CN112382603A - 一种晶圆台的旋转与扩张结构 - Google Patents

一种晶圆台的旋转与扩张结构 Download PDF

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CN112382603A
CN112382603A CN202011384044.0A CN202011384044A CN112382603A CN 112382603 A CN112382603 A CN 112382603A CN 202011384044 A CN202011384044 A CN 202011384044A CN 112382603 A CN112382603 A CN 112382603A
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王慧
蔡奇陵
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CYG Semiconductor Equipment Zhuhai Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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Abstract

本发明公开了一种晶圆台的旋转与扩张结构，包括底板及扩张环，扩张环安装于底板，晶圆台的旋转与扩张结构还包括旋转件、轴承、压制模块以及升降驱动件，扩张环通过轴承与旋转件连接，旋转件带动扩张环相对底板转动，扩张环与压制模块连接，升降驱动件与压制模块连接，升降驱动件通过压制模块带动扩张环相对底板升降，整个晶圆台的旋转与扩张结构能够使晶圆台既能旋转又能扩张，并且结构简单、安装方便、不影响晶圆加工以及加工精度。

Description

一种晶圆台的旋转与扩张结构
技术领域
本发明涉及晶圆，尤其是涉及一种晶圆台的旋转与扩张结构。
背景技术
在晶圆整体封装过程中，在整片的晶圆片的背面贴上蓝膜，后续需要对蓝膜进行处理，使蓝膜扩张。蓝膜扩张完毕后，还需旋转晶圆。因此需要一种能够使晶圆台既能旋转又能扩张的结构，现有技术中一般使用大型导轨，做上下移动的限位。但大型导轨的使用使晶圆台侧面加工不易，精度不容易保持；并且导轨的平行校正复杂，整体旋转与升降装置结构复杂，安装困难。
发明内容
为了克服现有技术的不足，本发明的目的在于提供一种结构简单、安装方便、不影响晶圆加工以及加工精度的晶圆台的旋转与扩张结构。
本发明的目的采用以下技术方案实现：
一种晶圆台的旋转与扩张结构，包括底板及扩张环，所述扩张环安装于所述底板，所述晶圆台的旋转与扩张结构还包括旋转件、轴承、压制模块以及升降驱动件，所述扩张环通过所述轴承与所述旋转件连接，所述旋转件带动所述扩张环相对所述底板转动，所述扩张环与所述压制模块连接，所述升降驱动件与所述压制模块连接，所述升降驱动件通过所述压制模块带动所述扩张环相对所述底板升降。
进一步地，所述轴承为直线轴承。
进一步地，所述旋转件为旋转圆盘。
进一步地，所述扩张环包括衔接边，所述压制模块设有衔接槽，所述衔接边位于所述衔接槽中。
进一步地，所述压制模块包括主体以及滚动安装于所述主体的滚轮，所述衔接槽设置于所述滚轮上。
进一步地，所述升降驱动件与所述主体连接。
进一步地，所述衔接边的形状与所述衔接槽的形状对应。
进一步地，所述衔接边与所述衔接槽呈V形。
进一步地，所述升降驱动件为丝杆。
进一步地，所述压制模块以及所述升降驱动件的数量分别为两个，两所述压制模块以及两所述升降驱动件分别位于所述扩张环的相对两侧，呈对称分布。
相比现有技术，本发明晶圆台的旋转与扩张结构的旋转件带动扩张环相对底板转动，扩张环与压制模块连接，升降驱动件与压制模块连接，升降驱动件通过压制模块带动扩张环相对底板升降，整个晶圆台的旋转与扩张结构能够使扩张环既能旋转又能扩张，并且结构简单、安装方便、不影响晶圆加工以及加工精度。
附图说明
图1为本发明晶圆台的旋转与扩张结构的立体图；
图2为图1的晶圆台的旋转与扩张结构的局部结构立体剖视图；
图3为图2的晶圆台的旋转与扩张结构A处的放大图；
图4为图2的晶圆台的旋转与扩张结构B处的放大图。
图中：10、底板；11、安装孔；20、扩张环；21、衔接边；30、旋转件；40、轴承；50、压制模块；51、主体；52、滚轮；520、衔接槽；60、升降驱动件。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，当组件被称为“固定于”另一个组件，它可以直接在另一个组件上或者也可以存在另一中间组件，通过中间组件固定。当一个组件被认为是“连接”另一个组件，它可以是直接连接到另一个组件或者可能同时存在另一中间组件。当一个组件被认为是“设置于”另一个组件，它可以是直接设置在另一个组件上或者可能同时存在另一中间组件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
请参阅图1至图4，本发明晶圆台的旋转与扩张结构包括底板10、扩张环20、旋转件30、轴承40、压制模块50、升降驱动件60。
底板10设有安装孔11。底板10整体呈矩形，安装孔11呈圆形，安装孔11位于底板10的中心处。
扩张环20呈圆环形。扩张环20设有衔接边21，衔接边21位于扩张环20的边缘。衔接边21呈V形。
旋转件30为旋转圆盘。
轴承40为直线轴承。轴承40的数量可以为多个，在本实施例中，轴承40的数量为两个，两轴承40对称分布。
压制模块50包括主体51以及滚轮52。滚轮52转动安装于主体51。滚轮52设有衔接槽520，衔接槽520的形状与衔接边21的形状对应。在本实施例中，衔接槽520呈V形。主体51上安装的滚轮52的数量为若干个。在本实施例中，主体51上滚轮52的数量为三个。压制模块50的数量为若干个。对称均匀分布于扩张环20四周，在本实施例中，压制模块50的数量为两个。
升降驱动件60为气缸、丝杆中的一种。在本实施例中，升降驱动件60为丝杆。升降驱动件60的数量与压制模块50的数量相同，在本实施例中，升降驱动件60的数量为两个。
组装晶圆台的旋转与扩张结构时，扩张环20安装于底板10的安装孔11中。扩张环20通过轴承40与旋转件30连接。扩张环20的衔接边21位于压制模块50的衔接槽520中。压制模块50的主体51与升降驱动件60连接。
使用晶圆台的旋转与扩张结构时，旋转件30转动，旋转件30通过轴承40带动扩张环20转动。扩张环20的衔接边21在滚轮52的衔接槽520中移动，使滚轮52相对主体51转动，减少衔接边21与衔接槽520的摩擦。升降驱动件60带动压制模块50上下移动，由于扩张环20的衔接边21位于压制模块50的衔接槽520中，压制模块50带动扩张环20升降。整个晶圆台的旋转与扩张结构能够使扩张环20既能旋转又能扩张，并且结构简单、安装方便、不影响晶圆加工以及加工精度。
对本领域的技术人员来说，可根据以上描述的技术方案以及构思，做出其它各种相应的改变以及形变，而所有的这些改变以及形变都应该属于本发明权利要求的保护范围之内。

