KR20190038998A - Method of inspecting and sorting chip electronic component - Google Patents

Abstract

The present invention relates to a method for inspecting and selecting a chip electronic component which uses an apparatus for conveying a chip electronic component configured by arranging a conveying disc having a chip electronic component receiving hole in a vertical or inclined state and shaft-supporting to enable rotation along a plane of the conveying disc. The method includes processes of measuring electric characteristics of the chip electronic component and discharging and recovering the chip electronic component having predetermined electric characteristics from the conveying disc, thereby realizing smooth discharge of the chip electronic component having predetermined electric characteristics. After measuring the electric characteristics of the chip electronic component, a physical impact is applied to the chip electronic component received in the chip electronic component receiving hole to perform operation of detaching the chip electronic component from a wall surface of the chip electronic component receiving hole before discharging the electronic component having predetermined electric characteristics from the conveying disc.

Description

[0001] METHOD OF INSPECTING AND SORTING CHIP ELECTRONIC COMPONENT [0002]

The present invention relates to a method for continuously inspecting and selecting electrical characteristics of a large amount of chip electronic components at high speed using an automated chip electronic component inspection and sorting apparatus. More particularly, the present invention relates to a chip electronic component transporting device in which a transporting disc having a chip electronic component accommodating hole is vertically or inclinedly arranged and supported so as to be rotatable along the plane of the transporting disc, And a step of selecting a chip electronic component having a predetermined electrical characteristic, discharging the chip electronic component from the transfer disc, and recovering the chip electronic component.

BACKGROUND ART [0002] With the increase in the production amount of small electronic devices such as mobile phones, smart phones, liquid crystal televisions, and electronic game devices, the production amount of minute chip electronic components mounted on such small electronic devices has been remarkably increased. Most of the chip electronic components are a two-terminal electronic component formed of a main body and electrodes provided on both opposite end faces of the main body. Examples of such chip electronic components include chip capacitors (also referred to as chip capacitors), chip resistors (including chip varistors), and chip inductors.

2. Description of the Related Art [0002] With the recent miniaturization of electronic devices to which chip electronic components are mounted and the increase in the number of chip electronic components mounted on electronic devices, chip electronic components have become extremely small. For example, for a chip capacitor, a chip capacitor of a very small size (for example, a size of 0.2 mm x 0.2 mm x 0.4 mm called a 0402 chip) has recently been used, By production, one unit of production is produced in units of tens to hundreds of thousands.

In general, electronic devices to which chip electronic components are mounted are generally subjected to preliminary inspection in advance for the chip electronic components to be mounted in order to lower the rate of defective products in electronic equipment caused by defects in the electronic components to be mounted. For example, with respect to a chip capacitor mounted on an electronic device, measurement (inspection) of electrical characteristics such as capacitance and leakage current is usually performed with respect to the total number of the chip capacitors.

It is necessary to conduct the inspection of the electrical characteristics of a large number of chip electronic components at high speed and to automatically perform the inspection at a high speed. In recent years, there has been proposed a technique of accepting (temporarily accepting) (That is, a chip electronic component inspection and sorting apparatus) for checking and selecting electrical characteristics of a chip electronic component having a chip electronic component carrier on which a through hole is formed is generally used. (Hereinafter, simply referred to as " transfer originals "), a plurality of projections for temporarily holding and holding chip electronic components to be inspected are formed in a state of being arranged in a plurality of three or more rows along the circumference . When the chip electronic component inspecting and sorting apparatus is used, the chip electronic component is held in the through hole of the transfer disc for intermittently rotating, and then the chip electronic component held in the transfer disc is transferred to the rotation path (Test contacts) are brought into contact with the respective electrodes of the chip electronic components and a predetermined voltage is applied thereto to measure electrical characteristics of the chip electronic components . Then, the chip electronic component exhibiting the desired electrical characteristics is identified and selected by the electrical characteristic discrimination device electrically connected to the contact for inspection.

For example, when the electrostatic capacity of the chip capacitor is inspected, the electric characteristic inspection unit is provided with an inspection electrode terminal from a tester (electric characteristic measurement apparatus) provided in the chip electronic component inspection and sorting apparatus, A test voltage having a predetermined frequency is applied. Then, a current value of a current generated in the chip capacitor is detected by the tester by application of the inspection voltage, and based on the detected current value and the voltage value of the applied inspection voltage, the capacitance of the chip capacitor to be inspected Measurement is carried out.

