CN102315139A - Technology of paste printing for manufacturing micron-sized salient point on wafer - Google Patents
Technology of paste printing for manufacturing micron-sized salient point on wafer Download PDFInfo
- Publication number
- CN102315139A CN102315139A CN201110262558A CN201110262558A CN102315139A CN 102315139 A CN102315139 A CN 102315139A CN 201110262558 A CN201110262558 A CN 201110262558A CN 201110262558 A CN201110262558 A CN 201110262558A CN 102315139 A CN102315139 A CN 102315139A
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- salient point
- wafer
- soldering paste
- technology
- micron
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- 238000005516 engineering process Methods 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 15
- 238000004140 cleaning Methods 0.000 claims abstract description 10
- 238000001514 detection method Methods 0.000 claims abstract description 5
- 238000005476 soldering Methods 0.000 claims description 44
- 239000010935 stainless steel Substances 0.000 claims description 10
- 229910001220 stainless steel Inorganic materials 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000010992 reflux Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 12
- 238000010008 shearing Methods 0.000 abstract 1
- 238000004377 microelectronic Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a technology of paste printing for manufacturing a micron-sized salient point on a wafer. The method comprises the following steps that: a design is drawn and a plate is made; a welding paste printing plate is manufactured; a welding paste is printed on the welding paste printing plate; and then examination, welding, cleaning and detection are carried out successively. According to the invention, manufacture of a small-size salient point is realized, wherein a diameter of the salient point is 150 micrometers, a height of the salient point is 200 micrometers, and a gap is 250 micrometers. Besides, the technology provided in the invention has advantages of good consistency, simple flow, high production efficiency, and low costs, so that the technology is suitable for application on mass production. Moreover, a height tolerance of the printed BGA salient point is less thatn 3.0 microns and a linear consistency is less than 5 microns; and index like a shearing intensity and a contact resistor satisfies the requirement on reliability.
Description
Technical field:
The invention belongs to the microelectronics manufacture field; The present invention relates to a kind of low cost process of making 150 microns/100 microns/250 microns salient points etc. of on wafer, biting.Wherein 150 microns/100 microns/250 microns salient points refer to salient point diameter, height and spacing respectively.
Background technology:
At present,, adopt bite technology or plant the playing skill art of soldering paste at microelectronic, bump making process, ability is following:
Wherein plant ball method and method for printing screen, the minimum convex spot diameter that can accomplish is 250 μ m minimum spacings, 400 μ m, is mainly used in the making of Sn/Pb alloy, lead-free solder, conductive paste salient point, and technology is simple, and cost is low, is suitable for producing in batches.What adopt usually in the world is that the salient point diameter is 300 μ m～500 μ m, and spacing 500 μ m～800 μ m adopt the printing soldering paste during manufacturing, and the Reflow Soldering welding forms spherical salient point.
When the salient point diameter is reduced to 200 μ m, bump pitch is reduced to 300 μ m when following, and for the height and the sphere diameter that guarantee salient point, the solder paste amounts of printing is more, and is interconnected easily between the solder ball after the printing with paste through routine, the reflow soldering, and can't repair.
In order to satisfy product miniaturization, high efficiency requirement, draw number in order to increase device I/O, reduce device volume and weight simultaneously, require the diameter of salient point on the wafer and spacing more and more littler.In order to obtain the salient point diameter and the spacing of smaller szie, the following method of general employing in the industry:
Drawback: relative cost is higher, and the time cycle is long.
The present invention researchs and solves above problem through intending from optimizing aspects such as printing with paste board parameter, pad parameters, realizes 150 μ m/200 μ m/250 μ m stud bump makings on the wafer.
Summary of the invention:
The present invention researchs and solves above problem through intending from optimizing aspects such as printing with paste board parameter, pad parameters, realizes 150 μ m/200 μ m/250 μ m stud bump makings on the wafer.
The objective of the invention is to overcome the shortcoming of above-mentioned prior art; Provide a kind of on wafer, biting to make the technology of micron salient point, the plate-making that comprises the steps: to draw, make the soldering paste stencil, to soldering paste stencil, printing soldering paste, check, welding, cleaning and detection.
During said printing soldering paste, stainless steel bushing and wafer are aligned, at welding disking area printing soldering paste; In the microscopically check, guarantee all to have on each pad uniform soldering paste to be printed up, then; The wafer that prints soldering paste is placed in the reflow ovens; Adopt the curve reflux temperature to reflux, form solder ball, last cleaning scaling powder.
Said soldering paste stencil material is a stainless steel.
Said soldering paste stencil thickness is 0.1mm～0.15mm.
Said pad size is 0.1mm～0.25mm.
Said orifice sizes is 0.15mm～0.3mm, and the small opening perforate of the soldering paste of biting is for circular.
Said soldering paste is selected Sn63Pb37/Sn62Pb36Ag2 or SnAgCu lead-free solder paste.
