KR102571292B1 - Method of inspecting and sorting chip electronic component - Google Patents

Abstract

(Problem) Electrical characteristics of chip electronic components using a conveying device for chip electronic components configured by arranging a conveying disc having a chip electronic component receiving hole in a vertical or inclined state and supporting the conveying disc so that rotation along the plane is possible. In a method for inspecting and sorting chip electronic components including a step of measuring and then discharging and recovering chip electronic components having predetermined electrical characteristics from a conveyance disc, smooth discharge of chip electronic components having predetermined electrical characteristics is performed. come true
(Solution Means) After measuring the electrical characteristics of the chip electronic component, and before ejecting the chip electronic component having predetermined electrical characteristics from the transfer disk, a physical impact is applied to the chip electronic component accommodated in the chip electronic component accommodating hole, An operation of separating the chip electronic component from the wall surface of the chip electronic component accommodating hole is performed.

Description

Inspection selection method of chip electronic components {METHOD OF INSPECTING AND SORTING CHIP ELECTRONIC COMPONENT}

The present invention relates to a method of continuously inspecting and sorting electric characteristics of a large number of chip electronic components at high speed using an automated chip electronic component inspection and sorting device. More specifically, using a chip electronic component conveying device configured by arranging a conveying disc having a chip electronic component accommodating hole in a vertical or inclined state and supporting the conveying disc so that rotation along a plane is possible, The present invention relates to a method for inspecting and sorting chip electronic components including a step of measuring (inspecting) electrical characteristics of electronic components, selecting chip electronic components having predetermined electrical characteristics, discharging them from a conveyance disk, and collecting the electronic components.

With the increase in production of small electronic devices such as mobile phones, smart phones, liquid crystal televisions, and electronic game machines, the production of minute chip electronic components mounted on such small electronic devices is significantly increasing. Most of the chip electronic components are electronic components having a two-terminal structure formed of a body portion and electrodes provided on each of the opposite end surfaces of the body portion. Examples of chip electronic components having such a configuration include chip capacitors (also called chip capacitors), chip resistors (including chip varistors), and chip inductors.

In recent years, with further miniaturization of electronic devices equipped with chip electronic components and an increase in the number of chip electronic components mounted in electronic devices, chip electronic components have become extremely small. For example, with respect to chip capacitors, recently, chip capacitors of a very small size (e.g., a size of 0.2 mm × 0.2 mm × 0.4 mm, called a 0402 chip) have come to be used, and such minute chip electronic components are By production, one production unit is produced in units of tens of thousands to hundreds of thousands.

In an electronic device on which chip electronic components are mounted, in order to reduce the defective product rate of the electronic device due to defects in the chip electronic components to be mounted, it is common that all chip electronic components to be mounted are preliminarily inspected. For example, with regard to chip capacitors installed in electronic devices, electrical characteristics such as capacitance and leakage current are usually measured (inspected) in advance for all of them.

Inspection of the electrical characteristics of a large number of chip electronic components needs to be performed at high speed, and as a device for automatically performing the high-speed inspection, recently, acceptance (temporary acceptance) of a large number of chip electronic components has been developed. An automated device for inspecting and sorting electric characteristics of chip electronic components (ie, a chip electronic component inspection and sorting device) equipped with a chip electronic component conveying disk having a perforation thereon is generally used. In a chip electronic component transport disk (hereinafter sometimes simply referred to as a "transport disk"), a large number of perforations for temporarily receiving and holding chip electronic components, which are normally inspected objects, are formed along the circumference in a state in which three or more rows are arranged. has been Then, when this device for inspecting and sorting chip electronic components is used, after the chip electronic component is accommodated and held in the hole of the conveying disc that rotates intermittently, the chip electronic component held in the conveying disc is placed on the rotation path of the conveying disc. An operation of measuring electrical characteristics of the chip electronic component by applying a predetermined voltage by bringing a pair of electrode terminals (testing contactors) into contact with each electrode of the chip electronic component in the electrical characteristic inspection unit formed at a position along this is carried out Then, the chip electronic component exhibiting the desired electrical characteristics is discriminated and selected by the electrical characteristic discrimination device electrically connected to the inspection contact.