Typical devices for testing electric characteristics of typical chip electronic components generally used include a method of arranging a chip electronic component conveying disc having at least three rows of through holes in the form of concentric circles on a surface thereof in a vertical or inclined state, A chip electronic component supply accommodating portion disposed at a position along a surface of the conveying disk, and an electrode terminal including a roller electrode terminal and a fixed electrode terminal, There is a chip electronic component electric property inspection apparatus including an electric property inspection unit provided with a set.

When the inspection of the chip electronic component held on the transfer disc is completed, it is confirmed on the basis of the inspection result that the inspected chip electronic component has predetermined electric characteristics, ), Discharging the chip electronic component from the through hole, and collecting the chip electronic component to be accommodated in a predetermined container. For this reason, a conventional chip electronic component inspection and sorting apparatus is additionally provided with a chip electronic component sorting section (sorting section) for sorting (or sorting) the chip electronic components after inspection, In many cases, the product is commercialized as an electronic component electric property inspection and sorting apparatus.

An example of the above chip electronic component inspection and sorting apparatus is the apparatus described in Patent Document 1. [ That is, Patent Document 1 discloses a chip electronic component inspection and sorting apparatus having the above-described configuration, in which chip electronic components to be inspected, which are manufactured based on the same standard so as to exhibit predetermined identical electrical characteristics, And the inspection device is electrically connected to the electrodes of the chip electronic component. Then, a voltage for inspection is applied to each chip electronic component from the inspection device, and the current value generated in each chip electronic component is detected by a checker A method for continuously checking the electrical characteristics of a chip electronic component including a step of detecting the electrical characteristics of the chip electronic component.

The chip electronic component electrical characteristics inspection portion of the chip electronic component inspection and sorting apparatus is usually provided with a fixed probe electrode (usually simply called a fixed electrode) disposed on the rear side (or the lower side) (Generally referred to simply as a movable electrode) disposed on the upper side (the lower side or the upper side) of the movable body is provided in a plurality of sets along the radial direction of the carrying disk.

As the movable probe provided in the chip electronic component electrical property inspection unit of the above-described chip electronic component inspection and sorting apparatus, it is preferable that the probe tip portion (portion contacting the electrode surface of the chip electronic component) is formed into a rod shape or a plate shape, Or the tip of the probe is provided with a rotatable roller so as to realize reliable contact between the tip of the probe and the electrode of the chip electronic component. Recently, there has been a problem in that the tip end portion of the probe has less wear and / (That is, an electrode terminal in which a roller is attached to the tip end portion) is less likely to be damaged.

Examples of the roller electrode terminals provided in the electronic component electrical property inspection portion of the chip electronic component inspection and sorting device are described in detail in the Patent Documents 2 to 6 together with the example of the configuration diagram.

Of the above Patent Documents 2 to 6, Patent Document 2 discloses a chip electronic component inspection and sorting apparatus in which chip electronic component conveying disks are vertically arranged, and also discloses a configuration example of a known roller electrode terminal.

Patent Document 4 of Patent Document 3 and Patent Document 4 which is a corresponding international publication of Patent Document 3 and Patent Document 6 which is a corresponding international publication of Patent Document 5 disclose a chip electronic device An example of a component inspection and sorting apparatus is disclosed, and another configuration example of a roller electrode terminal provided in a chip electronic component inspection and sorting apparatus is also disclosed.

Patent Document 7 discloses a chip component electronic component inspecting and sorting apparatus using the chip component electronic component inspecting and sorting apparatus having the above-described configuration. In order to take out the chip electronic components carried after the measurement of electrical characteristics in a stable posture, There is disclosed a proposal of forming a compressed air jetting port on a side surface of a chip electronic component receiving hole of a transfer table (transport table).

