CN112362015B - Method for detecting BGA solder balls for packaging integrated circuit - Google Patents
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/10—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring diameters
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/20—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring contours or curvatures, e.g. determining profile
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/20—Metals
- G01N33/202—Constituents thereof
- G01N33/2022—Non-metallic constituents
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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Abstract
The invention discloses a method for detecting BGA solder balls for packaging an integrated circuit, which comprises step.1, step.2, step.3, step.4, step.5, step.6 and step.7; step.1 comprises the Ball diameter, true sphericity, surface quality, electrostatic treatment and Ball shear test of the solder Ball; step.1 comprises the Ball diameter, true sphericity, surface quality, electrostatic treatment and Ball shear test of the solder Ball; and step.2 is diameter detection, and specifically, the diameter of the sphere is tested by adopting an X-Ray method. The invention has more systematic and comprehensive detection indexes by detecting the diameter and the sphericity of the solder Ball, evaluating the surface quality, carrying out electrostatic treatment, leading-in verification of a production line, Ball shear and the like. The defects of unsoldered welding spots, ball jumping, cavities, welding spot deviation and the like in the ball mounting process are reduced, the qualification rate after ball mounting is comprehensively improved, and the detected BGA solder balls can be suitable for the higher-end packaging field.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging, in particular to a method for detecting BGA solder balls for integrated circuit packaging.
Background
The BGA is called as a ballGridarray (PCB) in a ball grid array structure, and the method has the advantages of small packaging area; the functions are increased, and the number of pins is increased; the PCB can be centered by itself during the flux welding, and is easy to be tinned; the reliability is high; good electrical property, low overall cost and the like, and is more and more widely applied. The research on the BGA solder balls in developed countries such as Europe, America, Japan and Korean is early, the research comprises ball manufacturing equipment, a ball manufacturing process and a solder ball detection method, and the research leads the development direction of the world BGA industry in the production and sale of large electronic products such as memories, CPUs (central processing units), digital signal processors and the like by virtue of technical advantages at present and is in a global monopoly. China still needs to rely on import of BGA solder ball products. Due to the characteristics of small size, high precision requirement and the like, the preparation technology and the detection technology of the solder ball are the main reasons for limiting the development of the industry. The lack of the solder ball detection can cause the defects of solder joint failure, ball jumping, cavities, solder joint deviation and the like in the ball mounting process, cause the failure of components and parts, and cause major accidents in serious cases. For example, in 2014, an air passenger A320-216 Yaoyang QZ8501 passenger plane crashes on the way that Siyu flies to Singapore in the second city of Indonesia, and after investigation of the national transportation safety Committee of Indonesia within 12 months and 1 day of 2015, BGA welding points on circuit boards of channels A and B in an airplane rudder control unit module (RTLU) are found to crack, so that the electrical connection of instruments is disconnected, and the whole control unit fails. In China, research on BGA by partial scientific research institutes and enterprises is advanced to a certain extent, domestic BGA solder balls are gradually appeared in recent years, at present, domestic solder ball detection is mainly based on diameter, a uniform detection method is not provided, so that the qualification rate is low, and the product is only suitable for low-end industries such as repair and the like.
Disclosure of Invention
In view of the problems in the prior art, the invention discloses a method for detecting BGA solder balls for packaging an integrated circuit, which adopts the technical scheme that the method comprises the steps of solder Ball diameter, true sphericity, surface quality, electrostatic treatment, production line introduction and Ball shear test(ii) a The method comprises step.1, step.2, step.3, step.4, step.5 and step.6; and the step.1 is diameter detection, in particular to the method for detecting the diameter of the solder ball by adopting an X-Ray method. In order to improve the detection efficiency and accuracy, the X-Ray magnification is selected to be 100-200 times. The diameter of each tin ball is tested for three times, and the average value is taken as the final result. The diameter error allowable range of a single solder ball is +/-0.02 mm, and the diameter error range of an average solder ball is +/-0.01 mm; step.2 is evaluation of true sphericity, specifically, the true sphericity of the solder ball is calculated by adopting the ratio of the difference value of the maximum diameter and the minimum diameter of the solder ball to the theoretical diameter, and the true sphericity calculation method adopts a formula
Wherein C is a true sphericity value, dmaxIs the maximum diameter, dminIs the smallest diameter, d0Is the theoretical diameter; the step.3 is surface quality evaluation, and specifically comprises but is not limited to that the smoothness and the flatness are high under the condition that the tin ball is amplified by at least 100 times, no impurities or other pollutants, scratches, depressions, bulges, air holes and fine gaps can be seen by naked eyes, the surface of the tin ball has no serious oxidation phenomenon, and the surface oxygen content mass fraction is not higher than 10%; step.4 is electrostatic detection, specifically, after bottling, the finished solder ball is continuously shaken for no less than 10 times, the bottle is slowly inclined to 45 degrees, the solder ball does not stick to the wall, and no ball jumping phenomenon occurs in the manual ball planting process; step.5 is the production line import verification, specifically, after the ball is manually planted, the hot air gun is used for reflow soldering, the phenomena of no solder ball unmelted, no soldering and no solder joint deviation are avoided, and the surface of the solder joint is required to be bright white and have high glossiness. The welding temperature is not higher than 260 ℃, and the welding time is not more than 3 min; step.6 is a Ball shear test, wherein the Ball shear test requires that the fracture positions of welding spots are all generated on the solder balls, and the Ball shear value exceeds 120 gf.
