JP2007045597A - Chip component carrying device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip component carrying device capable of picking out carried chip components in a stable attitude. <P>SOLUTION: The chip component carrying device 12 comprises a carrying table 30 and a disc-like turntable 32. The turntable 32 has a plurality of cavity portions 34 arranged circularly side by side where the chip components 20 are sucked and held. By rotating the turn table 32, the chip components 20 are carried so as to draw a circular track where the chip components 20 are picked out of the cavity portions 34 by a chip component pick-out portion. With compressed air blown out of blow holes 46 formed in the carrying table 30, the chip component pick-out portion picks the chip components 20 out of the cavity portions 34. The plurality of blow holes 46 are formed in one cavity portion 34, and the blow holes 46 are arranged on both sides of a gravity center travel line 48 along which the gravity centers of the chip components 20 travel. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a chip component transport device, and more particularly to a chip component transport device for individually transporting chip components such as chip capacitors.

  FIG. 11 is an illustrative view showing a conventional chip component conveying apparatus. The chip part conveying apparatus 1 includes a disk-shaped turntable 2. The turntable 2 is formed with a plurality of cavities 2a concentrically. Chip components are supplied to the cavity 2a by the parts feeder 3 or the like, and the turntable 2 rotates to convey the chip components. The characteristic of the chip part is measured by the measuring device 4 in the movement path of the chip part. And in the extraction part 6, according to the measured characteristic, it classify | categorizes into a non-defective product and a defective product, for example, and chip components are taken out (refer patent document 1).

  As shown in FIGS. 12 and 13, the turntable 2 is provided to face the main surface of the guide plate 5 and is formed to rotate on the guide plate 5. A ring-shaped suction groove 6 is formed in the guide plate 5, and the chip component 7 housed in the cavity 2 a is sucked and held via the suction groove 6. In this state, the turntable 2 rotates, and the chip component 7 is conveyed so as to slide on the guide plate 5. In the take-out portion, the guide plate 5 is formed with an ejection hole 8 at a position corresponding to the cavity 2 a of the turntable 2. The chip component 7 is taken out from the cavity 2a by ejecting compressed air from the ejection hole 8 toward the chip component 7 accommodated in the cavity 2a. In the take-out portion, a hose 9 is disposed at a position facing the ejection hole 8 with the turntable 2 interposed therebetween. By this hose 9, the chip component that has jumped out of the cavity 2a is guided to a predetermined location.

  The pressure, flow rate, etc. of the compressed air are adjusted so that the extracted chip parts do not stay in the hose 9. In general, when the size of the chip component is small, the pressure of compressed air is low and the flow rate is low, and when the size of the chip component is large, the pressure of compressed air is high and the flow rate is high, so The extraction condition is set. In this way, by adjusting the compressed air, the chip component is rotated less and can be taken out in a stable posture. In order to adjust such compressed air, pressure adjustment by attaching a regulator to the compressed air circuit and flow rate adjustment by a flow rate adjustment valve are performed.

JP 2002-29627 A

  However, in such a conventional chip component transport device, if the hole diameter of the ejection hole is not increased as the size of the chip component is increased, a moment is generated in the force to be taken out with respect to the center of gravity of the chip component. The posture becomes unstable and stagnation occurs in the take-out path such as in the hose. Further, when the size of the chip part is smaller than the diameter of the ejection hole, the chip part enters the ejection hole, and the chip part is defective. In the worst case, the turntable may be damaged by the chip part caught in the ejection hole.

  Therefore, a main object of the present invention is to provide a chip component transport apparatus that can take out a chip component that has been transported in a stable posture.