Japanese Laid-Open Patent Publication No. 2015-213121 Japanese Patent Application Laid-Open No. 2008-224418 Japanese Published Patent Application No. 2010-511865 WO2008 / 067129 A2 Japanese Patent Publication No. 2010-517058 WO2008 / 094831 A1 Japanese Patent Application Laid-Open No. 2007-45597

In the inspection and sorting operation using a chip electronic component, particularly a chip electronic component inspection and sorting apparatus using the chip electronic component that is miniaturized so as to have a very small size as described above, (Inventor) of the present invention has found that, in discharging the chip electronic component, sometimes the problem (discharge) of the chip electronic component is confirmed, Trouble) occurred. Specifically, as described above, the present inventor has confirmed that the chip electronic part sorting section has been confirmed to have a predetermined electric characteristic, and the pressurized air is introduced into the through hole of the conveying disk accommodating the selected chip electronic component The chip electronic components are discharged and sorted (or classified) so as to be accommodated in a predetermined container. However, the trouble that the chip electronic components from the through-hole into which the pressurized air is introduced is not smoothly discharged is particularly small Of the present invention occurs quite frequently in the inspection and sorting operation of chip electronic components.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method for realizing more smooth discharge of chip electronic components from the through-hole (chip electronic component accommodating hole) of a chip electronic component transfer disc when performing a chip electronic component inspection selection method have.

The inventor of the present invention has studied to clarify the cause of the discharge trouble from the transfer origin of the chip electronic component. As a result of the examination, the main cause of the discharge trouble of the chip electronic component is that the chip electronic component is accommodated in the chip electronic component accommodating hole (through hole) of the transfer disc, It has been concluded that the contact with the test sphere causes the sidewall to be pressed against the wall of the through hole at the side thereof and to be attached to the wall surface of the through hole. It has also been confirmed that the attachment of such a chip electronic component to the wall surface of the through hole of the transfer disc is particularly easy to occur for the chip electronic component as described above.

The present inventor has further studied to apply a physical impact to the chip electronic component attached to the wall surface of the through hole of the transfer disc in the measurement step of the electrical property before the discharge operation of the transfer disc from the through hole, It has been confirmed that the above problem of the present invention can be solved efficiently by removing the chip electronic component from the wall surface of the electronic component receiving hole.

Accordingly, the present invention provides a chip electronic component transfer apparatus comprising: a chip electronic component carrier having a plurality of chip electronic component accommodating holes arranged in a vertical or inclined state, and supported by a shaft so as to be intermittently rotated along a plane of the chip electronic component carrier; Preparing an electronic component carrying apparatus;

A chip electronic component having electrodes at both ends opposite to each other in a chip electronic component accommodating hole of a chip electronic component carrying disc is mounted so that at least a part of each electrode protrudes from both spherical surfaces of the chip electronic component accommodating hole ;

Moving the chip electronic component carrier along the disc plane to move the received chip electronic component to an electric characteristic measurement position where the movable roller electrode terminal and the fixed electrode terminal are disposed;

The movable electrode terminal and the fixed electrode terminal are brought into contact with the electrodes at both ends of the chip electronic component at the electrical property measurement position to apply a voltage and then the electrical characteristics of the chip electronic component are measured to determine a predetermined electric characteristic Selecting a chip electronic component representing the chip;

Moving the chip electronic component transporting disc back along the disc plane to move the chip electronic component whose electrical property measurement has been completed from the electrical characteristic measuring position to the chip electronic component classifying portion; And,

The chip electronic component sorting section supplies a pressurized gas to the chip electronic component receiving hole in which the chip electronic component selected in the electrical characteristic measuring step is accommodated, And a step of discharging and recovering the chip electronic component representing the chip electronic component,

A step of moving a chip electronic component for which electrical characteristics measurement has been completed from an electrical property measurement position to a chip electronic component classification portion, wherein a physical impact is applied to a chip electronic component accommodated in the chip electronic component accommodation hole, Wherein the operation of separating the chip electronic component from the wall surface of the chip electronic component receiving hole is carried out by the operation of the chip electronic component.

A preferred embodiment of the method for inspecting a chip electronic component of the present invention is as follows.

(1) A physical impact applied to a chip electronic component accommodated in a chip electronic component accommodating hole is applied in a direction perpendicular to the transporting disc.

(2) A physical impact applied to a chip electronic component accommodated in a chip electronic component accommodating hole is applied by a downward movement of a bar member moving up and down in a direction perpendicular to the transporting disc.

By using the inspection and sorting method of the chip electronic component of the present invention, it is possible to realize more smooth discharge of the chip electronic component from the through hole (chip electronic component receiving hole) of the chip electronic carrier at the time of conducting the chip electronic component inspection selection method.

