CN112358684B - 一种可激光焊接的毫米波雷达壳体材料及其制备方法 - Google Patents

一种可激光焊接的毫米波雷达壳体材料及其制备方法 Download PDF

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CN112358684B
CN112358684B CN202011246478.4A CN202011246478A CN112358684B CN 112358684 B CN112358684 B CN 112358684B CN 202011246478 A CN202011246478 A CN 202011246478A CN 112358684 B CN112358684 B CN 112358684B
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laser
wave radar
weldable
millimeter wave
solvent
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CN112358684A (zh
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卢军
沈晓洁
李兰军
赵泳
董斌
邵禹通
刘曙阳
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Nanjing Dongju Carbon Fiber Composite Material Research Institute Co ltd
Nanjing Guanxu New Materials Technology Co ltd
NANJING JULONG TECHNOLOGY CO LTD
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Nanjing Dongju Carbon Fiber Composite Material Research Institute Co ltd
Nanjing Xuning New Material Technology Co ltd
NANJING JULONG TECHNOLOGY CO LTD
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Abstract

本发明公开了一种可激光焊接的毫米波雷达壳体材料及其制备方法,属于毫米波雷达壳体制造技术领域。一种可激光焊接的毫米波雷达壳体材料,包括以下重量份数的组分:聚丙烯50~90,玻璃纤维10~50,成核剂0.2~0.8,相容剂0.5~1,黑色着色剂0.1~0.5,抗氧剂0.1~0.5,光稳定剂0.1~0.8。本发明公开的雷达壳体材料具有低介电、轻量化、高强度和高耐热的优点,其能透过近红外光束,具有可激光焊接性。

