CN112447697A - 包括光学电子组件的电子设备以及制造方法 - Google Patents

包括光学电子组件的电子设备以及制造方法 Download PDF

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CN112447697A
CN112447697A CN202010908261.9A CN202010908261A CN112447697A CN 112447697 A CN112447697 A CN 112447697A CN 202010908261 A CN202010908261 A CN 202010908261A CN 112447697 A CN112447697 A CN 112447697A
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R·科菲
R·布雷希格纳克
J-M·里维雷
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STMicroelectronics Grenoble 2 SAS
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Abstract

本公开的实施例涉及包括光学电子组件的电子设备以及制造方法。不透明的电介质载体和限制基板由在彼此上层叠的层的堆叠形成。该堆叠包括实心背层和前框架，前框架具有外围壁和中间分隔件，前框架界定两个腔体，该两个腔体位于实心背层之上并且在中间分隔件的任一侧上。电子集成电路(IC)芯片位于腔体内部，并且被安装在实心背层之上。每个IC芯片包括集成光学元件。在IC芯片和实心背层的背侧电接触部之间提供电连接。透明的密封块被模制在腔体中以将IC芯片嵌入。

Description

包括光学电子组件的电子设备以及制造方法
优先权要求
本申请要求于2019年09月03日提交的法国专利申请号1909671的优先权权益，其内容在法律允许的最大范围内通过引用以其整体并入本文。
技术领域
本发明涉及微电子领域，并且更具体地涉及包括电子IC芯片的电子设备领域，该电子IC芯片包括光发射和/或光接收集成光学元件。
背景技术
已知的电子设备包括具有电连接网络的载体基板、光发射电子集成电路(IC)芯片和光接收电子IC芯片，所述IC芯片以一定的间隔被安装在载体基板的一个面之上，并且电子设备包括封装盖体，封装盖体被安装在载体基板的所述面上，并且界定电子IC芯片分别位于其中的腔室，该封装盖体具有面对电子IC芯片的光学元件的开口，在该开口中通常提供光学元件滤光器。
这种电子设备要求大量的制造和安装操作。
发明内容
根据一个实施例，提出了一种电子设备，该电子设备包括：不透明的电介质载体和限制基板(carrier and confinement substrate)，其包括在彼此之上层叠的几个层，包括实心背层和前框架，前框架包括外围壁和中间分隔件，以便在该中间分隔件的任一侧上、并且在实心背层之上界定两个腔体；电子集成电路(IC)芯片，分别位于腔体内并且被安装在实心背层之上，这些IC芯片包括集成光学元件；电连接，在IC芯片与实心背层的背侧电接触部之间；以及透明封装块，被模制在腔体中，并且IC芯片被嵌入在其中。
上述布置特别适合，特别是在IC芯片较薄的情况下，因为载体和限制基板也可以较薄，从而产生薄的设备。
电连接可以包括在腔体中的电接触部。
电连接可以包括穿过背层的电连接过孔。
电连接可以包括在背层之上的电接触部。
前框架可以包括至少一个层，该至少一个层在背层之上并且设置有形成腔体的开口。
前框架可以包括在背层之上的第一层和在第一层之上的第二层，第一层具有相对于第二层突出到腔体中的部分。
电连接可以包括布置在从第二层突出的部分之上的电接触部。
电连接可以包括布置在从第二层突出的部分之上的电接触部。
电连接可以包括穿过从第二层突出的部分的电连接过孔。
封装块可以包括滤光颗粒。
设备可以包括滤光光学裸片，滤光光学裸片在封装块之上并且面对IC芯片光学元件，并且设备可以包括不透明前层，不透明前层位于框架和封装块之上并且在光学裸片的位置处设置有开口。
电子IC芯片中的一个电子IC芯片的光学元件可以是光发射器，而其他电子IC芯片的光学元件可以是光接收器。
附图说明
现在将通过由附图图示的非限制性示例性实施例来描述电子设备，其中：
图1示出了包括光学电子IC芯片的电子设备的横截面，
图2示出了图1的电子设备的载体和限制基板的多个层的分解透视图，
