CN112400036B - 无电铜或铜合金镀浴和用于镀覆的方法 - Google Patents

无电铜或铜合金镀浴和用于镀覆的方法 Download PDF

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Publication number
CN112400036B
CN112400036B CN201980045418.5A CN201980045418A CN112400036B CN 112400036 B CN112400036 B CN 112400036B CN 201980045418 A CN201980045418 A CN 201980045418A CN 112400036 B CN112400036 B CN 112400036B
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CN
China
Prior art keywords
copper
substituted
unsubstituted
plating bath
hydrogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201980045418.5A
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English (en)
Chinese (zh)
Other versions
CN112400036A (zh
Inventor
R-D·库尔克
S·扎韦尔
K·克拉登
A·彼得
B·贝克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN112400036A publication Critical patent/CN112400036A/zh
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
CN201980045418.5A 2018-06-08 2019-06-05 无电铜或铜合金镀浴和用于镀覆的方法 Expired - Fee Related CN112400036B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18176836.7 2018-06-08
EP18176836.7A EP3578683B1 (en) 2018-06-08 2018-06-08 Electroless copper or copper alloy plating bath and method for plating
PCT/EP2019/064616 WO2019234085A1 (en) 2018-06-08 2019-06-05 Electroless copper or copper alloy plating bath and method for plating

Publications (2)

Publication Number Publication Date
CN112400036A CN112400036A (zh) 2021-02-23
CN112400036B true CN112400036B (zh) 2023-02-21

Family

ID=62597382

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980045418.5A Expired - Fee Related CN112400036B (zh) 2018-06-08 2019-06-05 无电铜或铜合金镀浴和用于镀覆的方法

Country Status (7)

Country Link
US (1) US11396706B2 (enExample)
EP (1) EP3578683B1 (enExample)
JP (1) JP7335280B2 (enExample)
KR (1) KR20210018457A (enExample)
CN (1) CN112400036B (enExample)
TW (1) TWI814822B (enExample)
WO (1) WO2019234085A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7601633B2 (ja) * 2020-12-28 2024-12-17 上村工業株式会社 フレキシブル基板の製造方法
EP4063533A1 (en) * 2021-03-25 2022-09-28 Atotech Deutschland GmbH & Co. KG A process for electrochemical deposition of copper with different current densities
CN114150299A (zh) * 2021-04-27 2022-03-08 天津大学 用于超低轮廓铜箔及其覆铜板制备的化学沉积方法
JP7735686B2 (ja) * 2021-05-24 2025-09-09 三菱瓦斯化学株式会社 無電解銅めっき用組成物および無電解銅めっき方法
KR20230039434A (ko) * 2021-09-14 2023-03-21 코닝 인코포레이티드 유리 기판 구조물의 제조 방법 및 배선 기판의 제조 방법
TW202449229A (zh) 2023-04-26 2024-12-16 德商德國艾托特克有限兩合公司 基材表面之預處理方法
TW202607188A (zh) 2024-03-28 2026-02-16 德商德國艾托特克有限兩合公司 對非導電或含碳纖維基材之表面行無電鍍銅之方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7297190B1 (en) * 2006-06-28 2007-11-20 Lam Research Corporation Plating solutions for electroless deposition of copper
CN103397316A (zh) * 2013-07-18 2013-11-20 胜宏科技（惠州）股份有限公司 一种酸性化学镀铜复合添加剂及其制备方法和使用方法
CN104968835A (zh) * 2013-03-27 2015-10-07 埃托特克德国有限公司 无电镀铜溶液

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4629636A (en) 1984-06-07 1986-12-16 Enthone, Incorporated Process for treating plastics with alkaline permanganate solutions
US4617205A (en) 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
ES2224507T3 (es) 1998-11-13 2005-03-01 Lpw-Chemie Gmbh Procedimiento para la metalizacion de una superficie de plastico.
US6913651B2 (en) 2002-03-22 2005-07-05 Blue29, Llc Apparatus and method for electroless deposition of materials on semiconductor substrates
DE10226328B3 (de) * 2002-06-11 2004-02-19 Atotech Deutschland Gmbh Saure Lösung zur Silberabscheidung und Verfahren zum Abscheiden von Silberschichten auf Metalloberflächen
IL153498A0 (en) * 2002-12-17 2003-07-06 J G Systems Inc Electroless copper metallization of electronic devices
JP4078977B2 (ja) * 2002-12-27 2008-04-23 日立化成工業株式会社 無電解金めっき液及び無電解金めっき方法
US7220296B1 (en) 2005-12-15 2007-05-22 Intel Corporation Electroless plating baths for high aspect features
EP2009142B8 (en) 2006-04-18 2013-08-14 Okuno Chemical Industries Co., Ltd. Composition for etching treatment of resin molded article
EP1876262A1 (en) 2006-07-07 2008-01-09 Rohm and Haas Electronic Materials, L.L.C. Environmentally friendly electroless copper compositions
KR20080083790A (ko) 2007-03-13 2008-09-19 삼성전자주식회사 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법
WO2013050332A2 (en) 2011-10-05 2013-04-11 Atotech Deutschland Gmbh Formaldehyde-free electroless copper plating solution
JP5382279B1 (ja) * 2012-03-28 2014-01-08 Ｄｉｃ株式会社 導電性パターン、電気回路、電磁波シールド、及び、導電性パターンの製造方法
CN105008587B (zh) 2013-03-27 2018-04-17 埃托特克德国有限公司 化学镀铜溶液
JP6176841B2 (ja) * 2013-07-19 2017-08-09 ローム・アンド・ハース電子材料株式会社 無電解銅めっき液
US20160145745A1 (en) * 2014-11-24 2016-05-26 Rohm And Haas Electronic Materials Llc Formaldehyde-free electroless metal plating compositions and methods
ES2639300T3 (es) 2014-12-16 2017-10-26 Atotech Deutschland Gmbh Composiciones de baño de chapado para el chapado no electrolítico de metales y aleaciones metálicas
US10767275B2 (en) 2015-08-31 2020-09-08 Atotech Deutschland Gmbh Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7297190B1 (en) * 2006-06-28 2007-11-20 Lam Research Corporation Plating solutions for electroless deposition of copper
CN104968835A (zh) * 2013-03-27 2015-10-07 埃托特克德国有限公司 无电镀铜溶液
CN103397316A (zh) * 2013-07-18 2013-11-20 胜宏科技（惠州）股份有限公司 一种酸性化学镀铜复合添加剂及其制备方法和使用方法

Also Published As

Publication number Publication date
US11396706B2 (en) 2022-07-26
WO2019234085A1 (en) 2019-12-12
EP3578683A1 (en) 2019-12-11
CN112400036A (zh) 2021-02-23
EP3578683B1 (en) 2021-02-24
JP7335280B2 (ja) 2023-08-29
TW202000648A (zh) 2020-01-01
US20210246559A1 (en) 2021-08-12
JP2021527166A (ja) 2021-10-11
TWI814822B (zh) 2023-09-11
KR20210018457A (ko) 2021-02-17

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