The present invention is formed so as to penetrate through both a main surface of a transport table having a transport surface for transporting chip components, a plate-shaped transport medium provided opposite to the transport surface of the transport table, and the transport medium. Cavity part for storing chip parts to be stored, driving means for moving the transport medium along the transport surface of the transport table, and the center of gravity movement line for moving the center of gravity of the chip parts stored in the cavity part. And a plurality of ejection holes for ejecting compressed air toward the chip component, and a compressed air ejection for controlling the flow rate, pressure and ejection time of the compressed air ejected from the ejection holes. A chip component conveying device including a mechanism.
The present invention also provides a transport table having a transport surface for transporting chip components, a plate-shaped transport medium provided opposite the transport surface of the transport table, and a transport medium having a bottom surface on the transport table side. The cavity part for storing the chip parts formed so as to open in the main surface of the substrate, the drive means for moving the conveyance medium along the conveyance surface of the conveyance table, and the center of gravity of the chip parts accommodated in the cavity part are A plurality of ejection holes formed on the bottom surface of the cavity portion so as to be arranged on both sides of the moving center-of-gravity movement line, and for ejecting compressed air toward the chip component, and a transfer table along the movement path of the cavity portion A supply port for supplying compressed air to the ejection holes formed at predetermined positions, and a supply path formed on the transport table for supplying compressed air from the supply ports to the ejection holes. When the flow rate of the compressed air ejected from the ejection hole, and a compressed air jet mechanisms for controlling the pressure and jetting time, a chip component transporting device.
In these chip component conveying apparatuses, it is preferable that the midpoint of the line connecting the plurality of ejection holes is on the barycentric movement line.
Furthermore, it is preferable that the positions of the plurality of ejection holes are line symmetric with respect to the center-of-gravity movement line.
Moreover, as a conveyance medium, it can be set as the disk in which the cavity part was formed concentrically.
Further, it is preferable that the main surface of the carrier medium is inclined with respect to the horizontal plane in a range of 45 ° to 90 ° so that the carrier medium becomes the upper surface.
Further, a hose for collecting the chip components can be installed at a position facing the ejection hole with the carrier medium interposed therebetween.

The chip component housed in the cavity portion of the transport medium is transported, and the chip component is taken out from the cavity portion by ejecting compressed air from the ejection hole toward the chip component. At this time, a plurality of ejection holes for ejecting compressed air are arranged on both sides of the center of gravity movement line where the center of gravity of the chip component moves, so that an extrusion force acts on both sides of the center of gravity of the chip component, thereby stabilizing the chip component. It is taken out from the cavity part with the posture. Furthermore, in order to take out the chip components in a good posture, the flow rate, pressure, and ejection time of the compressed air are controlled to be optimum conditions.
In such a chip component transport apparatus, the cavity portion may be formed so as to penetrate both sides of the transport medium, or formed so as to have a bottom surface on the transport table side and open to the main surface of the transport medium. May be. When the cavity part which has a bottom face is formed in the conveyance table side, at the time of conveyance of a chip component, a chip component and a conveyance table do not rub, and damage to a chip component is prevented.
Further, since the midpoint of the line connecting the plurality of ejection holes is on the center-of-gravity movement line of the chip part, the chip part is pushed out without rotating.
In particular, when the plurality of ejection holes are arranged so as to be line-symmetric with respect to the center-of-gravity movement line of the chip part, the chip part is pushed out in a stable posture.
Further, by making the carrier medium into a disk shape having concentric cavities, the chip parts can be efficiently collected and taken in a small space.
Furthermore, since the chip component in the cavity portion is held in an inclined state by inclining the carrier medium, the chip component is not easily dropped from the cavity portion even if there is vibration due to the conveyance.
Further, by providing a hose at a position facing the ejection hole with the conveyance medium in between, the collected chip component can be guided to an arbitrary place, and taping after collecting the chip component becomes easy.

  According to the present invention, it is possible to take out the chip component conveyed by the conveyance medium in a stable posture, and the chip component is prevented from staying in a collecting hose or the like.

  The above object, other objects, features, and advantages of the present invention will become more apparent from the following description of the best mode for carrying out the invention with reference to the drawings.

  FIG. 1 is an illustrative view showing an example of a chip part inspection apparatus using the chip part conveying apparatus of the present invention. The chip part inspection apparatus 10 includes a chip part conveying apparatus 12. Further, the chip component inspection device 10 is provided with a chip component supply unit 14, and the chip components are supplied to the chip component transport device 12. The chip component conveyed by the chip component conveying device 12 is conveyed to a measuring device 16 provided in the middle of conveyance, and a plurality of characteristics are measured. The chip component whose characteristics have been measured is collected by the chip component take-out unit 18. At this time, according to the measurement result of the characteristics, for example, it is classified as a good product and a defective product, and the chip parts are collected.

  As shown in FIG. 2, the chip component 20 to be inspected by the chip component inspection apparatus 10 is one in which external electrodes 24 are formed at both ends of a rectangular base body 22, for example. Examples of such a chip component 20 include a chip-type capacitor, but are not limited thereto, and any chip-type component may be used.

  As shown in FIGS. 3 and 4, the chip component transport device 12 includes a plate-shaped transport table 30. One main surface of the transfer table 30 is used as a transfer surface 30 a for transferring the chip component 20. A turntable 32 as a transport medium is placed on the transport surface 30 a of the transport table 30. The turntable 32 is formed in a disc shape, and a plurality of cavity portions 34 are formed concentrically with respect to the center point. The cavity 34 is formed in a quadrangular shape so as to penetrate both main surfaces of the turntable 32. In FIG. 3, only one row of the cavity portions 34 arranged in a circle is shown, but actually, a plurality of rows of cavity portions 34 are formed concentrically as shown in FIG. 1. .