图3-图6示出了图1的电子设备的制造步骤，
图7示出了图1的电子设备的变型实施例的横截面，以及
图8示出了包括光学电子IC芯片的电子设备的横截面。
具体实施方式
图1中图示的电子设备1包括载体和限制基板2，其包括堆叠并且在彼此之上层叠的几个层。
载体和限制基板2包括层的堆叠，层的堆叠包括实心背层3和前框架4，前框架4包括外围壁5和中间分隔件6，中间分隔件6接合外围壁5的两个相对的分支(limb)，以便界定两个腔体7和8，两个腔体7和8在中间分隔件6的任一侧上并且在实心背层3之上。
载体和限制基板2由不透明的电介质材料(例如环氧树脂)制成。
实心背层3和前框架4具有例如一致的正方形或矩形轮廓。前框架4具有相对的纵向分支和相对的横向分支，中间分隔件6接合纵向分支。
更具体地，前框架4包括在实心背层3之上(并与其接触)的第一层9和在第一层9之上(并与其接触)的第二层10。第一层9和第二层10具有一致的轮廓。
第一层9具有开口11和12，并且第二层具有开口13和14。分别位于彼此之上的开口11和12以及开口13和14形成腔体7和8。
第一层9具有相对于第二层10突出到腔体7和8中的部分15和16，从而形成台阶。
例如，如图1和图2中所图示的，第一层9和第二层10具有一致的轮廓。第一层9和第二层10的纵向分支9a和10a具有相同的宽度。突出部分15和16是由于以下事实而产生的：第一层9的横向分支9b比第二层10的横向分支10b宽。第一层9和第二层10的中间分支9c和10c具有相同的宽度并且在彼此之上，从而形成中间分隔件6。
电子设备1包括光学电子集成电路(IC)芯片17和18，其分别位于腔体7和8中，并且通过介于实心背层3的前面与IC芯片17和18的背面之间的粘合剂的层19和20而被安装在实心背层3之上。IC芯片17和18包括集成光学元件21和22，集成光学元件21和22朝向或面对这些IC芯片17和18的前面定向。
例如，IC芯片17的光学元件21是光发射器，并且IC芯片18的光学元件22是光接收器。
电子设备1包括电连接23和24，电连接23和24将IC芯片17和18连接到载体和限制基板2的实心背层3的背面的背侧电接触部25和26，其穿过实心背层3和前框架4的第一层9。
背侧电接触部25和26被配置成连接到接收基板的电连接网络的垫，电子设备1被安装在该接收基板之上，该接收基板承载电子组件，该电子组件能够通过接收基板的电连接网络以及电连接23和24，与IC芯片17和18交换电信号。
电连接23和24包括电连接过孔27和28，电连接过孔27和28穿过实心背层3，并且在腔体7和8中具有电接触部，该电接触部通过粘合剂的导电层19和20连接到IC芯片17和18的背侧电接触部。
电连接23和24包括电连接过孔29和30和电连接过孔31和32，电连接过孔29和30穿过实心背层3，电连接过孔31和32穿过框架4的第一层9的突出部分15和16。
电连接过孔29和30以及电连接过孔31和32彼此对齐，并且在背层3和第一层9之间的接合(即，安装或附接)表面处彼此连接。电连接23和24包括电线，该电线在腔体7和8中将电连接过孔31和32的前端连接到IC芯片17和18的前侧电接触部。
可选地，载体和限制基板2可以包括电连接网络，该电连接网络允许IC芯片17和18彼此电链接并且电链接到实心背层3的背侧电接触部。
电子设备1包括透明电介质封装块35和36，其被模制在腔体7和8中，并且IC芯片17和18以及电线33和34被嵌入在其中。
透明封装块35和36例如由环氧树脂制成。
有利地，透明封装块35和36的前面35a和36a位于与第二层10的前面10a相同的平面中。
电子设备1可以被单独制造，或者根据现在将要描述的集合制造的模式制造。
如图3中图示的，提供了集合背层3A、集合第一层9A和集合第二层10A，它们以使得与要制造的电子设备1相对应的位点E一致的方式堆叠。有利地，位点E相邻，并且以行和列布置。
在每个位点E，集合背层3A设置有电连接过孔27、28、29和30，集合第一层9A设置有电连接过孔31和32，并且具有开口11和12，并且集合第二层10A具有开口13和14。
层3A、9A和10A压制层叠到彼此上，使得它们彼此粘附并且形成一个单元，并且使得在电连接过孔29、31和30、32之间在层3A和层9A的接合表面处建立电链接。
然后获得设置有电连接的集合载体和限制基板2A。
此后，如图4中图示的，通过粘合剂的导电层19和20，IC芯片17和18被安装和固定在每个位点E的腔体7和8中，并且安装和固定在集合背层3A之上，它们在电连接过孔27和28与IC芯片17和18之间建立电链接。