The invention has the beneficial effects as follows that this technology adopts the leakage printing process method, realized the making of the small size salient point of 250 microns of 150 microns of diameters, 200 microns of height and spacings.Process consistency is good, flow process is simple, production efficiency is high, with low cost, be suitable for producing in enormous quantities.The BGA bump height tolerance of biting is less than 3.0 μ m, and linear consistency is less than 5 μ m, and indexs such as shear strength, contact resistance all satisfy reliability requirement.
Description of drawings:
Fig. 1 is a soldering paste stencil structural representation of the present invention;
Wherein: 1 is pad; 2 is small opening.
Embodiment:
Below in conjunction with accompanying drawing the present invention is done and to describe in further detail:
Referring to Fig. 1, the present invention passes through stainless steel bushing small opening parameter, and aspects such as stainless steel bushing thickness, design small opening diameter, the selection of soldering paste parameter are optimized, to realize above-mentioned purpose.
Technological process is following:
Picture plate-making → making soldering paste stencil → to (soldering paste is bitten) plate → printing soldering paste → check → welding → cleaning → detection
5.2 soldering paste stencil parameter:
Soldering paste stencil material: stainless steel
Soldering paste stencil thickness: 0.1mm～0.15mm
Pad size: 0.1mm～0.25mm
Orifice sizes: 0.15mm～0.3mm
Drain board material selects stainless steel get final product, select the stainless steel bushing thickness that is fit to, soldering paste select Sn63Pb37/Sn62Pb36Ag2 or SnAgCu lead-free solder paste all can, the small opening perforate of the soldering paste of biting is circle.
Through the printing soldering paste, form salient point behind the reflow welding.During the printing soldering paste, stainless steel bushing and wafer are aligned, at welding disking area printing soldering paste; In the microscopically check, guarantee all to have on each pad uniform soldering paste to be printed up, then; The wafer that prints soldering paste is placed in the reflow ovens; Adopt the curve reflux temperature to reflux, form solder ball, last cleaning scaling powder.Basic process steps is: printing soldering paste → Reflow Soldering → cleaning scaling powder.
Adopt 771 chips that produce 314, carry out secondary wiring after, carry out printing with paste, reflow welding, cleaning and detection.
Through behind welding of printing soldering paste, reflow welding and the cleaning scaling powder as follows:
Because of technology is stencil printing, high conformity, the linear high conformity of ball.Disk internal linear consistency is controlled at ± 2.5 μ m in.
Use the step tester to measure bump height, measure the chip of 5 positions on the wafer, measure 7 points on each chip, measurement data is seen table 1.
The table 1 bump height meter of biting
Show in the table that the bump height of biting scope is 90 μ m～100 μ m (in the disks).Maximum height tolerance in the maximum height tolerance in the chip ± 1.44 μ m, disk ± 4.76 μ m.
Conclusion: realized on wafer, making 150 microns/100 microns/250 microns salient points (salient point diameter 150 μ m, spacing 250 μ m, height 90 μ m～100 μ m); Height tolerances: in the chip ± 1.44 μ m, in the disk ± the linear consistency of 4.76 μ m: in the chip ± 2.5 μ m.
Above content is to combine concrete preferred implementation to further explain that the present invention did; Can not assert that embodiment of the present invention only limits to this; Those of ordinary skill for technical field under the present invention; Under the prerequisite that does not break away from the present invention's design, can also make some simple deduction or replace, all should be regarded as belonging to the present invention and confirm scope of patent protection by claims of being submitted to.
Claims (7)
1. on wafer, bite and make the technology of micron salient point for one kind, it is characterized in that, the plate-making that comprises the steps: to draw, make the soldering paste stencil, to soldering paste stencil, printing soldering paste, check, welding, cleaning and detection.
2. on wafer, bite as claimed in claim and make the technology of micron salient point, it is characterized in that, during said printing soldering paste; Stainless steel bushing and wafer are aligned,, check at microscopically at welding disking area printing soldering paste; Guarantee all to have on each pad uniform soldering paste to be printed up, then, the wafer that prints soldering paste is placed in the reflow ovens; Adopt the curve reflux temperature to reflux, form solder ball, last cleaning scaling powder.
3. on wafer, bite as claimed in claim and make the technology of micron salient point, it is characterized in that said soldering paste stencil material is a stainless steel.
4. on wafer, bite as claimed in claim and make the technology of micron salient point, it is characterized in that said soldering paste stencil thickness is 0.1mm～0.15mm.
5. on wafer, bite as claimed in claim and make the technology of micron salient point, it is characterized in that said pad size is 0.1mm～0.25mm.
6. on wafer, bite as claimed in claim and make the technology of micron salient point, it is characterized in that said orifice sizes is 0.15mm～0.3mm, the small opening perforate of the soldering paste of biting is for circular.
