CN112327123A

CN112327123A - Testing device

Info

Publication number: CN112327123A
Application number: CN201910646729.9A
Authority: CN
Inventors: 徐广泽; 韩鹏宇
Original assignee: Suzhou Nexun High Energy Semiconductor Co ltd
Current assignee: Suzhou Nexun High Energy Semiconductor Co ltd; Dynax Semiconductor Inc
Priority date: 2019-07-17
Filing date: 2019-07-17
Publication date: 2021-02-05

Abstract

The invention provides a testing device, which relates to the field of microelectronic testing and comprises a circuit board, a fixed seat and a probe, wherein a heat sink through hole is formed in the circuit board, the fixed seat is convexly arranged on the circuit board and is arranged at an interval with the heat sink through hole, the probe is fixed on the fixed seat and extends towards the heat sink through hole, a probe groove is formed in the circuit board between the fixed seat and the heat sink through hole, and the probe is suspended above the probe groove. When testing, the encapsulation device that awaits measuring is connected with the probe electricity, because the probe is in the suspension state and can push down towards the probe recess under the extrusion of the encapsulation device that awaits measuring for the encapsulation device that awaits measuring can keep good electrical contact with the probe, and the needle depth of probe is less simultaneously, and the stroke of pushing down is also less, has just also broken away from the restriction of pin height among the prior art, thereby makes the heat radiation structure's of the encapsulation device bottom that awaits measuring thickness littleer, has promoted the radiating effect.

Description

Testing device

Technical Field

The invention relates to the field of microelectronic testing, in particular to a testing device.

Background

At present, in the semiconductor industry, the test of plastic package devices is mainly realized in a socket (socket) test mode, and a plurality of manufacturers at home and abroad can provide a socket solution. For direct current testing, spring probes (Pogo pins) are mostly adopted for electrical connection of a packaged device to be tested in socket, the device is required to have good heat dissipation capacity for long-time testing, and the Pogo pins can bring negative effects on heat dissipation of the device to be tested.

Disclosure of Invention

The invention aims to provide a testing device which can test a packaged device to be tested, has good electrical contact and good testing effect, can bring benefits to the heat dissipation of the packaged device to be tested, and improves the heat dissipation effect of the packaged device to be tested in the testing process.

The invention is realized by adopting the following technical scheme.

The utility model provides a testing device, includes circuit board, fixing base and probe, has heat sink through-hole on the circuit board, and the fixing base is protruding to be established on the circuit board and to set up with heat sink through-hole interval, and the probe is fixed on the fixing base and extends towards heat sink through-hole, is provided with the probe recess on the circuit board between fixing base and the heat sink through-hole, and the probe is suspended in the top of probe recess.

Further, the probe includes cantilever and needle point, and the one end of cantilever is fixed to be set up on the fixing base, and the other end extends to the probe recess and the suspension is on the probe recess, and the needle point setting is kept away from the one end of fixing base at the cantilever.

Further, the needle tip is bent away from the circuit board by the cantilever.

Furthermore, the top end of the needle point is provided with a propping surface which is used for being attached to the surface of the circuit board when the needle point is pressed downwards.

Further, the needle depth of the needle tip is 0.3mm-1mm, and the projection length of the cantilever and the needle tip on the probe groove is 3mm-10 mm.

Further, the depression stroke of the probe is smaller than the depth of the probe groove.

Furthermore, the probe is the multichannel, and the mutual parallel arrangement of multichannel probe, and every way probe is fixed to be set up on the fixing base.

Furthermore, the probe groove comprises a region to be tested and an accommodating region, the region to be tested is close to the heat sink through hole relative to the accommodating region, the accommodating region extends from the fixing seat to the region to be tested, and the width of the region to be tested is larger than that of the accommodating region.

Further, the width of the area to be measured is smaller than or equal to the width of the heat sink through hole.

Furthermore, the accommodating area extends to the middle part of the area to be measured, so that the area to be measured and the accommodating area form a T-shaped structure.