The method for inspecting a chip electronic component of the present invention is particularly applicable to a chip electronic component having a very small main size (for example, a size of 0.2 mm x 0.2 mm x 0.4 mm, called 0402 chip) And can be effectively used at the time of testing and sorting chip electronic components manufactured in a smaller size.

1 is a front view showing an example of the entire configuration of a chip electronic component inspection and sorting apparatus.
Fig. 2 is a view for explaining a step of accommodating chip electronic components in the through hole (chip electronic component receiving hole) of the chip electronic component carrier, and is shown as a partial cross-sectional view of a side surface of the chip electronic carrier shown in Fig.
3 is a cross-sectional view showing a process of inspecting an electrical characteristic of a chip electronic component accommodated in a through hole of a transfer origin in an inspection section.
4 is a view showing the structure of a roller electrode terminal described in Patent Document 2. Fig.
5 is a cross-sectional view showing a state in which a chip electronic component is discharged by the introduction of a pressurized gas into a transmission in a chip electronic component sorting portion of a transfer origin.
Fig. 6 is a view showing the contact state before and after the inspection of the electric characteristics of the chip electronic component housed in the transfer disc and the roller portion of the roller electrode terminal shown in Patent Document 2. Fig.
Fig. 7 is a view showing the posture state inside the chip electronic component accommodating hole (through hole) before and after the electric characteristic inspection of the chip electronic component housed in the transfer disc newly confirmed by the present inventor.
8 is a schematic diagram showing an example of a configuration of an impact applicator for applying a physical impact to a chip electronic component used in the present invention.
Fig. 9 is a perspective view showing an example of the configuration of the impact applying member shown in Fig. 8;
10 is a schematic view showing another example of the configuration of the impact applying member for applying a physical impact to the chip electronic component used in the present invention.

First, a configuration example of a general chip electronic component inspection and sorting apparatus used for carrying out a continuous inspection and sorting method of electrical characteristics of a chip electronic component of the present invention will be briefly described with reference to FIGS. 1 to 5 .

A chip capacitor, which is a typical example of a chip electronic component to be inspected, is composed of a capacitor body made of a dielectric and a pair of electrodes (or electrode surfaces) formed opposite to both ends of the capacitor body. A typical chip capacitor is a chip ceramic capacitor using ceramics as a dielectric. In addition, electrodes of chip electronic components generally used at present are formed of tin, and a solder layer for mounting chip electronic components on various substrates is formed on the surface.

The chip electronic component to be inspected is often of the same production lot, but it may be a chip electronic component of the same production lot mixed with other chip electronic components. However, chip electronic components of both production lots are generally manufactured in accordance with the same standard so as to exhibit the same electrical characteristics (usually manufactured for the purpose of selling the same products as one another).

Fig. 1 is a front view showing a configuration example of a chip electronic component inspection and sorting apparatus using a transfer disc, and Fig. 2 is a view showing a state in which chip electronic components are supplied from the chip electronic component supply means to the through- This is shown as a schematic diagram.

A chip electronic component inspection and sorting apparatus 10 shown in Fig. 1 is provided with a chip electronic component transfer disc (hereinafter referred to as " chip ") 12, in which a plurality of through holes 11a temporarily accommodating chip electronic components are formed on the surface of a disc, 11 are vertically arranged and supported by a central shaft 42 formed in the base 41 so as to be rotatable along the plane of the disk. The rotation of the transporting disc is driven by the rotation drive device 43. [

(Supply water supply station) 101, an inspection unit (inspection station) 102 of the chip electronic component electrical characteristics, and a sorting unit (sorting station) of the chip electronic component are provided in the rotation path of the transfer disc 11, (103) are set.

The inspection unit 102 is provided with electrode terminals (electrical characteristic measuring terminals) for measuring electrical characteristics at positions close to both openings of the respective through holes 11a in the respective rows of the transporting disc 11. The inspectors 14a and 14b are electrically connected to the electrode terminals, and the controller 15 is connected to the inspecting device so as to supply a signal relating to the inspecting process to the inspecting device.

The sorting section 103 is provided with a chip electronic discharge pipe 62 for guiding chip electronic components discharged from the through hole 11a of the transporting disc 11 to the chip electronic component collecting case 61 .