  As shown in FIG. 4, a rotation shaft 36 is attached to the center portion of the turntable 32. The rotary shaft 36 is coupled to the drive device 38 so as to penetrate the transport table 30. By this driving device 38, the turntable 32 rotates so as to slide on the conveyance surface 30 a of the conveyance table 30.

  Further, on the side of the conveyance surface 30 a of the turntable 32, a back digging groove 40 that is continuous with the cavity portion 34 is formed. The back digging groove 34 is formed on one end side of each cavity portion 34 on the outer peripheral side of the concentric cavity portion 34. Further, a ring-shaped suction groove 42 is formed on the conveyance surface 30 a side of the conveyance table 30 so as to connect the back digging grooves 40 of one row of turntables 32. Accordingly, a single row of cavity portions 34 arranged in a circle are connected by one suction groove 42. At two opposite positions of the suction groove 42, suction holes 44 are formed. The suction hole 44 is connected to, for example, a vacuum pump. Thereby, the chip component 20 transferred into the cavity portion 34 is sucked and held on the back digging groove 40 side.

  Further, in the chip component take-out unit 18, an ejection hole 46 for ejecting compressed air is formed at a predetermined position of the transport table 30. The ejection holes 46 are formed at intervals corresponding to the plurality of cavity portions 34. For example, two ejection holes 46 are formed corresponding to one cavity portion 34. The two ejection holes 46 are arranged on both sides of a center-of-gravity movement line 48 in which the center of gravity of the chip component 20 sucked and held in the cavity portion 34 moves. That is, as the turntable 32 rotates, the center of gravity of the chip component 20 sucked and held in the cavity portion 34 moves in a circular orbit, and two ejection holes 46 are arranged on both sides of the circular orbit. The

  Here, the midpoint of the line connecting the two ejection holes 46 formed corresponding to one cavity 34 is the center of gravity movement of the chip component 20 as shown in FIGS. 5 (A), (B), and (C). Located on line 48. In particular, the two ejection holes 46 are preferably arranged so as to be line-symmetric with respect to the center-of-gravity movement line 48 of the chip component 20. These ejection holes 46 are connected to an air compressor, for example, and compressed air is ejected from the ejection holes 46 toward the cavity portion 34. At this time, the flow rate, pressure, ejection time, and the like of the compressed air ejected from the ejection hole 46 in accordance with the size of the chip component 20 held in the cavity 34 by the compressed air ejection mechanism (not shown). Be controlled.

  Further, a hose 50 for collecting the chip component 20 is attached to a position facing the ejection hole 46 across the turntable 32 in the chip component extraction unit 18. Since the ejection holes 46 are formed at intervals corresponding to the plurality of cavities 34, a plurality of hoses 50 are arranged correspondingly. These hoses 50 are led to a plurality of places for classifying the chip components 20. Since the chip component 20 is classified into a predetermined place by the hose 50, taping after the chip component 20 is collected becomes easy.

  In the chip component inspection apparatus 10, the chip component 20 is transferred into the cavity portion 34 of the turntable 32 in the chip component supply unit 14. At this time, as shown in FIG. 4, the chip component 20 is transferred into the cavity 34 so that the external electrode 24 is arranged in the thickness direction of the turntable 32. The chip component 20 transferred to the cavity part 34 is sucked and held in the cavity part 34 through the suction groove 42, the suction hole 44 of the transfer table 30 and the back digging groove 40 of the turntable 32. Therefore, the chip component 20 is held on the side where the back digging groove 40 is formed, that is, at a certain position of the cavity portion 34.

  When the turntable 32 rotates while the chip component 20 is held, the chip component 20 is conveyed while drawing a circular path. The turntable 32 is intermittently rotated at intervals of the cavity portions 34 adjacent to each other in the circumferential direction, for example, so that the chip component 20 is temporarily stopped at the measurement device 16 portion. Then, the characteristic of the chip component 20 is measured by the measuring device 16.

  The chip component whose characteristics are measured by the measuring device 16 is conveyed to the chip component take-out unit 18 by the rotation of the turntable 32. In the chip part taking-out part 18, the chip part 20 is ejected from the cavity part 34 by ejecting compressed air from the ejection hole 46, and collected at a predetermined place by the hose 50. At this time, the position of the cavity portion 34 that ejects the compressed air is selected in the circumferential direction of the turntable 32 based on the measurement result of the characteristics of the chip component 20. Then, at a selected position, the compressed air is ejected from the ejection hole 46 toward the chip component 20 in the cavity portion 34, for example, to be classified into a non-defective product and a defective product, and the chip component 20 is taken out. Note that suction is also applied to the suction groove 42 when compressed air is ejected from the ejection holes 46.