此后，如图5中图示的，在每个位点E处，电线33和34被放置在IC芯片17和18与电连接过孔31和32的前端之间的位置，电连接过孔31和32的前端位于层9A的前表面的未被层10A覆盖的台阶部分上。
此后，如图6中图示的，在每个位点E处，腔体7和8填充有可浇注的材料，例如树脂。该操作可以在合适的模具中执行，可选地利用插入膜来进行，以避免树脂飞溅。此后，例如通过固化来固定材料，以便形成在腔体7和8中被模制的透明封装块35和36。
此后，沿着位点E之间的间隔的行和列，贯穿集合载体和限制基板2A执行完全切割操作37。
因此，获得了在位点E的位置处被单个化的多个电子设备，每个电子设备对应于参考图1描述的电子设备1。
根据一个变型实施例，封装块35和36的构成材料包括能够形成滤光器(特别地，针对红外辐射)的特定颗粒。
根据图7中图示的另一变型实施例，电子设备1还包括光学裸片38和39，光学裸片38和39允许光穿过，形成例如滤光器(特别是红外辐射滤光器)，并且位于封装块35和36的前面35a和36a之上，面对IC芯片17和18的光学元件21和22(即，与它们竖直对齐)。
例如，光学裸片38和39由滤光树脂制成。
电子设备1还包括不透明前层40，其覆盖封装块35和36的前面35a和36a以及第二层10的前面10a。前层40具有开口41和42，开口41和42面对IC芯片17和18的光学元件21和22。不透明前层40可以由环氧树脂制成。不透明前层40可以被原位产生或者可以是附加的膜。
前层40包括与光学裸片38和39的位置一致的开口41和42。
基于参考图6描述的集合设备并且在其之后放置光学裸片38和39以及前层40。
根据一种制造变型，光学裸片38和39在每个位点E处被固定在封装块35和36的前面35a和36a之上。然后，产生不透明的集合前层，同时形成开口41和42。该操作可以通过溅射执行。该集合前层可以由集合膜形成，该集合膜设置有开口41和42，并且例如通过层叠而连接。此后，上述切割操作37还穿过集合不透明前层而被执行。
根据另一种制造变型，提供了在位点E处设置有光学裸片38和39的集合不透明前层。该集合前层被放置在参考图6描述的集合设备的集合第二层10A和封装块35和36之上，并且该集合层例如通过层叠而连接。此后，上述切割操作37还穿过集合不透明前层而被执行。
根据图8中图示的变形实施例，电子设备101以与电子设备1相同的方式包括不透明的电介质载体和限制基板102，其被层叠并且包括实心背层103和前框架104，以便在实心背层3之上界定两个腔体105和106。
在该情况下，前框架104包括层107，层107具有开口107a和107b，以便形成外围壁108和中间分隔件109，中间分隔件109接合外围壁108的两个相对的分支，腔体105和106被形成在该中间分隔件的任一侧上。
光学电子IC芯片110和111被布置在腔体105和106中，并且通过粘合剂的层112和113被固定在背层103之上。
电连接114和115将IC芯片110和111连接到背侧电接触部116和117。
电连接114和115包括电连接过孔118和119，其等效于电子设备1的电连接过孔27和28，电连接过孔118和119穿过背层103，并且通过粘合剂的导电层112和113连接到IC芯片110和111。
电连接114和115包括电连接过孔120和121，其等效于电子设备1的电连接过孔29和30并且穿过背层103。在该情况下，电线122和123将电连接过孔120和121的端部连接到腔体105和106中的IC芯片110和111的前侧电接触部。
IC芯片110和111以及电线122和123被嵌入在透明封装块124和125中，透明封装块124和125被模制在腔体105和106中，并且等效于电子设备1的透明封装块35和36。
电子设备101以与电子设备1相同的方式制造。
电介质载体和限制基板102通过层叠背层103和层107来制造，背层103设置有电连接过孔118、119、120和121，层107形成框架104。
然后，将IC芯片110和111被固定在背层103之上的腔体105和106中。
然后，电线122和123被放置在适当的位置。
然后，腔体105和106被填充以便形成封装块124和125。
封装块124和125的构成材料可以包括颗粒以便滤光。
电子设备101在封装块124和125之上可以设置有形成滤光器器的光学裸片，光学裸片面对IC芯片的光学元件，并且电子设备101在封装块124和125和层107之上可以设置有不透明前层，所述光学裸片和前层等同于上面参考图7描述的光学裸片38和39以及前层40。