The invention has the following beneficial effects:

the invention provides a testing device, wherein a heat sink through hole is formed in a circuit board, a fixed seat is convexly arranged on the circuit board and is arranged at an interval with the heat sink through hole, one end of a probe is fixed on the fixed seat and extends towards the heat sink through hole, and the probe is suspended on a probe groove between the fixed seat and the heat sink through hole. Compared with the prior art, the testing device provided by the invention can test the packaged to-be-tested device, has good electrical contact and good testing effect, and can avoid the thick and heavy copper block arranged at the bottom of the to-be-tested device through the probe, so that the heat dissipation of the to-be-tested device is facilitated, and the heat dissipation effect of the to-be-tested device in the testing process is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic diagram of an overall structure of a testing apparatus according to the present invention;

FIG. 2 is a schematic view of a first partial structure of a testing apparatus provided in the present invention;

FIG. 3 is a first cross-sectional view of a testing device provided by the present invention;

FIG. 4 is a schematic diagram of a second partial structure of the testing device provided in the present invention;

FIG. 5 is a second cross-sectional view of a testing device provided by the present invention;

FIG. 6 is a schematic view of a connection structure between the probe and the fixing base in FIG. 1;

FIG. 7 is a schematic view of another connection structure between the probe and the holder in FIG. 1;

FIG. 8 is a schematic view of a second layout structure of the fixing base shown in FIG. 1;

fig. 9 is a schematic view of a third layout structure of the fixing base in fig. 1.

Icon: 100-a test device; 110-a circuit board; 111-external circuit wiring; 130-a fixed seat; 150-a probe; 151-cantilever; 153-needle tip; 155-a holding surface; 170-heat sink vias; 190-probe grooves; 191-a region to be detected; 193-containment zone.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships conventionally put on the products of the present invention when used, and are only used for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," "mounted," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. Features in the embodiments described below may be combined with each other without conflict.

First embodiment

Referring to fig. 1 to 4, the present embodiment provides a testing apparatus 100 for testing a packaged device to be tested, which is mounted on a testing fixture, and the packaged device to be tested is placed into the testing fixture and electrically contacted with the testing apparatus 100, so as to test the packaged device to be tested. The probe card is adopted for testing, the packaging device to be tested can be tested, the electrical contact is good, the testing effect is good, the thick copper block is prevented from being arranged at the bottom of the packaging device to be tested, the heat dissipation of the packaging device to be tested can be benefited, and the heat dissipation effect of the packaging device to be tested in the testing process is improved.

The testing device 100 provided by the embodiment includes a circuit board 110, a fixing base 130 and a probe 150, wherein the circuit board 110 has a heat sink through hole 170, the fixing base 130 is convexly disposed on the circuit board 110 and spaced from the heat sink through hole 170, the probe 150 is fixed on the fixing base 130 and extends toward the heat sink through hole 170, a probe groove 190 is disposed on the circuit board 110 between the fixing base 130 and the heat sink through hole 170, and the probe 150 is suspended above the probe groove 190. Specifically, the heat sink through hole 170 is used for the heat sink block on the test fixture to pass through, and the package device to be tested is contacted with the probe 150 and placed on the heat sink block, because the probe 150 is adopted, and the probe 150 is suspended above the probe groove 190, the thickness of the heat sink block can be greatly reduced, and the heat dissipation of the package device to be tested in the test process is beneficial.

It should be noted that the packaged device to be tested in this embodiment is a dual-edge flat lead-free packaged Device (DFN), and of course, the packaged device to be tested here may also be a quad flat lead-free packaged device (QFN), a ceramic packaged device, a metal packaged device, or the like. The testing apparatus 100 provided in this embodiment may also be applied to testing various types of packages, such as radio frequency packaged devices, power electronic packaged devices, and the like.

In this embodiment, the heat sink through hole 170 is rectangular, the heat sink block is filled in the heat sink through hole 170, and the package device to be tested is pressed on the heat sink block, so as to ensure the contact and heat dissipation between the package device to be tested and the heat sink block. Of course, the heat sink through hole 170 may have other shapes such as a circle or an ellipse, as long as it can pass through the heat sink.