The through hole 11a of the chip electronic component transporting disc 11 is normally arranged on the surface of the transporting disc on a plurality of concentric circles at positions where the concentric circles are equally divided.

In the chip electronic component inspection and sorting apparatus 10 shown in Fig. 1, six projections are arranged in the radial direction between the center and the peripheral edge of the transfer origin 11, and a total of six projections Each chip electronic component is inspected for electrical characteristics of the chip electronic component. The number of the through holes arranged in the radial direction between the center and the peripheral edge of the transfer disc 11 is generally in the range of 3 to 20, particularly in the range of 3 to 12.

The transfer disc 11 is rotatably provided on the base 41 via a base plate (reference plate) 45 (see Fig. 2) and a central shaft 42, and is arranged on the back side of the base plate By rotating the formed rotary drive device 43, the periphery of the central axis 42 is intermittently rotated at a predetermined period.

The chip electronic component 19 to be inspected in the chip electronic component supply accommodating portion 101 is temporarily accommodated in the through hole 11a of the transfer disc 11.

As shown in Figs. 1 and 2, a chip electronic component 19 to be inspected, which is an externally supplied inspection object, is inserted into a hopper 47, and chip electronic component supply means (not shown) provided in the chip electronic component supply / 31 to the through hole 11a of the transfer disc 11 through the bucket 44. [

2, when the chip electronic component 19 is supplied from the hopper to the bucket 44, a gas flow such as an air flow from the outside is introduced into the bucket 44 It is preferable that the bucket is floated. By making the chip electronic component 19 floating in the bucket 44 as described above, it becomes possible to smoothly and securely accommodate the transfer disc 11 of the chip electronic component 19 into the through hole 11a.

The base plate (base plate) 45 is provided with a reduced-pressure hole 45a so as to enable smooth accommodation of the original plate 11 of the chip electronic component 19 in the through hole 11a, The decompression hole is connected to the decompression device (46).

3, electrodes (22a, 22b) at both ends of the respective chip electronic components (19a, 19b, 19c, 19d, 19e, 19f) Are arranged at positions close to both openings of the through hole (chip electron receiving hole) 11a of the transporting disc 11 to electrically connect to the inspection device . Of these electrode terminals, the electrode terminal 12a is a fixed electrode terminal, and is fixed to the base plate 45 by an electrically insulating tubular body disposed around the electrode terminal 12a. On the other hand, the electrode terminal 12b is a movable electrode terminal, and as such a movable electrode terminal, a roller electrode terminal is generally used.

Next, the configuration of the roller electrode terminal generally used for measuring the electrical characteristics of the chip electronic component will be described with reference to the drawing showing the structure of the roller electrode terminal shown in Fig. 4 (a) is a front view of the roller electrode terminal, and Fig. 4 (b) is a side view showing the internal structure of the roller electrode terminal.

4A and 4B, the roller electrode terminal 13 includes a case 131, a connection terminal 132 to a test device, a roller electrode 133, a roller electrode 133, A rotation shaft 134, a roller electrode holder 135, a swing support point 136, a coil spring 137, and a connection cable 138.

3, the electrode terminal support plate 53 supporting the movable electrode terminal 12b is moved to the transport disc 11 side so that the movable electrode terminal 12b supported by the electrode terminal support plate is also moved to the transport disc 11, . By moving the movable electrode terminal 12b, the chip electronic component is brought into contact with the paired electrode terminals 12a and 12b. In this contact state, each electrode of the chip electronic component is electrically connected to the fixed electrode terminal 12a and the movable electrode terminal 12b.

In the inspection section (electrical characteristic measurement position) 102, six chip electronic components 19a, 19b, 19c, 19d, 19e, and 19f accommodated and arranged in a row in the radial direction of the transport disc 11 A predetermined electric characteristic is checked and a chip electronic component showing a predetermined electric characteristic is selected.

The chip electronic component whose electrical characteristics are inspected is then sent to the classifying section 103 of the chip electronic component shown in Fig. 1 by the rotational movement of the transfer origin 11, and the chip electronic component Classification (sorting) is carried out.

