KR20110090298A

KR20110090298A - Pitch convertible test socket

Info

Publication number: KR20110090298A
Application number: KR1020100009995A
Authority: KR
Inventors: 한민석
Original assignee: (주)티에스이
Priority date: 2010-02-03
Filing date: 2010-02-03
Publication date: 2011-08-10

Abstract

PURPOSE: A pitch conversion available test socket including a contact pad is provided to increase the height of a test socket by using a test broad. CONSTITUTION: A plurality of upper conductive filled rubbers(61a) has the same pitch with a pitch of terminals of semiconductor element receiving the test. An upper silicon rubber connector unit has the upper conductivity filled rubber. A connection PCB(10) has a plurality of conductive members whose upper part is connected to a lower end of filled rubbers. A lower conductive filled rubber is connected to a lower end of the conductive members. A plurality of lower conductivity filling rubbers has the same pitch with the pitch of the contact pads of the test broad. A lower silicon rubber connector unit has lower conductive filled rubbers.

Description

Pitch convertible test socket

The present invention relates to a pitch convertible test socket, and more particularly, to a test socket for electrically connecting a terminal of a semiconductor device under test and a contact pad of a test board.

Recently, a ball grid array (BGA) in which a plurality of ball-shaped terminals are formed on a lower surface of a body is becoming more common than a QFP (quad flat package) in which a terminal protrudes outward on a side of a body. . When such a semiconductor device is manufactured, a test is performed to inspect properties and defects. Usually, a test socket is inserted between a semiconductor device and a test board installed in a test equipment.

There are two types of test sockets, a pogo pin and a silicon rubber. When the pitch of a terminal of a semiconductor device is a fine pitch, a silicon rubber socket using a silicon rubber is used. Is used.

By the way, when the pitch of the terminal of a semiconductor element is a fine pitch of 0.5 mm or less, since the pitch of the contact pad of a test board also becomes 0.5 mm or less, since manufacturing difficulty increases, the manufacturing process for a test board becomes long and manufactures There is a problem that the yield is lowered, the manufacturing cost is increased, even if the test board is impossible to manufacture. In addition, when the test socket is manufactured using only silicon rubber, there is a problem in that there is a limit in increasing the height of the test socket.

The present invention can be used in a test board having a contact pad having a pitch larger than the terminal pitch of the semiconductor device under test, and to provide a pitch convertible test socket capable of increasing the height of the test socket. There is a purpose.

In order to achieve the above object, the present invention, an upper silicon rubber connector portion having a plurality of upper conductive filling rubber having a pitch equal to the pitch of the terminals of the semiconductor device under test; A printed circuit board (PCB) having a plurality of conductive members each of which is connected to the bottom of each of the upper conductive filling rubbers; And a lower silicon rubber connector portion having a respective upper end connected to a lower end of each of the conductive members, the lower silicon rubber connector having a plurality of lower conductive filling rubbers having the same pitch as that of the contact pads of the test board. Provides a pitch convertible test socket, characterized in that greater than the pitch of the top of the conductive members.

According to the present invention, there is provided a test socket which can be used for a test board having a contact pad having a pitch larger than the terminal pitch of a semiconductor device under test, and which can be further increased in height than a test socket made of only silicon rubber. do.

1 is a plan view of a connection PCB of a pitch convertible test socket according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of the pitch changeable test socket taken along dashed line AA ′ shown in FIG. 1.

Hereinafter, preferred embodiments of the pitch convertible test socket according to the present invention will be described with reference to the accompanying drawings.

1 is a plan view of a connection PCB of a pitch convertible test socket according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the pitch convertible test socket cut along the dotted line AA ′ shown in FIG. 1.

1 and 2, a pitch convertible test socket 100 according to an embodiment of the present invention will be described. The pitch convertible test socket 100 includes an upper silicon rubber connector portion 60, a connection PCB 10, and a lower silicon rubber connector portion 70.

The upper silicon rubber connector part 60 includes a plurality of upper conductive filling rubbers 61a, 61b, and 61c having a pitch P1 equal to the pitch P1 of the terminals 40 of the semiconductor device 200 under test. , 61d, 61g). Except for the upper conductive filling rubbers 61a, 61b, 61c, 61d, and 61g, the upper silicon rubber connector portion 60 is formed of an insulating silicone rubber. Each of the upper conductive filling rubbers 61a, 61b, 61c, 61d, and 61g is in electrical contact with each of the terminals 40 of the semiconductor device 200. Therefore, the upper conductive filling rubbers 61a and 61b have the same pitch P1 as the terminal pitch P1 of the semiconductor element.

A connection PCB 10 is formed on the lower surface of the upper silicon rubber connector part 60. The connection PCB 10 has a plurality of conductive members 20a, 20b, 20c and 20d that are conductive. Upper ends 21a, 21b, 21c, and 21d of each of the conductive members 20a, 20b, 20c, and 20d are connected to lower ends of each of the upper conductive filling rubbers 61a, 61b, 61c, and 61d. The pitch P2 of the lower ends of the conductive members 20a and 20b is larger than the pitch P1 of the upper ends of the conductive members 20a and 20b. The connection PCB 10 is preferably a build up PCB.

