 3 is a schematic cross-sectional structure diagram of a semiconductor processing apparatus provided in the prior art.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.
The embodiment of the application provides a bearing device, which is arranged in a process chamber of semiconductor process equipment and used for bearing a workpiece to be processed, and a schematic structural diagram of the bearing device is shown in fig. 1 and comprises: the device comprises a chuck component 1, a heater 2 and a cooling component 3; the chuck assembly 1 is arranged on the heater 2 and is used for bearing and fixing a workpiece to be processed (not shown in the figure); the heater 2 is used for heating a workpiece to be processed, and the bottom of the heater 2 is provided with a cooling space 21; the cooling assembly 3 is arranged in the cooling space 21, the cooling assembly 3 is internally provided with an air channel 31, the top surface of the cooling assembly 3 is provided with an air vent 32 communicated with the air channel 31, the air channel 31 is used for introducing cooling gas and blows the cooling gas to the bottom of the heater 2 through the air vent 32, so that the heater 2 cools a workpiece to be machined borne on the chuck assembly 1; the top surface of the cooling assembly 3 is further provided with a flow guide structure 4, and the flow guide structure 4 is used for guiding part of the cooling gas blown out from the air vent 32 to the range of the bottom of the heater 2 corresponding to the edge area of the chuck assembly 1.
As shown in fig. 1, the chuck assembly 1 may specifically include an electrostatic chuck 11 and a pressing ring 12, the electrostatic chuck 11 is disposed on a top surface of the heater for carrying and fixing a workpiece to be processed, specifically a wafer, but the embodiment of the present invention does not limit the chuck assembly 1 and the specific type of the workpiece to be processed. The pressing ring 12 is sleeved on the outer periphery of the electrostatic chuck 11 and connected to the heater 2 for fixing the electrostatic chuck 11 to the heater 2, but the embodiment of the present application is not limited thereto, and for example, the electrostatic chuck 11 may be disposed on the top surface of the heater 2 by an adhesive method. The heater 2 may be provided therein with a heating wire, which is connected to a power supply for heating a workpiece to be processed when a process is performed. The heater 2 has a cooling space 21 at the bottom thereof for isolating a vacuum environment of the process chamber, the cooling module 3 is disposed in the cooling space 21, and the cooling space 21 has an exhaust port (not shown) for exhausting the cooling gas in the cooling space 21. The cooling assembly 3 is formed with a flow channel 31, and a top surface thereof is opened with a vent 32 communicated with the flow channel 31, the flow channel 31 is communicated with a cooling air source (not shown in the figure), the vent 32 is used for blowing cooling air in the flow channel 31 to the bottom of the heater 2, so that the heater 2 cools a workpiece to be processed carried on the chuck assembly 1. The cooling gas source may be an inert gas source such as argon or nitrogen, or may be a dry gas source, but the embodiment of the present application is not limited thereto. The top surface of the cooling assembly 3 is provided with a flow guiding structure 4, and the flow guiding structure 4 can guide part of the gas blown out from the air vents 32 to the edge region of the cooling space 21 so as to increase the cooling speed of the heater 2 in the range corresponding to the edge region of the chuck assembly 1, thereby increasing the cooling speed of the edge region of the workpiece to be processed.
According to the embodiment of the application, the cooling assembly blows the cooling gas to the bottom of the heater to cool, so that the workpiece to be machined can be cooled without being naturally cooled to a preset temperature, and the process speed is greatly improved; and the condition that the workpiece to be machined is broken due to the fact that the temperature of the cooling water pipe is low is avoided, and therefore the process yield is greatly improved. In addition, the flow guide structure can guide cooling gas to the edge area of the chuck assembly, so that the cooling speed of the edge area and the cooling speed of the middle area of the workpiece to be machined are the same, the temperature uniformity of the workpiece to be machined is greatly improved, and the process yield and the economic benefit are greatly improved.
It should be noted that the embodiment of the present application is not limited to the specific implementation of the heater 2, and for example, other types of heaters may be used for the heater 2. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1, the flow guiding structure 4 includes a partition cylinder 41 and a flow guiding ring 42, the partition cylinder 41 is disposed on the top surface of the cooling module 3, and the peripheral wall of the partition cylinder 41 is close to the edge of the top surface of the cooling module 3, and the partition cylinder 41 has air vents 32 on the inner side and the outer side; the inner edge of the deflector ring 42 is connected with the top end of the separating tube 41, and the bottom surface of the deflector ring 42 and the outer peripheral surface of the separating tube 41 form a preset included angle which is larger than 90 degrees and smaller than 180 degrees.