  When the chip component 20 is taken out, compressed air is ejected from the ejection holes 46. However, since the ejection holes 46 are arranged on both sides of the center of gravity moving line 48 of the chip component 20, a moment is generated in the chip component 20. do not do. For this reason, the chip component 20 is prevented from rotating into the hose 50 in a stable posture, and the chip component 20 is prevented from staying in the hose 50. In particular, when the midpoint of the line connecting the two ejection holes 46 is on the center-of-gravity movement line 48 of the chip component 20, the chip component 20 can be taken out in a stable posture. Further, when the two ejection holes 46 are arranged in line symmetry with respect to the center-of-gravity movement line 48 of the chip component 20, the chip component 20 can be taken out in a more stable posture.

  Thus, by using this chip component conveying device 12, the chip component 20 can be taken out in a stable posture, and the retention of the chip component 20 in the hose 50 can be prevented. , Classification work can be done without delay. Further, in this chip component conveying device 12, since the number of the ejection holes 46 for ejecting the compressed air is large with respect to one cavity portion 34, the pipe resistance of the compressed air is reduced, and high speed removal is possible. Therefore, the capacity of the entire apparatus can be increased.

  As shown in FIG. 6, the bottom surface 52 may be formed in the cavity portion 34. The bottom surface 52 is formed on the conveyance surface 30 a side of the conveyance table 30. For example, two ejection holes 54 are formed in the bottom surface 52. As shown in FIGS. 5A, 5 </ b> B, and 5 </ b> C, the ejection holes 54 are disposed on both sides of the center-of-gravity movement line of the chip component 20 held in the cavity portion 34. Further, the back digging groove 40 is formed on the outer peripheral side of the bottom surface 52 arranged in a circle, and is connected to the suction groove 42 formed in the transport table 30.

  In the chip component take-out unit 18, a supply port 56 for supplying compressed air to the transport table 30 is formed corresponding to the ejection hole 54 formed in the bottom surface 52 of the turntable 32. In order to send compressed air to the supply port 56, a supply path 58 is formed in the transfer table 30. The supply port 56 and the supply path 58 are formed at intervals corresponding to the plurality of cavity portions 34.

  In such a chip component transport device 12, when the chip component 20 is transported, the chip component 20 moves while being held on the bottom surface 52, so that even if the turntable 32 rotates, the chip component 20 is transported by the transport table 30. It does not rub against the transport surface 30a. Further, the chip component 20 being transported is not caught by the supply port 56 formed in the transport table 30. Therefore, if this chip component transport device 12 is used, the possibility of breakage of the chip component 20 can be reduced.

  When the size of the chip component 20 changes, the chip component does not enter the cavity part 34, or the position of the center of gravity of the chip part 20 in the cavity part 34 changes, and the position of the center of gravity moving line 48 changes. To do. Therefore, when the chip component 20 having a different size is transported, as shown in FIG. 7, it is changed to a turntable 32 in which the position and size of the cavity portion 34 are changed. In the turntable 32, the size of the cavity portion 34 is set in accordance with the size of the chip component 20, and the ejection holes 46 or the supply ports 56 are arranged on both sides of the center-of-gravity movement line 48 of the chip component 20. A cavity portion 34 is formed. Thus, by changing the turntable 32, it is possible to deal with a plurality of types of chip components 20.

  Moreover, as the cavity part 34, the shape opened toward the outer peripheral part of the turntable 32 may be sufficient as shown in FIG. Even in such a case, the chip component 20 can be prevented from spilling on the outer peripheral side of the turntable 32 by adjusting the position of the back digging groove 40 for sucking the chip component 20.

  Furthermore, as shown in FIG. 9, the transport table 30 and the turntable 32 are preferably formed at an angle of 45 ° to 90 ° with respect to the horizontal plane. At this time, the turntable 32 is arranged on the upper side, and the cavity portion 34 is arranged so as to open upward. With such an arrangement, the chip component 20 held in the cavity 34 is not easily spilled even if there is vibration due to conveyance.