A process of sorting (sorting) chip electronic components in the chip portion 103 of the chip electronic component is shown in a schematic view in Fig. In the sorting section 103, a pressurized gas ejection hole 45b is formed in a base plate (reference piece) 45 and this pressurized gas ejection hole 45b is connected to a pressurized gas production device 63. [ The pressurized gas is generally produced by the pressurization of air.

The chip electronic components 19a, 19b, 19c, 19d, 19e and 19f which have been inspected for electrical characteristics and sent to the separating section 103 by the rotational movement of the transfer disc are transferred onto the base plate And stops at a position corresponding to the hole 45b. Based on the control signal sent from the controller 15, the pressurized gas is supplied to the through hole (chip electronic component receiving hole) 11a of the conveying disc 11 through a predetermined pressurized gas ejection hole 45b, The chip electronic component 19a in the through hole 11a is lifted and discharged by the supply of the pressurized gas and is received in the chip electronic component recovery case 61 shown in Fig. 1 through the inside of the chip electronic discharge pipe 62 .

6 (a), 6 (b) and 6 (c) show the chip electronic component 19 and the roller electrode terminal 133 (electrical characteristic measurement position) In the contact state of the contact portion. That is, the roller electrode terminal 133 is connected to the chip electronic component 19 accommodated in the through hole of the transfer origin 11 by the movement of the transfer disc 11 in the direction of the arrow shown in (a) And then, as shown in (b), it is put on the surface of the top electrode. At this point in time, the transport disc 11 temporarily stops, and during this stop, a voltage is applied between the upper roller electrode terminal 133 and the lower fixed electrode terminal 134, so that the electrical characteristics of the chip electronic component 19 . After the electrical measurement is completed, as shown in Fig. 3C, the transporting disc 11 moves again in the direction indicated by the arrow. As a result, the roller electrode terminal 133 is electrically connected to the other electrode It comes down from the top while touching in the corner.

Next, FIG. 7 schematically shows a change in the contact state between the chip electronic component and the roller electrode terminal in the inspection section, which has been found by the present inventors as a basis of the present invention.

7, (1) shows a state in which the chip electronic component 19 accommodated in the transfer origin 11 moves to the vicinity of the electric characteristic measurement position and starts to rise on the top of the fixed electrode terminal 134, And starts to contact the roller electrode terminal 133 at the upper end of the front side thereof. In this process, the chip electronic component 19 is moved in parallel to approach the left side as shown in the inside of the through hole 11a. Finally, the chip electronic component 19 is pressed in the left side wall surface, It comes into contact with the wall and stops. [0003] Electronic chip electronic components tend to stick to the inner wall surface of the through hole frequently, especially for the above-mentioned mainstream microelectronic chip components.

When the electronic component 19 is attached to the wall surface on the left side of the chip electronic component 19 as shown in Fig. 7 (a), the chip electronic component 19 is mounted on one of the wall surfaces The left side wall surface in the drawing). The chip electronic component 19 in the position pasted to the left side wall surface of the through hole 11a can not be electrically connected to the through hole 11a after the measurement of the electrical characteristics, (Base plate) 45 while maintaining the state of the attachment to the left side wall surface of the base plate (reference plate) 45. Thus, the chip electronic component 19 reaches the parting portion (chip electronic component discharge portion) 103 with the side surface attached to the wall surface of the through hole 11a. Therefore, the chip electronic component 19 provided for the discharge operation from the transfer disc tends to be difficult to discharge even by the introduction of the pressurized gas into the transfer in the separating portion. Therefore, Resulting in exhaust trouble of parts.

The inventors of the present invention have devised a method for effectively avoiding occurrence of discharge troubles of a chip electronic component in the sorting section described so far by applying a physical impact to a chip electronic component accommodated in the chip electronic component accommodating hole It has been confirmed that by applying such a physical impact, the chip electronic component can be efficiently detached from the wall surface of the chip electronic component receiving hole.

That is, according to the experiment of the inventor of the present invention, when the test screening operation is carried out without conducting the physical impact application process to the chip electronic component proposed in the present invention, particularly in the test screening of the above- The emission troubles occurred at a high rate of 10 to 20% (the rate at which the chip electronic components did not discharge from the through hole even though the pusher stay was introduced into the through hole). However, the discharge operation from the through- It was confirmed that, when the physical impact was applied to the chip electronic component disclosed in this specification, the ratio of the discharge trouble was remarkably reduced to less than 1%.

