CN112405327A - 化学机械研磨设备防碰撞侦测系统 - Google Patents
化学机械研磨设备防碰撞侦测系统 Download PDFInfo
- Publication number
- CN112405327A CN112405327A CN202011280766.1A CN202011280766A CN112405327A CN 112405327 A CN112405327 A CN 112405327A CN 202011280766 A CN202011280766 A CN 202011280766A CN 112405327 A CN112405327 A CN 112405327A
- Authority
- CN
- China
- Prior art keywords
- grinding
- motor
- connecting plate
- fixedly connected
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 67
- 238000001514 detection method Methods 0.000 title claims abstract description 18
- 239000000126 substance Substances 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000005096 rolling process Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011280766.1A CN112405327B (zh) | 2020-11-16 | 2020-11-16 | 化学机械研磨设备防碰撞侦测系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011280766.1A CN112405327B (zh) | 2020-11-16 | 2020-11-16 | 化学机械研磨设备防碰撞侦测系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112405327A true CN112405327A (zh) | 2021-02-26 |
CN112405327B CN112405327B (zh) | 2022-07-15 |
Family
ID=74832413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011280766.1A Active CN112405327B (zh) | 2020-11-16 | 2020-11-16 | 化学机械研磨设备防碰撞侦测系统 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112405327B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203380775U (zh) * | 2013-07-29 | 2014-01-08 | 中芯国际集成电路制造(北京)有限公司 | 研磨装置 |
CN207724094U (zh) * | 2017-12-28 | 2018-08-14 | 德淮半导体有限公司 | 化学机械研磨装置 |
CN209940092U (zh) * | 2019-05-16 | 2020-01-14 | 江苏欧博智能纺织有限公司 | 一种纱线绕线筒放置架 |
CN210574980U (zh) * | 2019-12-13 | 2020-05-19 | 嫩江市城乡规划中心 | 一种城市规划用宣传板 |
CN211498552U (zh) * | 2019-09-29 | 2020-09-15 | 郑志辉 | 一种便于安装的声屏障 |
-
2020
- 2020-11-16 CN CN202011280766.1A patent/CN112405327B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203380775U (zh) * | 2013-07-29 | 2014-01-08 | 中芯国际集成电路制造(北京)有限公司 | 研磨装置 |
CN207724094U (zh) * | 2017-12-28 | 2018-08-14 | 德淮半导体有限公司 | 化学机械研磨装置 |
CN209940092U (zh) * | 2019-05-16 | 2020-01-14 | 江苏欧博智能纺织有限公司 | 一种纱线绕线筒放置架 |
CN211498552U (zh) * | 2019-09-29 | 2020-09-15 | 郑志辉 | 一种便于安装的声屏障 |
CN210574980U (zh) * | 2019-12-13 | 2020-05-19 | 嫩江市城乡规划中心 | 一种城市规划用宣传板 |
Also Published As
Publication number | Publication date |
---|---|
CN112405327B (zh) | 2022-07-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: No.45 and 51, Yougu Industrial Park, Xibei Town, Xishan District, Wuxi City, Jiangsu Province Applicant after: GMC SEMITECH Co.,Ltd. Address before: No. 45, Yougu Enterprise Park, 58 Jinghong Road, Xibei Town, Xishan District, Wuxi City, Jiangsu Province Applicant before: GMC SEMITECH Co.,Ltd. |
|
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Li Feng Inventor after: Liu Yulong Inventor before: Li Feng Inventor before: Liu Yulong |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: No. 1 Jingxiang Road, Xibei Town, Xishan District, Wuxi City, Jiangsu Province, 214000 Patentee after: Jimsi Semiconductor Technology (Wuxi) Co.,Ltd. Country or region after: China Address before: No.45 and 51, Yougu Industrial Park, Xibei Town, Xishan District, Wuxi City, Jiangsu Province Patentee before: GMC SEMITECH Co.,Ltd. Country or region before: China |