As shown in fig. 1, the partition cylinder 41 is a cylindrical structure made of metal, the peripheral wall of the partition cylinder 41 can be located on the top surface of the cooling module 3 near the edge, and the inside and the outside of the partition cylinder 41 are provided with the air vents 32. The bottom end of the separation cylinder 41 is fixedly connected with the top surface of the cooling module 3 by welding, for example, but the embodiment of the present application is not limited to a specific connection manner. The deflector ring 42 may be made of metal material to form a ring-shaped plate structure. The inner edge of the deflector ring 42 is fixedly connected to the top end of the partition cylinder 41 by welding, for example, the outer edge of the deflector ring 42 extends obliquely upward from the outside of the partition cylinder 41, so that a preset included angle is formed between the bottom surface of the deflector ring 42 and the outer peripheral surface of the partition cylinder 41, and the preset included angle may be a value such as 95 degrees, 120 degrees, 140 degrees or 170 degrees, but the present application is not limited thereto, and the setting can be adjusted by a person skilled in the art as required. Further, the space enclosed by the inner side of the partition cylinder 41 is aligned with the middle area of the chuck assembly 1, so that the vent 32 positioned at the inner side of the partition cylinder 41 can directly blow gas to the range of the bottom of the heater 2 corresponding to the middle area of the chuck assembly 1; and the air vents 32 on the outer side of the partition cylinder 41 are blown to the bottom of the heater 2 in the range corresponding to the edge area of the chuck assembly 1 under the guiding action of the deflector ring 42, so that the cooling gas is guided.
It should be noted that the embodiments of the present application are not limited to the specific implementation of the flow guiding structure 4, for example, the separating cylinder 41 and the flow guiding ring 42 are integrally formed, or the flow guiding structure 4 has a structure with similar effects. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1, the cooling assembly 3 includes a flow-equalizing plate 33 and an air duct plate 34 stacked in sequence, wherein an air vent is formed through the flow-equalizing plate 33 in a thickness direction; the air channel 31 includes a first air channel 311 and a second air channel 312, a groove is formed on the top surface of the air channel plate 34, and the bottom surface of the uniform flow plate 33 is matched with the groove to form the first air channel 311 and the second air channel 312; the first gas flow passage 311 is provided corresponding to a central region of the chuck assembly 1, and the second gas flow passage 312 is provided around the first gas flow passage 311 and is provided corresponding to an edge region of the chuck assembly 1.
As shown in fig. 1, the flow equalizing plate 33 and the air duct plate 34 may be both made of a plate-like structure made of a metal material, and both are stacked by brazing, but the embodiment of the present invention is not limited to a specific connection method, and for example, the flow equalizing plate and the air duct plate are fixedly connected by bonding, bolting, or the like. The air vent 32 is inserted through the flow equalizing plate 33 in the thickness direction. The air channel 31 may include a first air channel 311 and a second air channel 312, a circular groove and an annular groove may be formed on the top surface of the air channel plate 34, and the flow-equalizing plate 33 covers the upper portion of the air channel plate 34, so that the bottom surface of the flow-equalizing plate 33, the circular groove and the annular groove surround to form the first air channel 311 and the second air channel 312. The first air flow channel 311 is disposed corresponding to a middle region of the chuck assembly 1 for cooling the middle region of the workpiece, and the second air flow channel 312 corresponds to an edge region of the chuck assembly 1 for cooling the edge region of the workpiece. By adopting the above design, the first air flow channel 311 and the second air flow channel 312 respectively correspond to different regions of the chuck assembly 1, and different regions of the workpiece to be processed can be respectively cooled, so that the overall temperature uniformity of the workpiece to be processed is greatly improved, and the process yield of the embodiment of the application is greatly improved. In addition, the design also enables the structure of the embodiment of the application to be simple and easy to use, thereby greatly reducing the application and maintenance cost.