For example, when testing the capacitance of a chip capacitor, in the electrical characteristics inspection unit, the inspection device (electrical characteristics measurement device) provided in the chip electronic component inspection and sorting device passes through the electrode terminal for inspection to the chip capacitor. A test voltage having a predetermined frequency is applied. Then, the current value of the current generated in the chip capacitor by the application of the inspection voltage is detected by the inspection device, and based on the detected current value and the voltage value of the applied inspection voltage, the capacitance of the chip capacitor to be inspected is determined. measurements are made.

In a typical device for inspecting electrical characteristics of chip electronic components, which is generally used, a chip electronic component conveyance disc having at least three rows of through-holes concentrically formed on the surface is placed in a vertical or inclined state, and the conveyance disc is Electrode terminals including a base supporting shafts at the center of rows of concentric through-holes to enable intermittent rotation, and chip electronic component supply receiving portions, roller electrode terminals, and fixed electrode terminals respectively disposed at positions along the surface of the conveying disk. There is an apparatus for inspecting electrical properties of a chip electronic component including an electrical property inspection unit having a set.

After the inspection of the chip electronic component held in the transfer disk is completed, based on the inspection result, it is confirmed that the inspected chip electronic component has predetermined electrical characteristics, ) is introduced with pressurized air to eject the chip electronic component from the through hole and collect it so that it is accommodated in a predetermined container. For this reason, a chip electronic component sorting unit (sorting station) for sorting (or sorting) the chip electronic components after inspection is further attached to a normal chip electronic component inspection and sorting device, and a chip having such a configuration is provided. In many cases, it is commercialized as an electronic component electrical characteristic inspection sorting device.

An example of the chip electronic component inspection and sorting device described above is the device described in Patent Literature 1. That is, in Patent Literature 1, chip electronic components to be inspected manufactured based on the same standards so as to exhibit the same predetermined electrical characteristics are arranged close to each other using the chip electronic component inspection and sorting device having the above-described configuration. The inspection device is then electrically connected to the electrode of the chip electronic component, and an inspection voltage is applied to each chip electronic component from the inspection device, and the current value generated in each chip electronic component is measured by the inspection device. A method for improving a method for continuously inspecting electrical characteristics of a chip electronic component including a step of detecting by the method is disclosed.

In the chip electronic component electrical characteristic inspection unit of the chip electronic component inspection and sorting device described above, a fixed probe electrode (generally, simply referred to as a fixed electrode) disposed on the rear side (or lower side) of the transport disk and the front side of the transport disk ( Alternatively, a plurality of sets of electric characteristic test tools configured by combining movable probe electrodes (generally, simply referred to as movable electrodes) disposed on the upper side) are provided along the radial direction of the conveying master.

As for the movable probe provided in the electric characteristic inspection unit of the chip electronic component of the chip electronic component inspection and sorting device, the tip of the probe (the part in contact with the electrode surface of the chip electronic component) is rod-shaped, plate-shaped, or brush-shaped, Or, by attaching a rotatable roller to the tip of the probe, studies have been made to realize reliable contact between the tip of the probe and the electrode of the chip electronic component. The use of roller electrode terminals (i.e., electrode terminals with a roller attached to the tip) with less damage to the electrodes has become common.

Examples of roller electrode terminals provided in the electronic component electrical property inspection unit of the chip electronic component inspection and sorting device are described in detail with examples of configuration diagrams in Patent Documents 2 to 6.

Among Patent Literatures 2 to 6 above, Patent Literature 2 discloses a device for inspecting and sorting chip electronic components configured by vertically arranging a chip electronic component conveying disc, and also discloses a known configuration example of a roller electrode terminal.