In this embodiment, the probe groove 190 is implemented by digging a groove on the circuit board 110, so that the probe groove 190 region is lower than the height of the fixing base 130, so that the probe 150 can be suspended above the probe groove 190 and bent downward and extended into the probe groove 190 under the pressing-down action of the packaged device to be tested. The probe 150 extends from the fixing base 130 toward the heat sink through hole 170, and the probe 150 does not extend into the heat sink through hole 170, but is suspended above the probe groove 190, so as to avoid interference with the heat sink block.

The probe groove 190 includes a region to be tested 191 and an accommodating region 193, the region to be tested 191 is close to the heat sink through hole 170 relative to the accommodating region 193, the accommodating region 193 extends from the fixing base 130 to the region to be tested 191, the width of the region to be tested 191 is larger than that of the accommodating region 193, the probe 150 extends from the fixing base 130 to the accommodating region 193 and the region to be tested 191 in sequence, and the free end of the probe 150 is suspended above the region to be tested 191. It should be noted that the width of region to be measured 191 and the width of accommodation region 193 mentioned herein refer to the width of region to be measured 191 and accommodation region 193 in the direction perpendicular to probe 150. The area to be tested 191 and part of the heat sink through holes 170 jointly form a device placing area for accommodating the packaged device to be tested, and the bottom of the packaged device to be tested extends into the area to be tested 191 and part of the heat sink through holes 170 respectively. Because the width of the region to be tested 191 is greater than that of the accommodating region 193, a stop surface is formed at the joint of the accommodating region 193 and the region to be tested 191, the sliding of the packaged device to be tested in the horizontal direction can be effectively prevented, and the testing precision is improved.

In the present embodiment, the width of the region to be tested 191 is less than or equal to the width of the heat sink via 170. It should also be noted that the width of region to be measured 191 and the width of receiving region 193 referred to herein refer to the width in the direction perpendicular to probes 150. Preferably, the width of the region to be tested 191 is slightly smaller than the width of the heat sink through hole 170, and when the package device to be tested is placed, because the width of the heat sink through hole 170 is slightly larger than the width of the region to be tested 191, the heat sink through hole 170 can allow the heat sink block to pass through, and the placement area of the heat sink block is larger, so that the package device to be tested is conveniently placed, and good contact is ensured.

In this embodiment, the accommodating region 193 extends to the middle of the region to be tested 191, so that the region to be tested 191 and the accommodating region 193 form a T-shaped structure, thereby limiting the two ends of the packaged device to be tested, and further preventing the packaged device to be tested from sliding in the horizontal direction. Of course, here, the region to be measured 191 and the accommodating region 193 may also form an L-shaped structure, or the width of the region to be measured 191 and the width of the accommodating region 193 are the same to form a rectangular structure, and the shapes of the region to be measured 191 and the accommodating region 193 are not particularly limited herein.

Referring to fig. 5, the probe 150 includes a cantilever 151 and a tip 153, one end of the cantilever 151 is fixedly disposed on the fixing base 130, the other end extends to the probe groove 190 and is suspended above the probe groove 190, and the tip 153 is disposed at an end of the cantilever 151 away from the fixing base 130. Specifically, the cantilever 151 and the needle tip 153 are integrally disposed, and the needle tip 153 is used for contacting with a test pin of the package device to be tested and realizing electrical connection. The end of the cantilever 151 is soldered to the circuit board 110 and the fixed base 130 is formed at the soldered position, or a soldering board is protruded from the circuit board 110 and the end of the cantilever 151 is soldered directly to the soldering board.

In this embodiment, the circuit board 110 may be a Printed Circuit Board (PCB), and specifically may be a double-sided PCB with circuit function, the back side is grounded, the front side is wired, and the wiring structure can refer to fig. 1. The circuit board 110 is supported by a high temperature resistant plate and has a gold-deposited surface. Meanwhile, the PCB board may be a single layer board, and the probe groove 190 is formed by grooving the upper surface. Of course, the kind of the board material of the PCB, the surface treatment process, etc. herein include not limited to the types mentioned in the present invention. According to actual use, the method can be adjusted as follows: the surface of the plate can be treated without surface treatment or other surface treatment according to the use requirement, and the plate thickness is not limited. Meanwhile, the PCB board can also be a multilayer board.