As a preferred technical scheme of the invention, the sample for detecting the diameter of the solder ball in step.1 is sampled in a micro-random manner, and the sampling proportion is not less than ten thousandth of the total quantity of the solder balls.
As a preferable technical means of the present invention, the maximum diameter d in step.2 ismaxAnd a minimum diameter dminUsing VMS-2010 image measurementDetermination by an instrument of theoretical diameter d0The solder ball quality and density are calculated.
As a preferable technical scheme of the invention, the solder ball in step.3 is magnified by a scanning electron microscope, the conditions of pits, bulges, folds, pores, cracks and microstructures on the surface of the solder ball are observed, and the oxygen content of the surface is tested by adopting an oxygen-nitrogen-hydrogen analyzer.
As a preferred technical scheme of the invention, the static electricity removing method in step.4 is to blow for 20-30 min at normal temperature by an ion blower, and then bottle the solder balls.
As a preferred technical scheme of the invention, the ball-planting substrate in step.5 is Ni/Pd/Au, the spacing of welding spots is 0.4-0.6 mm, and the thickness of the substrate is not less than 180 μm.
As a preferable technical scheme of the invention, the thickness of the push broach used in the Ball shear test in step.6 is higher than 0.5-0.8 mm, and the face width of the push broach is 0.4-0.6 mm.
The invention has the beneficial effects that: the invention has more systematic and comprehensive detection indexes by detecting the diameter and the sphericity of the solder Ball, evaluating the surface quality, carrying out electrostatic treatment, leading-in verification of a production line, Ball shear and the like. The defects of unsoldered welding spots, ball jumping, cavities, welding spot deviation and the like in the ball mounting process are reduced, the qualification rate after ball mounting is comprehensively improved, and the detected BGA solder balls can be suitable for the higher-end packaging field.
Drawings
FIG. 1 is a flow chart of the present invention;
FIG. 2 is an X-Ray diameter detection diagram of the present invention;
FIG. 3 is a schematic diagram of the true sphericity assessment of the present invention;
FIG. 4 is a drawing illustrating the guiding effect of the ball mounting line according to the embodiment of the present invention;
FIG. 5 is a Ball shear failure mode diagram according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the following specific examples and the accompanying drawings. The procedures, conditions, experimental methods and the like for carrying out the present invention are general knowledge and common general knowledge in the art except for the contents specifically mentioned below, and the present invention is not particularly limited.