In Patent Document 3 and Patent Document 4, which are international publications corresponding to Patent Document 3, and in Patent Document 6, which is an international publication corresponding to Patent Document 5 and Patent Document 5, chip electronics configured by arranging a chip electronic component transfer disc in an inclined state. An example of a component inspection and sorting device is disclosed, and another configuration example of a roller electrode terminal provided in the chip electronic component inspection and sorting device is also disclosed.

In Patent Literature 7, in a chip electronic component inspection and sorting method using the chip electronic component inspection and sorting device having the above-described structure, a chip component conveying disk is provided so that the chip electronic component transported after measuring the electrical characteristics can be taken out in a stable posture. A proposal to form a compressed air outlet on the side surface of a chip electronic component receiving hole of (transfer table) is described.

Japanese Unexamined Patent Publication No. 2015-213121 Japanese Unexamined Patent Publication No. 2008-224418 Japanese Published Patent Publication No. 2010-511865 WO2008/067129 A2 Japanese Published Patent Publication No. 2010-517058 WO2008/094831 A1 Japanese Unexamined Patent Publication No. 2007-45597

In the inspection and sorting operation using the chip electronic component inspection and sorting device for inspecting and sorting chip electronic components, particularly chip electronic components that have been miniaturized to have a very small size as described above, in the chip electronic component classification unit, predetermined electrical characteristics It is confirmed that it is a chip electronic component having a chip electronic component, and an operation of discharging the selected electronic component from the transfer disk is performed. Trouble) occurred. To explain this concretely, the present inventor introduces pressurized air into through-holes of the conveying disk containing the chip electronic component that has been identified as having predetermined electrical characteristics in the chip electronic component sorting unit as described above and selected. However, there is a problem that the chip electronic components are not smoothly discharged from the perforation into which pressurized air is introduced, especially for very small sizes. It was realized that it occurs quite frequently in the inspection and sorting of chip electronic components.

Accordingly, an object of the present invention is to provide a method for realizing more smooth discharge of chip electronic components from through-holes (chip electronic component accommodating holes) of a chip electronic component conveying disc during implementation of a chip electronic component inspection and sorting method. there is.

The present inventors conducted studies to find out the cause of the problem of discharging the chip electronic components from the transfer disc. And, as a result of the study, the main cause of the problem of ejection of the chip electronic component is that the chip electronic component is accommodated in the chip electronic component accommodating hole (through-hole) of the conveying disk, and in the process of measuring the electrical characteristics, the electrical characteristics of the chip electronic component It was concluded that, by contact with the inspection tool, the side surface was pressed against the wall surface of the through hole and adhered to the wall surface of the through hole. It was also confirmed that such sticking to the wall surface of the perforation of the conveying disk of the chip electronic component is particularly easy to occur for micronized chip electronic components as described above.

The present inventors continued to study further, and applied a physical impact to the chip electronic component attached to the wall surface of the through-hole of the transport master in the electrical characteristic measurement step before carrying out the discharge operation from the through hole of the transport master, It was confirmed that the above problems of the present invention can be efficiently solved by separating the electronic component from the wall surface of the electronic component accommodating hole.

Therefore, the present invention is a chip configured by arranging a chip electronic component transport disc having a plurality of chip electronic component accommodating holes in a vertical or inclined state, and supporting the chip electronic component transport disc to intermittently rotate along the plane. Process of preparing an electronic parts conveying device;

Inside the chip electronic component accommodating hole of the chip electronic component conveying disc, a chip electronic component having electrodes at both ends facing each other is placed, and at least a part of each electrode protrudes from both opening surfaces of the chip electronic component accommodating hole. The process of accepting as much as possible;

a step of rotating the chip electronic component conveying disk along the plane of the disk to move the accommodated chip electronic component to the electric characteristic measuring position where the movable roller electrode terminal and the fixed electrode terminal are disposed;