In the present embodiment, the needle tip 153 is bent by the cantilever 151 in a direction away from the circuit board 110. Specifically, the tip 153 of the probe 150 faces upward, and when the package device to be tested is pressed down, the probe can directly contact the tip 153 and press down to bend the cantilever 151, so that an upward elastic force is applied to the tip 153, and good contact between the tip 153 and the pin of the package device to be tested is ensured.

In this embodiment, the top end of the needle tip 153 has a supporting surface 155, and the supporting surface 155 is used for being attached to the surface of the package device to be tested when the needle tip 153 is pressed down. Specifically, the top end of the needle tip 153 is ground to be flat and form a supporting surface 155, and after the pressing stroke of the to-be-tested package device is in place, the supporting surface 155 is in a horizontal plane, so that the contact mode between the to-be-tested package device and the needle tip 153 after pressing can be guaranteed to be surface contact. Through the arrangement of the abutting surface 155, the probe 150 can be pressed in place and then in surface contact with a packaged device to be tested, and in other cases, line contact is realized, so that point contact under the condition of non-flat grinding is avoided, and the contact stability is improved.

In the present embodiment, the needle depth of the needle tip 153 is 0.3mm to 1mm, and the projected length of the cantilever 151 and the needle tip 153 on the probe well 190 is 3mm to 10 mm. Preferably, the needle tip 153 has a needle depth of 0.4mm to 0.8 mm. It should be noted that, here, the needle depth of the needle tip 153 refers to the vertical distance from the top end of the needle tip 153 to the upper surface of the PCB below, and this distance should be as small as possible in the case of satisfying the pressing stroke of the needle tip 153 at the time of pressing. The projected length of the cantilever 151 and the probe 150 on the probe groove 190 herein refers to the suspended length of the cantilever 151 and the tip 153, i.e., the horizontal distance between the fulcrum of the cantilever 151 and the end of the tip 153, which can affect the depression stroke of the probe 150, i.e., the greater the horizontal distance between the fulcrum of the cantilever 151 and the end of the tip 153, the greater the depression stroke of the probe 150.

In this embodiment, the depression stroke of the tip 153 is less than the depth of the probe groove 190. The depth of the probe groove 190 refers to a vertical distance between the surface of the PCB at the bottom of the probe groove 190 and the surface of the PCB where the fixing base 130 is located. Because the probe 150 is bent downwards under the extrusion of the packaging device to be tested, the needle point 153 extends downwards into the probe groove 190, the pressing stroke of the probe point 153 is smaller than the depth of the probe groove 190, the bottom of the needle point 153 can be prevented from contacting the surface of the PCB, and the safety of the testing process is ensured. Preferably, the probe 150 has a pressing stroke of less than 1 mm.

It should be noted that, the needle depth of the needle tip 153 may be redesigned according to actual requirements, and similarly, the suspension lengths of the cantilever 151 and the needle tip 153 may also be redesigned according to actual requirements, and the value range mentioned in this embodiment is not limited, and it is only required to ensure that the pressing stroke of the probe 150 is smaller than the depth of the probe groove 190.

In this embodiment, the probe 150 has a dual-needle structure, which includes two sub-probes. By providing the dual pin structure, good electrical contact between the probe 150 and the pins of the packaged device to be tested is ensured. Of course, the probe 150 may have a single-needle or multi-needle structure, and is not limited in particular.

Referring to fig. 6, in the present embodiment, the two sub-probes are parallel to each other, have the same length, and are flush with each other in the horizontal direction and the vertical direction, so that the two sub-probes are all in contact with the packaged device to be tested.

Referring to fig. 7, in another preferred embodiment of the present invention, one of the two sub-probes extends out of the fixing base 130 by a length greater than that of the other sub-probe extending out of the fixing base 130. Through the dislocation set of two sub-probes, can guarantee that the connection contact condition of at least one sub-probe is good, guarantee the contact effect. Of course, the two sub-probes may be vertically displaced, and the contact effect can be ensured.