It should be noted that the number and arrangement of the first air flow channels 311 and the second air flow channels 312 are not limited in the embodiments of the present application, for example, the first air flow channels 311 and the second air flow channels 312 are all multiple and are concentrically nested. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1, the air vent 32 includes a plurality of first through holes 321 and a plurality of second through holes 322, the plurality of first through holes 321 are located in a projection range of the first air flow channel 311, and the plurality of second through holes 322 are located in a projection range of the second air flow channel 312.
As shown in fig. 1, the first through holes 321 may be arranged as a plurality of circular rings, which are concentrically disposed and concentrically nested with the top surface of the uniform flow plate 33, and are all located within a projection range of the first air flow passage 311, i.e., within a range corresponding to the circular groove. The first through holes 321 may be arranged in a uniform or non-uniform manner, and the first through holes 321 may be a combination of circular holes and irregular holes or any one of the circular holes and the irregular holes. The plurality of second through holes 322 may be arranged in more than one circular ring, for example, two circular rings are concentrically nested with the top surface of the uniform flow plate 33, and are located in the projection range of the second flow channel 312, i.e., in the range corresponding to the annular groove. The second through holes 322 may be arranged in a uniform or non-uniform manner, and the second through holes 322 may be a combination of circular holes and irregular holes or any one of them. By adopting the above design, the first air channel 311 and the second air channel 312 correspond to different through holes respectively, so that the embodiment of the present application is convenient for flexible control, for example, when the cooling rate of the edge area is low, the cooling rate can be adjusted by adjusting the air flow in the second air channel 311. In addition, the arrangement and shape of the first through holes 321 and the second through holes 322 can be adjusted, so that the applicability and the application range can be greatly improved.
In an embodiment of the present application, as shown in fig. 1, the cooling module 3 further includes a cooling plate 35 stacked at the bottom of the air channel plate 34, a plurality of cooling channels 351 are further disposed in the cooling plate 35, the plurality of cooling channels 351 are arranged in parallel along a radial direction of the cooling plate 35, an arrangement density of the cooling channels 351 at the bottom of the first air channel 311 is smaller than an arrangement density of the cooling channels 351 at the bottom of the second air channel 312, and the cooling channels 351 are used for introducing a cooling medium to cool the cooling module 3.
As shown in fig. 1, a plurality of cooling channels 351 may be directly formed in the cooling plate 35, or a plurality of annular grooves may be formed in the cooling plate 35, and the plurality of annular grooves cooperate with the air duct plate 34 to form the cooling channels 351. The cooling channels 351 may be arranged in the cooling plate 35 in a concentric nested manner, and the cooling channels 351 may be located in the corresponding projection areas of the first air channel 311 and the second air channel 312, and the cooling channels 351 may be specifically connected to a cooling source, so as to introduce a cooling medium to further cool the cooling component 3 and the cooling gas in the first air channel 311 and the second air channel 312, thereby further increasing the cooling rate of the workpiece to be processed. The cooling medium may specifically be a cooling liquid or a cooling gas, but this is not limited in the embodiments of the present application. Further, the arrangement density of the cooling flow channel 351 in the range corresponding to the first air flow channel 311 is relatively loose, and the arrangement density in the range corresponding to the second air flow channel 312 is relatively tight, that is, the arrangement density of the cooling flow channel 351 at the bottom of the first air flow channel 311 is smaller than the arrangement density of the cooling flow channel 351 at the bottom of the second air flow channel 312, so that the cooling rate of the edge of the workpiece to be machined is further increased, and the temperature uniformity of the workpiece to be machined is further increased.
It should be noted that, in the embodiment of the present application, the specific number and arrangement of the cooling channels 351 are not limited, for example, one cooling channel 351 is arranged in a spiral shape. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1, a plurality of heat dissipation fins 331 are further disposed on the top surface of the flow equalizing plate 33, and the plurality of heat dissipation fins 331 are concentrically nested on the flow equalizing plate 33. Specifically, the heat dissipation fins 331 may be a circular sleeve structure integrally formed with the flow equalizing plate 33, and a plurality of heat dissipation fins 331 are concentrically nested on the flow equalizing plate 33, for example, and are spaced from a circular ring surrounded by the plurality of first through holes 321, but the embodiment of the present invention is not limited thereto. Further, in order to avoid the interference of the heat dissipation fins 331 on the flow guiding effect of the flow guiding structure 4, the heat dissipation fins 331 are only disposed inside the separation cylinder 41 of the flow guiding structure 4, but the embodiment of the present application is not limited thereto. With the above design, the heat dissipating fins 331 can increase the contact area and the heat conduction area between the cooling module 3 and the cooling gas in the cooling space 21, thereby further increasing the cooling rate. It should be noted that, the specific shape and arrangement of the heat dissipation fins 331 are not limited in the embodiments of the present application, and those skilled in the art can adjust the arrangement according to actual situations.
