CN112449679A - 前驱物输送系统及其相关方法 - Google Patents

前驱物输送系统及其相关方法 Download PDF

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Publication number
CN112449679A
CN112449679A CN201980048382.6A CN201980048382A CN112449679A CN 112449679 A CN112449679 A CN 112449679A CN 201980048382 A CN201980048382 A CN 201980048382A CN 112449679 A CN112449679 A CN 112449679A
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China
Prior art keywords
gas
window
diborane
windows
radiation
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Pending
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CN201980048382.6A
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English (en)
Chinese (zh)
Inventor
黄祖滨
S·L·怀特
J·R·巴基
D·N·凯德拉亚
J·C·罗查
F·阮
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN112449679A publication Critical patent/CN112449679A/zh
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
    • G01N15/02Investigating particle size or size distribution
    • G01N15/0205Investigating particle size or size distribution by optical means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
    • G01N15/06Investigating concentration of particle suspensions
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G01N21/3504Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dispersion Chemistry (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Chemical Vapour Deposition (AREA)
CN201980048382.6A 2018-07-31 2019-07-09 前驱物输送系统及其相关方法 Pending CN112449679A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862712627P 2018-07-31 2018-07-31
US62/712,627 2018-07-31
PCT/US2019/041056 WO2020027991A1 (en) 2018-07-31 2019-07-09 Precursor delivery system and methods related thereto

Publications (1)

Publication Number Publication Date
CN112449679A true CN112449679A (zh) 2021-03-05

Family

ID=69231289

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980048382.6A Pending CN112449679A (zh) 2018-07-31 2019-07-09 前驱物输送系统及其相关方法

Country Status (5)

Country Link
JP (1) JP7485652B2 (ko)
KR (1) KR20210027267A (ko)
CN (1) CN112449679A (ko)
SG (1) SG11202010408SA (ko)
WO (1) WO2020027991A1 (ko)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101010446A (zh) * 2004-07-27 2007-08-01 应用材料公司 封闭回路清洁气体方法和系统
CN104513970A (zh) * 2014-12-25 2015-04-15 贵州大学 一种制备硼化镁超导薄膜的装置及其制备方法
CN105651729A (zh) * 2014-12-02 2016-06-08 株式会社堀场Stec 分解检测装置、浓度测量装置和浓度控制装置
CN205301167U (zh) * 2015-12-28 2016-06-08 保定市北方特种气体有限公司 一种气体浓度检测装置
US9388491B2 (en) * 2012-07-23 2016-07-12 Novellus Systems, Inc. Method for deposition of conformal films with catalysis assisted low temperature CVD
CN108220922A (zh) * 2016-12-15 2018-06-29 东京毅力科创株式会社 成膜方法、硼膜以及成膜装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000178734A (ja) 1998-12-18 2000-06-27 Tokyo Electron Ltd タングステン膜の成膜方法
US6592817B1 (en) 2000-03-31 2003-07-15 Applied Materials, Inc. Monitoring an effluent from a chamber
US20020152797A1 (en) * 2001-01-09 2002-10-24 Mcandrew James J.F. Gas delivery apparatus and method for monitoring a gas phase species therein
US7129519B2 (en) 2002-05-08 2006-10-31 Advanced Technology Materials, Inc. Monitoring system comprising infrared thermopile detector
US6947138B2 (en) 2003-06-16 2005-09-20 Advanced Technology Materials, Inc. Optical sensor system and method for detection of hydrides and acid gases
KR101241922B1 (ko) * 2005-06-22 2013-03-11 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 통합 가스 배합 장치 및 방법
JP2007285842A (ja) 2006-04-17 2007-11-01 Nippon Koden Corp ガス濃度測定装置
JP6795371B2 (ja) * 2016-10-14 2020-12-02 株式会社神鋼エンジニアリング&メンテナンス ホウ素濃度計及びホウ素濃度の推定方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101010446A (zh) * 2004-07-27 2007-08-01 应用材料公司 封闭回路清洁气体方法和系统
US9388491B2 (en) * 2012-07-23 2016-07-12 Novellus Systems, Inc. Method for deposition of conformal films with catalysis assisted low temperature CVD
CN105651729A (zh) * 2014-12-02 2016-06-08 株式会社堀场Stec 分解检测装置、浓度测量装置和浓度控制装置
CN104513970A (zh) * 2014-12-25 2015-04-15 贵州大学 一种制备硼化镁超导薄膜的装置及其制备方法
CN205301167U (zh) * 2015-12-28 2016-06-08 保定市北方特种气体有限公司 一种气体浓度检测装置
CN108220922A (zh) * 2016-12-15 2018-06-29 东京毅力科创株式会社 成膜方法、硼膜以及成膜装置

Also Published As

Publication number Publication date
SG11202010408SA (en) 2021-02-25
JP7485652B2 (ja) 2024-05-16
JP2021532592A (ja) 2021-11-25
WO2020027991A1 (en) 2020-02-06
KR20210027267A (ko) 2021-03-10

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