It should be noted that, in this embodiment, the probes 150 and the fixing base 130 may be disposed on one side, two sides, three sides, or four sides of the heat sink through hole 170, and the number of the probes 150 on each side and the arrangement position of the fixing base 130 may be the same or different, which corresponds to the number and position of the pins of the package device to be tested.

In this embodiment, the probes 150 are multi-path probes, the multi-path probes 150 are disposed in parallel, and each path of probe 150 is fixedly disposed on the fixing base 130. The fixing bases 130 are also multiple, the fixing bases 130 are arranged on one side of the heat sink through hole 170, and at least one probe 150 is fixedly arranged on each fixing base 130.

In this embodiment, the probe 150 is taken as 6 paths for illustration, the 6 paths of probes 150 are oppositely arranged on two sides of the heat sink through hole 170, and the probes 150 on each side are parallel to each other. Meanwhile, one side of the heat sink through hole 170 is provided with a fixing seat 130, wherein the 3-way probes 150 are commonly connected to the fixing seat 130, the other side of the heat sink through hole 170 is provided with 3 fixing seats 130, and the other 3-way probes 150 are respectively connected with the 3 fixing seats 130 and respectively connected with the electrodes of the 3 enhancement devices.

It should be noted that the number of paths and the arrangement positions of the probes 150 in this embodiment are not limited to the design manner mentioned in this embodiment, and may be modified correspondingly according to the number and positions of the pins of the package, so as to ensure that the gate and drain pins on both sides of the package can correspond to the probes 150 one-to-one. The package can accommodate a plurality of enhancement devices, for example, at most 3, 4 or 5 enhancement devices, and the number of pins on both sides is increased, so that the number of the probe 150 is matched. Meanwhile, the package is not limited to the arrangement of the pins on two sides, and the pins may be arranged on the four sides, so that the positions of the probes 150 are matched therewith.

Referring to fig. 1, in the present embodiment, the circuit board 110 is provided with an external circuit trace 111, and the external circuit trace 111 is electrically connected to one or more of the probes 150. Specifically, one or more of the probes 150 may be connected according to the test content, i.e., different conduction modes may be selected according to the test content.

It should be noted that the external circuit trace 111 further has components such as a resistor and a capacitor for perfecting the test circuit, wherein the resistor and the capacitor on the external circuit trace 111 are both high temperature resistant components, and play roles in voltage stabilization and filtering.

In the embodiment, the external circuit traces 111 are respectively disposed on the circuit board 110 at two sides of the heat sink through hole 170 and close to the fixing base 130, wherein the fixing base 130 also has a connecting wire extending toward the external circuit trace 111, and the connecting wire is electrically connected to the probe 150 disposed on the fixing base 130, so as to diffuse the electrical connection of the probe 150 outward. The external circuit wire 111 and the connecting wire can be connected by a jumper wire or other methods.

Specifically, in this embodiment, the fixing bases 130 are disposed on two sides of the heat sink through hole 170, wherein the fixing base 130 on the left side is an integral structure, and the 3-way probes 150 are disposed on the fixing base 130 at intervals and are respectively connected to the electrodes of the 3 enhancement devices on the package device to be tested. The right fixing base 130 is divided into 3, and the remaining 3 probes 150 are respectively connected with the 3 fixing bases 130 and respectively connected with the electrodes of the 3 enhancement type devices on the to-be-tested packaging device. Each fixing base 130 has a connecting wire extending outwards, and the connecting wire extends to a position close to the external circuit. When the external circuit wiring 111 is selected to be conducted with 3 connecting wires, a pair of 3 devices to be tested is correspondingly selected to be conducted, and when the external circuit wiring 111 is conducted with 2 or 3 connecting wires, the external circuit wiring is conducted with 2 or 3 devices to be tested, so that the conduction is realized corresponding to 2 or 3 devices to be tested, and the simultaneous or separate testing of different devices to be tested is realized, and the conduction mode can be selected. It should be noted that, the 3 fixing bases 130 on the right side may also be connected together two by two, or 3 are connected together and correspond to the left side, and are not limited in detail here. Here, the left side and the right side are relative concepts, and the actual left side and the actual right side are not limited, and the arrangement of the fixing bases 130 on both sides may be interchanged, and the purpose of selecting the passage can be achieved similarly.