In an embodiment of the present application, as shown in fig. 1, the cooling module 3 further includes a supporting structure 36, and the supporting structure 36 is disposed at the bottom of the cooling plate 35 for supporting the cooling plate 35. Specifically, the supporting structure 36 may be a ring-shaped structure made of a metal material, and the supporting structure 36 is concentrically disposed at the bottom of the cooling plate 35 by, for example, brazing, and is used for supporting the cooling plate 35, the air duct plate 34, and the uniform flow plate 33. However, the embodiment of the present application is not limited thereto, for example, the supporting structure 36 may further include a plurality of supporting pillars uniformly arranged along the circumferential direction of the cooling plate 35 for supporting the cooling plate 35, the air duct plate 34 and the uniform flow plate 33. With the above design, the supporting structure 36 can reduce the contact area of the inner wall of the cooling space 21, and can avoid heat conduction between the heater 2 and the cooling module 3, thereby further improving the cooling effect of the embodiment of the present application, and further making the application implement simple structure, thereby greatly reducing the application and maintenance cost. It should be noted that, the embodiment of the present application is not limited to the specific structure and material of the supporting structure 36, and those skilled in the art can adjust the setting according to the actual situation.
In an embodiment of the present application, as shown in fig. 1, the carrying device further includes a base 5, a sleeve 22 is disposed on a bottom surface of the heater 2, the sleeve 22 is disposed on a top portion of the base 5, the sleeve 22 and the base 5 cooperate to form a cooling space 21, and the base 5 is further used for carrying a supporting structure 36. Specifically, a cylindrical sleeve 22 is integrally formed at the edge of the bottom surface of the heater 2, and the sleeve 22 may also be in a split structure with the heater 2 and fixedly connected with the bottom surface of the heater 2 by brazing. The sleeve 22 may be attached to the top of the base 5 and connected to the base 5 to form the cooling space 21, for example, the base 5 may be clearance fitted with the sleeve 22 so that the cooling space 21 can communicate between the inside and the outside of the space. The heater 2 may be disposed in a process chamber (not shown) of a semiconductor apparatus through a susceptor 5. The base 5 specifically comprises a support tube and an annular bearing plate arranged on top of the support tube, the bearing plate is used for cooperating with the sleeve 22 to form the cooling space 21, and the support structure 36 can be arranged on the bearing plate, so that the embodiment of the present application is easy to disassemble, assemble and maintain; the stay tube adopts hollow structure can be convenient for set up various pipe fittings and cable to make this application embodiment simple structure, and can also save space occupancy by a wide margin.
It should be noted that in not all embodiments of the present application, a base is not required, and in some embodiments, the bottom of the sleeve 22 may be provided with an end cap to form the cooling space 21. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In one embodiment of the present application, as shown in fig. 1, the cooling element 3 is disposed at the bottom of the cooling space 21 and spaced from the heater 2 in the axial direction of the cooling space 21. Specifically, the cooling module 3 is disposed at the bottom of the cooling space 21, and a preset distance is provided between the top surface of the cooling module 3 and the bottom surface of the heater 2, that is, the cooling module 3 and the heater 2 are spaced in the axial direction of the cooling space 21, and due to the preset distance therebetween, convection is generated after the gas is blown to the bottom surface of the heater 2, so as to increase the gas flowing speed in the cooling space 21, and thus the cooling effect of the embodiment of the present application is greatly improved. It should be noted that, the embodiment of the present application does not limit the specific value of the preset distance, and a person skilled in the art can adjust the setting according to actual situations.