Fig. 8 shows a concrete example of a means for applying a physical impact to a chip electronic component accommodated in the chip electronic component accommodating hole. The physical impact applying means 139 shown in Fig. 8 is a rod-shaped body that moves up and down with respect to the transfer origin (that is, moves in the direction perpendicular to the transfer origin) And a plate-like member for contact is provided. The bar body has a spring (140) provided around the bar body as shown in Fig. 9 (a support frame disposed in the radial direction of the transport disc, so that the lower surface of the reflection member is positioned near the surface of the transport disc (Supported by the physical impact applying means supporting frame 141), it is possible to move up and down in a very short time.

8A shows an example in which the physical impact applying means 139 is used in combination with a base plate (reference plate) 45 of a usual shape. Fig. 8B shows an example in which the base plate 45, And a depressed portion is formed in a region located below the physical impact applying means.

As shown in Fig. 10, the physical impact applying means may be a physical impact applying means (roller type), that is, a configuration 139a in which a roller is formed at the lower end portion of the bar member, A brush capable of being rotated, or a drum-shaped rotating body rotating along the surface of the transporting disc. In other words, the physical impact applying means used in the present invention can be constituted by various means.

In the present specification, the description of the configuration of the chip electronic component inspection and sorting apparatus and the operation and effect of the present invention are described by taking chip electronic component inspection and sorting apparatuses in which the original chip electronic component carrier is arranged in the vertical direction, It goes without saying that the chip electronic component inspection and sorting apparatus used in the method for measuring the electrical characteristics of the chip electronic component of the invention may be a device in which the original chip electronic component carrier is pivotally supported on the base in an inclined state.

10: chip electronic component inspection screening device
11: Chip for transferring chip electronic components (original disc)
11a: Through hole (chip electronic component receiving hole)
12a: fixed electrode terminal
12b: movable electrode terminal
13: roller electrode terminal
19: Chip electronic components
22a, 22b: electrodes
31: Chip electronic component supply means
41: expectation
44: Bucket
45: Base plate (base plate)
47: Hopper
101: chip electronic component supply accommodating portion
133: roller electrode
139: Physical impact applying means
139a: Physical impact applying means (roller type)

Claims (3)

There is provided a chip electronic component conveying device in which a chip electronic component conveying disc having a plurality of chip electronic component receiving holes is arranged in a vertical or inclined state and is supported so as to be intermittently rotated along the plane of the chip electronic component conveying disc ;
A chip electronic component having electrodes at both ends opposite to each other in a chip electronic component receiving hole of a chip electronic component carrying disc is mounted so that at least a part of each electrode protrudes from both spherical surfaces of the chip electronic component receiving hole ;
Moving the chip electronic component carrier along the disc plane to move the received chip electronic component to an electric characteristic measurement position where the movable roller electrode terminal and the fixed electrode terminal are disposed;
The movable electrode terminal and the fixed electrode terminal are brought into contact with the electrodes at both ends of the chip electronic component at the electrical property measurement position to apply a voltage and then the electrical characteristics of the chip electronic component are measured to determine a predetermined electric characteristic Selecting a chip electronic component representing the chip;
Moving the chip electronic component transporting disc back along the disc plane to move the chip electronic component whose electrical property measurement has been completed from the electrical characteristic measuring position to the chip electronic component classifying portion; And,
The chip electronic component sorting section supplies a pressurized gas to the chip electronic component receiving hole in which the chip electronic component selected in the electrical characteristic measuring step is accommodated, And a step of discharging and recovering the chip electronic component representing the chip electronic component,
A step of moving a chip electronic component for which electrical characteristics measurement has been completed from an electrical characteristic measurement position to a chip electronic component classification portion, wherein a physical impact is applied to a chip electronic component accommodated in the chip electronic component accommodation hole, And a step of separating the chip electronic component from the wall surface of the chip electronic component receiving hole. The method according to claim 1,
Wherein a physical impact applied to a chip electronic component accommodated in the chip electronic component accommodating hole is applied in a direction perpendicular to the transfer disc. The method according to claim 1,
Wherein the physical impact applied to the chip electronic component accommodated in the chip electronic component accommodating hole is applied by the descending movement of the bar member moving up and down in the vertical direction with respect to the transfer original.

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