Example 1
As shown in FIGS. 1 to 5, the invention discloses a method for detecting BGA solder balls for integrated circuit packaging, which adopts the technical scheme that the method comprises the steps of solder Ball diameter, true sphericity, surface quality, electrostatic treatment, production line introduction and Ball shear test; the method comprises step.1, step.2, step.3, step.4, step.5 and step.6; and the step.1 is diameter detection, in particular to the method for detecting the diameter of the solder ball by adopting an X-Ray method. In order to improve the detection efficiency and accuracy, the X-Ray magnification is selected to be 100-200 times. The diameter of each tin ball is tested for three times, and the average value is taken as the final result. The diameter error allowable range of a single solder ball is +/-0.02 mm, and the diameter error range of an average solder ball is +/-0.01 mm; step.2 is evaluation of true sphericity, specifically, the true sphericity of the solder ball is calculated by adopting the ratio of the difference value of the maximum diameter and the minimum diameter of the solder ball to the theoretical diameter, and the true sphericity calculation method adopts a formula
Wherein C is a true sphericity value, dmaxIs the maximum diameter, dminIs the smallest diameter, d0Is the theoretical diameter; the step.3 is surface quality evaluation, and specifically comprises but is not limited to that the smoothness and the flatness are high under the condition that the tin ball is amplified by at least 100 times, no impurities or other pollutants, scratches, depressions, bulges, air holes and fine gaps can be seen by naked eyes, the surface of the tin ball has no serious oxidation phenomenon, and the surface oxygen content mass fraction is not higher than 10%; step.4 is electrostatic detection, specifically, after bottling, the finished solder ball is continuously shaken for no less than 10 times, the bottle is slowly inclined to 45 degrees, the solder ball does not stick to the wall, and no ball jumping phenomenon occurs in the manual ball planting process; step.5 is the production line import verification, specifically, after the ball is manually planted, the hot air gun is used for reflow soldering, the phenomena of no solder ball unmelted, no soldering and no solder joint deviation are avoided, and the surface of the solder joint is required to be bright white and have high glossiness. The welding temperature is not higher than 260 ℃, and the welding time is not more than 3 min; step.6 is a Ball shear test, wherein the Ball shear test requires that the fracture positions of welding points all occur on solder balls, and the Ball shear value exceeds 120 gf.
As a preferred technical scheme of the invention, the sample for detecting the diameter of the solder ball in step.1 is sampled in a micro-random manner, and the sampling proportion is not less than ten thousandth of the total quantity of the solder balls.
As a preferable technical means of the present invention, the maximum diameter d in step.2 ismaxAnd a minimum diameter dminMeasured by a VMS-2010 image measuring instrument and the theoretical diameter d0Is obtained by calculating the mass and the density of the solder balls.
As a preferred technical scheme of the invention, the tin ball in step.3 is magnified by a scanning electron microscope, defects such as pits, bulges, folds, pores and cracks on the surface and microstructure conditions are observed, and the oxygen content of the surface is tested by adopting an oxygen-nitrogen-hydrogen analyzer.
As a preferred technical scheme of the invention, the static electricity removing method in step.4 is to blow for 25min at normal temperature by an ion blower, and then bottle the solder balls.
As a preferable technical scheme of the invention, the ball-planting substrate in step.5 is Ni/Pd/Au, the solder joint spacing is 0.4mm, and the substrate thickness is 180 μm.
As a preferable technical scheme of the invention, the thickness of the push broach used in the Ball shear test in step.6 is 0.5mm, and the face width of the push broach is 0.6 mm.
Example 2
Example 2 is the same as example 1 except that the diameter of the solder ball and the ball mounting parameter are different
Example 3
Example 3 is the same as example 1 except that the diameter of the solder ball and the ball mounting parameter are different.
To further illustrate the present invention, the results of the test under three different ball mounting parameters of example 2 and example 3 were attached. The specific differences are as follows: the solder ball in example 1 was a Kinzhi Kabushiki Kaisha solder ball having a diameter of 0.25 mm. Example 2 is a self-made solder ball, the diameter of the solder ball is 0.25mm, the reflow soldering temperature is 260 ℃, the solder ball has high smoothness and flatness under 150 times of amplification, no impurities or other pollutants, scratches, pits, bumps, pores, fine gaps and the like can be seen by naked eyes, the surface of the solder ball has no severe oxidation phenomenon, and the surface oxygen content is 7 mass percent. Blowing by an ion blower for 20min at normal temperature, wherein the distance between welding points is 0.45mm, the thickness of the substrate is 200 μm, the thickness of a push broach used in Ball shear test is 0.6mm, and the width of the push broach surface is 0.8 mm. The example 3 is a self-made solder ball, the diameter of the solder ball is 0.3mm, and the rest is the same as the example 1. The results of the three examples are: in examples 2 and 3, a wall hanging phenomenon occurs in the bottle body, the antistatic property of the ball body needs to be improved, and in example 1, the wall hanging phenomenon does not occur. After the production line is introduced, the appearances of the embodiment 1, the embodiment 2 and the embodiment 3 are not obviously different and abnormal (see fig. 4), the Ball shear failure mode result is that failure modes all occur in the solder balls, the process requirements are met (fig. 5), and the Ball shear values of the tested 13 groups of solder balls are shown in the following table.