The lower silicon rubber connector part 70 is formed on the lower surface 12 of the connection PCB 10. The lower silicon rubber connector part 70 includes a plurality of lower conductive filling rubbers 71a, 71b, 71c, 71d, and 71g. An upper end of each of the lower conductive filling rubbers 71a, 71b, 71c, 71d, and 71g is connected to a lower end of each of the conductive members 20a, 20b, 20c, 20d, and 20g. In addition, a lower end of each of the lower conductive filling rubbers 71a, 71b, 71c, 71d, and 71g is in electrical contact with the contact pads 50 of the test board 300. Therefore, the lower conductive filling rubbers 71a and 71b have the same pitch P2 as the contact pad pitch P2 of the test board 300.

Referring to the first conductive member 20a and the second conductive member 20b illustrated in FIG. 2, the structure of forming the pitch of the lower ends of the conductive members to be greater than the pitch of the upper ends of the conductive members will be described below. Each of the first conductive member 20a and the second conductive member 20b has upper and lower vias 23a and 23b, lower and lower vias 25a and 25b, and lower and lower vias 25a and 25b, respectively. It consists of a trace (24a, 24b) connected to the top of the).

Since the lower via 25a of the first conductive member 20a is formed farther from the center position (hereinafter, referred to as a 'center position') of the conductive member array than the upper via 23a of the first conductive member 20a. The trace 24a of the first conductive member 20a is formed to face outward. In FIG. 1, since the number of conductive members arranged in a line passing through the center of the opposite side (hereinafter, referred to as a 'center line') is an odd number, as in the dotted line A-A ', the position of the center conductive member 20g is the center position. However, if the number of conductive members arranged in the center line is an even number, the midpoint between the two innermost conductive members will be the center position. Since the lower via 25b of the second conductive member 20b is also formed farther from the center position than the upper via 23b of the second conductive member 20b, the trace 24b of the second conductive member 20b is also outside. It is formed to face toward.

Also, the pitch of the lower ends of the conductive members is larger than the pitch of the upper ends of the conductive members. Therefore, since the distance from the first conductive member 20a to the center position is greater than the distance from the second conductive member 20b to the center position, the length of the trace 24a of the first conductive member 20a is determined to be zero. 2 is greater than the length of the trace 24b of the conductive member 20b.

Next, the overlap of the traces of the conductive members will be described with reference to FIGS. 1 and 2. As shown in FIG. 1, the conductive members are located in the diagonal direction of the insulating plate like the fifth conductive member 20e and the sixth conductive member 20f, or the first conductive member 20a and the second conductive member 20b. When located on the center line and located far from the center position, the traces 24b and 24f overlap each other with the adjacent traces 24a and 24e when viewed from above. Therefore, as shown in FIG. 2, the length of the upper via 23a of the first conductive member 20a is made shorter than the length of the upper via 23b of the second conductive member 20b, so that the second conductive member ( Trace 24b of 20b is formed to be located partially below trace 24a of first conductive member 20a.

On the other hand, when the conductive members such as the third conductive member 20c and the fourth conductive member 20d are located close to the center position or at positions other than the diagonal line and the center line, the trace 24d is adjacent to the trace 24c. ) And do not overlap with each other. Therefore, in this case, as described above, the length of the upper via 23c of the conductive member 20c positioned adjacent to the outside may be shorter than the length of the upper via 23d of the conductive member 20d located inside. no need.

The pitch convertible test socket according to the present embodiment has a trace at a lower end than the pitch at the top while each conductive member has a trace. Therefore, even when the pitch of the terminal of the semiconductor element is a fine pitch of 0.5 mm or less, it is 0.65. You can test using a test board with a pitch of mm or more. In addition, since the conductive member has a shape consisting of a top via, a bottom via, and a trace, not diagonal lines, the conductive member may be easily formed in a build-up PCB manufactured by stacking a plurality of thin films.

In addition, the pitch convertible test socket according to the present embodiment increases the height of the test socket by using the connection PCB, and thus may have a height higher than that of the test socket made of only silicon rubber. In addition, compared to the test socket made of only the PCB, it is possible to prevent product damage by the upper silicon rubber connector portion and the lower silicon rubber connector portion formed above and below the connecting PCB.

On the other hand, in the present specification and drawings have been described with respect to preferred embodiments of the present invention, although specific terms are used, it is merely used in a general sense to easily explain the technical details of the present invention and to help the understanding of the invention, It is not intended to limit the scope of the invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention can be carried out in addition to the embodiments disclosed herein.

10: PCB 20a, 20b, 20c, 20d, 20e, 20f: conductive member
20f: center conductive member 23a, 23b, 23c, 23d: top via
24a, 24b, 24c, 24d: traces 25a, 25b, 25c, 25d: bottom via
60: upper silicon rubber connector
61a, 61b, 61c, 61d, 61g: upper conductive filling rubber
70: lower silicon rubber connector
71a, 71b, 71c, 71d, 71g: upper conductive filling rubber

Claims

An upper silicon rubber connector portion having a plurality of upper conductive filling rubbers having a pitch equal to that of terminals of the semiconductor device under test;
A connection PCB having a plurality of conductive members each of which is connected to a bottom of each of the upper conductive filling rubbers; And
Each upper end is connected to a lower end of each of the conductive members, and includes a lower silicon rubber connector part having a plurality of lower conductive filling rubbers having a pitch equal to that of the contact pads of the test board,
The pitch of the lower end of the conductive members is pitch conversion test socket, characterized in that greater than the pitch of the upper end of the conductive members.

2. The pitch changeable test socket of claim 1, wherein at least one of the conductive members comprises a top via, a bottom via, and a trace connected to a bottom of the top via and a top of the bottom via. .