KR101981526B1 - U-type PION pin of test scoket - Google Patents

Abstract

The U-type PION pin of the present invention includes a first connection pin in contact with a terminal of a semiconductor device, a second connection pin in contact with a pad of the test apparatus, an electrical path between the first connection pin and the second connection pin A U-turn body for changing to a U-type, a first spring provided between the first connecting pin and the U-turn body, and a second spring provided between the second connecting pin and the U-turn body. According to the structure of the present invention as described above, inspection can be performed without limitation even when the terminals and the pads are located on the same plane.

Description

U-type PION pin of test socket {U-type PION pin of test scoket}

The present invention relates to a U-type PION pin and a test socket including the U-type PION pin. In particular, when a terminal of a corresponding semiconductor device and a pad of a test apparatus are not coaxially aligned, The second connecting pin is biaxially aligned and sloped by the U-turn body, the direction of the current is opposite, the first connecting pin is resiliently coupled to the U-turn body by the first spring, The connecting pin is resiliently coupled to the U-turn body by a second spring, but to a U-type PION pin that provides the same or different elastic force as the first spring.

In general, a ball grid array (BGA) type semiconductor package (PKG) is finally subjected to characteristic measurement or defect inspection through various electrical tests by a test apparatus. At this time, a test socket is used to electrically connect the circuit pattern of the test printed circuit board provided in the test apparatus to the contact ball of the BGA type semiconductor package (PKG).

However, as shown in FIG. 1, a plurality of pogo pins 10 are installed in the housing in a predetermined rule in such a test socket.

Such a pogo pin 10 should be provided for each terminal interval of the semiconductor package PKG. As miniaturization, integration and high performance of the semiconductor package PKG are progressed, the pogo pin 10 for inspecting a semiconductor package (PKG) Should be small. That is, the outer diameter of the pogo pin 10 must be small. In order to transmit the high frequency electrical signal without distortion, the propagation path must be stable and the impedance on the propagation path must be minimized.

However, the conventional pogo pin 10 including the upper probe 12, the cylindrical housing 12, the lower probe 14, and the spring 16 has a spring housing 16 as the cylindrical housing 12 is provided outside the spring. The outer diameter of the cylindrical housing 12 may be enlarged by the thickness of the cylindrical housing 12 and the outer diameter of the cylindrical housing 12 may not be reduced to a certain size or less.

In addition, when the cylindrical housing 12 is used, the shape of the pogo pin 10 necessarily provides a linear shape in electrically connecting the terminal of the semiconductor device PKG to the pad of the test apparatus (PCB) .

As a result, the terminals of the semiconductor device (PKG) and the pads of the test device (PCB) are always located on a straight line, and the terminal arrangement of the semiconductor device can be changed according to the inspection object. However, have. For example, the semiconductor device PKG and the test device PCB may be located on the same plane. The contact loads required for the terminals of the semiconductor device PKG and the pads of the test apparatus (PCB) do not necessarily match.

Korean Patent No. 10-1673502

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above problems occurring in the prior art, and it is an object of the present invention to provide a semiconductor device and a semiconductor device, To a PION pin capable of jumping a terminal and a pad in order to electrically connect the corresponding terminal to the corresponding terminal when the device is located on the same plane.

It is another object of the present invention to provide a PION pin which absorbs mechanical shocks by using a coil spring independent of a terminal of a semiconductor device and a pad of a test apparatus even though the terminals of the semiconductor device and the pads of the test device are not located on a straight line .

According to an aspect of the present invention, there is provided a U-type PION pin comprising: a first connecting pin which contacts a terminal of a semiconductor device; a second connecting pin which contacts a pad of the testing device; A U-turn body for changing an electrical path between the first connecting pin and the second connecting pin to U-type, a first spring provided between the first connecting pin and the U-turn body, And a second spring installed between the U-turn body.

As described above, according to the configuration of the present invention, the following effects can be expected.

First, even when the test apparatus and the semiconductor device are arranged on the same plane, the terminals and the pads can be jumped to perform the electrical connection, thereby being able to actively cope with the user environment.

Second, coil springs having different elasticity can be mounted on the terminals of the semiconductor device and the pads of the test apparatus, thereby satisfying the consumer need for various elasticity.

1 is a cross-sectional view showing a configuration of a test socket according to the prior art;
2 is a configuration diagram showing a configuration of a test socket according to the present invention;
FIGS. 3 to 5 are a perspective view, an exploded perspective view, and an incisional perspective view showing the construction of a U-type PION pin according to the present invention;

Brief Description of the Drawings The advantages and features of the present invention, and how to achieve them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.

Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific types of regions of the elements and are not intended to limit the scope of the invention.

Hereinafter, preferred embodiments of the U-type PION pin and the test socket including the U-type PION pin according to the present invention will be described in detail with reference to the accompanying drawings.

Pitch Innovation Pioneer (PION) pins are described for use in final test sockets for convenience of explanation, but are not limited to, and may be used in burn-in test sockets.

The test socket is used for electrically inspecting a semiconductor package (PKG) such as a semiconductor integrated circuit device such as a package IC or an MCM or a wafer on which an integrated circuit is formed, In order to electrically connect the connecting terminals (including the contact pads, hereinafter referred to as the pads) of the test apparatus (hereinafter referred to as pads) including the ball and the terminals (PCB).

Referring to FIG. 2, the test socket 1000 includes at least one U-type PION pin 300.

3 to 5, the U-type PION pin 300 includes a first connection pin 310 to be in contact with a terminal of the semiconductor package PKG, a second connection A pin 320 and a U-turn body 330 in which an electrical path is changed between the first connection pin 310 and the second connection pin 320. The U-turn body 330 is connected between the first connection pin 310 and the U- And a second spring 350 installed between the second connection pin 320 and the U-turn body 330. The first spring 340 is installed in the U-

The first connecting pin 310 and the second connecting pin 320 are provided in the form of a strip of a predetermined thickness that is narrow and long. These strips have an edge of a width and a width of a width (thickness). The U-turn body 330 is also in the form of a strip having a length longer than the width, and its thickness substantially coincides with the first connection pin 310 or the second connection pin 320.

The U-turn body 330 provides hooking engagement with the first connecting pin 310 crossing the plane to the plane. Similarly, the U-turn body 330 and the second connecting pin 320 are also hooked to each other. Therefore, the first connection pin 310 and the second connection pin 320 coincide with each other in the planar direction.

In the present invention, since the strips are formed in the form of a plate having a predetermined width and a predetermined thickness, they can be manufactured using the MEMS process, and since the pair of strips are orthogonally connected, the three- You can expect.

The first connection pin 310 includes a first tip 312 that directly contacts a conductive ball or a conductive bump or other terminal B and a pair of first hooks 314 selectively fastened to the U- ). The first hook 314 further includes a first stopper 316 extending in its width. A first spring 340 is supported on the first stopper 316.

The second connection pin 320 includes a second tip 322 that is in direct contact with a contact pad or other pad P and a pair of second hooks 324 that are selectively coupled to the U- do. The second hook 324 further includes a second stopper 326 extending in its width. A second spring 350 is supported on the second stopper 326.

The first spring 340 and the second spring 350 function to extend the product life of the test socket 1000 by absorbing the shock generated by the repetitive test when the coil spring is used. Both ends of the coil spring are respectively supported on the first stopper 316, a corresponding pair 316 ', a second stopper 326, and a corresponding pair 326' described later.

However, according to the embodiment of the present invention, the first spring 340 and the second spring 350 need not necessarily have the same elastic modulus. The elastic force of the second spring 350 is relatively constant since the second connecting pin 320 is connected to the pad P of the test apparatus PCB, The elastic force of the second spring 340 may vary depending on the inspection object. For example, when the object to be inspected is provided in the form of a film, the contact load can be adjusted so as not to be relatively large.

The terminals B of the semiconductor device PKG of the present invention and the pads of the test apparatus PCB are located at substantially the same level. The U-turn body 330 may be bent or bent at least twice through the changing portion to form an electrical path between the terminal B and the pad P spaced apart by a predetermined distance.

For example, the U-turn body 330 includes a first vertical portion 330a hooked to the first connection pin 310, a first changing portion 330b bent or bent from the first vertical portion 330a, A horizontal portion 330c which is angularly changed by 90 ° with respect to the first vertical portion 330a by the first changing portion 330b and a second changing portion 330b which is bent or bent substantially same as the first changing portion 330a from the horizontal portion 330c And a second vertical part 330e hooked to the second connecting pin 320 and rotated by 90 ° with respect to the horizontal part 330a by the second changing part 330d. do.

The first vertical part 330a further includes a first pair of hooks 314 'hooked to the first connection pin 310 at one end and a pair of first stoppers 316' . The second vertical portion 330e includes a second hook corresponding pair 324` hooked to the second connecting pin 320 at the other end and a second stopper corresponding pair 326` having an extended outer width.