At the electrical property measurement position, a voltage is applied by bringing the movable roller electrode terminal and the fixed electrode terminal into contact with each of the electrodes at both ends of the chip electronic component, and then measuring the electrical characteristics of the chip electronic component to obtain predetermined electrical characteristics. a process of selecting chip electronic components to be represented;

a step of moving the chip electronic component whose electrical property measurement has been completed from the electrical property measurement position to a chip electronic component sorting unit by rotating the chip electronic component transfer disk again along the plane of the disk; and,

In the chip electronic component sorting unit, pressurized gas is supplied to the chip electronic component accommodating hole in which the chip electronic component selected in the electrical property measurement step is accommodated, and the predetermined electrical characteristics are obtained from the chip electronic component accommodating hole of the chip electronic component conveying disk. A method for inspecting and sorting chip electronic components including a step of discharging and recovering chip electronic components exhibiting:

In the process of moving the chip electronic component whose electrical characteristics have been measured from the electrical characteristic measuring position to the chip electronic component sorting unit, a physical impact is applied to the chip electronic component accommodated in the chip electronic component accommodating hole, and the physical impact A method for inspecting and sorting chip electronic components characterized by performing an operation of separating the chip electronic components from the wall surface of the chip electronic component accommodating hole.

A preferred embodiment of the method for inspecting and selecting a chip electronic component according to the present invention is as follows.

(1) A physical impact applied to the chip electronic component accommodated in the chip electronic component accommodating hole is applied in a direction perpendicular to the conveying disk.

(2) A physical impact applied to the chip electronic component housed in the chip electronic component accommodating hole is applied by a downward movement of a rod-shaped body that moves up and down in a vertical direction with respect to the transport disc.

By using the chip electronic component inspection and sorting method of the present invention, chip electronic components can be more smoothly discharged from the through-holes (chip electronic component accommodating holes) of the chip electronic conveyance disc when the chip electronic component inspection and sorting method is implemented.

In particular, the method for inspecting and sorting chip electronic components of the present invention is currently being considered for practical use, especially for chip electronic components of a very small size (e.g., a size of 0.2 mm × 0.2 mm × 0.4 mm, called a 0402 chip) that has recently become mainstream. It can also be used effectively at the time of inspection and sorting of chip electronic components manufactured in ever-smaller sizes.

1 is a front view showing an example of the overall configuration of a chip electronic component inspection and sorting device.
FIG. 2 is a view for explaining a process of accommodating chip electronic components in through-holes (chip electronic component accommodating holes) of the chip electronic component transport disk, and is shown as a partial sectional view of a side surface of the chip electronic component transport disk in FIG. 1 .
3 is a cross-sectional view showing a process of inspecting electrical characteristics of chip electronic components accommodated in through-holes of a conveyance disc by an inspection unit.
4 is a diagram showing the structure of the roller electrode terminal described in Patent Literature 2;
5 is a cross-sectional view showing how chip electronic components are discharged by introduction of a pressurized gas into through-holes in a chip electronic component sorting unit of a transfer disc.
FIG. 6 is a diagram showing a contact state before and after an electrical property test between a chip electronic component accommodated in a conveyance disk shown in Patent Document 2 and a roller portion of a roller electrode terminal.
Fig. 7 is a diagram showing the state of posture inside a chip electronic component accommodating hole (through-hole) before and after an electrical property test of the chip electronic component housed in the transfer disc newly confirmed by the present inventors.
8 is a schematic diagram showing an example of the structure of an impact applying tool for applying a physical impact to a chip electronic component used in the present invention.
Fig. 9 is a perspective view showing an example of the configuration of the impact applying tool shown in Fig. 8;
10 is a schematic diagram showing another configuration example of an impact applying tool for applying a physical impact to a chip electronic component used in the present invention.

First, a configuration example of a general chip electronic component inspection and sorting device used in the implementation of the continuous inspection and selection method for electric characteristics of chip electronic components according to the present invention will be briefly described with reference to FIGS. 1 to 5 as accompanying drawings. .