Claims (7)
1. A detection method of BGA tin balls for electronic packaging is characterized by comprising the steps of tin Ball diameter, true sphericity, surface quality, electrostatic treatment, production line introduction and Ball shear test; the method comprises step.1, step.2, step.3, step.4, step.5 and step.6; step.1 is diameter detection, specifically, the diameter of the solder ball is detected by adopting an X-Ray method; in order to improve the detection efficiency and accuracy, the X-Ray magnification is selected from 100-200 times; taking the average value of the diameter of each tin ball for three times as the final result; the diameter error allowable range of a single solder ball is +/-0.02 mm, and the diameter error range of an average solder ball is +/-0.01 mm; step.2 is evaluation of true sphericity, specifically, the true sphericity of the solder ball is calculated by adopting the ratio of the difference value of the maximum diameter and the minimum diameter of the solder ball to the theoretical diameter, and the true sphericity calculation method adopts a formula
Wherein C is a true sphericity value, dmaxIs the maximum diameter, dminIs the smallest diameter, d0Is the theoretical diameter; step.3 is surface quality evaluation, including but not limited to, smoothness and flatness under at least 100 times of solder ball magnificationThe integrity is high, no impurities, other pollutants, scratches, pits, bulges, air holes and fine seams can be seen by naked eyes, the surface of the tin ball has no serious oxidation phenomenon, and the mass fraction of the surface oxygen content is not higher than 10%; step.4 is electrostatic detection, specifically, after bottling, the finished solder ball is continuously shaken for no less than 10 times, the bottle is slowly inclined to 45 degrees, the solder ball does not stick to the wall, and no ball jumping phenomenon occurs in the manual ball planting process; step.5 is the production line import verification, specifically, after the ball is planted manually, the hot air gun is used for reflow soldering, the phenomena of no solder ball unmelted, no soldering and no solder joint deviation are avoided, and the surface of the solder joint is required to be bright white and have high glossiness; the welding temperature is not higher than 260 ℃, and the welding time is not more than 3 min; step.6 is a Ball shear test, wherein the Ball shear test requires that the fracture positions of welding spots are all generated on the solder balls, and the Ball shear value exceeds 120 gf.
2. The method of claim 1, wherein the step of inspecting the BGA solder balls comprises: and (3) carrying out micro-random sampling on a sample for detecting the diameter of the solder ball in step.1, wherein the sampling proportion is not less than ten thousandth of the total quantity of the solder balls.
3. The method of claim 1, wherein the step of inspecting the BGA solder balls comprises: maximum diameter d in step.2maxAnd a minimum diameter dminMeasured by a VMS-2010 image measuring instrument and the theoretical diameter d0Is obtained by calculating the mass and the density of the solder balls.
4. The method of claim 1, wherein the step of inspecting the BGA solder balls comprises: and (3) magnifying the solder ball in step.3 by a scanning electron microscope, observing the conditions of pits, bulges, folds, air holes, cracks and microstructures on the surface of the solder ball, and testing the oxygen content of the surface by adopting an oxygen-nitrogen-hydrogen analyzer.
5. The method of claim 1, wherein the step of inspecting the BGA solder balls comprises: the static electricity removing method in step.4 is to blow the mixture for 20-30 min at normal temperature by an ion blower, and then bottle the solder balls.
6. The method of claim 1, wherein the step of inspecting the BGA solder balls comprises: the ball-planting substrate in step.5 is Ni/Pd/Au, the spacing of welding points is 0.4-0.6 mm, and the thickness of the substrate is not less than 180 mu m.
7. The method of claim 1, wherein the step of inspecting the BGA solder balls comprises: the thickness of the push broach used in Ball shear test in step.6 is higher than 0.5-0.8 mm, and the width of the push broach surface is 0.4-0.6 mm.
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| CN113238164B (en) * | 2021-05-14 | 2022-11-29 | 山东英信计算机技术有限公司 | Device and method for detecting poor welding of BGA solder balls |
| CN113686253A (en) * | 2021-09-18 | 2021-11-23 | 广州海普电子材料科技有限公司 | BGA solder ball detection method and system |
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