Claims (19)

1.一种电子设备，包括：
不透明的电介质载体和限制基板，包括在彼此之上层叠的层的堆叠，其中所述堆叠包括实心背层和前框架，所述前框架包括外围壁和中间分隔件，以便界定两个腔体，所述两个腔体被定位在所述实心背层上方并且在所述中间分隔件的任一侧上；
电子集成电路(IC)芯片，定位在所述两个腔体中的每个腔体内部并且被安装在所述实心背层之上，其中每个电子IC芯片包括集成光学元件；
电连接，在每个电子IC芯片和所述实心背层的背侧电接触部之间；以及
透明封装块，被模制在所述腔体中，并且将所述电子IC芯片嵌入。
2.根据权利要求1所述的设备，其中每个透明封装块具有与所述前框架的上表面共面的上表面。
3.根据权利要求1所述的设备，其中所述电连接包括：在所述前框架的表面上的所述两个腔体中的电接触部。
4.根据权利要求3所述的设备，其中所述电连接包括：从所述电接触部穿过所述前框架的电连接过孔。
5.根据权利要求4所述的设备，其中所述电连接还包括键合线，所述键合线被嵌入在所述透明封装块中，并且将所述电子IC芯片电连接到所述电接触部。
6.根据权利要求4所述的设备，其中所述电连接包括另外的电连接过孔，所述另外的电连接过孔穿过所述背层，并且电连接到穿过所述前框架的所述电连接过孔。
7.根据权利要求6所述的设备，其中所述电连接还包括在所述背层之上的另外的电接触部，所述另外的电接触部将穿过所述前框架的所述电连接过孔电连接到穿过所述背层的所述另外的电连接过孔。
8.根据权利要求1所述的设备，其中所述前框架包括至少一个层，所述至少一个层被层叠在所述背层之上，并且设置有形成所述两个腔体的开口。
9.根据权利要求1所述的设备，其中所述前框架包括：层叠在所述背层之上的第一层、和层叠在所述第一层之上的第二层，其中所述第一层包括表面部分，所述表面部分突出到所述腔体中并且未被所述第二层覆盖。
10.根据权利要求9所述的设备，其中所述电连接包括：在所述第一层的所述表面部分上的所述两个腔体中的电接触部。
11.根据权利要求10所述的设备，其中所述电连接包括：从所述电接触部穿过所述第一层的电连接过孔。
12.根据权利要求11所述的设备，其中所述电连接还包括键合线，所述键合线被嵌入在所述透明封装块中，并且将所述电子IC芯片电连接到所述电接触部。
13.根据权利要求11所述的设备，其中所述电连接包括另外的电连接过孔，所述另外的电连接过孔穿过所述背层，并且电连接到穿过所述第一层的所述电连接过孔。
14.根据权利要求13所述的设备，其中所述电连接还包括在所述背层之上的另外的电接触部，所述另外的电接触部将穿过所述第一层的所述电连接过孔电连接到穿过所述背层的所述另外的电连接过孔。
15.根据权利要求1所述的设备，其中所述透明封装块由包括滤光颗粒的材料制成。
16.根据权利要求1所述的设备，还包括在每个透明封装块的顶表面上的滤光光学裸片，所述滤光光学裸片被定位为面对所述集成光学元件。
17.根据权利要求16所述的设备，还包括不透明前层，所述不透明前层在所述框架和所述透明封装块之上延伸，并且在每个滤光光学裸片的位置处设置有开口。
18.根据权利要求16所述的设备，其中每个透明封装块具有与所述前框架的上表面共面的上表面，并且其中所述滤光光学裸片被安装到所述透明封装块的共面的所述上表面上。
19.根据权利要求1所述的设备，其中用于所述两个电子IC芯片中的一个电子IC芯片的所述集成光学元件是光发射器，并且其中用于所述两个电子IC芯片中的另一个电子IC芯片的所述集成光学元件是光接收器。
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