Based on the same inventive concept, the present application provides a semiconductor processing apparatus, as shown in fig. 2, including a process chamber 100 and a carrying device 101 provided in the above embodiments, wherein the carrying device 101 is disposed in the process chamber 100.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
according to the embodiment of the application, the cooling assembly blows the cooling gas to the bottom of the heater to cool, so that the workpiece to be machined can be cooled without being naturally cooled to a preset temperature, and the process speed is greatly improved; and the condition that the workpiece to be machined is broken due to the fact that the temperature of the cooling water pipe is low is avoided, and therefore the process yield is greatly improved. In addition, the flow guide structure can guide cooling gas to the edge area of the chuck assembly, so that the cooling speed of the edge area and the cooling speed of the middle area of the workpiece to be machined are the same, the temperature uniformity of the workpiece to be machined is greatly improved, and the process yield and the economic benefit are greatly improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (10)
1. A bearing device is arranged in a process chamber of semiconductor process equipment and used for bearing a workpiece to be processed, and is characterized by comprising: the chuck assembly, the heater and the cooling assembly;
the chuck assembly is arranged on the heater and is used for bearing and fixing the workpiece to be machined; the heater is used for heating the workpiece to be processed, and the bottom of the heater is provided with a cooling space;
the cooling assembly is arranged in the cooling space, a gas channel is arranged in the cooling assembly, a vent hole which is respectively communicated with the gas channel and the cooling space is formed in the top surface of the cooling assembly, the gas channel is used for introducing cooling gas, and the cooling gas flowing into the cooling space through the vent hole is diffused towards the bottom of the heater, so that the heater cools a workpiece to be machined which is borne on the chuck assembly;
still be provided with the water conservancy diversion structure on cooling module's the top surface, the water conservancy diversion structure be used for with the part cooling gas water conservancy diversion that the blow vent blew off extremely the heater bottom with the corresponding within range in chuck subassembly edge region.
2. The carrying device as claimed in claim 1, wherein the flow guiding structure comprises a partition cylinder and a flow guiding ring, the partition cylinder is disposed on the top surface of the cooling module, the peripheral wall of the partition cylinder is close to the edge of the top surface of the cooling module, and the inside and the outside of the partition cylinder are provided with the air vents; the inner edge of the guide ring is connected with the top end of the separating cylinder, the bottom surface of the guide ring and the outer peripheral surface of the separating cylinder form a preset included angle, and the preset included angle is larger than 90 degrees and smaller than 180 degrees.
3. The carrier in accordance with claim 1 wherein the cooling module comprises a flow homogenizing plate and an air duct plate stacked in sequence, the flow homogenizing plate having the vent holes formed therethrough in a thickness direction; the air flow channel comprises a first air flow channel and a second air flow channel, the top surface of the air channel plate is provided with a groove, and the bottom surface of the uniform flow plate is matched with the groove to form the first air flow channel and the second air flow channel; the first gas flow channel is arranged corresponding to the middle area of the chuck assembly, and the second gas flow channel is arranged around the first gas flow channel and is arranged corresponding to the edge area of the chuck assembly.
4. The carrier of claim 3 wherein the vent includes a plurality of first through holes and a plurality of second through holes, the plurality of first through holes being located within a projected range of the first gas flow channel, the plurality of second through holes being located within a projected range of the second gas flow channel.
5. The carrier apparatus according to claim 4 wherein the cooling module further comprises a cooling plate stacked on the bottom of the air channel plate, the cooling plate has a plurality of cooling channels disposed therein, the plurality of cooling channels are arranged in parallel along the radial direction of the cooling plate, and the density of the cooling channels arranged on the bottom of the first air channel is less than the density of the cooling channels arranged on the bottom of the second air channel, the cooling channels are used for introducing a cooling medium to cool the cooling module.
6. The carrier device according to claim 3, wherein a plurality of heat dissipation fins are further arranged on the top surface of the flow homogenizing plate, and the plurality of heat dissipation fins are concentrically nested on the flow homogenizing plate.
7. The carrier in claim 5, wherein the cooling assembly further comprises a support structure disposed at a bottom of the cooling plate for supporting the cooling plate.
8. The carrier in accordance with claim 7 further comprising a base, wherein a sleeve is disposed on a bottom surface of the heater, wherein the sleeve is disposed on a top portion of the base, wherein the sleeve cooperates with the base to form the cooling space, and wherein the base is further configured to carry the support structure.