  Further, the conveyance medium is not limited to the disk-shaped turntable, and may be a belt-shaped conveyance belt 60 as shown in FIG. In this case, the transport table 62 is also formed in an annular shape that contacts the inside of the transport belt 60. A plurality of cavities 34 are formed in the transport belt 60, and the chip component 20 is sucked and held in the cavities 34. Then, the chip component 20 is transported by rotating the transport belt 60 around the transport table 62.

  Also in such a chip component conveying device 12, the chip component take-out unit ejects the chip component 20 in a stable posture by ejecting compressed air from the ejection holes arranged on both sides of the center of gravity moving line of the chip component 20. be able to. Therefore, the chip component 20 does not stay in the hose, and the inspection and classification work of the chip component 20 can be performed without delay.

It is an illustration figure which shows an example of the chip component inspection apparatus using the chip component conveying apparatus of this invention. It is a perspective view which shows an example of the chip component test | inspected with the chip component inspection apparatus shown in FIG. It is a top view which shows an example of the chip component conveying apparatus of this invention. It is an illustration figure which shows the internal structure of the chip component conveying apparatus shown in FIG. It is an illustration figure which shows arrangement | positioning of the ejection hole of the chip component conveying apparatus shown to FIG. 3 and FIG. It is an illustration figure which shows the internal structure of the other example of the chip component conveying apparatus of this invention. It is a top view which shows the further another example of the chip component conveying apparatus of this invention. It is a partial solution figure which shows the other example of the turntable used for the chip component conveying apparatus of this invention. It is an illustration figure which shows the angle of the conveyance table of the chip component conveying apparatus of this invention, and a turntable. It is a perspective view which shows another example of the chip component conveying apparatus of this invention. It is an illustration figure which shows an example of the chip component inspection apparatus using the conventional chip component conveyance apparatus. It is a top view which shows an example of the conventional chip component conveyance apparatus. It is an illustration figure which shows the internal structure of the conventional chip component conveying apparatus shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Chip component inspection apparatus 12 Chip component conveyance apparatus 20 Chip component 30 Conveyance table 32 Turntable 34 Cavity part 36 Rotating shaft 38 Drive apparatus 40 Back digging groove 42 Suction groove 44 Suction hole 46 Ejection hole 48 Chip part center of gravity moving line 50 Hose 52 Bottom surface 54 Ejection hole 56 Supply port 58 Supply path 60 Conveying belt 62 Conveying table

Claims (7)

A transfer table having a transfer surface for transferring chip components;
A plate-shaped transport medium provided facing the transport surface of the transport table;
A cavity for storing the chip component formed so as to penetrate both main surfaces of the carrier medium;
Drive means for moving the transport medium along the transport surface of the transport table;
A plurality of jets formed on the transfer table so as to be arranged on both sides of a center-of-gravity movement line in which the center of gravity of the chip component housed in the cavity portion moves, and for ejecting compressed air toward the chip component A chip component transport device including a hole, and a compressed air ejection mechanism for controlling a flow rate, pressure, and ejection time of compressed air ejected from the ejection hole. A transfer table having a transfer surface for transferring chip components;
A plate-shaped transport medium provided facing the transport surface of the transport table;
A cavity portion for storing the chip component formed so as to have a bottom surface on the transport table side and open to a main surface of the transport medium;
Drive means for moving the transport medium along the transport surface of the transport table;
The plurality of chip parts formed on the bottom surface of the cavity part so as to be arranged on both sides of the center-of-gravity movement line in which the center of gravity of the chip part accommodated in the cavity part moves, and for ejecting compressed air toward the chip part Vent hole,
A supply port for supplying compressed air to the ejection holes formed at predetermined positions of the transport table along the movement path of the cavity portion;
A supply path formed in the transfer table for supplying compressed air from the supply port to the ejection holes, and a compressed air ejection mechanism for controlling the flow rate, pressure and ejection time of the compressed air ejected from the ejection holes A chip parts conveying apparatus.   The chip component transport apparatus according to claim 1, wherein a midpoint of a line connecting the plurality of ejection holes is on the center-of-gravity movement line.   4. The chip component transport device according to claim 1, wherein the positions of the plurality of ejection holes are line symmetric with respect to the center-of-gravity movement line. 5.   5. The chip component transport apparatus according to claim 1, wherein the transport medium is a disk in which the cavity portion is formed concentrically. 6.   6. The apparatus according to claim 1, wherein the main surface of the conveyance medium is inclined with respect to a horizontal plane in a range of 45 ° to 90 ° so that the conveyance medium becomes an upper surface. Chip component transfer device.   The chip component transport apparatus according to any one of claims 1 to 6, wherein a hose for collecting the chip component is installed at a position facing the ejection hole with the transport medium interposed therebetween.

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