7. on wafer, bite as claimed in claim and make the technology of micron salient point, it is characterized in that, said soldering paste is selected Sn63Pb37/Sn62Pb36Ag2 or SnAgCu lead-free solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110262558 CN102315139B (en) | 2011-09-07 | 2011-09-07 | Technology of drop-out printing for manufacturing micron-sized salient point on wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110262558 CN102315139B (en) | 2011-09-07 | 2011-09-07 | Technology of drop-out printing for manufacturing micron-sized salient point on wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102315139A true CN102315139A (en) | 2012-01-11 |
| CN102315139B CN102315139B (en) | 2013-08-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110262558 Active CN102315139B (en) | 2011-09-07 | 2011-09-07 | Technology of drop-out printing for manufacturing micron-sized salient point on wafer |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103373096A (en) * | 2012-04-27 | 2013-10-30 | 北京印刷学院 | Method for improving dot height uniformity of vacuum glass isolating dot matrix of silkscreen printing |
| CN103522783A (en) * | 2013-10-24 | 2014-01-22 | 天津理工大学 | Method for preparing low-cost interdigital transducer and reflecting grating by utilizing silk-screen printing process |
| CN104078367A (en) * | 2013-03-29 | 2014-10-01 | 天水天光半导体有限责任公司 | Manufacturing technology of reversely-packaged Schottky diode salient points |
| CN108987287A (en) * | 2018-06-29 | 2018-12-11 | 南京矽邦半导体有限公司 | A kind of packaging method by biting alloy generation ball grid array after Reflow Soldering on pdm substrate |
| CN110927356A (en) * | 2019-12-19 | 2020-03-27 | 厦门市及时雨焊料有限公司 | Method for testing performance of solder paste |
| CN112362015A (en) * | 2020-06-29 | 2021-02-12 | 泰安晶品新材料科技有限公司 | Method for detecting BGA solder balls for packaging integrated circuit |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1553480A (en) * | 2003-06-03 | 2004-12-08 | 香港科技大学 | Printing preparation of mini gap reversed-mounting welded convex templates with lead/tin or leadless solder |
| CN1588634A (en) * | 2004-07-22 | 2005-03-02 | 上海交通大学 | Selective laser back flow preparing method for flip-chip convex point |
| CN101540288A (en) * | 2008-03-18 | 2009-09-23 | 恩益禧电子股份有限公司 | Method for printing a metal paste, metal mask, and bump forming method |
-
2011
- 2011-09-07 CN CN 201110262558 patent/CN102315139B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1553480A (en) * | 2003-06-03 | 2004-12-08 | 香港科技大学 | Printing preparation of mini gap reversed-mounting welded convex templates with lead/tin or leadless solder |
| CN1588634A (en) * | 2004-07-22 | 2005-03-02 | 上海交通大学 | Selective laser back flow preparing method for flip-chip convex point |
| CN101540288A (en) * | 2008-03-18 | 2009-09-23 | 恩益禧电子股份有限公司 | Method for printing a metal paste, metal mask, and bump forming method |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103373096A (en) * | 2012-04-27 | 2013-10-30 | 北京印刷学院 | Method for improving dot height uniformity of vacuum glass isolating dot matrix of silkscreen printing |
| CN104078367A (en) * | 2013-03-29 | 2014-10-01 | 天水天光半导体有限责任公司 | Manufacturing technology of reversely-packaged Schottky diode salient points |
| CN104078367B (en) * | 2013-03-29 | 2017-10-13 | 天水天光半导体有限责任公司 | A kind of manufacture craft of flip chip package Schottky diode salient point |
| CN103522783A (en) * | 2013-10-24 | 2014-01-22 | 天津理工大学 | Method for preparing low-cost interdigital transducer and reflecting grating by utilizing silk-screen printing process |
| CN108987287A (en) * | 2018-06-29 | 2018-12-11 | 南京矽邦半导体有限公司 | A kind of packaging method by biting alloy generation ball grid array after Reflow Soldering on pdm substrate |
| CN110927356A (en) * | 2019-12-19 | 2020-03-27 | 厦门市及时雨焊料有限公司 | Method for testing performance of solder paste |
| CN112362015A (en) * | 2020-06-29 | 2021-02-12 | 泰安晶品新材料科技有限公司 | Method for detecting BGA solder balls for packaging integrated circuit |
| CN112362015B (en) * | 2020-06-29 | 2022-06-21 | 泰安晶品新材料科技有限公司 | Method for detecting BGA solder balls for packaging integrated circuit |
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| Publication number | Publication date |
|---|---|
| CN102315139B (en) | 2013-08-07 |
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Effective date of registration: 20221229 Address after: 451161 Tower C, Xinggang Building, No. 16, Huhang Road, Zhengzhou Airport Economic Comprehensive Experimental Zone, Zhengzhou City, Henan Province Patentee after: Zhengzhou Xinghang Technology Co.,Ltd. Address before: 710054 Shaanxi province Xi'an Taiyi Road No. 189 Patentee before: NO.771 INSTITUTE OF NO.9 RESEARCH INSTITUTE, CHINA AEROSPACE SCIENCE AND TECHNOLOGY Corp. |