A chip capacitor, which is a typical example of a chip electronic component to be inspected, is composed of a capacitor body made of a dielectric material and a pair of electrodes (or electrode surfaces) formed to face each other at both ends thereof. A typical chip capacitor is a chip ceramic capacitor using ceramic as a dielectric. In addition, electrodes of currently generally used chip electronic components are made of tin, and a solder layer for mounting chip electronic components on various substrates is formed on the surface thereof.

Chip electronic components to be inspected are often from the same manufacturing lot, but chip electronic components from different lots may be mixed with chip electronic components from the same manufacturing lot. However, it is common that the chip electronic components of both production lots are manufactured according to the same standard so as to exhibit the same electrical characteristics as each other (generally, those manufactured for the purpose of being sold as mutually identical products).

Fig. 1 is a front view showing a configuration example of a chip electronic component inspection and sorting device using a conveying disk, and Fig. 2 shows a state in which chip electronic components are supplied from chip electronic component supply means through a bucket to the hole in the conveying disk. It is shown as this schematic diagram.

In the chip electronic component inspection and sorting device 10 shown in FIG. 1 , a chip electronic component conveying disc ( 11) is vertically disposed, and is pivotally supported on a central axis 42 formed in the base 41 so as to be able to rotate along the plane of the disk. The rotation of this transfer disc is driven by the rotation drive device 43 .

In the rotational path of the transport disk 11, there is a chip electronic component supply receiving section (supply receiving area) 101, a chip electronic component electrical characteristic inspection section (inspection section) 102, and a chip electronic component sorting section (sorting area) (103) is set.

In the inspecting section 102, electrode terminals for measuring electrical properties (terminals for measuring electrical properties) are provided at positions close to both openings of each through hole 11a in each row of the transfer disc 11. To the electrode terminals, inspection devices 14a and 14b are electrically connected, and a controller 15 is connected to the inspection device so as to supply signals relating to inspection processing to the inspection device.

The sorting unit (sorting station) 103 is provided with a chip electronic discharge pipe 62 for guiding the chip electronic components discharged from the hole 11a of the transfer disc 11 to the chip electronic component recovery case 61. .

The hole 11a of the chip electronic component conveyance master 11 is normally arranged on the surface of the conveyance master at a position obtained by dividing the concentric circles equally on a plurality of concentric circles.

In the chip electronic component inspection and sorting device 10 shown in Fig. 1, a total of 6 through-holes arranged in the radial direction are formed between the center and the circumferential edge of the transfer disc 11, and a total of 6 holes accommodated in each through-hole. Electrical characteristics of the chip electronic component are inspected for each of the chip electronic components. The number of through-holes lined up in the radial direction between the center and the periphery of the conveyance disc 11 is generally within the range of 3 to 20, particularly within the range of 3 to 12.

The transfer disc 11 is rotatably installed on the base 41 via a base plate (reference stand) 45 (see Fig. 2) and a central axis 42, and is disposed on the back side of the base plate. By actuating the formed rotation driving device 43, it rotates intermittently around the central axis 42 at a predetermined cycle.

In the through hole 11a of the conveyance master 11, the chip electronic component 19 to be inspected is temporarily accommodated in the chip electronic component supply accommodating portion 101.

As shown in FIGS. 1 and 2 , the chip electronic component 19 supplied from the outside to be inspected is put into the hopper 47, and the chip electronic component supply means provided in the chip electronic component supply receiving portion 101 ( 31) through the bucket 44 and supplied to the through hole 11a of the conveying disc 11.

2, when the electronic component 19 is supplied from the hopper to the bucket 44, a gas flow such as air flow is introduced into the inside of the bucket 44 from the outside. It is preferable to make it a floating state in a bucket by blowing it out. By setting the chip electronic component 19 in a floating state in the bucket 44 in this way, the chip electronic component 19 can be accommodated more smoothly and reliably in the through-hole 11a of the transfer master 11.

In addition, in order to enable smooth acceptance of the conveyance master 11 of the chip electronic component 19 into the through hole 11a, a pressure reducing hole 45a is formed in the base plate (reference table) 45, and this The pressure reducing hole is connected to the pressure reducing device 46.