Description

一种可激光焊接的毫米波雷达壳体材料及其制备方法
技术领域
本发明涉及毫米波雷达壳体材料技术领域,具体地说,涉及一种可激光焊接的77GHz毫米波雷达壳体材料。
背景技术
毫米波雷达,是工作在毫米波波段的雷达,通常是30~300GHz频段。其中,车用毫米波雷达主要有24GHz窄带雷达(24.00-24.25GHz)、24GHz超宽带雷达(24.25-24.65GHz)、77GHz雷达(76-77GHz)和79GHz雷达(77-81GHz)。相比24GHz雷达,77GHz雷达体积更小、检测精度更好,对雷达壳体材料要求更趋于低介电、低损耗以及轻量化。
雷达壳体材料要满足介电性能、力学性能、工艺性能和重量等要求,材料的介电性能包括介电常数和介电损耗。介电常数大,则电磁波在空气与雷达壳体界面上的反射率大,这将增加镜像波瓣电平、降低传输效率。介电损耗大,电磁波能量在穿透雷达壳体时转化成热量损耗的能量多。因此要求天线罩材料的介电常数和介电损耗尽可能低,以达到最大传输和最小反射的目的。低介电常数的材料给天线罩带来宽频带响应,允许放宽罩壁厚度公差,从而降低制造成本。
通常毫米波雷达壳体材料采用纤维增强热塑性复合材料,如聚苯硫醚(PPS)、聚对苯二甲酸丁二酯(PBT)以及聚酰亚胺(PI)等材料。日本宝理开发了一种能够平衡各项性能的PPS。日本东丽开发了适用于毫米波雷达的聚酰亚胺(PI)材料。SABIC通过玻纤改性增强PBT开发出可透过雷达波的材料。这些材料具有高强度、耐高温、耐化学性等优点,但是密度大、成本高的问题限制了这些材料在毫米波雷达领域的广泛应用。另外,PBT和PI材料含有极性基团,材料本体的介电常数一般高于3.,玻纤增强后达3.5以上,限制了在毫米波雷达中的使用。
玻纤增强聚丙烯材料的介电常数相对低,成本也低,近年来玻纤增强聚丙烯材料制备雷达壳体材料越来越受欢迎。专利CN110527188A公开了一种高透波聚丙烯组合物及其制备方法,在22GHz~80GHz毫米波范围该材料的频率损耗低于3%,在1MHz测试条件下介电常数在2.2左右,具备较高的透波性能和较低的介电常数,但其强度较低和耐热性较差,并不适用于雷达天线罩的应用。
通常雷达壳体是通过螺钉的方式固定在安装面上,但是这种安装方式存在很多缺点,诸如易松动、脱落以及密封性能差等,不能很好地保护雷达器件。相比螺钉联接,激光焊接塑料的方式具有连接可靠、密封性好,加工方便以及不渗水等优点,能更大的保证毫米波的传输性能。
塑料激光焊接的原理是通过压力将两个待焊接塑料零部件压在一起,借助近红外激光束透过上层透光材料,被下层吸光材料吸收热能使塑料接触面熔化,进而将热塑性片材、薄膜或模塑零部件粘结在一起的技术。激光焊接作为一种现代焊接技术,具有熔深深、速度快、变形小、对焊接环境要求不高、功率密度大、不受磁场的影响、不局限于导电材料、不需要真空的工作条件并且焊接过程中不产生X射线等优势,非常适合于微型零件和可达性很差的部位的焊接,被广泛应用于高端精密制造领域。
鉴于聚烯烃的结构特点,只有吸光的炭黑是聚烯烃理想的黑色颜料,无法实现激光透射焊接,上层材料的透近红外光率是衡量焊接质量的指标之一。因此,如何使深色毫米波雷达壳体满足低介电常数、高强度、高耐热、轻量化要求的同时提高壳体的透近红外光率采用激光焊接方式联接是扩大材料在毫米波雷达壳体领域应用的一项关键技术,目前仍未见相关技术专利报道。
发明内容
为解决上述技术问题,本发明提供一种雷达壳体材料同时具有低介电、轻量化、高强度和高耐热的优点,其能透过近红外光束,具有可激光焊接性。
为解决上述技术问题,本发明采用以下技术方案:
一种可激光焊接的毫米波雷达壳体材料,包括以下重量份数的组分:
聚丙烯 50~90
玻璃纤维 10~50
成核剂 0.2~0.8
相容剂 0.5~1
有机黑色着色剂 0.1~0.5
抗氧剂 0.1~0.5
光稳定剂 0.1~0.8。
进一步的技术方案,所述聚丙烯是高流动性均聚聚丙烯或共聚聚丙烯中的一种或多种。
进一步的技术方案,所述玻璃纤维是硅烷型浸润剂处理过的无碱玻璃纤维纱的一种或多种。
进一步的技术方案,所述成核剂是纳米级针状的凹凸棒,其长径比为30~50,粒径为5~8微米。
进一步的技术方案,所述相容剂是马来酸酐与聚烯烃的接枝物,马来酸酐接枝率为1.0%~2.5%。
进一步的技术方案,所述黑色着色剂由溶剂红,溶剂蓝,溶剂绿和溶剂黄按照重量比(6~8):(3~5):(1~3):(0.5~1)复配得到。优选地,溶剂红为E2G,溶剂蓝为RR,溶剂绿为5B,溶剂黄为Yellow G。
进一步的技术方案,所述抗氧剂为受阻酚类、胺类、亚磷酸酯类和硫代酯类抗氧剂中的一种或多种。优选地,抗氧剂是1010和168按照重量比例1:1或1:2复配。
进一步的技术方案,所述光稳定剂为受阻胺类、苯并三唑类和二苯甲酮类光稳定剂中的一种或多种。
一种可激光焊接的毫米波雷达壳体材料的制备方法,包括以下步骤:
将聚丙烯、相容剂、抗氧剂、黑色着色剂、光稳定剂以及成核剂按照一定比例加入到混合机中使之充分混合均匀,将得到的混合物加入到双螺杆挤出机内,将得到的树脂熔体挤入与双螺杆挤出机机头连接的浸渍模具中,继而将连续玻璃纤维通过浸渍模具,使连续玻璃纤维被熔体充分浸渍,最后冷却、牵引、切粒,即得到可激光焊接的毫米波雷达壳体材料。
有益效果
与现技术相比,本发明具有如下显著优点:
1、本发明采用LFT-G工艺制备玻纤增强PP材料和纳米级成核剂提高PP的结晶度双重方式赋予材料高强度和高耐热的优点。