The horizontal portion 330c is provided at right angles to the first vertical portion 330a and the second vertical portion 330e, but is not necessarily limited thereto, and may be provided in a semicircular or arch shape. Nevertheless, the first vertical part 330a and the second vertical part 330e are parallel to each other.

Referring again to FIG. 2, the test socket 1000 may further include an insulating block 300 'on which a plurality of PION pins 300 are installed. The insulating block 300 'may be assembled by separating the PION pin 300 into left and right blocks. For example, the plurality of PION pins 300 may be supported at regular intervals in the block 300 ', and only a part of the first connection pin 310 and the second connection pin 320 may be exposed to the outside.

A semiconductor device PKG is positioned above the convex 300 and a test device PCB is located below the block 300. A plurality of The PION pins 300 may be arranged with a predetermined rule.

In addition, even if the semiconductor device PKG and the test device PCB are located at substantially the same level, the heights may be different from each other. At this time, the lengths of the first vertical part 330a and the second vertical part 330e can be changed accordingly.

Although not shown in the drawing, the present invention can perform electrical inspection by further connecting a multi-contact auxiliary pin to the first connection pin 310 or the second connection pin 320. An auxiliary groove may be further formed in the first tip 312 to allow the multi-contact auxiliary pin to engage with the first tip 312.

The multi-contact auxiliary pin may include an auxiliary tip connected to the terminal B together with the first tip 312, and a secondary hook hooked to the above-described auxiliary groove. As described above, the auxiliary tip has two or more contact points, thereby providing stable contact characteristics despite the alignment tolerance occurring in contact with the conductive balls and other terminals (B).

For example, the semiconductor device PKG may include a fan-out fan (not shown) in which input / output connection terminals of a solder ball or a conductive bump for reducing an overall size of a package and transmitting an electrical signal are extended to a protection member through a re- -out) type system.

As described above, according to the present invention, when the terminals of the semiconductor device and the pads of the testing device are disposed on substantially the same plane, the first vertical portion, the first changing portion, the horizontal A second changing portion, and a second vertical portion, and jumps the terminals and pads spaced apart from each other by a predetermined distance. Many other modifications will be possible to those skilled in the art, within the scope of the basic technical idea of the present invention.

300: PION pin 310: first connection pin
320: second connecting pin 330: U-turn body
340: first spring 350: second spring

Claims (7)

A first connecting pin contacting the terminal of the semiconductor device;
A second connecting pin contacting the pad of the test apparatus;
A U-turn body for changing the electrical path between the first connecting pin and the second connecting pin to U-type;
A first spring installed between the first connecting pin and the U-turn body; And
And a second spring installed between the second connecting pin and the U-turn body,
The corresponding terminal and the pad are located on the same plane,
The U-type PION pin is bent twice to form an electrical path between the terminal and the pad that are spaced apart. delete The method according to claim 1,
The U-
A first vertical portion extending vertically and hooked to the first connecting pin;
A first changing part bent from the first vertical part;
A horizontal portion which is angularly changed by 90 ° with respect to the first vertical portion by the first changing portion;
A second changing part bent from the horizontal part in the same manner as the first changing part; And
And a second vertical portion extending vertically and hooked to the second connecting pin which is angularly translated by 90 DEG with respect to the horizontal portion by the second changing portion. The method of claim 3,
Wherein the horizontal portion is semicircular or arcuate in shape. The method of claim 3,
Wherein the first connection pin
A first tip in direct contact with the terminal;
A first hook selectively fastened to the U-turn body; And
And a first stopper for expanding an outer width of the first hook,
Wherein the first vertical portion comprises:
A first hook corresponding pair hooked to the first connecting pin at one end; And
A first stopper corresponding pair in which an outer width is expanded,
The second connecting pin
A second tip in direct contact with the pad;
A second hook selectively fastened to the U-turn body; And
And a second stopper in which an outer width of the second hook extends
And the second vertical portion includes:
A second hook corresponding pair hooked to the second connecting pin at the other end; And
And a second stopper corresponding pair whose outer width is expanded. 6. The method of claim 5,
Both ends of the first spring being supported by the first stopper and the first stopper corresponding pair,
Both ends of the second spring being supported on the pair of the second stopper and the second stopper,
And the elastic force of the first spring is different from the elastic force of the second spring. The method of claim 3,
And the first connection pin and the second connection pin are respectively hooked to the multi-contact auxiliary pin.

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