Next, as shown in FIG. 3 , in the inspection unit (electrical characteristic measurement position) 102, electrodes 22a, 22b at both ends of each of the individual chip electronic components 19a, 19b, 19c, 19d, 19e, 19f ) to the tester, electrode terminals 12a and 12b configured as a pair are disposed at positions close to both openings of the through holes (chip electron accommodating holes) 11a of the transfer master 11, respectively. . Among these electrode terminals, the electrode terminal 12a is a fixed electrode terminal and is fixed to the base plate 45 by an electrically insulative cylinder disposed around it. On the other hand, the electrode terminal 12b is a movable electrode terminal, and a roller electrode terminal is generally used as such a movable electrode terminal.

Next, the structure of a roller electrode terminal generally used for measuring electrical characteristics of chip electronic components will be described with reference to the drawing showing the structure of a roller electrode terminal shown in FIG. 4 . 4(a) is a front view of the roller electrode terminal, and (b) is a side view showing the internal structure of the roller electrode terminal.

In the example of the roller electrode terminal shown in (a) and (b) of FIG. 4 , the roller electrode terminal 13 includes a case 131, a connection terminal 132 to the tester, a roller electrode 133, and a roller electrode. A rotational shaft 134, a roller electrode holder 135, a swing support point 136, a coil spring 137, and a connecting cable 138 are included.

In FIG. 3 , by moving the electrode terminal support plate 53 supporting the movable electrode terminal 12b to the conveying disk 11 side, the movable electrode terminal 12b supported by the electrode terminal supporting plate is also transferred to the conveying disk 11. move to the side Due to the movement of the movable electrode terminal 12b, the chip electronic component is sandwiched between the paired electrode terminals 12a and 12b to come into contact. In this contact state, each electrode of the chip electronic component is electrically connected to the fixed electrode terminal 12a and the movable electrode terminal 12b.

Then, in the inspection section (electrical characteristics measurement position) 102, each of the six chip electronic components 19a, 19b, 19c, 19d, 19e, and 19f accommodated and arranged so as to be lined up in a line in the radial direction of the transfer disc 11 For , predetermined electrical characteristics are inspected, and chip electronic components exhibiting predetermined electrical characteristics are selected.

The chip electronic components whose electrical characteristics have been inspected are then sent to the chip electronic component sorting unit 103 shown in FIG. Sorting (sorting) is carried out.

A sorting (sorting) step of chip electronic components in the sorting unit 103 of chip electronic components is shown as a schematic diagram in FIG. 5 . In the classification unit 103, a pressurized gas blowing hole 45b is formed in the base plate (reference table) 45, and this pressurized gas blowing hole 45b is connected to the pressurized gas generating device 63. Pressurized gas is generally created by pressurizing air.

The chip electronic components 19a, 19b, 19c, 19d, 19e, and 19f sent to the sorting unit 103 by the rotational movement of the transfer disc and whose electrical characteristics have been inspected are ejected from the base plate (reference table) 45 by pressurized gas It stops at a position corresponding to the ball 45b. Then, based on the control signal sent from the controller 15, the pressurized gas is supplied to the through hole (chip electronic component accommodating hole) 11a of the transfer disc 11 through the predetermined pressurized gas blowing hole 45b, By supplying the pressurized gas, the chip electronic component 19a in the through hole 11a is lifted and discharged, passes through the inside of the chip electronic discharge pipe 62, and is housed in the chip electronic component collection case 61 shown in FIG. .

6(a), (b), and (c) show a chip electronic component 19 and a roller electrode terminal 133 in an inspection unit (electric characteristic measuring position) shown in Patent Document 2, which is a document representing the prior art. ) is a diagram showing the change in the contact state. That is, the roller electrode terminal 133 is moved in the direction of the arrow shown in (a) of the conveyance master 11, and the chip electronic component 19 accommodated in the hole of the conveyance master 11 and the top thereof First, contact is made at one corner of the electrode, and then, as shown in (b), it is in a state of sitting on the surface of the top electrode. At this point, the transfer master 11 is temporarily stopped, and during the stop, a voltage is applied between the upper roller electrode terminal 133 and the lower fixed electrode terminal 134, so that the electrical characteristics of the chip electronic component 19 change. It is measured. After the electrical measurement is finished, as shown in (c), the conveying master 11 moves again in the direction of the arrow, and as a result, the roller electrode terminal 133 is moved to the other side of the electrode at the top of the chip electronic component. While touching at the corner, descend from the top.

Next, FIG. 7 schematically shows a change in the state of contact between the chip electronic component and the roller electrode terminal in the inspection unit, which was discovered by the present inventor's examination, which is the basis of the present invention.

In FIG. 7 , (1), the chip electronic component 19 accommodated in the transfer disk 11 moves to the vicinity of the electrical characteristic measurement position and starts to sit on the top of the fixed electrode terminal 134, and at the same time, A state where contact with the roller electrode terminal 133 has begun at the upper end on the front side is shown. In this process, the chip electronic component 19 moves in parallel so as to approach the left side as shown in the inside of the through hole 11a, and is finally pressed and attached to the wall surface on the left side, or is left tilted to the left side. As a result, it comes into contact with the wall and stops. The phenomenon of sticking to the inner wall surface of through-holes of electronic chip electronic components tends to occur particularly frequently with respect to micro-sized chip electronic components that have become mainstream in recent years.

When the electronic chip electronic component 19 is attached to the wall surface on the left side, the chip electronic component 19, as shown in (2) of FIG. In the drawing, the electrical characteristics are measured in a state where it is attached to the left wall surface). The chip electronic component 19 at the position attached to the left wall surface of the through hole 11a, even after measuring the electrical characteristics, is accompanied by the rotation of the transfer disc 11, as shown in (3), the through hole 11a It is sent to the sorting unit 103 along the surface of the base plate (standard table) 45 while maintaining the state of sticking to the left wall surface of the base plate. Accordingly, the chip electronic component 19 reaches the sorting unit (chip electronic component discharge unit) 103 with the side surface attached to the wall surface of the through hole 11a in this way. For this reason, it is easy to discharge the chip electronic component 19 provided for the ejection operation from the conveying disc even by introduction of pressurized gas into the through-hole in the sorting section, and the chip electronic component 19 in the sorting section, which was previously a problem, is difficult to discharge. As a result, it causes the ejection trouble of parts.

A method devised by the present inventor as a method for effectively avoiding the problem of discharging chip electronic components from the sorting unit described so far is to apply a physical impact to the chip electronic component accommodated in the chip electronic component accommodating hole. method, and it has been confirmed that it is possible to efficiently release the chip electronic component from the wall surface of the chip electronic component accommodating hole by applying such a physical impact.

That is, according to the experiment of the present inventors, in the above-described inspection and sorting of particularly minute chip electronic parts, when the process of applying physical impact to the chip electronic parts proposed in the present invention is not performed, and the inspection and sorting operation is performed, Although discharge trouble occurred at a high rate of 10 to 20% (the percentage of chip electronic components not being discharged from the through hole despite introducing pressurized gas into the through hole), the transfer work of the chip electronic component from the through hole Prior to the implementation, it was confirmed that when a physical impact was applied to the chip electronic component disclosed in this specification, the ratio of the discharge trouble was remarkably reduced to less than 1%.

8 shows a specific example of means for applying a physical impact to the chip electronic component accommodated in the chip electronic component accommodating hole. The physical impact applying means 139 shown in FIG. 8 is a rod-shaped body that moves vertically with respect to the conveying disk (that is, moves in the vertical direction with respect to the conveying disk), and has a lower end for ensuring contact with the electrodes on the top surface of the chip electronic component. A half-shaped member for contact is provided. This rod-like body is formed by a spring 140 provided around the rod-shaped body as shown in FIG. 9 (a support frame disposed in the radial direction of the transport disk so that the lower surface of the half-shaped member is located in the vicinity of the surface of the transport disk 11). (supported by the physical impact application unit support frame) 141) enables vertical movement in a very short time.

(a) in FIG. 8 shows an example in which the physical impact applying means 139 is used in combination with a base plate (reference table) 45 of a normal shape, and (b) shows an example of using the base plate 45 A configuration example in which a recessed portion is formed in an area located below the physical impact applying means is shown.

Further, as shown in Fig. 10, the physical impact applying unit may be a physical impact applying unit (roller type), that is, a structure 139a in which a roller is formed at the lower end of the rod-shaped body, or similarly, it may be moved up and down in a short time. It may be a brush capable of this, or a drum-shaped rotary body that rotates along the surface of the conveying disc. That is, the means for applying physical impact used in the present invention can be a means of various configurations.

In addition, in the present specification, the description of the configuration of the electronic component inspection and sorting device and the operation and effect of the present invention have been described by taking a chip electronic component inspection and sorting device that operates with a chip electronic component conveying disk disposed in a vertical direction as an example, but the present invention It goes without saying that the chip electronic component inspection and sorting device used in the method for measuring electrical characteristics of chip electronic components according to the present invention may be a device in which a chip electronic component conveying disk is pivotally supported in an inclined state on a base.

10: chip electronic component inspection sorting device
11: chip electronic component transfer disc (transport disc)
11a: perforation (hole for accepting chip electronic components)
12a: fixed electrode terminal
12b: movable electrode terminal
13: roller electrode terminal
19: chip electronic components
22a, 22b: electrode
31: chip electronic component supply means
41: Expect
44 : Bucket
45: base plate (standard stand)
47: Hopper
101: chip electronic component supply receiving part
133: roller electrode
139: physical impact application means
139a: physical impact application means (roller type)

Claims (3)

A chip electronic component conveying device configured by arranging a chip electronic component conveying disk having a plurality of chip electronic component accommodating holes in a vertical or inclined state and shaft-supporting the chip electronic component conveying disk to enable intermittent rotation along a plane is prepared. process to do;
Inside the chip electronic component accommodating hole of the chip electronic component conveying disc, a chip electronic component having electrodes at both ends facing each other is placed, and at least a part of each electrode protrudes from both opening surfaces of the chip electronic component accommodating hole. The process of accepting as much as possible;
a step of rotating the chip electronic component conveying disk along the plane of the disk to move the accommodated chip electronic component to the electric characteristic measuring position where the movable roller electrode terminal and the fixed electrode terminal are disposed;
At the electrical property measurement position, a voltage is applied by bringing the movable roller electrode terminal and the fixed electrode terminal into contact with each of the electrodes at both ends of the chip electronic component, and then measuring the electrical characteristics of the chip electronic component to obtain predetermined electrical characteristics. a process of selecting chip electronic components to be represented;
a step of moving the chip electronic component whose electrical property measurement has been completed from the electrical property measurement position to a chip electronic component sorting unit by rotating the chip electronic component transfer disk again along the plane of the disk; and,
In the chip electronic component sorting unit, pressurized gas is supplied to the chip electronic component accommodating hole in which the chip electronic component selected in the electrical property measurement step is accommodated, and the predetermined electrical characteristics are obtained from the chip electronic component accommodating hole of the chip electronic component conveying disk. A method for inspecting and sorting chip electronic components including a step of discharging and recovering chip electronic components exhibiting:
In the process of moving the chip electronic component whose electrical characteristics have been measured from the electrical characteristic measuring position to the chip electronic component sorting unit, physical impact is applied to the chip electronic component accommodated in the chip electronic component accommodating hole in a direction perpendicular to the transfer disk. A method for inspecting and sorting chip electronic components, characterized in that the physical impact is applied by the downward motion of a rod-shaped body that moves up and down, and an operation of separating the chip electronic component from the wall surface of the chip electronic component accommodating hole is performed by the physical impact. delete delete

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