2、PP材料本身透光率较高,但玻纤的添加会使激光束在材料中发生更多的反射和散射,耐高温的黑色着色剂的添加也会吸收部分光束,因此激光透过率大大降低。本发明的PP材料在凹凸棒诱导结晶的作用下形成小尺寸球晶,减少激光束通过该材料时的散射,提高激光束的透过率,进而提高激光焊接的强度。
3、本发明中凹凸棒使PP球晶尺寸细化,提高毫米波的穿透性,降低材料的介电常数,在77GHz测试条件下介电常数在2.6左右,可用于77GHz毫米波雷达壳体。
4、本发明的材料可以直接注塑成型,用于天线罩等要求低介电常数的壳体结构,制备工艺简单。将黑色毫米波雷达壳体材通过激光焊接的方式牢固地固定在安装面上,解决了现有联接方式易脱落以及密封性能差等问题,能更好的保护雷达器件。
具体实施方式
下面结合实施例对本发明作进一步详细的描述。
实施例
一种可激光焊接的毫米波雷达壳体材料,包括以下重量份数的组分:
聚丙烯 50~90
玻璃纤维 10~50
成核剂 0.2~0.8
相容剂 0.5~1
有机黑色着色剂 0.1~0.5
抗氧剂 0.1~0.5
光稳定剂 0.1~0.8
所述聚丙烯是高流动性均聚聚丙烯或共聚聚丙烯中的一种或多种。
所述玻璃纤维是硅烷型浸润剂处理过的无碱玻璃纤维纱的一种或多种。
所述成核剂是纳米级针状的凹凸棒,其长径比为30~50,粒径分布在5~8微米。
所述相容剂是马来酸酐与聚烯烃的接枝物,马来酸酐接枝率为1.0%~2.5%。
所述黑色着色剂由溶剂红E2G,溶剂蓝RR,溶剂绿5B和溶剂黄Yellow G按照重量比8:5:3:1复配得到。溶剂黄Yellow G选用朗盛溶剂色浆MACROLEX® Yellow G。
所述抗氧剂为受阻酚类、胺类、亚磷酸酯类和硫代酯类抗氧剂中的一种或多种。优选,抗氧剂是1010和168按照重量比例1:1或1:2复配。
所述光稳定剂为受阻胺类、苯并三唑类和二苯甲酮类光稳定剂中的一种或多种。
实施例1~4的配方如表1所示,实施例的制备方法包括以下步骤:
将聚丙烯、相容剂、抗氧剂、黑色着色剂、成核剂和光稳定剂按照一定比例加入到混合机中使之充分混合均匀,将预混物加入到双螺杆挤出机内,将得到的树脂熔体挤入与双螺杆挤出机机头连接的浸渍模具中,继而将连续玻璃纤维通过浸渍模具,使连续玻璃纤维被熔体充分浸渍,最后冷却、牵引、切粒,即得到可激光焊接的毫米波雷达壳体粒料。
将粒料在90℃烘干3小时,注塑成型,其中,注塑机的工作条件为:一区温度200-220℃,二区温度为230-240℃,三区温度为240-250℃,四区温度为245-255℃,压力为60-90MPa,速度为30-50mm/s。其中,一套标准样条进行力学性能测试,60*20*2的样条按照单搭的方式进行激光焊接。
实施例的测试标准与条件如下:拉伸强度按ISO 527测试,拉伸速度为50mm/min;弯曲强度按ISO 178测试,测试速度为2mm/min;悬臂梁缺口冲击强度按ISO 180测试,缺口形状为V形;简支梁无缺口冲击强度按ISO179测试,热变形温度按ISO75-2,负荷1.8MPa;介电性能按SJ 20512-1995,频率为77GHz;透光率:紫外可见近红外分光光度计 Lambda950,60mm*60mm*2mm光面板子,波长为800~1200nm。
表1 实施例1~4和对比例的配方
配方 实施例1 实施例2 实施例3 实施例4 对比例1
均聚PP 60 50 60 70
共聚PP 20 20 70
连续玻纤 20 30 40 30
短玻纤 30
凹凸棒 0.7 0.5 0.2 0.6 0
PP-g-MAH 0.5 0.5 0.8 1 1
黑色着色剂 0.2 0.5 0.4 0.3
炭黑色粉 0.5
抗氧剂1010 0.1 0.1 0.2 0.2 0.2
抗氧剂168 0.1 0.2 0.2 0.3 0.2
稳定剂770 0.3 0.2 0.2 0.3
稳定剂944 0.2 0.4 0.2
UV-531 0.5
表2 实施例1~4和对比例的性能测试结果
实施例 实施例1 实施例2 实施例3 实施例4 对比例1
密度 1.05 1.12 1.22 1.12 1.12
拉伸强度/MPa 72 98 124 110 70
断裂伸长率 2.3 1.9 2.6 2 3.5
弯曲模量/MPa 4200 6000 8300 6700 4000
弯曲强度/MPa 120 155 185 160 90
悬臂梁缺口冲击强度/kJ·m<sup>-2</sup> 20 25 28 23 10
简支无梁缺口冲击强度/kJ·m<sup>-2</sup> 55 63 66 61 45
热变形温度HDT(1.8MPa) 136 155 162 160 115
介电常数Dk 2.46 2.6 2.71 2.59 2.62
透光率(950nm) 53% 43% 35% 46% 0
通过实施例的阐述,本发明选择通用塑料聚丙烯为基材,添加无碱玻璃纤维纱,通过LFT-G工艺生产和成核剂的诱导结晶作用,赋予了材料高强度和高耐热等优点;凹凸棒使PP球晶尺寸细化,有利于毫米波的穿透性,降低了材料的介电常数,满足5G对雷达壳体高强度、高耐热以及高透波的要求。另外, PP的球晶尺寸的细化,减少材料对激光束的散射作用,提高了材料的透光率,在有机染料的作用下也不影响材料的透光率,实现了毫米波雷达壳体以激光焊接的方式连接在安装面上,焊接强度高,不易损坏,解决了现有连接方式存在的易松动、密封性差等带来的一系列问题。
本发明包括但不限于以上实施例,根据本发明的阐述,不脱离本发明范畴所做出的改进和修改都应该在本发明的保护范围之内。另外,本发明的材料不仅仅可以用在毫米波雷达壳体上,还可用于要求低介电常数的各种天线罩领域。