Referring to fig. 8 and 9, in other preferred embodiments of the present invention, the fixing base 130 may extend to have a plurality of modifications, for example, 3 fixing bases 130 are respectively disposed at two sides of the heat sink through hole 170, and each fixing base 130 is disposed with a 1-way probe 150. And the connecting wires extended from the fixing seats 130 on the two sides can be selectively conducted with the external circuit wiring 111, so that various controllable test modes can be realized, and a certain or multiple enhancement devices can be tested. Or, the connecting wires extended from the fixing base 130 on one side can be selectively conducted with the external circuit wiring 111, and the other side is in a connection state, so that various controllable test modes can be realized, and a certain or multiple enhancement-type devices can be tested.

In summary, the present embodiment provides a testing apparatus 100, which realizes a package-level test and is beneficial to heat dissipation of a device while ensuring good electrical contact. Meanwhile, the needle point 153 of the probe 150 is ground flat, so that good contact between the probe 150 and the packaged device to be tested can be further improved. And the probe 150 adopts a double-needle structure, so that good contact between the probe 150 and the packaged device to be tested is further improved. In addition, the connection wires and the external circuit wires can be selectively conducted, so that the flexibility of the testing device 100 is improved, a plurality of enhanced devices can be tested simultaneously or respectively, and the testing device is very flexible.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a testing device, characterized in that, includes circuit board (110), fixing base (130) and probe (150), heat sink through-hole (170) have on circuit board (110), fixing base (130) are protruding to be established on circuit board (110) and with heat sink through-hole (170) interval sets up, probe (150) are fixed on fixing base (130) and towards heat sink through-hole (170) extend, fixing base (130) with be provided with probe recess (190) on circuit board (110) between heat sink through-hole (170), probe (150) suspension in the top of probe recess (190).

2. The testing device according to claim 1, wherein the probe (150) comprises a cantilever (151) and a needle tip (153), one end of the cantilever (151) is fixedly arranged on the fixed base (130), the other end of the cantilever (151) extends to the probe groove (190) and is suspended on the probe groove (190), and the needle tip (153) is arranged at one end of the cantilever (151) far away from the fixed base (130).

3. The testing device according to claim 2, characterized in that the needle tip (153) is bent away from the circuit board (110) by the cantilever (151).

4. The testing device according to claim 2, wherein the tip of the needle tip (153) has an abutting surface (155), and the abutting surface (155) is used for being attached to the surface of the packaged device to be tested when the needle tip (153) is pressed down.

5. The test device according to claim 2, wherein the needle depth of the needle tip (153) is 0.3mm to 1mm, and the projected length of the cantilever (151) and the needle tip (153) on the probe groove (190) is 3mm to 10 mm.

6. The testing device of claim 1, wherein a depression stroke of the probe (150) is less than a depth of the probe groove (190).

7. The testing device according to claim 1, wherein the probes (150) are multiplexed, the multiplexed probes (150) are arranged in parallel, and each probe (150) is fixedly arranged on the fixing base (130).

8. The testing device according to claim 1, wherein the probe groove (190) comprises a region to be tested (191) and a receiving region (193), the region to be tested (191) is close to the heat sink through hole (170) relative to the receiving region (193), the receiving region (193) extends from the fixing seat (130) to the region to be tested (191), and the width of the region to be tested (191) is larger than the width of the receiving region (193).

9. The testing device according to claim 8, wherein the width of the region under test (191) is smaller than or equal to the width of the heat sink via (170).

10. The test device according to claim 8, wherein the receiving region (193) extends to a middle portion of the region under test (191) such that the region under test (191) and the receiving region (193) form a T-shaped structure.