Claims (10)

1.一种晶圆台的旋转与扩张结构，包括底板及扩张环，所述扩张环安装于所述底板，其特征在于：所述晶圆台的旋转与扩张结构还包括旋转件、轴承、压制模块以及升降驱动件，所述扩张环通过所述轴承与所述旋转件连接，所述旋转件带动所述扩张环相对所述底板转动，所述扩张环与所述压制模块连接，所述升降驱动件与所述压制模块连接，所述升降驱动件通过所述压制模块带动所述扩张环相对所述底板升降。
2.根据权利要求1所述的晶圆台的旋转与扩张结构，其特征在于：所述轴承为直线轴承。
3.根据权利要求1所述的晶圆台的旋转与扩张结构，其特征在于：所述旋转件为旋转圆盘。
4.根据权利要求1所述的晶圆台的旋转与扩张结构，其特征在于：所述扩张环包括衔接边，所述压制模块设有衔接槽，所述衔接边位于所述衔接槽中。
5.根据权利要求4所述的晶圆台的旋转与扩张结构，其特征在于：所述压制模块包括主体以及滚动安装于所述主体的滚轮，所述衔接槽设置于所述滚轮上。
6.根据权利要求5所述的晶圆台的旋转与扩张结构，其特征在于：所述升降驱动件与所述主体连接。
7.根据权利要求4所述的晶圆台的旋转与扩张结构，其特征在于：所述衔接边的形状与所述衔接槽的形状对应。
8.根据权利要求7所述的晶圆台的旋转与扩张结构，其特征在于：所述衔接边与所述衔接槽呈V形。
9.根据权利要求1所述的晶圆台的旋转与扩张结构，其特征在于：所述升降驱动件为丝杆。
10.根据权利要求1所述的晶圆台的旋转与扩张结构，其特征在于：所述压制模块以及所述升降驱动件的数量分别为两个，两所述压制模块以及两所述升降驱动件分别位于所述扩张环的相对两侧，呈对称分布。
CN202011384044.0A 2020-11-30 2020-11-30 一种晶圆台的旋转与扩张结构 Pending CN112382603A (zh)

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