Claims (7)

1.一种可激光焊接的毫米波雷达壳体材料,其特征在于,包括以下重量份数的组分:
聚丙烯 50~90
玻璃纤维 10~50
成核剂 0.2~0.8
相容剂 0.5~1
有机黑色着色剂 0.1~0.5
抗氧剂 0.1~0.5
光稳定剂 0.1~0.8;
所述成核剂是纳米级针状凹凸棒,其长径比为30~50,平均直径为5~8微米;
所述的有机黑色着色剂由溶剂红,溶剂蓝,溶剂绿和溶剂黄按照重量比(6~8):(3~5):(1~3):(0.5~1)复配而成;
所述的溶剂红为E2G,溶剂蓝为RR,溶剂绿为5B,溶剂黄为Yellow G。
2.根据权利要求1所述的一种可激光焊接的毫米波雷达壳体材料,其特征在于,所述聚丙烯是高流动性均聚聚丙烯或共聚聚丙烯中的一种或多种。
3.根据权利要求1所述的一种可激光焊接的毫米波雷达壳体材料,其特征在于,所述玻璃纤维是硅烷型浸润剂处理过的无碱玻璃纤维纱的一种或多种。
4.根据权利要求1所述的一种可激光焊接的毫米波雷达壳体材料,其特征在于,所述相容剂是马来酸酐与聚烯烃的接枝物,马来酸酐接枝率为1.0%~2.5%。
5.根据权利要求1所述的一种可激光焊接的毫米波雷达壳体材料,其特征在于,所述抗氧剂为受阻酚类、亚磷酸酯类和硫代酯类抗氧剂中的一种或多种。
6.根据权利要求1所述的一种可激光焊接的毫米波雷达壳体材料,其特征在于,所述光稳定剂为受阻胺类、苯并三唑类和二苯甲酮类光稳定剂中的一种或多种。
7.权利要求1-6任一项所述的一种可激光焊接的毫米波雷达壳体材料的制备方法,其特征在于,包括以下步骤:
将聚丙烯、相容剂、抗氧剂、黑色着色剂、成核剂以及光稳定剂按照重量份数加入到混合机中使之充分混合均匀得到预混物,将预混物加入到双螺杆挤出机内,将得到的树脂熔体挤入与双螺杆挤出机机头连接的浸渍模具中,继而将连续玻璃纤维通过浸渍模具,使连续玻璃纤维被熔体充分浸渍,最后冷却、牵引、切粒,即得到可激光焊接的毫米波雷达壳体材料。
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Denomination of invention: A laser weldable millimeter wave radar shell material and its preparation method

Granted publication date: 20220520

Pledgee: Nanjing Branch of Jiangsu Bank Co.,Ltd.

Pledgor: Nanjing Julong Technology Co.,Ltd.

Registration number: Y2024980003201

PE01 Entry into force of the registration of the contract for pledge of patent right