9. The carrier in accordance with claim 1 wherein the cooling assembly is disposed at a bottom of the cooling space and spaced from the heater in an axial direction of the cooling space.
10. A semiconductor processing apparatus comprising a process chamber and the carrier of any of claims 1-9 disposed within the process chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110139550.1A CN112466809B (en) | 2021-02-02 | 2021-02-02 | Semiconductor process equipment and bearing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110139550.1A CN112466809B (en) | 2021-02-02 | 2021-02-02 | Semiconductor process equipment and bearing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112466809A CN112466809A (en) | 2021-03-09 |
| CN112466809B true CN112466809B (en) | 2021-06-08 |
Family
ID=74802526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110139550.1A Active CN112466809B (en) | 2021-02-02 | 2021-02-02 | Semiconductor process equipment and bearing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112466809B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111607785A (en) * | 2020-05-26 | 2020-09-01 | 北京北方华创微电子装备有限公司 | Heating device and semiconductor processing equipment |
| CN113517211B (en) * | 2021-04-16 | 2024-05-17 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and film deposition method |
| CN113604786B (en) * | 2021-07-06 | 2024-05-17 | 北京北方华创微电子装备有限公司 | Heater of semiconductor device and semiconductor device |
| CN115101444B (en) * | 2022-06-22 | 2023-07-14 | 北京北方华创微电子装备有限公司 | Bearing device and semiconductor process equipment |
| CN115513103A (en) * | 2022-11-23 | 2022-12-23 | 西安奕斯伟材料科技有限公司 | Device for back sealing silicon wafer |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101092122B1 (en) * | 2010-02-23 | 2011-12-12 | 주식회사 디엠에스 | Gas injection system for etching profile control |
| CN109148252A (en) * | 2018-08-28 | 2019-01-04 | 德淮半导体有限公司 | Etching apparatus and crystal edge lithographic method |
| CN111607785A (en) * | 2020-05-26 | 2020-09-01 | 北京北方华创微电子装备有限公司 | Heating device and semiconductor processing equipment |
-
2021
- 2021-02-02 CN CN202110139550.1A patent/CN112466809B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN112466809A (en) | 2021-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112466809B (en) | Semiconductor process equipment and bearing device | |
| WO2021238955A1 (en) | Heating apparatus and semiconductor processing device | |
| US20110180233A1 (en) | Apparatus for controlling temperature uniformity of a showerhead | |
| CN112509954B (en) | Semiconductor process equipment and bearing device thereof | |
| US10386126B2 (en) | Apparatus for controlling temperature uniformity of a substrate | |
| WO2009086013A2 (en) | Method and apparatus for controlling temperature of a substrate | |
| JP2011500961A (en) | Chemical vapor deposition reactor | |
| KR20020061714A (en) | Shower head & film forming apparatus having the same | |
| US11952653B2 (en) | Sputtering reaction chamber and process assembly of sputtering reaction chamber | |
| WO2014086283A1 (en) | Electrostatic chuck and plasma processing device | |
| CN112593199B (en) | Semiconductor process equipment and bearing device | |
| US9460946B2 (en) | Substrate processing apparatus and heating equipment | |
| US9847240B2 (en) | Constant mass flow multi-level coolant path electrostatic chuck | |
| US20210351016A1 (en) | Shield cooling assembly, reaction chamber and semiconductor processing apparatus | |
| CN112593208B (en) | Semiconductor processing equipment | |
| CN107680915B (en) | Plasma source cooling mechanism and semiconductor processing equipment | |
| US5985089A (en) | Plasma etch system | |
| US20220205092A1 (en) | Coating device and carrier seat thereof | |
| CN104835761A (en) | Temperature-controllable heating disc enabling peripheral outgassing | |
| CN117916405A (en) | Heated lid for process chamber | |
| CN112011774B (en) | Semiconductor equipment, semiconductor chamber thereof and semiconductor cooling method | |
| CN106856188B (en) | Bearing device and semiconductor processing equipment | |
| CN114005781A (en) | Bearing device and semiconductor process chamber | |
| CN114686855B (en) | Nozzle device and film forming apparatus | |
| CN220984500U (en) | Wafer bearing device and semiconductor process equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |