CN202667125U - Solder ball sphere diameter automatic screening machine device - Google Patents
Solder ball sphere diameter automatic screening machine device Download PDFInfo
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- CN202667125U CN202667125U CN 201220278935 CN201220278935U CN202667125U CN 202667125 U CN202667125 U CN 202667125U CN 201220278935 CN201220278935 CN 201220278935 CN 201220278935 U CN201220278935 U CN 201220278935U CN 202667125 U CN202667125 U CN 202667125U
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- mesh screen
- solder ball
- sphere diameter
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Abstract
The utility model provides a solder ball sphere diameter automatic screening machine device, and relates to the technical field of electronic intelligent control devices. The lower end of a solder bass (2) is provided with a precision mesh screen (3), the lower end of the precision mesh screen (3) is provided with a mesh screen fixing plate (4), a swing fixing shaft (9) is arranged inside the mesh screen fixing plate (4), and one ends of the precision mesh screen (3) and the mesh screen fixing plate (4) are provided with impact hammers (5). The lower end of the mesh screen fixing plate (4) is provided with a material receiving hopper (6), the lower end of the material receiving hopper (6) is provided with a material receiving barrel (7), and a control system (8) is respectively connected with a discharging hopper (1), the impact hammers (5), the mesh screen fixing plate (4) and the material receiving barrel (7). The solder ball sphere diameter automatic screening machine device can achieve automatic screening according to the solder ball sphere diameter, can achieve multiple-few control especially for feeding materials with different sphere diameters, can freely change feeding material screening quantity and screening time according to different sphere diameters and tolerances, and is provided with a random sampling groove to achieve required screening quality.
Description
Technical field
The utility model relates to electronic and intelligentized type control device technical field, relates in particular to a kind of solder ball sphere diameter automatic screening machine.
Background technology
BGA/CSP refers to a kind of packaging technology of chip, this is relevant with the chip encapsulation technology revolution, be current high-tech and to end product little thin light high reliability relevant, in other words, at present all digital camera video camera notebook computer mobile phone automotive electronics automobile satellite navigation instrument etc. all visit the merit of BGA technique; The chip pin that Most is many at present can reach at most 2600, spacing according to electric principle metal pins must have a suitable spacing, too small spacing can cause short circuit, therefore by too much pin requirements of traditional handicraft will certainly cause end product large weight thick, and BGA/CSP technique is solve at present this technique unique; And BGA tin ball (or claiming solder ball) is one of encapsulation main material that applies to BGA/CSP technique.
The inland of China is about 88,000,000,000/month (88KKK) tin ball output in 2006, and prediction to the tin ball output of inland of China in 2008 will account for about 35% of worldwide production total amount, has dwindled gap with the technical merit of Japan and the United States in manufacturing technology.
Report according to another China Electronics News, various countries make an investment in the encapsulation of chip and continue to strengthen, especially to the investment of BGA and CSP packaging technology, simultaneously encapsulating material and manufacturer from Japanese Taiwan shift to China, can reach a conclusion thus, the demand of BGA tin ball can be along with investment orientation to its demand of transfer of China with in rising trend.
The solder ball operation is many, process route is longer, the length of solder ball online production has direct impact to the generation of the defective products of solder ball, it is maximum for solder ball is quantized, accelerate to reduce in system online the generation of defective products, and the control of solder ball tolerance, the selection result directly affect the encapsulation quality and judge, the solder ball sphere diameter has plurality of specifications from 0.889mm～0.080mm, tolerance according to the size of sphere diameter be controlled at ± 0.025～0.003mm between, the size of sphere diameter tolerance directly affects the out of roundness of solder ball.
Solder ball sphere diameter screening mode mainly be at present have following several: the first roller type screening: utilize two roller bearings to carry out the sphere diameter screening, the large I of sphere diameter is by regulating the spacing of roller bearing, the defective of using this mode to screen sphere diameter is, the length processing request precision of roller bearing is high, its error increases with the length of roller bearing and improves, and the roller bearing screening is subjected to environment temperature, humidity effect larger, easily adheres to the tin ball on roller bearing, when roller bearing rolls, easily the tin ball is flattened, form bad tin ball; The second manual formula screening: use accurate mesh screen to carry out the sphere diameter screening, the control of sphere diameter mainly is by making the mesh screen of different pore size, it is manually more that manual screening is used, different people's group operations is difficult control easily, the number of particularly screening amount directly affects screening effect, therefore the screening of repeatedly doing over again easily forms oxidation, and screening quantizes, dwindles in the goods time significant solder ball sphere diameter automatic screening machine to the solder ball sphere diameter.
Summary of the invention
The purpose of this utility model provides solder ball sphere diameter automatic screening machine, it can come automatic screening for the solder ball sphere diameter, the number control that particularly different sphere diameters is fed intake, can also be according to different sphere diameters and tolerance, can arbitrarily change screening feed intake quantity and screening time, and be provided with the groove of sampling immediately and can reach required screening quality.
In order to solve the existing problem of background technology, the utility model is by the following technical solutions: it is comprised of discharge bucket 1, solder ball 2, accurate mesh screen 3, mesh screen fixed disk 4, impact hammer 5, receiving hopper 6, the bucket 7 that connects material, control system 8, amplitude of oscillation fixed axis 9; The lower end of discharge bucket 1 is provided with solder ball 2, the lower end of solder ball 2 is provided with accurate mesh screen 3, the lower end of accurate mesh screen 3 is provided with mesh screen fixed disk 4, and be provided with amplitude of oscillation fixed axis 9 in the mesh screen fixed disk 4, one end of accurate mesh screen 3 and mesh screen fixed disk 4 is provided with impact hammer 5, the lower end of mesh screen fixed disk 4 is provided with receiving hopper 6, and the lower end of receiving hopper 6 is provided with the bucket 7 that connects material, and control system 8 is connected with discharge bucket 1, impact hammer 2, mesh screen fixed disk 4 and the bucket 7 that is connected respectively.
Described control system 8 by cylinder control module 8-1, the control module that feeds intake 8-2, striking control module 8-3, motor control module 8-4, main control module 8-5, communication interface 8-6, wave control module 8-7, energy supply control module 8-8, warning system module 8-9, infrared ray sensor 8-10 form; Cylinder control module 8-1 is connected with the control module 8-2 that feeds intake, the control module that feeds intake 8-2 is connected with main control module 8-5, main control module 8-5 interconnects with motor control module 8-4 and communication interface 8-6 respectively, motor control module 8-4 respectively with cylinder control module 8-1 be connected control module 8-7 and be connected, waving control module 8-7 is connected with main control module 8-5 with energy supply control module 8-8 and is connected, communication interface 8-6 and warning system module 8-9 interconnect, and warning system module 8-9 is connected with infrared ray sensor 8-10.
Described main control module 8-5 sets inventory, waves number of times, clashes into number of times and dynamics according to parameter input, simultaneously according to sensing device feedback abnormal alarm and terminate job.
The utility model can come automatic screening for the solder ball sphere diameter, the number control that particularly different sphere diameters is fed intake, can also be according to different sphere diameters and tolerance, can arbitrarily change screening feed intake quantity and screening time, and be provided with the groove of sampling immediately and can reach required screening quality.
Description of drawings:
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of control system in the utility model;
Fig. 3 is the structural representation of the utility model impact hammer direction of motion;
Fig. 4 is the schematic diagram that waves of accurate mesh screen of the present utility model and mesh screen fixed disk;
Fig. 5 is discharging schematic diagram of the present utility model;
Fig. 6 is the theory structure schematic diagram that feeds intake of the present utility model;
Fig. 7 is collision theory structural representation of the present utility model;
Fig. 8 is the theory structure schematic diagram that waves of the present utility model;
Fig. 9 is alarm principle structural representation of the present utility model.
The specific embodiment:
With reference to Fig. 1-Fig. 5, this specific embodiment by the following technical solutions: it is comprised of discharge bucket 1, solder ball 2, accurate mesh screen 3, mesh screen fixed disk 4, impact hammer 5, receiving hopper 6, the bucket 7 that connects material, control system 8, amplitude of oscillation fixed axis 9; The lower end of discharge bucket 1 is provided with solder ball 2, the lower end of solder ball 2 is provided with accurate mesh screen 3, the lower end of accurate mesh screen 3 is provided with mesh screen fixed disk 4, and be provided with amplitude of oscillation fixed axis 9 in the mesh screen fixed disk 4, one end of accurate mesh screen 3 and mesh screen fixed disk 4 is provided with impact hammer 5, the lower end of mesh screen fixed disk 4 is provided with receiving hopper 6, and the lower end of receiving hopper 6 is provided with the bucket 7 that connects material, and control system 8 is connected with discharge bucket 1, impact hammer 2, mesh screen fixed disk 4 and the bucket 7 that is connected respectively.
Described control system 8 by cylinder control module 8-1, the control module that feeds intake 8-2, striking control module 8-3, motor control module 8-4, main control module 8-5, communication interface 8-6, wave control module 8-7, energy supply control module 8-8, warning system module 8-9, infrared ray sensor 8-10 form; Cylinder control module 8-1 is connected with the control module 8-2 that feeds intake, the control module that feeds intake 8-2 is connected with main control module 8-5, main control module 8-5 interconnects with motor control module 8-4 and communication interface 8-6 respectively, motor control module 8-4 respectively with cylinder control module 8-1 be connected control module 8-7 and be connected, waving control module 8-7 is connected with main control module 8-5 with energy supply control module 8-8 and is connected, communication interface 8-6 and warning system module 8-9 interconnect, and warning system module 8-9 is connected with infrared ray sensor 8-10.
Described main control module 8-5 sets inventory, waves number of times, clashes into number of times and dynamics according to parameter input, simultaneously according to sensing device feedback abnormal alarm and terminate job.
With reference to Fig. 6, described main control module 8-5 receives the inventory parameter by the TIP input, makes it drive compressor by main control module 8-5 to the triggering of motor, produce vacsorb solder ball 2, then discharge and evenly spread to mesh screen, after the discharging action is finished, feed intake and automatically recover.
With reference to Fig. 7, described main control module 8-5 receives bump number of times and the dynamics parameter by the TIP input, and main control module 8-5 is by control output bump number of times and bump dynamics to motor, after number of times reaches, motor rotation is stopped, clashing into and stop.
With reference to Fig. 8, described main control module 8-5 receive by the TIP input wave number of times and rocking tendency parameter, main control module 8-5 by to Electric Machine Control output wave number of times and rocking tendency, after number of times reaches, wave return to the plane after, motor rotation stops, and when main control module 8-5 received the discharging parameter, main control module 8-5 sent signal to motor and swing module, release the bucket that connects material by cylinder, swing module produces the directioning falling action, pour out institute screen expect after, wave the recovery plane.
With reference to Fig. 9, when described infrared ray sensor 8-10 detects infrared radiation source, there are not mesh screen or mesh screen to come off on the expression mesh screen rack, namely send signal to main control module 8-5 by interface, after main control module 8-5 received signal, energy supply control module namely cut off motor power, and feeding system is because stopping action without driving, representing when infrared ray sensor 8-10 detects infrared radiation source has mesh screen on the mesh screen rack, system is recovered.
This specific embodiment can be come automatic screening for the solder ball sphere diameter, the number control that particularly different sphere diameters is fed intake, can also be according to different sphere diameters and tolerance, can arbitrarily change screening feed intake quantity and screening time, and be provided with the groove of sampling immediately and can reach required screening quality.
Claims (2)
1. solder ball sphere diameter automatic screening machine is characterized in that it is comprised of discharge bucket (1), solder ball (2), accurate mesh screen (3), mesh screen fixed disk (4), impact hammer (5), receiving hopper (6), connect material bucket (7), control system (8), amplitude of oscillation fixed axis (9); The lower end of discharge bucket (1) is provided with solder ball (2), the lower end of solder ball (2) is provided with accurate mesh screen (3), the lower end of accurate mesh screen (3) is provided with mesh screen fixed disk (4), and be provided with amplitude of oscillation fixed axis (9) in the mesh screen fixed disk (4), one end of accurate mesh screen (3) and mesh screen fixed disk (4) is provided with impact hammer (5), the lower end of mesh screen fixed disk (4) is provided with receiving hopper (6), the lower end of receiving hopper (6) be provided with connect material the bucket (7), control system (8) respectively with discharge bucket (1), impact hammer (2), mesh screen fixed disk (4) connects with the bucket (7) that is connected.
2. solder ball sphere diameter automatic screening machine according to claim 1, it is characterized in that described control system (8) by cylinder control module (8-1), the control module that feeds intake (8-2), striking control module (8-3), motor control module (8-4), main control module (8-5), communication interface (8-6), wave control module (8-7), energy supply control module (8-8), warning system module (8-9), infrared ray sensor (8-10) and form; Cylinder control module (8-1) is connected with the control module that feeds intake (8-2), the control module that feeds intake (8-2) is connected with main control module (8-5), main control module (8-5) interconnects with motor control module (8-4) and communication interface (8-6) respectively, motor control module (8-4) respectively with cylinder control module (8-1) be connected control module (8-7) and be connected, wave control module (8-7) and be connected 8-8 with energy supply control module) be connected with main control module (8-5) respectively, communication interface (8-6) interconnects with warning system module (8-9), and warning system module (8-9) is connected with infrared ray sensor (8-10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220278935 CN202667125U (en) | 2012-06-14 | 2012-06-14 | Solder ball sphere diameter automatic screening machine device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220278935 CN202667125U (en) | 2012-06-14 | 2012-06-14 | Solder ball sphere diameter automatic screening machine device |
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| Publication Number | Publication Date |
|---|---|
| CN202667125U true CN202667125U (en) | 2013-01-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220278935 Expired - Lifetime CN202667125U (en) | 2012-06-14 | 2012-06-14 | Solder ball sphere diameter automatic screening machine device |
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| Country | Link |
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| CN (1) | CN202667125U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105797949A (en) * | 2014-12-29 | 2016-07-27 | 重庆群崴电子材料有限公司 | An automatic screening machine for BGA solder balls |
| CN112362015A (en) * | 2020-06-29 | 2021-02-12 | 泰安晶品新材料科技有限公司 | Method for detecting BGA solder balls for packaging integrated circuit |
-
2012
- 2012-06-14 CN CN 201220278935 patent/CN202667125U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105797949A (en) * | 2014-12-29 | 2016-07-27 | 重庆群崴电子材料有限公司 | An automatic screening machine for BGA solder balls |
| CN112362015A (en) * | 2020-06-29 | 2021-02-12 | 泰安晶品新材料科技有限公司 | Method for detecting BGA solder balls for packaging integrated circuit |
| CN112362015B (en) * | 2020-06-29 | 2022-06-21 | 泰安晶品新材料科技有限公司 | Method for detecting BGA solder balls for packaging integrated circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 201104 2-3 floor of No. 2328, Chunshen Road, Minhang District, Shanghai Patentee after: Shanghai Xi Xi Mstar Technology Ltd Address before: 201100 2-3 floor of No. 2328, Chunshen Road, Minhang District, Shanghai Patentee before: Shanghai Xinjinhua Welding Material Technology Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130116 |
|
| CX01 | Expiry of patent term |